CN107591421A - Optical filter combination, camera module chip package base assembly and preparation method thereof - Google Patents
Optical filter combination, camera module chip package base assembly and preparation method thereof Download PDFInfo
- Publication number
- CN107591421A CN107591421A CN201710698558.5A CN201710698558A CN107591421A CN 107591421 A CN107591421 A CN 107591421A CN 201710698558 A CN201710698558 A CN 201710698558A CN 107591421 A CN107591421 A CN 107591421A
- Authority
- CN
- China
- Prior art keywords
- optical filter
- supporting part
- camera module
- metalwork
- chip package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of preparation method of camera module chip package base assembly, including：It is integrally to be put into plastic mold die cavity in the form of sub-assembly as optical filter combines by metalwork and with optical filter, is stripped after injection molding, finally gives camera module chip package base assembly.When preparing optical filter combination, optical filter combination can be obtained by automatic drawstring quantity-produced manufacture method, and the paster yield of optical filter is higher.In addition, it is also proposed that optical filter used in a kind of camera module chip package base assembly and the component combines.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of optical filter combination, camera module chip package base
Component and preparation method thereof.
Background technology
Chip package base in mobile phone camera module group is the component in mobile phone camera module group, is used on pcb board
Between electronic component and voice coil motor.
The infrared filter paster technique in mobile phone camera module group is at present：The pure plastic parts of injection molding passes through paster
Infrared fileter and the chip package base in optical camera module are pasted together by factory by IR modes with specific glue,
Form H/R components.Chip package base in optical camera module is primarily referred to as：AF-Holder bases (are applied to optics
Camera).
However, because pure plastic parts is bulk packages, need to put pure plastic cement products into specific tool before paster, per money product not
Equally, tool is different, and input automatic machine cost is high.For specific tool because assembling needs can not reduce gap, paster precision is not high,
Erratic fluctuations occurs in yield.
The content of the invention
Based on this, it is necessary to the problem of for optical filter paster yield and high process costs in mobile phone camera module group,
A kind of preparation method of camera module chip package base assembly is provided.Also propose that a kind of optical filter combines and used this group
The camera module chip package base assembly of conjunction.
A kind of preparation method of camera module chip package base assembly, including：
Metal sheet is made to the metalwork of predetermined shape, the metalwork is provided with supporting part, and the supporting part is provided with
Loophole；
Optical filter is adhesively fixed on the supporting part and forms optical filter combination；
Optical filter combination is implanted into plastic mould die cavity by the form of material strip, is stripped after injection molding, if obtaining
The semi-finished product of involvement material strip；
The semi-finished product of the even material strip are cut, obtain some camera module chip package base assemblies, the camera
Module chip encapsulation base plate component includes plastic base, and the metalwork is embedded in the plastic base.
The preparation method of above-mentioned camera module chip package base assembly, metalwork and be with filter set with optical filter
Sub-assembly form is integrally put into plastic mold die cavity as conjunction, when preparing optical filter combination, can continuously be given birth to by automatic drawstring
The manufacture method of production obtains optical filter combination, and the paster yield of optical filter is higher.
In one of the embodiments, described be bonded and fixed in optical filter forms optical filter combination on the supporting part
Before step, the supporting part is surface-treated, is formed and has sticking insulating barrier, it is described to be bonded and fixed at optical filter
In the step of optical filter combination is formed on the supporting part, the optical filter is bonded on the insulating barrier using glue.
In one of the embodiments, in the plastic base of formation, it is embedded with simultaneously in same plastic base
Optical filter combination described in two, two optical filter combinations are arranged side by side on the plastic base.
In one of the embodiments, the top surface of the plastic base of formation has opening, and the metalwork is located at
In the opening, and its edge is embedded in the plastic base, and the top surface of the optical filter is not higher than the top of the plastic base
Face.
A kind of optical filter combination, including：Metalwork, provided with material strip portion and the supporting part being connected with material strip portion, the carrying
Portion is provided with loophole；Optical filter, it is bonded and fixed on the supporting part of the metalwork.
