CN107573104B - Ceramic part preparation method, ceramic part, fingerprint identification module and electronic equipment - Google Patents
Ceramic part preparation method, ceramic part, fingerprint identification module and electronic equipment Download PDFInfo
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- CN107573104B CN107573104B CN201710984304.XA CN201710984304A CN107573104B CN 107573104 B CN107573104 B CN 107573104B CN 201710984304 A CN201710984304 A CN 201710984304A CN 107573104 B CN107573104 B CN 107573104B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 202
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 331
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 194
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 97
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000005245 sintering Methods 0.000 claims abstract description 12
- 239000002344 surface layer Substances 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- 239000011159 matrix material Substances 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 239000010703 silicon Substances 0.000 claims description 19
- 239000013077 target material Substances 0.000 claims description 17
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 14
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000395 magnesium oxide Substances 0.000 claims description 10
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010884 ion-beam technique Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 18
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 66
- 229910052581 Si3N4 Inorganic materials 0.000 description 23
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 238000007747 plating Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 9
- 229910010271 silicon carbide Inorganic materials 0.000 description 9
- 239000007888 film coating Substances 0.000 description 7
- 238000009501 film coating Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
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- 239000011261 inert gas Substances 0.000 description 6
- 229910000484 niobium oxide Inorganic materials 0.000 description 6
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
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- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003666 anti-fingerprint Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
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Abstract
The embodiment of the application discloses a ceramic part preparation method, a ceramic part, a fingerprint identification module and electronic equipment. The method comprises the following steps: preparing a ceramic substrate; forming a color film layer on the surface of the ceramic substrate to obtain a color ceramic part, wherein the color film layer comprises at least one silicon dioxide film layer and at least one film layer corresponding to a material with a refractive index exceeding silicon dioxide, the silicon dioxide film layers and the film layers corresponding to the material with the refractive index exceeding silicon dioxide are alternately arranged, and the surface layer of the color film layer is the silicon dioxide film layer; and sintering the color ceramic part. By adopting the technical scheme, the bonding strength of the color film layer and the ceramic substrate is improved, and the situation that the color film layer on the surface of the ceramic part is partially peeled off can be effectively avoided.
Description
Technical Field
The embodiment of the application relates to a part preparation technology of electronic equipment, in particular to a ceramic part preparation method, a ceramic part, a fingerprint identification module and electronic equipment.
Background
With the development of material technology, ceramic products are increasingly used in electronic devices by virtue of the characteristics of fine texture, excellent hardness and wear resistance, good thermal stability and the like.
In order to meet the appearance requirements of people on electronic equipment, especially smart phones, ceramic parts used in electronic products are generally required to be colored so as to obtain colorful ceramic with various colors. However, in the related art, the stress of the film layer between the color layer and the ceramic part is large, which results in poor adhesion between the color layer and the ceramic part. The phenomenon that the color layer is partially peeled off easily occurs in the long-term use process of the electronic product, and the surface appearance shows larger color difference after the color layer is peeled off.
Disclosure of Invention
The embodiment of the application provides a ceramic part preparation method, a ceramic part, a fingerprint identification module and electronic equipment, which can increase the adhesive force between a color film layer and a ceramic substrate and effectively improve the corrosion resistance and the wear resistance of the ceramic part.
In a first aspect, an embodiment of the present application provides a method for manufacturing a ceramic component, including:
preparing a ceramic substrate;
forming a color film layer on the surface of the ceramic substrate to obtain a color ceramic part, wherein the color film layer comprises at least one silicon dioxide film layer and at least one film layer corresponding to a material with a refractive index exceeding silicon dioxide, the silicon dioxide film layers and the film layers corresponding to the material with the refractive index exceeding silicon dioxide are alternately arranged, and the surface layer of the color film layer is the silicon dioxide film layer;
and sintering the color ceramic part.
In a second aspect, embodiments of the present application further provide a ceramic component, which is prepared by the ceramic component preparation method according to the first aspect. Wherein, this ceramic part includes mobile terminal backshell apron, fingerprint identification apron, button or wearable equipment shell.
The third aspect, this application embodiment still provides a fingerprint identification module, and this fingerprint identification module includes above-mentioned second aspect fingerprint identification apron.
In a fourth aspect, embodiments of the present application further provide an electronic device, which includes the ceramic part according to the second aspect.
