CN107579016B - A kind of interdigitated test structure - Google Patents
A kind of interdigitated test structure Download PDFInfo
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- CN107579016B CN107579016B CN201710772516.1A CN201710772516A CN107579016B CN 107579016 B CN107579016 B CN 107579016B CN 201710772516 A CN201710772516 A CN 201710772516A CN 107579016 B CN107579016 B CN 107579016B
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Abstract
The invention discloses a kind of interdigitated test structures, including：The multiple metal structures being oppositely arranged in a first direction；Wherein, the metal structure includes：First metal wire structure；A plurality of second metal wire structure connecting is vertically arranged with first metal wire structure；The third metal wire structure being set between adjacent two second metal wire structures；The third metal wire structure is arranged between the short metal wire of preset quantity according to pre-determined distance successively, and arragement direction is perpendicular to first metal wire structure；It is not connected between the third metal wire structure and first metal wire structure and second metal wire structure；It is connected with each other between first metal wire structure in said first direction；It is connected with each other between the adjacent short metal wire in the third metal wire structure in said first direction.The interdigitated test structure can be accurately positioned the position of failpoint.
Description
Technical field
The present invention relates to reliability of technology monitoring technology fields, and more specifically more particularly to a kind of test of interdigitated is tied
Structure.
Background technology
With the continuous development of science and technology, semiconductor devices be widely used in daily life, work and
In industry, in semiconductor processing, interdigitated test structure is monitored for reliability of technology and the monitoring of failpoint.
Existing interdigitated test structure is by applying voltage detecting electric current, using OBIRCH (Optical Beam
Induced Resistance Change, photoinduction resistance variations) and EMMI (Emission Microscope, low-light are aobvious
Micro mirror) tool capture hot spot mode, position the position of failpoint.
But existing interdigitated test structure, the position range of failpoint can only be substantially oriented, it can not essence
Determine the position of position failpoint.
Invention content
To solve the above problems, the present invention provides a kind of interdigitated test structure, which can essence
Determine the position of position failpoint.
To achieve the above object, the present invention provides the following technical solutions：
A kind of interdigitated test structure, the interdigitated test structure include：What is be oppositely arranged in a first direction is multiple
Metal structure；
Wherein, the metal structure includes：First metal wire structure；It is vertically arranged and connect with first metal wire structure
A plurality of second metal wire structure；The third metal wire structure being set between adjacent two second metal wire structures；Institute
It states third metal wire structure to be arranged successively according to pre-determined distance between the short metal wire of preset quantity, and arragement direction hangs down
Directly in first metal wire structure；The third metal wire structure and first metal wire structure and second metal
It is not connected between cable architecture；
It is connected with each other between first metal wire structure in said first direction；Institute in said first direction
It states and is connected with each other between the adjacent short metal wire in third metal wire structure.
Preferably, in above-mentioned interdigitated test structure, in said first direction in the third metal wire structure
Both ends are attached respectively between adjacent short metal wire.
Preferably, in above-mentioned interdigitated test structure, first metal wire structure, second metal wire structure with
And the third metal wire structure relative position immobilizes.
Preferably, in above-mentioned interdigitated test structure, between the multiple metal structures being oppositely arranged in a first direction
Distance meet preset condition, and relative position immobilizes.
Preferably, in above-mentioned interdigitated test structure, the first metal wire structure grounding connection.
Preferably, in above-mentioned interdigitated test structure, the distance between adjacent two described second metal wire structures phase
Deng.
Preferably, in above-mentioned interdigitated test structure, the third metal wire structure is located at adjacent two described second
The middle position of metal wire structure.
Preferably, in above-mentioned interdigitated test structure, the quantity of second metal wire structure is 20 to 100.
Preferably, in above-mentioned interdigitated test structure, the pre-determined distance between the short metal wire is 40nm-200nm.
By foregoing description it is found that interdigitated test structure provided by the invention includes：It is oppositely arranged in a first direction
Multiple metal structures；
Wherein, the metal structure includes：First metal wire structure；It is vertically arranged and connect with first metal wire structure
A plurality of second metal wire structure；The third metal wire structure being set between adjacent two second metal wire structures；Institute
It states third metal wire structure to be arranged successively according to pre-determined distance between the short metal wire of preset quantity, and arragement direction hangs down
Directly in first metal wire structure；The third metal wire structure and first metal wire structure and second metal
It is not connected between cable architecture；
It is connected with each other between first metal wire structure in said first direction；Institute in said first direction
It states and is connected with each other between third metal wire structure.
It follows that the third metal wire structure that the interdigitated test structure is made of setting multiple short metal wires,
And be not connected between the first metal wire structure and the second metal wire structure, it is at floating state；After the completion of test, lead to
It crosses the first metal wire structure grounding connection, is based on voltage contrast principle, under a scanning electron microscope, the first metal wire structure
Bright contrast is presented with the second metal wire structure, under normal circumstances when, since the short metal wire in third metal structure is in floating
Set the contrast that dull gray will be presented in state, occur bursting when the part between third metal wire structure and the second metal wire structure or
The connection structure of the interdigitated test structure causes the short metal wire in third metal wire structure to be connected with the second metal wire structure,
The short metal wire be connected at this time is no longer on floating state, also indirect earthed to show bright contrast, not with the second metal knot
The short metal wire of structure conducting still shows the contrast of dull gray.That is, the short metal wire be connected with the second metal wire structure
Part is failpoint position, compares and determines the approximate range of failpoint in the prior art, the interdigitated test structure is more
Add the position for being accurately positioned out failpoint.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of vertical view of interdigitated test structure in the prior art；
Fig. 2 is a kind of schematic top plan view of interdigitated test structure provided in an embodiment of the present invention；
Fig. 3 is a kind of the first metal wire structure and the second metal knot of interdigitated configuration provided in an embodiment of the present invention
The side view of structure；
Fig. 4 is a kind of side view of the third metal wire structure of interdigitated configuration provided in an embodiment of the present invention；
Fig. 5 is that a kind of principle vertical view there are interdigitated test structure when failpoint provided in an embodiment of the present invention is illustrated
Figure；
Fig. 6 provides a kind of side view of connection third metal wire structure for the embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
With reference to figure 1, Fig. 1 is a kind of vertical view of interdigitated test structure in the prior art.
As shown in Figure 1, in the interdigitated test structure, pass through the two metal line structure C ombA in upper and lower horizontal direction
And apply voltage on CombB, detect the electric current of interdigitated test structure, using OBIRCH (photoinduction resistance variations) and
EMMI (Emission Microscope, low-light microscope) tool captures the mode of hot spot, positions the position of failpoint.
When not having disabling portion, the interdigitated configuration of CombA and the interdigitated configuration of CombB are without electric current；When perpendicular
Histogram between metal wire structure due to cannot bear enough voltage and burst conducting or vertical direction metal wire structure it
Between there are particle cause vertical direction metal wire structure connect cause to fail, by OBIRCH utilize laser irradiation initiation
The different variation of electric current, can only substantially orient the position range of failpoint, failpoint can not be accurately positioned
Position.
It is difficult the position range for capturing failpoint in the case of low current also, when application voltage is too small；It is electric when applying
When pressing through big, the region between the metal wire structure and metal wire structure of conducting can be damaged.
Based on the above issues, in order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to
The present invention is described in further detail for the drawings and specific embodiments.
With reference to figure 2, Fig. 2 is a kind of schematic top plan view of interdigitated test structure provided in an embodiment of the present invention.
The interdigitated test structure includes：The multiple metal structures 21 being oppositely arranged in a first direction；
Wherein, the metal structure 21 includes：First metal wire structure 22；It is vertical with first metal wire structure 22 to set
Set a plurality of second metal wire structure 23 of connection；The third metal being set between adjacent two second metal wire structures 23
Cable architecture 24；The third metal wire structure 24 is arranged between the short metal wire of preset quantity according to pre-determined distance successively
Cloth, and arragement direction is perpendicular to first metal wire structure 22；The third metal wire structure 24 and first metal wire
It is not connected between structure 22 and second metal wire structure 23；
It is connected with each other between first metal wire structure 22 in said first direction；In said first direction
It is connected with each other between adjacent short metal wire in the third metal wire structure 24.
That is, with reference to figure 3, Fig. 3 is a kind of first metal knot of interdigitated configuration provided in an embodiment of the present invention
The side view of structure and the second metal wire structure.As shown in figure 3, between multiple metal wire structures 21 it is corresponding in a first direction
Upper stacking setting, also, be connected with each other between the first adjacent metal wire structure 22 on first direction, and be connected, the connection
Relative position between the first metal wire structure 22 that measure is additionally operable on fixed first direction does not change.
Corresponding, with reference to figure 4, Fig. 4 is a kind of third metal knot of interdigitated configuration provided in an embodiment of the present invention
The side view of structure.As shown in figure 4, due to being respectively provided be made of short metal wire between arbitrary two article of second metal wire structure 23
Three metal wire structures 24 then in a first direction, being also mutually attached between adjacent short metal wire, and are connected, the company
The relative position connect between the short metal wire that measure is also additionally operable on fixed first direction does not change.
It should be noted that since short metal wire has certain length, need short metal wire adjacent on first direction
Between both ends be attached respectively.
In embodiments of the present invention, the interdigitated test structure is by being arranged the third metal being made of multiple short metal wires
Cable architecture, and be not connected between the first metal wire structure and the second metal wire structure, it is at floating state；When testing
Cheng Hou, by by the first metal wire structure grounding connection, voltage contrast principle being based on, under a scanning electron microscope, such as Fig. 2 institutes
Show, bright contrast is presented in the first metal wire structure 22 and the second metal wire structure 23, under normal circumstances when, due to third metal knot
The short metal wire contrast at floating state that dull gray will be presented in structure 24, as shown in figure 5, when third metal wire structure 24 and the
Part between two metal wire structures 23 occurs bursting or the connection structure of the interdigitated test structure leads to third metal wire
Short metal wire and the second metal wire structure 23 in structure 24 are connected, and the short metal wire be connected at this time is no longer on floating state,
Also indirect earthed to show bright contrast, the lining of dull gray is not still showed with the short metal wire of the second metal wire structure 23 conducting
Degree.That is, the short metal line portions with the conducting of the second metal wire structure 23 are failpoint position, compare the prior art
In determine that the approximate range of failpoint, the interdigitated test structure have more been accurately positioned out the position of failpoint.
Based on the above embodiment of the present invention, in an alternative embodiment of the invention, adjacent two second metal wire structures
The distance between 23 is equal, that is to say, that and the second metal wire structure 23 is uniformly arranged in the first metal wire structure 22, and
The distance is configured according to the resistance to pressure request of test, is not limited in embodiments of the present invention.
Similarly, the distance between multiple metal structures 21 being oppositely arranged in a first direction meet preset condition, and phase
It immobilizes to position；That is, as shown in figure 3, in a first direction, distance between the first adjacent metal wire structure 22
Meet preset condition, and relative position immobilizes.
Based on the above embodiment of the present invention, in an alternative embodiment of the invention, the third metal wire structure 24 is located at phase
The middle position of adjacent two second metal wire structures 23.That is, ensureing the short metal wire in third metal wire structure
It is identical as at a distance from the second metal wire structure of both sides, further increase the measuring accuracy of interdigitated test structure.
Preferably, in embodiments of the present invention, the quantity of second metal wire structure 23 is 20 to 100.
Preferably, in embodiments of the present invention, the short metal wire arrangement in the third metal wire structure 24 it is default away from
From for 40nm-200nm.
It should be noted that in embodiments of the present invention, the quantity of the first metal wire structure 22, the second metal wire in attached drawing
The quantity of structure 23, the quantity of the short metal wire in third metal wire structure 24 only illustrate by way of example, not
It is construed as limiting.
With reference to figure 6, Fig. 6 provides a kind of side view of connection third metal wire structure for the embodiment of the present invention.The present invention carries
A kind of interdigitated test structure supplied needs when carrying out failpoint test by the third metal knot of top layer on first direction
It is connected between adjacent short metal wire in structure.
As shown in fig. 6, by the form of short metal wire by the adjacent short metal in the third metal wire structure of top layer
It is connected between line, applies voltage on short metal wire 61, for providing test voltage for the third metal wire structure.
Preferably, by the third metal wire structure in arbitrary two the second metal wire structures as shown in fig. 6, connecting
It connects, and each short metal wire 61 is connected in a metal line, by giving a metal line to apply voltage, for being to be somebody's turn to do
The entire third metal wire structure of interdigitated test structure provides test voltage.
After the completion of testing failpoint, when being positioned to failpoint, the connection type is removed.
It should be noted that the connection type only illustrates by way of example in embodiments of the present invention, not
It is construed as limiting.
Based on the above-mentioned whole embodiments of the present invention, a kind of interdigitated test structure provided by the invention, by being arranged by more
The third metal wire structure that a short metal wire is constituted, and do not connect between the first metal wire structure and the second metal wire structure
It connects, it is at floating state；After the completion of test, by by the first metal wire structure grounding connection, being based on voltage contrast principle,
Under scanning electron microscope, bright contrast is presented in the first metal wire structure and the second metal wire structure, under normal circumstances when, due to
The short metal wire contrast at floating state that dull gray will be presented in third metal structure, when third metal wire structure and the second gold medal
Part between category cable architecture occurs bursting or the connection structure of the interdigitated test structure causes in third metal wire structure
Short metal wire be connected with the second metal wire structure, the short metal wire be connected at this time is no longer on floating state, also indirect earthed
Bright contrast is showed, the short metal wire not be connected with the second metal wire structure still shows the contrast of dull gray.That is,
The short metal line portions be connected with the second metal wire structure are failpoint position, compare and determine failpoint in the prior art
Approximate range, which has more been accurately positioned out the position of failpoint.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (9)
1. a kind of interdigitated test structure, which is characterized in that the interdigitated test structure includes：It is opposite in a first direction to set
The multiple metal structures set；
Wherein, the metal structure includes：First metal wire structure；Be vertically arranged with first metal wire structure connect it is more
The second metal wire structure of item；The third metal wire structure being set between adjacent two second metal wire structures；Described
Three metal wire structures be preset quantity short metal wire between arranged successively according to pre-determined distance, and arragement direction perpendicular to
First metal wire structure；The third metal wire structure and first metal wire structure and the second metal knot
It is not connected between structure；
It is connected with each other between first metal wire structure in said first direction；In said first direction described
It is connected with each other between adjacent short metal wire in three metal wire structures.
2. interdigitated test structure according to claim 1, which is characterized in that the third gold in said first direction
Both ends are attached respectively between belonging to the adjacent short metal wire in cable architecture.
3. interdigitated test structure according to claim 1, which is characterized in that first metal wire structure, described
Two metal wire structures and the third metal wire structure relative position immobilize.
4. interdigitated test structure according to claim 1, which is characterized in that is be oppositely arranged in a first direction is multiple
The distance between metal structure meets preset condition, and relative position immobilizes.
5. interdigitated test structure according to claim 1, which is characterized in that the first metal wire structure ground connection connects
It connects.
6. interdigitated test structure according to claim 1, which is characterized in that adjacent two second metal wire structures
The distance between it is equal.
7. interdigitated test structure according to claim 1, which is characterized in that the third metal wire structure is located at adjacent
The middle position of two second metal wire structures.
8. interdigitated test structure according to claim 1, which is characterized in that the quantity of second metal wire structure is
20 to 100.
9. interdigitated test structure according to claim 1, which is characterized in that the pre-determined distance between the short metal wire
For 40nm-200nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710772516.1A CN107579016B (en) | 2017-08-31 | 2017-08-31 | A kind of interdigitated test structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710772516.1A CN107579016B (en) | 2017-08-31 | 2017-08-31 | A kind of interdigitated test structure |
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| CN107579016A CN107579016A (en) | 2018-01-12 |
| CN107579016B true CN107579016B (en) | 2018-09-14 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7592827B1 (en) * | 2007-01-12 | 2009-09-22 | Pdf Solutions, Inc. | Apparatus and method for electrical detection and localization of shorts in metal interconnect lines |
| US7772590B2 (en) * | 2007-03-05 | 2010-08-10 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Metal comb structures, methods for their fabrication and failure analysis |
| CN104282594A (en) * | 2014-10-20 | 2015-01-14 | 武汉新芯集成电路制造有限公司 | Test structure for monitoring performance of dielectric layers |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8350583B2 (en) * | 2009-08-12 | 2013-01-08 | International Business Machines Corporation | Probe-able voltage contrast test structures |
| US9851398B2 (en) * | 2015-03-30 | 2017-12-26 | Globalfoundries Inc. | Via leakage and breakdown testing |
-
2017
- 2017-08-31 CN CN201710772516.1A patent/CN107579016B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7592827B1 (en) * | 2007-01-12 | 2009-09-22 | Pdf Solutions, Inc. | Apparatus and method for electrical detection and localization of shorts in metal interconnect lines |
| US7772590B2 (en) * | 2007-03-05 | 2010-08-10 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Metal comb structures, methods for their fabrication and failure analysis |
| CN104282594A (en) * | 2014-10-20 | 2015-01-14 | 武汉新芯集成电路制造有限公司 | Test structure for monitoring performance of dielectric layers |
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| CN107579016A (en) | 2018-01-12 |
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