In one of the embodiments, the surface of the supporting part, which is provided with, has sticking insulating barrier, and the optical filter glues
Knot is fixed on the insulating barrier.
In one of the embodiments, the optical filter is infrared filter, and the infrared filter is white glass
Infrared fileter, basket glass infrared fileter or resin basket glass infrared fileter.
In one of the embodiments, the thickness of the metalwork is 0.05~0.15 millimeter.
In one of the embodiments, the surface of the supporting part is proof gold metal surface, or the mixing for metal and plastic cement
Surface, blending surface include metal support and the plastic cement supporting part in the hole on metal support.
A kind of camera module chip package base assembly, including the combination of foregoing optical filter, in addition to plastic base, institute
Stating plastic base has an opening, and the optical filter combination is located in the opening, wherein the supporting part be embedded in it is described
In plastic base.
Brief description of the drawings
Fig. 1 is the schematic diagram that the optical filter of one embodiment of the invention combines；
Fig. 2 is the explosive view of the optical filter combination shown in Fig. 1；
Fig. 3 is that the optical filter of another embodiment combines the schematic diagram for the camera module chip package base assembly to be formed；
Fig. 4 is the schematic diagram that the optical filter with Fig. 1 combines camera module chip package base assembly；
Fig. 5 is the explosive view of Fig. 4 camera module chip package base assembly；
Fig. 6 is the schematic diagram of the camera module chip package base assembly of another embodiment.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Below in conjunction with the accompanying drawings, optical filter combination, camera module chip package base assembly and its preparation of the present invention are illustrated
The better embodiment of method.
With reference to figure 1 and Fig. 2, the present invention provides a kind of optical filter combination 10, and it may be used to form camera module chip envelope
Fill base assembly (H/R components).
Optical filter combination 10 includes metalwork 110 and the optical filter 120 being fixed together with metalwork 110.Metalwork 110
It is embedded in plastic base 20, the supporting part 113 being connected provided with material strip portion 112, with material strip portion 112.Supporting part 113 is provided with saturating
Unthreaded hole 114.Optical filter 120 is then bonded and fixed on the supporting part 113 of metalwork 110, corresponding with loophole 114.
Metalwork 110 is metal sheet, and thickness is 0.05~0.15 millimeter.The material of metalwork can be simple metal, no
Become rusty steel, alloy etc..
Further, the surface of supporting part 113 can also be further provided with having sticking insulating barrier.Optical filter 120 is
Fixed on the insulating layer by glue bonding, improve cohesive fastness.
The surface of the supporting part 113 of above-mentioned metalwork 110 is the supporting surface of simple metal, improves the intensity of supporting part 113.
In other embodiment, as shown in figure 3, the surface of supporting part 113 can also be the blending surface of metal and plastic cement.For example, can be with
It is that injecting hole is opened up on metal surface.Plastic cement is irrigated in injecting hole, so as to form the blending surface of metal and plastic cement.Supporting part
113 include metal support 1131 and the plastic cement supporting part 1132 in the hole on metal support 1131.Metal support
1131 and the surface co-planar of plastic cement supporting part 1132 form the blending surface.
Optical filter 120 is infrared filter.Specifically, infrared filter can be white glass infrared fileter, basket
Glass infrared fileter or resin basket glass infrared fileter.
Above-mentioned optical filter combination 10, metalwork 110 is combined to form optical filter combination 10 in advance with optical filter 120, then
It is used further to be formed the camera module chip package base assembly with plastic base.Pure plastic base need not be put into specific
Tool, therefore, the attaching process of optical filter 120 is simple, and yield is higher, can produce in bulk.
It refer to Fig. 4 and Fig. 5, the camera module chip package base assembly of one embodiment of the invention, including it is foregoing
Optical filter combination 10 and plastic base 20.Wherein, optical filter combination 10 is embedded in plastic base 20.Specifically, plastic base
20 and optical filter combination 10 integral piece can be formed as by burying forming mode.
The top surface of plastic base 20 offers opening 210.Optical filter combination 10 is then in opening 210, and metal
The edge of part 110 is embedded in plastic base 20.