The embodiment of the application provides a preparation scheme of a ceramic part, which comprises the steps of preparing a ceramic substrate; forming a color film layer on the surface of the ceramic substrate to obtain a color ceramic part, wherein the color film layer comprises at least one silicon dioxide film layer and at least one film layer corresponding to a material with the refractive index exceeding that of silicon dioxide; carry out sintering treatment to this colored ceramic part for colour rete crystallization fuses with ceramic base member, and space and grain boundary between the rete reduce gradually until there is not obvious limit, thereby make each rete that the colour rete includes, and the stress between colour rete and the ceramic base member reduces, and adhesive force increases, improves joint strength, can avoid the condition that the colour rete part on ceramic part surface drops effectively to take place.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a ceramic part according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a gold-colored ceramic part provided by an embodiment of the present application;
FIG. 3 is a flow chart of another method for making a ceramic part according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a ceramic part provided in an embodiment of the present application;
fig. 5 is an exploded view of a fingerprint recognition module according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures.
Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the steps as a sequential process, many of the steps can be performed in parallel, concurrently or simultaneously. In addition, the order of the steps may be rearranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The shell of the smart phone comprises a plastic shell, a metal shell and the like, and although the cost of the plastic shell is low, the hand feeling and the appearance effect are poor when the smart phone is held, and the requirements of people cannot be met. If the metal casing is of an integrated structure, electrostatic shielding is easily caused to radio signals, and the antenna performance of the smart phone is affected, so that the metal casing is divided to be in a discontinuous state in a commonly used solving mode at present, and the antenna performance of the smart phone is not affected. The form of the dividing strip also affects the aesthetic property of the mobile phone shell, and the all-metal structure of the mobile phone shell cannot be realized.
In the related art, a scheme of using a ceramic material as a smart phone shell also appears, and a common scheme is to color the ceramic shell by using a coloring agent or plate a color layer on the surface of the ceramic shell. However, the ceramic shell is colored by immersing the ceramic shell into the coloring agent, so that the color gorgeous degree of the obtained colored ceramic part cannot meet the requirement; the method of plating the color layer on the surface of the ceramic part is adopted, and the problem that the color layer is easy to fall off due to the fact that the film layer between the color layer and the ceramic part has large stress and poor adhesive force caused by the difference of thermal expansion coefficients. The preparation scheme of the ceramic part provided by the embodiment of the application can well solve the problems that the color ceramic is not bright in appearance and a color layer is easy to fall off.
Fig. 1 is a flowchart of a method for manufacturing a ceramic component according to an embodiment of the present disclosure, which is suitable for a case of manufacturing a color ceramic component in which a color film layer is firmly bonded to a ceramic substrate. As shown in fig. 1, the method includes:
Wherein the ceramic base includes a ceramic material processed to have a predetermined structure. The ceramic substrate having a predetermined structure may be prepared by firing a ceramic material into a ceramic substrate by means of a predetermined mold. It is also possible to purchase the ceramic substrate already prepared directly.
The vacuum furnace is vacuumized, the higher the vacuum degree is, the better the film coating effect is, but the time spent on the vacuum operation is increased along with the increase of the vacuum degree, and the pressure in the vacuum furnace can be not less than 2 × 10 for balancing the time and the vacuum degree-3And when Pa, stopping the vacuum pumping operation.
And 120, forming a color film layer on the surface of the ceramic substrate to obtain the color ceramic part.
The color film layer comprises at least one silicon dioxide film layer and at least one film layer corresponding to a material with the refractive index exceeding silicon dioxide, the silicon dioxide film layers and the film layers corresponding to the material with the refractive index exceeding silicon dioxide are alternately arranged, and the surface layer of the color film layer is the silicon dioxide film layer. In order to meet the requirement of dirt resistance and easy cleaning of the surface of the ceramic part, a plating layer with low surface energy can be plated on the surface of the ceramic part to reduce the surface energy of the ceramic part, so that the passivation effect is achieved. Among them, the low surface energy material may be a low surface energy self-limiting organofluoride, which may also be referred to as an anti-fingerprint film. The low surface energy self-limiting organofluoro compound may be produced by Dajin, Xinyue, Dow Corning, etc. Since the main reactive group of the low surface energy self-limiting organofluorine compound is a condensation reaction with hydroxyl (Si — OH) groups on the surface of silica, but the surface of the ceramic part does not contain Si — OH, if such an organofluorine compound is used on the ceramic part, it is necessary to form a silica film layer on the surface layer of the ceramic part and then plate the low surface energy organofluorine compound. From the above, in order to be better combined with the anti-fingerprint film, the surface layer of the color layer needs to be a silicon dioxide film layer.