The top surface of optical filter 120 can select to be arranged to the top surface not higher than plastic base 20.Specifically, optical filter 120
Top surface and plastic base 20 either flush.
In the camera module chip package base assembly of Fig. 4 and Fig. 5 signals, plastic base 20 is embedded singly to take the photograph base
There is an optical filter combination 10.
In addition, plastic base 20 can also be it is as shown in Figure 6 it is double take the photograph base, provided with opening 210 at two, be embedded in two altogether
Individual optical filter combination 10, two optical filter combinations 10 are arranged side by side on plastic base 20.
Above-mentioned camera module chip package base assembly, metalwork 110 and with optical filter 120 combined with optical filter
Sub-assembly form is integrally embedded into plastic base 20 as 10, therefore the paster yield of optical filter is higher.
The preparation process of above-mentioned camera module chip package base assembly comprises the following steps.
S100, the metalwork that metal sheet is made to predetermined shape, the metalwork are provided with supporting part, on the supporting part
Provided with loophole.
In this step, thick metal alloy (alloy, copper, stainless steel etc.) sheet materials of 0.05~0.15mm are passed through into precision first
Diel strikes out the shape for meeting client's function needs and shaping quantization and reel packaging.
However, it can further select to pass through metal alloy (alloy, copper, stainless steel etc.) product for striking out predetermined shape
Special surface treatment mode is insulated and adhered to, and strong characteristic simultaneously pack by reel, obtains predetermined metal product.Metal product
Supporting part surface formed with having sticking insulating barrier.
S200, optical filter formation optical filter combination is adhesively fixed on the supporting part.In this step, by infrared fileter
It is fixed on by using specific glue on metal product.
When supporting part surface, which is provided with, has sticking insulating barrier, optical filter is bonded in the insulating barrier using glue
On.
S300, the form implantation plastic mould die cavity by optical filter combination by material strip, are stripped after injection molding, obtain
If to the semi-finished product of involvement material strip.
To continuously it be implanted into ready plastic mould die cavity by the form of material strip with infrared fileter metal product
Face, plastic grains are melted again by selecting suitable injection machine, plastic mold die cavity is injected by Shooting Technique, then through supercooling
But, eject, the demoulding, the semi-finished product of the company's of obtaining material strip：Post the plastic cement hardware integrated product of optical filter.
It is molded in the obtained plastic cement hardware integrated product for posting optical filter, the top surface of plastic base has opening,
The metalwork is located in the opening, and its edge is embedded in the plastic base, and the top surface of the optical filter is not higher than institute
State the top surface of plastic base.
Plastic base can be it is as shown in Figure 1 singly take the photograph base, be embedded with an optical filter combination.Further, it is also possible to it is
It is as shown in Figure 4 it is double take the photograph base, the optical filter combination described in two, two optical filterings are embedded with same plastic base simultaneously
Piece combination is arranged side by side on the plastic base.
S400, the semi-finished product for cutting the even material strip, obtain some camera module chip package base assemblies, described to take the photograph
Picture head mould group chip package base assembly includes plastic base, and the metalwork is embedded in the plastic base.
Plastic cement hardware integrated product passes through special guillotine after paster, and guillotine is with severing material strip and more cave numbers point
Acupoints.The finished product (such as Fig. 1) that rear product meets customer drawings requirement is cut, material strip is pulled by automatic machine, can be achieved complete
Automatic production.
In the preparation method of above-mentioned camera module chip package base assembly, metalwork 110 and with optical filter 120 be with
Sub-assembly form as optical filter combination 10 is integrally put into plastic mold die cavity, can be by certainly when preparing optical filter combination 10
Dynamic drawstring quantity-produced manufacture method obtains optical filter combination 10, and the paster yield of optical filter is higher.
In addition, the camera module chip package base assembly that the present invention obtains is pure hardware one tensioning member, can break through
The most thin limit of pure plastic cement, the most thin scope for accomplishing 0.05~0.15mm, vacateed to the encapsulation of mobile phone dual camera module chip
More use space.
The camera module chip package base assembly that the present invention obtains is plastic cement hardware integral piece, because being buried inside plastic cement
Enter metal, significantly increase intensity, can effectively solve the problem that do pure plastic parts it is thin after intensity deficiency the shortcomings that.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of preparation method of camera module chip package base assembly, it is characterised in that including step：
Metal sheet is made to the metalwork of predetermined shape, the metalwork is provided with supporting part, and the supporting part is provided with printing opacity
Hole；
Optical filter is adhesively fixed on the supporting part and forms optical filter combination；
Optical filter combination is implanted into plastic mould die cavity by the form of material strip, is stripped after injection molding, if obtaining involvement
The semi-finished product of material strip；
The semi-finished product of the even material strip are cut, obtain some camera module chip package base assemblies, the camera module
Chip package base assembly includes plastic base, and the metalwork is embedded in the plastic base.
2. the method as described in claim 1, it is characterised in that described be bonded and fixed in optical filter on the supporting part is formed
Before the step of optical filter combines, the supporting part is surface-treated, is formed and has sticking insulating barrier, it is described to filter
Piece is bonded and fixed on the supporting part in the step of forming optical filter combination, is bonded in the optical filter using glue described
On insulating barrier.
3. the method as described in claim 1, it is characterised in that in the plastic base of formation, same plastic base
In be embedded with optical filter combination described in two simultaneously, the combination of two optical filters is arranged side by side on the plastic base.
4. according to the method for claim 1, it is characterised in that the top surface of the plastic base of formation has opening,
The metalwork is located in the opening, and its edge is embedded in the plastic base, and the top surface of the optical filter is not higher than institute
State the top surface of plastic base.
A kind of 5. optical filter combination, it is characterised in that including：
Metalwork, provided with material strip portion and the supporting part being connected with material strip portion, the supporting part is provided with loophole；
Optical filter, it is bonded and fixed on the supporting part of the metalwork.
6. optical filter combination according to claim 5, it is characterised in that it is sticking that the surface of the supporting part is provided with tool
Insulating barrier, the optical filter are bonded and fixed on the insulating barrier.
7. optical filter combination according to claim 5, it is characterised in that the optical filter is infrared filter, described
Infrared filter is white glass infrared fileter, basket glass infrared fileter or resin basket glass infrared fileter.
8. optical filter combination according to claim 5, it is characterised in that the thickness of the metalwork is 0.05~0.15 milli
Rice.
9. optical filter combination according to claim 5, it is characterised in that the surface of the supporting part is proof gold metal surface,
Or be metal and the blending surface of plastic cement, supporting part includes metal support and the plastic cement branch in the hole on metal support
The surface co-planar of support part, metal support and plastic cement supporting part forms the blending surface.
10. a kind of camera module chip package base assembly, including the filter set as described in any one of claim 5 to 9
Close, it is characterised in that also including plastic base, the plastic base has opening, and the optical filter combination is opened positioned at described
In fenestra, wherein the supporting part is embedded in the plastic base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698558.5A CN107591421B (en) | 2017-08-15 | 2017-08-15 | Camera module chip packaging base assembly and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698558.5A CN107591421B (en) | 2017-08-15 | 2017-08-15 | Camera module chip packaging base assembly and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107591421A true CN107591421A (en) | 2018-01-16 |