Optionally, the film layer corresponding to the material with the refractive index exceeding that of the silicon dioxide may be a single crystal silicon film layer, and further, the color film layer includes at least one silicon dioxide film layer and at least one single crystal silicon film layer. Because the monocrystalline silicon has good extinction characteristic (or called light absorption characteristic), the monocrystalline silicon can better absorb the light with the unwanted color and reflect the light with the wanted color, so that the surface color of the colored ceramic part is purer.
The number of layers and the thickness of each layer can be determined based on the optical curve matching the desired color of the ceramic part and the refractive index of the material of the layers. For example, the desired color is input into a set application program (the application program may match an optical curve corresponding to the desired colored ceramic according to an existing optical theoretical model, thereby determining the film thickness and the number of the films), an optical curve corresponding to the desired color is matched, and then a substance for forming each film is input, so that the thickness and the number of the films can be determined.
For example, the expected color is golden, silicon dioxide and monocrystalline silicon with different refractive indexes are used for forming color film layers, 5-7 layers of silicon dioxide film layers and monocrystalline silicon film layers are required to be alternately arranged through calculation of a set application program, the film coating time required for forming each film layer with the preset thickness is obtained, the film layers with the preset number are coated on the surface of the ceramic part through controlling the film coating time, the color film layers are formed on the surface of the ceramic part, and the ceramic part is enabled to be golden in appearance through the color film layers. Taking a golden ceramic part as an example, the thickness value range of the color film layer formed by alternately overlapping 7 layers (which can be 5 layers or 6 layers, if the silicon dioxide film layer and the monocrystalline silicon film layer in the color film layer are 6 layers in total, the overlapping sequence of the silicon dioxide film layer and the monocrystalline silicon film layer is different from that of the other two cases) of the silicon dioxide film layer and the monocrystalline silicon film layer is 700-800 nm. As shown in fig. 2, in order to obtain a gold-colored ceramic component, a first film layer 220, a second film layer 230, a third film layer 240, a fourth film layer 250, a fifth film layer 260, a sixth film layer 270, and a seventh film layer 280 are formed on the surface of the ceramic substrate 210 as a silicon dioxide film layer, a monocrystalline silicon film layer, and a silicon dioxide film layer, respectively. Wherein the thickness of each film layer is calculated by an application program.
For another example, the expected color is red, silica and monocrystalline silicon with different refractive indexes are used for forming color film layers, 7-9 layers of the silica film layers and the monocrystalline silicon film layers are required to be alternately arranged through calculation of a set application program, the film coating time required for forming each film layer with the preset thickness is obtained, the film layers with the preset number are coated on the surface of the ceramic part through controlling the film coating time, the color film layers are formed on the surface of the ceramic part, and the ceramic part is enabled to be red in appearance through the color film layers. Taking a red ceramic part as an example, the thickness value range of the color film layer formed by alternately overlapping 9 layers (which can be 7 layers or 8 layers, if the silicon dioxide film layer and the monocrystalline silicon film layer in the color film layer are 8 layers in total, the overlapping sequence of the silicon dioxide film layer and the monocrystalline silicon film layer is different from that of the other two cases) of the silicon dioxide film layer and the monocrystalline silicon film layer is 900-1000 nm.
It is understood that the number of layers and the thickness of each layer can be controlled to obtain colored ceramics with different colors, and the number of layers and the thickness of each layer are only examples and are not limited. For example, by controlling the thickness of each film layer, a blue ceramic part or the like can be obtained by sequentially laminating a silicon dioxide film layer and a single crystal silicon film layer 7 on the surface of the ceramic part.
The color film layer can be formed on the surface of the ceramic substrate in a vacuum coating mode, and the number of the film layers included in the color film layer and the thickness of each film layer can be calculated through the application program. Taking silicon dioxide and monocrystalline silicon as film materials to make the ceramic parts have golden appearance as an example, a mode of forming a color film on the surface of a ceramic substrate by adopting a vacuum coating mode is described. Silicon dioxide and monocrystalline silicon with preset thicknesses can be alternately plated on the surface of the ceramic part in a magnetron sputtering mode, and the area of the monocrystalline silicon film layer and the area of the silicon dioxide film layer are equal to the surface area of the ceramic substrate. The color film deposited on the surface of the ceramic substrate in a magnetron sputtering mode is compact in texture, and the color change of the color ceramic part is small and negligible after sintering. For example, a silicon target is used as a cathode target, a ceramic matrix is arranged at an anode, and silicon atoms are separated from the silicon target under the bombardment of inert gas and move towards the ceramic matrix at the anode under the action of an electric field. In order to plate silicon dioxide on the ceramic matrix, oxygen can be continuously introduced into the vacuum furnace to form an excess oxygen atmosphere, silicon atoms firstly react with oxygen to form silicon dioxide in the process of moving towards the ceramic matrix, then the silicon dioxide is attached to the surface of the ceramic matrix, and a silicon dioxide film layer with a preset thickness grows on the surface of the ceramic matrix. Stopping introducing oxygen into the vacuum furnace, discharging oxygen participating in the vacuum furnace, bombarding the silicon target material by adopting inert gas to obtain silicon atoms, moving the silicon atoms to the ceramic substrate positioned at the anode under the action of an electric field, and forming a layer of monocrystalline silicon film with preset thickness on the surface of the silicon dioxide film. And continuously introducing oxygen into the vacuum furnace again, bombarding the silicon target by adopting inert gas to obtain silicon atoms, reacting the silicon atoms separated from the silicon target with the oxygen to obtain silicon dioxide, and attaching the silicon dioxide to the surface of the monocrystalline silicon film layer under the action of the electric field to form a silicon dioxide film layer with a preset thickness. When the sum of the number of the film layers of the silicon dioxide and the monocrystalline silicon is less than 7 (the number of the film layers corresponding to the color film layers of the golden ceramic part), the operation of plating the silicon dioxide and the monocrystalline silicon is alternately executed by adopting the mode.
It is understood that the above listed ways of forming the color film layer of the golden color ceramic part are only examples and not limitations. For example, a single crystal silicon film layer with a preset thickness can be formed on the surface of the ceramic substrate by adopting a magnetron sputtering mode; secondly, forming a silicon dioxide film layer with a preset thickness on the surface of the monocrystalline silicon film layer; then, forming a layer of monocrystalline silicon film with a preset thickness on the surface of the silicon dioxide film; when the sum of the number of the film layers of the monocrystalline silicon and the silicon dioxide is less than 6 (the number of the film layers corresponding to the color film layers of the golden ceramic part), the operation of plating the silicon dioxide and the monocrystalline silicon is alternately executed by adopting the mode.
Optionally, at least one of the silicon nitride film layer, the silicon carbide film layer and the niobium oxide film layer is adopted to replace the monocrystalline silicon film layer. Also taking golden ceramic as an example, a silicon nitride film layer can be used for replacing one single crystal silicon film layer in the color film layers, and the specific film layer to be replaced can be determined by calculation according to an application program. The silicon nitride film layer can also be used for replacing two or more than two monocrystalline silicon film layers, and even can replace all the monocrystalline silicon film layers. However, the extinction characteristic of the silicon nitride film layer is not as good as that of the monocrystalline silicon film layer, and as the number of the silicon nitride film layers replacing the monocrystalline silicon film layers increases, the color purity of the surface of the golden ceramic part decreases. If the silicon nitride film layer is used for replacing the monocrystalline silicon film layer, the mode of alternately plating silicon dioxide, monocrystalline silicon and silicon nitride with preset thickness on the surface of the ceramic part by adopting a magnetron sputtering mode can be as follows: the silicon target material is used as a cathode target material, a ceramic matrix is arranged at the anode, and silicon atoms are separated from the silicon target material under the bombardment of inert gas and move to the ceramic matrix at the anode under the action of an electric field. In order to plate silicon nitride on the ceramic matrix, nitrogen gas can be continuously introduced into the vacuum furnace to form an excess nitrogen gas atmosphere, silicon atoms firstly react with the nitrogen gas to form silicon nitride in the process of moving towards the ceramic matrix, then the silicon nitride is attached to the surface of the ceramic matrix, and a silicon nitride film layer with a preset thickness grows on the surface of the ceramic matrix. The manner of forming the silicon dioxide on the surface of the silicon nitride film layer is the same as the manner of forming the silicon dioxide film layer on the monocrystalline silicon film layer, and the manner of forming the monocrystalline silicon film layer on the surface of the silicon dioxide film layer is the same as the corresponding steps, and the description thereof is omitted.
It can be understood that the manner of replacing the monocrystalline silicon film layer with the silicon carbide film layer or the niobium oxide film layer is similar to the replacement manner of the silicon nitride film layer, and the specific implementation process may refer to the manner of replacing the monocrystalline silicon film layer with the silicon nitride film layer, and details are not described here.
It is understood that one of the silicon nitride film layer, the silicon carbide film layer and the niobium oxide film layer may be used to replace the monocrystalline silicon film layer, and two of the above film layers may also be used to replace the monocrystalline silicon film layer. Taking the case of using the silicon carbide film layer and the silicon nitride film layer to replace the single crystal silicon film layer, at this time, the color film layer includes the silicon dioxide film layer, the single crystal silicon film layer (if completely replaced by the silicon carbide film layer and the silicon nitride film layer, the single crystal silicon film layer may not be included), the silicon nitride film layer, and the silicon carbide film layer. The monocrystalline silicon film can also be replaced by a silicon nitride film, a silicon carbide film and a niobium oxide film. In addition, at least one of the silicon nitride film layer, the silicon carbide film layer and the niobium oxide film layer is used to replace the monocrystalline silicon film layer, which is not limited, and other film layers corresponding to the material with the refractive index larger than that of silicon dioxide can be used to replace the monocrystalline silicon film layer.
Optionally, an evaporation coating mode may be adopted to form a color film layer on the surface of the ceramic substrate, however, the color film layer deposited on the surface of the ceramic substrate in the evaporation coating mode has sparse texture, and in the subsequent sintering process, the color change of the surface of the sintered color ceramic part may be large due to the grain size change.
Optionally, the color film layer further includes at least one of an aluminum oxide film layer, a magnesium oxide film layer, or a zirconium oxide film layer. At least one of an alumina film layer, a magnesia film layer or a zirconia film layer can be used for replacing the silica film layer in the color film layer, and it is noted that the silica film layer on the surface layer of the color film layer cannot be replaced. Which silicon dioxide film layer may be replaced, and the thickness of the replacement film layer, may be determined by the application. Taking a red ceramic part as an example, if the 1 st and 5 th silicon dioxide film layers can be replaced by aluminum oxide film layers through calculation, firstly forming an aluminum oxide film layer with a preset thickness on the surface of a ceramic substrate; secondly, forming a monocrystalline silicon film layer with a preset thickness on the alumina film layer; then, forming a silicon dioxide film layer with a preset thickness on the monocrystalline silicon film layer; when a 5 th layer of film is to be plated, replacing a silicon target material with an aluminum target material, and forming an aluminum oxide film layer on the 4 th layer of monocrystalline silicon film layer; when the 9 th film layer is to be plated, a silicon dioxide film layer is formed on the 8 th monocrystalline silicon film layer, so that a complete color film layer is formed on the surface of the ceramic part, and the color film layer enables the color ceramic part to present a red appearance.
It is understood that at least one of the alumina film layer, the magnesium oxide film layer, or the zirconia film layer may be used instead of the silica film layer, and two of the above-described film layers may also be used instead of the silica film layer. Taking the case of using an alumina film layer and a magnesium oxide film layer instead of the monocrystalline silicon film layer, in this case, the color film layer includes a silica film layer, a monocrystalline silicon film layer, an alumina film layer, and a magnesium oxide film layer. The single crystal silicon film layer can also be replaced by an aluminum oxide film layer, a magnesium oxide film layer and a zirconium oxide film layer, and at the moment, the color film layer comprises a silicon dioxide film layer, a single crystal silicon film layer, an aluminum oxide film layer, a magnesium oxide film layer and a zirconium oxide film layer. In addition, the use of at least one of an alumina film layer, a magnesium oxide film layer, and a zirconium oxide film layer instead of a silica film layer is merely an example, and is not limited thereto
And 130, sintering the color ceramic part.
Because the surface layer of the color film layer of the color ceramic part is a silicon dioxide film layer, the last film coating operation is performed in an oxygen atmosphere, the oxygen in the vacuum furnace needs to be discharged, and nitrogen is continuously introduced into the vacuum furnace to ensure that the vacuum furnace is in the nitrogen atmosphere. The heating vacuum furnace enables the temperature of the colorful ceramic parts in the furnace to rise to a preset temperature, the preset temperature is maintained for a preset time, the colorful film crystals and the ceramic matrix are fused into a whole, the boundaries of the two crystal faces are gradually fused until no obvious boundary exists, the stress between the films is reduced, the adhesive force is increased, and the problem that the local color of the colorful ceramic parts drops can be effectively prevented.
In the technical scheme of the embodiment, a ceramic substrate is prepared; forming a color film layer on the surface of the ceramic substrate to obtain a color ceramic part, wherein the color film layer comprises at least one silicon dioxide film layer and at least one film layer corresponding to a material with the refractive index exceeding that of silicon dioxide; carry out sintering treatment to this colored ceramic part for colour rete crystallization fuses with ceramic base member, and space and grain boundary between the rete reduce gradually until there is not obvious limit, thereby make each rete that the colour rete includes, and the stress between colour rete and the ceramic base member reduces, and adhesive force increases, improves joint strength, can avoid the condition that the colour rete part on ceramic part surface drops effectively to take place.
Fig. 3 is a flow chart of another method for manufacturing a ceramic component according to an embodiment of the present disclosure.
The setting structure may be a structure corresponding to a rear case cover plate of the mobile terminal, a structure corresponding to a volume key or a power key, a structure corresponding to a wearable device housing, and the like.
The ceramic substrate having the above structure may be provided by an external manufacturer, or may be self-fired by using a mold corresponding to the above structure.
And 320, cleaning the ceramic substrate.
Before coating a film layer on the surface of the ceramic substrate, the surface of the ceramic substrate needs to be cleaned, so that the surface is prevented from being polluted to influence the film coating effect. For example, the ceramic substrate may be cleaned by ultrasonic cleaning or manual wiping.
And 330, fixing the ceramic substrate in a vacuum furnace.
And hanging the ceramic substrate after the cleaning treatment in a vacuum furnace. Wherein, the vacuum furnace can simultaneously realize vacuum sputtering and sintering operation.
And 340, preheating and vacuumizing the vacuum furnace.
In this case, the preheating operation is not a step that must be performed, and only the vacuum furnace may be vacuumized after the ceramic substrate is fixed in the vacuum furnace.
And 350, performing surface cleaning treatment on the ceramic substrate by using ion beams.
And controlling the low-pressure ion beam to uniformly scan the surface of the ceramic matrix so as to remove impurities on the surface of the ceramic matrix.
And 360, forming monocrystalline silicon film layers and silicon dioxide film layers which are alternately arranged on the surface of the ceramic substrate by taking silicon as a target material and adopting a magnetron sputtering process.
For example, the manner of forming the color film layer on the surface of the ceramic substrate may include:
step one, taking silicon as a target material, continuously introducing oxygen into a vacuum furnace, and forming a silicon dioxide film layer with a preset thickness on the surface of the ceramic substrate by adopting a magnetron sputtering process. Wherein, the magnetron sputtering process conditions can be as follows: sputtering pressure is 0.3-1.23 Pa, sputtering power is 1.2-2.4 KW, sputtering time is 3-10 min and is related to film thickness, sputtering temperature is 220-300 ℃, and oxygen is continuously introduced into the vacuum furnace during the sputtering time.
And step two, stopping introducing oxygen into the vacuum furnace when the sputtering time is up, discharging residual oxygen in the vacuum furnace, and forming a monocrystalline silicon film layer with a preset thickness on the surface of the silicon dioxide film layer by adopting a magnetron sputtering process. The sputtering process conditions are similar to the process described in step one, except that no oxygen is introduced, and are not described herein again.
And step three, when the sputtering time is up, continuously introducing oxygen into the vacuum furnace, and forming a silicon dioxide film layer with a preset thickness on the surface of the monocrystalline silicon film layer by adopting a magnetron sputtering process. Wherein, the sputtering process conditions are the same as the process described in the first step, and are not described herein again.
And step four, when the number of the film layers is less than the preset number of layers, circularly executing the step two and the step three to alternately plate the monocrystalline silicon film layers and the silicon dioxide film layers, wherein the surface layers of the color film layers are the silicon dioxide film layers.
Optionally, the method of plating the silicon dioxide film layer, the monocrystalline silicon film layer, the silicon nitride film layer, and the aluminum oxide film layer on the surface of the ceramic substrate with silicon as the first target material and aluminum as the second target material may be:
step one, calculating the number of film layers, the thickness of the film layers and the distribution of film layer materials required by achieving the expected color through an application program;
and step two, according to the calculation result, firstly plating a layer of alumina with a preset thickness on the surface of the ceramic substrate, wherein the realization mode can be that a second target material is adopted, and aluminum atoms are separated from the second target material under the bombardment of inert gas and move towards the ceramic substrate positioned at the anode under the action of an electric field. In order to plate alumina on the ceramic matrix, oxygen can be continuously introduced into the vacuum furnace to form an excess oxygen atmosphere, aluminum atoms firstly react with oxygen to form alumina in the process of moving towards the ceramic matrix, then the alumina is attached to the surface of the ceramic matrix, and an alumina film layer with a preset thickness grows on the surface of the ceramic matrix.
And thirdly, plating monocrystalline silicon with a preset thickness on the surface of the aluminum oxide film layer, wherein the realization mode can be that oxygen in the vacuum furnace is exhausted, a first target material is adopted, silicon atoms are separated from the first target material under the bombardment of inert gas and move towards the ceramic substrate under the action of an electric field, and the monocrystalline silicon film layer with the corresponding preset thickness is arranged on the surface of the aluminum oxide film layer.
And step three, forming a silicon dioxide film layer on the surface of the monocrystalline silicon film layer.
And step four, forming a silicon nitride film layer on the surface of the silicon dioxide film layer, wherein the implementation mode can be similar to the silicon dioxide film layer plating mode, and the difference is that the continuous oxygen feeding into the vacuum furnace is changed into the continuous nitrogen feeding into the vacuum furnace, and the description is omitted here.
And step five, alternately plating preset film layers before reaching the number of the film layers corresponding to the calculation result to obtain a color film layer, wherein the surface layer of the color film layer is a silicon dioxide film layer.
And 370, heating the color ceramic part to 600-700 ℃, and maintaining the temperature of the color ceramic part at 600-700 ℃ for a preset time length.
And (4) discharging oxygen in the vacuum furnace, and continuously introducing nitrogen into the vacuum furnace to ensure that the vacuum furnace is in an excessive nitrogen atmosphere. And heating the vacuum furnace to raise the temperature of the color ceramic parts in the furnace to 600-700 ℃, and maintaining the temperature for about 10min to melt the color film crystals and the ceramic matrix into a whole.
According to the technical scheme of the embodiment, the ceramic parts are cleaned for multiple times before the ceramic parts are coated with the film, so that the situation that impurities on the surfaces of the ceramic parts increase the stress between the film layers to cause the color film layers to easily fall off can be effectively avoided; meanwhile, the coating process and the sintering process are accurately controlled, so that the appearance and the performance of the colored ceramic part can meet the requirements of bright color, difficult falling and the like, and the product reject ratio is reduced.
Fig. 4 is a schematic cross-sectional view of a ceramic component according to an embodiment of the present disclosure. The ceramic part is prepared by the ceramic part preparation method provided by the embodiment of the invention. As shown in fig. 4, the ceramic part includes:
a ceramic base 410 having a structure matching the ceramic part;
the surface of the ceramic substrate 410 includes a color film layer 420 for making the ceramic substrate to present a color appearance; the color film layer 420 includes at least one silicon dioxide film layer 421 and at least one film layer 422 corresponding to a material having a refractive index exceeding silicon dioxide, the silicon dioxide film layers 421 and the film layers 422 corresponding to a material having a refractive index exceeding silicon dioxide are alternately disposed, and the surface layer of the color film layer 420 is the silicon dioxide film layer 421. The color film layer 420 is fused with the surface of the ceramic substrate 410 through a sintering process.
The technical scheme of this embodiment provides a ceramic part, and its colour rete crystallization fuses with ceramic base member, and space and grain boundary between the rete reduce gradually until there is not obvious limit to make each rete that the colour rete includes, and the stress between colour rete and the ceramic base member reduces, and adhesive force increases, improves joint strength, can avoid the condition emergence that the colour rete on ceramic part surface drops partially effectively.
Optionally, the ceramic part includes a mobile terminal rear shell cover plate, a fingerprint identification cover plate, a key or a wearable device housing.
Optionally, the film layer corresponding to the material with the refractive index exceeding that of silicon dioxide comprises a monocrystalline silicon film layer.
Optionally, at least one of a silicon nitride film layer, a silicon carbide film layer and a niobium oxide film layer is used to replace the monocrystalline silicon film layer.
Optionally, the color film layer further includes at least one of an aluminum oxide film layer, a magnesium oxide film layer, or a zirconium oxide film layer.
Fig. 5 is an exploded view of a fingerprint identification module according to an embodiment of the present application. As shown in fig. 5, the fingerprint identification module includes a fingerprint identification cover 510, a metal ring 520, a fingerprint chip 530, a flexible circuit board 540 and a printed circuit board 550, which are sequentially disposed. The fingerprint identification cover plate 510 is made of a ceramic part provided by the embodiment of the application.
The fingerprint identification module that this application embodiment provided, through adopting the colored ceramic part that this application embodiment provided as fingerprint identification apron, when satisfying the display effect requirement, have superstrong anticorrosive and the high characteristics of wearability, prolonged the life of fingerprint identification module.
Fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present application. As shown in fig. 6, the electronic device includes a rear case back plate 610, a volume button 620, and a power button 630. At least one of the rear housing backplate 610, the volume button 620 and the power button 630 is made of the ceramic parts provided by the embodiments of the present application.
The electron that this application embodiment provided is established not, through adopting the colored ceramic part that this application embodiment provided as backshell backplate, volume button and/or power button, when satisfying the display effect requirement, has superstrong anticorrosive and the high characteristics of wearability, avoids the local condition emergence that drops influence electronic equipment outward appearance of colour rete.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present application and the technical principles employed. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the application. Therefore, although the present application has been described in more detail with reference to the above embodiments, the present application is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the appended claims.
Claims (9)
1. A method of making a ceramic part, comprising:
preparing a ceramic substrate including preparing a ceramic substrate having a set structure;
cleaning the ceramic substrate;
fixing the ceramic substrate in a vacuum furnace;
preheating and vacuumizing treatment are carried out aiming at the vacuum furnace, and the preheating operation is not a step which is required to be executed;
performing surface cleaning treatment on the ceramic substrate by adopting ion beams;
taking silicon as a target material, and alternately forming a silicon atomic layer and a silicon dioxide film layer on the surface of the ceramic substrate by adopting a magnetron sputtering process to obtain the color ceramic part, wherein the color film layer of the color ceramic part comprises at least one silicon dioxide film layer and at least one silicon atomic layer, and the surface layer of the color film layer is the silicon dioxide film layer;
and sintering the color ceramic part.
2. The method of claim 1, comprising:
the area of the silicon atomic layer and the area of the silicon dioxide film layer are equal to the surface area of the ceramic matrix.
3. The method according to claim 1, wherein silicon is used as a target material, and a magnetron sputtering process is adopted to alternately form a silicon atomic layer and a silicon dioxide film layer on the surface of the ceramic substrate, and the method comprises the following steps:
step one, taking silicon as a target material, continuously introducing oxygen into a vacuum furnace, and forming a silicon dioxide film layer with a preset thickness on the surface of the ceramic substrate by adopting a magnetron sputtering process;
stopping introducing oxygen into the vacuum furnace, discharging residual oxygen in the vacuum furnace, and forming a silicon atom layer with a preset thickness on the surface of the silicon dioxide film layer by adopting a magnetron sputtering process;
continuously introducing oxygen into the vacuum furnace, and forming a silicon dioxide film layer with a preset thickness on the surface of the silicon atomic layer by adopting a magnetron sputtering process;
and step four, when the number of the film layers is less than the preset number of layers, circularly executing the step two and the step three.
4. The method of claim 1, wherein the color film layer further comprises at least one of an aluminum oxide film layer, a magnesium oxide film layer, or a zirconium oxide film layer.
5. The method of claim 1, wherein the sintering the colored ceramic part comprises:
heating the color ceramic part to 600-700 ℃, and maintaining the temperature of the color ceramic part at 600-700 ℃ for a preset time length.
6. A ceramic part produced by the method for producing a ceramic part according to any one of claims 1 to 5.
7. The ceramic part of claim 6, wherein the ceramic part comprises a mobile terminal back case cover, a fingerprint identification cover, a key, or a wearable device housing.
8. A fingerprint identification module characterized in that, fingerprint identification module includes the fingerprint identification apron of claim 7.
9. An electronic device characterized by comprising the ceramic part according to claim 6.
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| CN108642461A (en) * | 2018-04-23 | 2018-10-12 | 维沃移动通信有限公司 | A kind of manufacturing method and shell of shell |
| CN108585952A (en) * | 2018-05-15 | 2018-09-28 | 潮州三环（集团）股份有限公司 | A kind of chromatic ceramics |
| CN109704815A (en) * | 2019-02-28 | 2019-05-03 | 东莞信柏结构陶瓷股份有限公司 | Colored zirconia ceramics and preparation method thereof |
| CN112981351B (en) * | 2021-05-06 | 2021-08-03 | 蓝思科技（长沙）有限公司 | Preparation method of non-metal absorption gradient film, film-provided device and electronic product |
| CN115505879A (en) * | 2022-09-30 | 2022-12-23 | 广州市博泰光学科技有限公司 | Optical lens coating method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH03271197A (en) * | 1990-03-19 | 1991-12-03 | Kojundo Chem Lab Co Ltd | Method for forming silicon-based thin film |
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| CN101633287B (en) * | 2008-07-23 | 2012-12-12 | 比亚迪股份有限公司 | Plastic shell and method for preparing same |
| US20160238759A1 (en) * | 2015-02-18 | 2016-08-18 | Materion Corporation | Near infrared optical interference filters with improved transmission |
| CN107117829A (en) * | 2016-02-25 | 2017-09-01 | 蓝思科技股份有限公司 | A kind of glassware and preparation method thereof |
| CN106534418A (en) * | 2016-12-21 | 2017-03-22 | 广东欧珀移动通信有限公司 | Shell, manufacturing method and mobile terminal |
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