| CN107591421B CN107591421B (en) | 2023-08-04 |
Family
ID=61042210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710698558.5A Active CN107591421B (en) | 2017-08-15 | 2017-08-15 | Camera module chip packaging base assembly and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107591421B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108632514A (en) * | 2018-06-08 | 2018-10-09 | 昆山丘钛微电子科技有限公司 | Camera module and mobile terminal |
| WO2020173014A1 (en) * | 2019-02-26 | 2020-09-03 | 苏州昀冢电子科技股份有限公司 | Voice coil motor base, voice coil motor, and camera module |
| CN113363170A (en) * | 2021-05-11 | 2021-09-07 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base combination and manufacturing method thereof |
| WO2023011666A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Camera module, image acquisition module, and processing method for base of image acquisition module |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200240021Y1 (en) * | 2001-04-25 | 2001-10-12 | (주)반디플랙스 | Optical fiber lighting device with color fillter wheel for free changable |
| KR200394821Y1 (en) * | 2005-06-04 | 2005-09-07 | 주식회사 하이소닉 | Image photographing device |
| JP2010028698A (en) * | 2008-07-24 | 2010-02-04 | Smk Corp | Method of manufacturing pedestal for camera module |
| CN201489168U (en) * | 2009-07-09 | 2010-05-26 | 一品光学工业股份有限公司 | lens bracket of stacked lens module |
| CN202948184U (en) * | 2012-10-22 | 2013-05-22 | 深圳欧菲光科技股份有限公司 | Optical filter supporting frame |
| CN203337863U (en) * | 2013-06-19 | 2013-12-11 | 深圳日海通讯技术股份有限公司 | Optical fiber adapter centering assembly having optical filter and optical fiber adapter |
| KR20140076819A (en) * | 2012-12-13 | 2014-06-23 | 엘지이노텍 주식회사 | Camera Module |
| CN104816429A (en) * | 2015-04-28 | 2015-08-05 | 深圳市联懋塑胶有限公司 | Metal surface and plastic integral injection molding and firm adhering process |
| CN105655301A (en) * | 2016-03-25 | 2016-06-08 | 苏州昀冢电子科技有限公司 | Packaging base of camera module chip and processing method thereof |
| WO2016116009A1 (en) * | 2015-01-23 | 2016-07-28 | 宁波舜宇光电信息有限公司 | Security protection system, security protection camera module and manufacturing method therefor |
| CN205545522U (en) * | 2016-01-20 | 2016-08-31 | 南昌欧菲光电技术有限公司 | Camera module and circuit board |
| CN106027863A (en) * | 2016-05-27 | 2016-10-12 | 维沃移动通信有限公司 | Camera base, camera and terminal |
| CN106206756A (en) * | 2016-09-30 | 2016-12-07 | 深圳成光兴光电技术股份有限公司 | A kind of photosensitive tube and optical filter combination encapsulating structure and processing technique thereof |
| CN205945961U (en) * | 2016-08-24 | 2017-02-08 | 横店集团东磁有限公司 | Mobile phone camera module structure |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
| CN107026965A (en) * | 2017-05-17 | 2017-08-08 | 苏州昀冢电子科技有限公司 | Camera module chip package base plastic cement hardware integrated device |
| CN207070179U (en) * | 2017-08-15 | 2018-03-02 | 苏州昀冢电子科技有限公司 | Optical filter combination, camera module chip package base assembly |
-
2017
- 2017-08-15 CN CN201710698558.5A patent/CN107591421B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200240021Y1 (en) * | 2001-04-25 | 2001-10-12 | (주)반디플랙스 | Optical fiber lighting device with color fillter wheel for free changable |
| KR200394821Y1 (en) * | 2005-06-04 | 2005-09-07 | 주식회사 하이소닉 | Image photographing device |
| JP2010028698A (en) * | 2008-07-24 | 2010-02-04 | Smk Corp | Method of manufacturing pedestal for camera module |
| CN201489168U (en) * | 2009-07-09 | 2010-05-26 | 一品光学工业股份有限公司 | lens bracket of stacked lens module |
| CN202948184U (en) * | 2012-10-22 | 2013-05-22 | 深圳欧菲光科技股份有限公司 | Optical filter supporting frame |
| KR20140076819A (en) * | 2012-12-13 | 2014-06-23 | 엘지이노텍 주식회사 | Camera Module |
| CN203337863U (en) * | 2013-06-19 | 2013-12-11 | 深圳日海通讯技术股份有限公司 | Optical fiber adapter centering assembly having optical filter and optical fiber adapter |
| WO2016116009A1 (en) * | 2015-01-23 | 2016-07-28 | 宁波舜宇光电信息有限公司 | Security protection system, security protection camera module and manufacturing method therefor |
| CN104816429A (en) * | 2015-04-28 | 2015-08-05 | 深圳市联懋塑胶有限公司 | Metal surface and plastic integral injection molding and firm adhering process |
| CN205545522U (en) * | 2016-01-20 | 2016-08-31 | 南昌欧菲光电技术有限公司 | Camera module and circuit board |
| CN105655301A (en) * | 2016-03-25 | 2016-06-08 | 苏州昀冢电子科技有限公司 | Packaging base of camera module chip and processing method thereof |
| CN106027863A (en) * | 2016-05-27 | 2016-10-12 | 维沃移动通信有限公司 | Camera base, camera and terminal |
| CN205945961U (en) * | 2016-08-24 | 2017-02-08 | 横店集团东磁有限公司 | Mobile phone camera module structure |
| CN106206756A (en) * | 2016-09-30 | 2016-12-07 | 深圳成光兴光电技术股份有限公司 | A kind of photosensitive tube and optical filter combination encapsulating structure and processing technique thereof |
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN107026965A (en) * | 2017-05-17 | 2017-08-08 | 苏州昀冢电子科技有限公司 | Camera module chip package base plastic cement hardware integrated device |
| CN207070179U (en) * | 2017-08-15 | 2018-03-02 | 苏州昀冢电子科技有限公司 | Optical filter combination, camera module chip package base assembly |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108632514A (en) * | 2018-06-08 | 2018-10-09 | 昆山丘钛微电子科技有限公司 | Camera module and mobile terminal |
| WO2020173014A1 (en) * | 2019-02-26 | 2020-09-03 | 苏州昀冢电子科技股份有限公司 | Voice coil motor base, voice coil motor, and camera module |
| CN113363170A (en) * | 2021-05-11 | 2021-09-07 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base combination and manufacturing method thereof |
| CN113363170B (en) * | 2021-05-11 | 2024-01-19 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base combination and manufacturing method thereof |
| WO2023011666A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Camera module, image acquisition module, and processing method for base of image acquisition module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107591421B (en) | 2023-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207070179U (en) | Optical filter combination, camera module chip package base assembly | |
| CN107591421A (en) | Optical filter combination, camera module chip package base assembly and preparation method thereof | |
| CN107343126A (en) | Camera module chip package base | |
| JP3095762B2 (en) | Method for producing a microchip card incorporating a microprocessor chip and a microchip card produced by this method | |
| US7288441B2 (en) | Method for two-stage transfer molding device to encapsulate MMC module | |
| TW200836381A (en) | Method of compression-molding light emitting elements | |
| US20110318591A1 (en) | Molded article and method for making the same | |
| US20090189310A1 (en) | Semiconductor chip compression molding method and mold for compression molding | |
| TWI256112B (en) | Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same | |
| EP1094512A4 (en) | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like | |
| US5615476A (en) | Method for producing identity cards having electronic modules | |
| US20110111176A1 (en) | Shell body with a plastic member molded onto a glass panel, and method for manufacturing the shell body | |
| US9817079B2 (en) | Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet | |
| US20100055815A1 (en) | Method of manfuacturing lens for light emitting diode package | |
| CN105655301A (en) | Packaging base of camera module chip and processing method thereof | |
| CN102169553B (en) | Method for encapsulating and manufacturing glue perfusion molded SIM (subscriber identity module) film card with flip naked chip | |
| CN107454291A (en) | Camera module chip package base | |
| CN106055034A (en) | Decoration component fixing method and terminal with decoration component | |
| CN205508803U (en) | Make a video recording encapsulation base of head mould core assembly piece | |
| CN207070180U (en) | Camera module chip package base | |
| TW201037865A (en) | Method of packaging liminescence device | |
| CN207070181U (en) | Camera module chip package base | |
| FR2644630A1 (en) | Process for encarding micromodules and its application to the production of microchip cards | |
| JP2000280295A (en) | Mold for simultaneous molding and decoration and manufacture of article molded and decorated simultaneously | |
| CN107343127A (en) | Camera module chip package base |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215300 Songjiagang Road 269, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Yunzhong Electronic Technology Co.,Ltd. Address before: 215300, 144, Kang Zhuang Road, Zhou Town, Suzhou, Jiangsu, Kunshan Applicant before: SUZHOU GYZ ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |