CN107570245A - A kind of self-loopa micro-fluidic chip and its production and use - Google Patents
A kind of self-loopa micro-fluidic chip and its production and use Download PDFInfo
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Abstract
The invention discloses a kind of self-loopa micro-fluidic chip and its production and use.The micro-fluidic chip includes top-down microfluidic layer, driven by electroosmosis layer and chip base layer, the driven by electroosmosis layer limits separate fluidic channel and width/narrow electrode liquid metal flow passage with microfluidic layer and chip base layer respectively, solution and liquid metal to be driven are perfused with respectively in fluidic channel and wide/narrow electrode liquid metal flow passage, wherein described driven by electroosmosis layer and wide/narrow electrode liquid metal flow passage are in interdigitated, and wide/narrow electrode liquid metal flow passage is completely covered in the lower surface of the driven by electroosmosis layer, the upper surface of driven by electroosmosis layer is exposed in fluidic channel, the both ends of wide/narrow electrode liquid metal flow passage are connected by four metal electrodes with power supply respectively.The micro-fluidic chip of the present invention possesses the advantages that small volume, integrated level are high, portable, stability is good, and also very simple is easy by its preparation technology, it is low to prepare cost, has a wide range of application.
Description
Technical field
The invention belongs to microfluid conveying technology field, more particularly to a kind of self-loopa micro-fluidic chip and preparation method thereof
And purposes.
Background technology
Micro-fluidic chip is because the features such as its required sample volume is small, detection efficiency is high, use cost is low, is in biology
Field is widely used.With developing to biological micro-fluidic chip to multifunctional integrated direction, especially to biology
Cell realizes the demand of dynamic cultivation so that micro-fluidic chip must possess the self-driven function of chip of no external equipment pump valve.
And existing transfer tube majority is all to need huge external equipment source, it can not realize that the convenient type of chip carries, and and equipment
The installation in source is all complex.
What driving microfluid was commonplace at present is to use mechanical Micropump, and its driving force ratio is larger, and response speed compares
It hurry up, be the main flow of micro-fluidic field application.But mechanical Micropump is difficult to be miniaturized because its is complicated, and its type of drive
Check valve and the Micro blazed-grating of dynamic sealing be present, movable part is because abrasion occurs in long-term use, if material goes out
Existing fatigue has more aggravated the phenomenon of Micro blazed-grating, it is difficult to accurate conveying microlitre and microlitre below rank fluid.And fluid
Transport the problems such as discontinuous, pulsation occurs.
For problem above, many enterprises and R＆D institution start to turn to research non-mechanical Micropump, i.e., how by non-machine
Tool can be changed into the kinetic energy of microfluid.Based on such idea, external many researchers start theoretical using EOF
To make the electroosmotic pump of stable performance.Electroosmotic pump overcomes a series of shortcomings of mechanical Micropump well, and by changing electricity
Pressure and frequency can realize integrated pump valve with the flow of accurate control of fluid.By largely investigating, industrialization on the market at present
Electroosmotic pump is less, and the direct current electroosmotic pump of early stage is because its operating voltage is high, can produce substantial amounts of Joule heat during work, solution exists
Substantial amounts of bubble can be also produced to electrode surface, while with solution cell reaction can occur for metal material manufacture electrode, cause electricity
The consumption of pole and the denaturation of solution, this integrated and pump security to micro-fluidic chip all cause a series of problem.
The content of the invention
Present invention is primarily intended to overcome the deficiencies in the prior art, there is provided a kind of to be realized certainly by exchanging electric osmose driving principle
Micro-fluidic chip of circulation and its production and use, the micro-fluidic chip possesses small volume, portable, stability is good, integrated
The advantages that spending height, sound construction, simple and easy manufacture craft.
In order to achieve the above object, present invention employs following technical scheme：
A kind of self-loopa micro-fluidic chip, including top-down microfluidic layer, driven by electroosmosis layer and chip base layer,
The driven by electroosmosis layer limits separate fluidic channel and width/narrow electrode with microfluidic layer and chip base layer respectively
Liquid metal runner, solution to be driven and liquid are perfused with respectively in fluidic channel and wide/narrow electrode liquid metal flow passage
Metal, wherein the driven by electroosmosis layer and wide/narrow electrode liquid metal flow passage are in interdigitated, and under the driven by electroosmosis layer
Wide/narrow electrode liquid metal flow passage is completely covered in surface, and the upper surface of driven by electroosmosis layer is exposed in fluidic channel, wide/narrow
The both ends of electrode liquid metal flow passage are connected by four metal electrodes with power supply respectively.Liquid in wide electrode liquid metal flow passage
Liquid metal in state metal and narrow electrode liquid metal flow passage polarizes the driven by electroosmosis layer for making its surface, so that with
The solution of driven by electroosmosis layer contact produces induced charge, and the electric charge of the induced charge and driven by electroosmosis layer forms electric double layer.
In the presence of external electrical field, induced charge layer is acted on by Coulomb force, make electric charge occur displacement, so as to drag solution to
Fixed-direction moves, and EOF is formed, so as to form dynamic self-loopa microfluid system.
As the improved technical scheme of the present invention, the driven by electroosmosis layer is mainly combined by PDMS and carbon material.Adopt
It is compound with carbon material with PDMS, both driven by electroosmosis layer can be made to possess electric conductivity, enable again driven by electroosmosis layer preferably with it is micro-
Fluid layer and the bonding of chip base layer.
Further, the carbon material includes the one or more in graphene, CNT, porous carbon, carbon fiber.
Preferably, the dosage of the carbon material is 2%wt~40%wt of PDMS dosages.When carbon material is very few, PDMS
It is poor with the compound rear electric conductivity of carbon material；When carbon material is excessive, overall structures of the PDMS with carbon material after compound is fragile, easy
Burst apart, be not easy secondary operation；And when carbon material and PDMS limited proportion are in the scope, in solution close to driven by electroosmosis layer one
Side is not likely to produce bubble.
As the improved technical scheme of the present invention, it is described in driven by electroosmosis layer close to the side of fluid channel covered with carbon materials
Material.The carbon material possesses higher specific surface area, can increase electric charge storage capacity, so as to increase driven by electroosmosis efficiency.
Preferably, the thickness of the carbon material is 1~5 μm.
As the improved technical scheme of the present invention, the width of the driven by electroosmosis layer of the wide electrode district is 10~200 μm, institute
The width for stating the driven by electroosmosis layer of narrow electrode district is 5~50 μm, the driven by electroosmosis of the wide electrode district of a pair of interdigitateds and narrow electrode district
The spacing of layer is 5~50 μm, and the spacing of two adjacent electrode pairs is 10~50 μm.
As the improved technical scheme of the present invention, the liquid metal runner uses back-shaped interdigital runner or/and single fork
Refer to runner.
Preferably, the width of the wide electrode liquid metal flow passage is 5~80 μm, the narrow electrode liquid metal flow passage
Width is 1~20 μm.
As the improved technical scheme of the present invention, the fluidic channel includes cell culture insert, in cell culture insert
It is provided with columnar arrays.
Preferably, the microtrabeculae gap of the columnar arrays is 3~13 μm.
Further, the microchannel structural design is circularized closed, and cell suspension filling is provided with cell culture insert both sides
Enter hole.
In order to prepare the self-loopa micro-fluidic chip of said structure, present invention employs following method：(1) PDMS is utilized
Microfluidic layer and chip base layer are prepared, (2) are combined with each other using PDMS and carbon and prepare driven by electroosmosis layer, and (3) are by microfluid
Layer, driven by electroosmosis layer and chip base layer are bonded together according to order from top to down, and (4) are in wide/narrow electrode liquid metal
Runner both ends make four liquid metals and pour into hole, and microfluid is made in fluidic channel and pours into hole, and (5) are by liquid metal
Poured into microfluid in liquid metal runner and fluidic channel, four metal electrodes are inserted liquid metal and pour into hole by (6), so
Connected afterwards with power supply.
As the improved technical scheme of the present invention, driven by electroosmosis layer of the invention is made with the following method：Using PDMS,
Curing agent and carbon material mix after-pouring on the silicon chip with interdigital pattern, face corresponding with silicon chip are struck off, so
Solidify afterwards are molded, and recycle the unwanted region of laser incising eating away, and driven by electroosmosis layer, the top view of the driven by electroosmosis layer is made
For wide electrode district and the separate interdigitated knot of narrow electrode district.
Alternatively, the driven by electroosmosis layer is made with the following method：It is wide/narrow that band interdigitated is prepared first with PDMS
The chip basic unit of electrode liquid metal flow passage, after being then well mixed PDMS, curing agent and carbon material, load squash type 3D and beat
In print machine, 3D printer shower nozzle is allowed to be scanned along wide electrode liquid metal flow passage and narrow electrode liquid metal flow passage top so that
The upper surface of liquid metal runner is completely covered in mixture, curing molding, driven by electroosmosis layer is made.
Preferably, the dosage of the carbon material is 2~40%wt of PDMS dosages, and the curing agent is the 5 of PDMS dosages
~20%wt.
As the improved technical scheme of the present invention, before curing molding, first one layer is covered on uncured mixture surface
Carbon material.
The present invention also provides the purposes of above-mentioned self-loopa micro-fluidic chip, be mainly used in cell culture under dynamic environment,
The In vivo models such as cell detection, the flowing of cell screening or simulation blood in the blood vessels.When for cell in micro-fluidic chip
Dynamic environment under culture when, it is possible to achieve flow velocity, flow direction it is electrodeless adjustable, cell is observed in the liquid of flowing
Growth conditions.
Compared with prior art, the present invention possesses following technique effect：
1. the present invention makes electrodeless adjustable electroosmotic pump using driven by electroosmosis is theoretical, EOF moves pulse free during driving
Phenomenon, fluid motion are continuous.Driving liquid can be changed by the size, frequency and switching voltage direction that adjust input voltage
Flow and flow direction, whole device do not have moving component, good without wear phenomenon, stability.Alternating current is relative to straight simultaneously
Stream electricity can realize the driving of very little voltage, will not produce substantial amounts of Joule heat, smaller to impact cell.
2. present invention employs interdigitated electrode structure, inner conductive electrode is irrigated using liquid metal or using vacuum
The method for sucking metal liquid, preparation method are simple, it is possible to achieve very trickle wire arrangements.
3. micro-nano process technology is combined by the present invention with 3D printing technique, make the micro-structural of some high-aspect-ratios can be with
It is transferred to by way of directly extruding on microstructure, avoids some that micro-nano processing high aspect ratio structure is molded and lack
Fall into.
4. driven by electroosmosis layer is compound using PDMS and carbon material so that PDMS possesses certain electric conductivity, and be easier to and
Microfluidic layer and chip base layer prepared by PDMS is bonded together securely.As one layer of carbon material of its surface adhesion, Ke Yigeng
Electric double layer is formed with solution well, more electric charges, the delivery efficiency of elevator pump, and the device is stored and is not easy to occur instead with solution
Should, will not sacrificial electrode material, the component of solution will not be changed.
5. driven by electroosmosis area is separated from each other with cell culture zone position, electric current will not reduce electric current to cell by cell
Influence.
Brief description of the drawings
Fig. 1 is the overall structure figure of micro-fluidic chip；
Fig. 2 is the Structure explosion diagram of micro-fluidic chip；
The schematic diagram of Fig. 3 laser ablation driven by electroosmosis layers；
Fig. 4 is the schematic diagram of 3D printing driven by electroosmosis layer；
Fig. 5 is the perspective view of self-loopa micro-fluidic chip working region.
Embodiment
In order that it will be apparent to those skilled in that legibly understand the present invention, in conjunction with embodiment and accompanying drawing,
The present invention is described in detail.
Explanation of nouns：Driven by electroosmosis layer 2 is the conduction material for referring to make the solution in fluidic channel that induced charge occurs
The bed of material.It can be PDMS- carbon composites, and the material that can also possess electric conductivity by some other is made, such as super
Positive/negative material, the PDMS-Ag composites used in capacitor.
Liquid metal runner includes wide electrode liquid metal flow passage 203 and narrow electrode liquid metal flow passage 204.Wide/narrow electricity
Pole liquid metal runner (203/204) is finger beam electrode solution state metal flow passage 203 or/and narrow electrode liquid metal flow passage 204
Referred to as.
PDMS- carbon composites 208 refer to the material being combined with each other by PDMS and carbon, can be physical blendings, also may be used
Be using carbon material chemical modification PDMS so that PDMS produce electric conductivity be made.
PDMS：Dimethyl silicone polymer (polydimethylsiloxane)
Embodiment 1
As depicted in figs. 1 and 2, self-loopa micro-fluidic chip of the invention includes top-down microfluidic layer 1, electric osmose is driven
Dynamic layer 2 and chip base layer 3.The driven by electroosmosis layer 2 limits mutually solely with microfluidic layer 1 and chip base layer 3 respectively
Vertical fluidic channel and wide/narrow electrode liquid metal flow passage (203/204).In fluidic channel and wide/narrow electrode liquid gold
Solution and liquid metal to be driven are perfused with respectively in category runner (203/204).Wherein described driven by electroosmosis layer 2 and wide/narrow electricity
Pole liquid metal runner (203/204) is in interdigitated, and wide/narrow electrode is completely covered in the lower surface of the driven by electroosmosis layer 2
Liquid metal runner (203/204), the upper surface of driven by electroosmosis layer 2 are exposed in fluidic channel.In wide/narrow electrode liquid gold
The both ends of category runner (203/204) are connected by four metal electrodes 4 with the output port of AC power 6 respectively.AC power 6
Frequency range in 10-40kHz, voltage range is in 5-100Vpp.Preferably, AC power 6 can be using pcb board as bottom plate, thereon
It is integrated with direct current and becomes the miniature conversion module of exchange, is assembled with micro-fluidic chip basalis 3, carried out by miniature lithium ion battery
Power supply (not shown).
Wherein, the width of the driven by electroosmosis layer 2 of the wide electrode district 205 is 10~200 μm, the narrow electrode district 206
The width of driven by electroosmosis layer 2 is 5~50 μm, the driven by electroosmosis layer 2 of the wide electrode district 205 of a pair of interdigitateds and narrow electrode district 206
Spacing is 5~50 μm, and the spacing of two adjacent electrode pairs (205/206) is 10~50 μm.The liquid metal runner (203/
204) back-shaped interdigital runner or/and single interdigital runner are used.The width of the wide electrode liquid metal flow passage 203 be 5~
80 μm, the width of the narrow electrode liquid metal flow passage 204 is 1~20 μm.
When the micro-fluidic chip of the present invention is used for cell dynamic cultivation, fluidic channel can be designed to ring seal
Formula, cell culture insert 101 is provided with fluidic channel, the dykes and dams of columnar arrays composition are provided with cell culture insert 101
103, the microtrabeculae gap of columnar arrays is 3~13 μm.The both sides of cell culture insert 101 are provided with cell suspension and pour into area 102.
Cell suspension is poured into fluidic channel by pouring into area 102, then the both positive and negative polarity of power supply 6 is led on metal electrode 4 respectively, is adjusted
Economize on electricity pressure and frequency, liquid start to drive, and cell suspension starts to move along some direction, when cell passes through cell culture insert
When 101, the dykes and dams 103 that cell is cultured in pond 101 are intercepted, and cell is built up on the surface of dykes and dams 103, and nutrient solution can then pass through dike
The gap on dam 103 moves.Thus, cell carries out adherent growth in cell culture insert 101.Continued power, it can make at cell
In the state of dynamic cultivation.
Embodiment 2
The preparation technology of microfluidic layer 1 is as follows：PMDS colloids 20g is mixed with curing agent 2g, in planet batch mixer
Middle rotation 1min, then the PDMS liquid glues mixed are put into vacuum drying ware and carry out vacuumizing 10min, by what is made
Figuratum silicon chip is first put into the culture dish for being covered with aluminium-foil paper, and it is horizontal to ensure that silicon chip is placed.A lucifuge glass is placed into afterwards
Among ware, instill trim,ethylchlorosilane solution 2 and drip, taken out after stifling 2min.The PDMS liquid state colloids prepared have been cast in
On the silicon chip of figure, place into vacuum drying ware and vacuumize 10min, be put into after taking-up in 85 DEG C of baking ovens and toast 30min.Take out
PDMS after solidification is cut according to the sideline of pattern, and the planar dimension of microfluidic layer 1 is 5cm × 2cm, with card punch in phase
Wide electrode liquid metal flow passage 203, narrow electrode liquid metal flow passage 204 and the microfluid answered pour into area 102 and punch diameter respectively
For 1mm through hole.
The preparation technology of driven by electroosmosis layer 2 is as follows：PDMS colloids 20g and chloroform 100ml are dissolved each other, stir 10min.
Functionalized multi-wall carbonnanotubes powder 1.8g is mixed with porous carbon dust 1g, 10min is ground in mortar, is poured into
Among chloroform 100ml.Ultrasonic agitation 1h is carried out in 40kHz supersonic cleaning machines.Prepared after taking-up by the solution and before
PDMS/ chloroformic solutions are mixed, and are put into 40kHz supersonic cleaning machines ultrasonic agitation 2h.After taking-up, carried out in 80 DEG C of heating plates
8h is toasted, until solvent forms colloidal state.The solution prepared is put into 60 DEG C of vacuum drying oven baking 2h again.By the slurry
It is coated on aluminium foil, with doctor blade, is put into three-roll grinder and is rolled, by material again from aluminium-foil paper after rolling is good
On scrape off and be put into reagent bottle.2g curing agent solutions are added in slurry, 1min is rotated in planet batch mixer, this is mixed
Close solution and be put into vacuum drying ware progress vacuumize process, taken out after 10min.The silicon chip with interdigitated pattern made is first
The culture dish for being covered with aluminium-foil paper is put into, it is horizontal to ensure that silicon chip is placed.Place into afterwards among a lucifuge glass dish, instill front three
Base chlorosilane solution 2 drips, and is taken out after stifling 2min.The mixed solution prepared is coated on silicon chip, upper surface entered with scraper
Row strikes off processing.It is put into 85 DEG C of baking ovens and toasts 30min, solidifies PDMS.Semi-finished product after the completion of solidification, it is close to silicon chip
Side possesses wide/narrow electrode irrigation canals and ditches of interdigitated, after the chip base of the semi-finished product and plane is bonded together, may make up interdigital
Wide/narrow electrode liquid metal flow passage (203/204) of shape.Above-mentioned semi-finished product are cut by laser, removes unwanted part, makes
Width/narrow electrode district (205/206) that semi-finished product are divided into separate driven by electroosmosis layer 2 is obtained, as shown in Figure 3.The electric osmose
Drive width/narrow electrode district (205/206) of layer 2 viewed from above, it can be seen that clearly interdigitated configuration.In interdigital structure
It is upper to carry out pouring into 4 correspondence positions in region 207 in liquid metal that to get through aperture be 1mm holes.
The preparation technology of chip base layer 3 is as follows：Using PDMS colloids one is made using the preparation technology of microfluidic layer 1
The rectangle frame 301 of driven by electroosmosis layer 2 be able to be accommodated, is then bonded together with glass, forms chip base layer 3.Or use
PDMS colloids produce a rectangular channel that be able to accommodate driven by electroosmosis layer 2 using the preparation technology of microfluidic layer 1, directly as
Chip base layer 3.
Assembling：Chip base layer 3, driven by electroosmosis layer 2 and microfluidic layer 1 are put into plasma cleaner, are passed through oxygen, etc.
Ion Cleaning 20s.The bottom of driven by electroosmosis layer 2 and the top of chip base layer 3 are fitted together after taking-up, by microfluidic layer 1
Bottom is bonded with the top of driven by electroosmosis layer 2, and hole is alignd.85 DEG C of baking oven baking 30min, bonding are put into after posting
Finish.
Liquid filling：It is 1mm by external diameter, the internal diameter 0.5mm 4 hollow core metal electrodes 4 made by silvery are inserted into be made before
4 through holes on the microfluidic layer 1 performed, are inserted into bottom, and gallium is heated into 40 DEG C, and gold is passed through with the syringe for connecing sebific duct
Belong to electrode 4, make in its runner full of interdigital electrode area.Wherein, using point gum machine by silicon rubber to the top of microfluidic layer 1 with gold
Category electrode 4 contact site is sealed.The metal reperfusion mode of driven by electroosmosis layer 2, if using non-back-shaped interdigital runner design,
Need chip being put into vacuum plastic envelope, then vacuumize process, the absolute pressure of vacuum here are carried out by vacuum plastic sealing machine
Scope is between 0.1-0.5MPa.Vacuum takes plastic packaging bag apart after standing 24h, and liquid metal is poured into hollow metal electrode 4
It is interior.Due to PDMS breathing characteristics, certain negative pressure in material internal be present, metal liquid can be full of whole driven by electroosmosis workspace
Interdigital runner in.
Use：Wide/narrow electrode liquid metallic tines in the chip base layer 3 refer to structure and connect respectively by metal electrode 4
Two ports that indirect current source 6 exports.The frequency range of AC power 6 is in 20kHz, and voltage range is in 50Vpp.Microfluid
Flow velocity is 0.3 μm/s, and bubble-free produces after being continuously powered 1 day, and electrode does not have to react with solution.
Embodiment 3
Embodiment 3 is substantially the same manner as Example 2, and difference is the preparation technology of driven by electroosmosis layer 2, specific as follows：
PDMS colloids 20g and chloroform 100ml are dissolved each other, stir 10min.By functionalized multi-wall carbonnanotubes powder
1.8g is mixed with porous carbon dust 1g, and 10min is ground in mortar, is poured among chloroform 100ml.In 40kHz ultrasounds
Ultrasonic agitation 1h is carried out in cleaning machine.The solution is mixed with the PDMS/ chloroformic solutions prepared before after taking-up, is put into
2h is stirred by ultrasonic in 40kHz supersonic cleaning machines.After taking-up, baking 8h is carried out in 80 DEG C of heating plates, until solvent forms colloidal
State.The solution prepared is put into 60 DEG C of vacuum drying oven baking 2h again.The slurry is coated on aluminium foil, scraped with scraper
It is flat, it is put into three-roll grinder and is rolled, material is scraped off from aluminium-foil paper again after rolling is good and is put into reagent bottle.
2g curing agent solutions are added in slurry, rotate 1min in planet batch mixer, the mixed solution is put into vacuum drying ware is carried out
Vacuumize process, take out after 10min.The silicon chip with interdigitated pattern made first is put into the culture dish for being covered with aluminium-foil paper,
It is horizontal to ensure that silicon chip is placed.Place into afterwards among a lucifuge glass dish, instill trim,ethylchlorosilane solution 2 and drip, fumigate
Taken out after 2min.The mixed solution prepared is coated on silicon chip, upper surface is carried out with scraper to strike off processing, then in its upper table
Face covers one layer of carbon fiber, and the thickness of carbon fiber is subsequently placed into 85 DEG C of baking ovens to control at 5 μm and toasts 30min, consolidate PDMS
Change.Semi-finished product after the completion of solidification, it is close to the side of silicon chip and possesses wide/narrow electrode irrigation canals and ditches of interdigitated, when the semi-finished product are with putting down
After the chip base in face is bonded together, wide/narrow electrode liquid metal flow passage (203/204) of interdigitated may make up.By above-mentioned half
Finished product is cut by laser, and removes unwanted part so that semi-finished product be divided into the width of separate driven by electroosmosis layer 2/
Narrow electrode district (205/206).The width of the driven by electroosmosis layer 2/narrow electrode district (205/206) is viewed from above, it can be seen that clear
Clear interdigitated configuration.4 correspondence positions for carrying out pouring into region 207 on interdigital structure in liquid metal get through aperture and are
1mm holes.
Use：Wide/narrow electrode liquid metallic tines in the chip base layer 3 refer to structure and connect respectively by metal electrode 4
Two ports that indirect current source 6 exports.The frequency range of AC power 6 is in 20kHz, and voltage range is in 50Vpp.Microfluid
Flow velocity is 0.5 μm/s, and bubble-free produces after being continuously powered 1 day.
Embodiment 4
The preparation technology of microfluidic layer 1 is the same as embodiment 2.
The preparation of chip base layer 3：PDMS colloids 10g is mixed with curing agent 1g, rotated in planet batch mixer
1min, then PDMS liquid glues are put into vacuum drying ware and carry out vacuumizing 10min, the interdigitated pattern that has that will be made
Silicon chip is first put into the culture dish for being covered with aluminium-foil paper, and it is horizontal to ensure that silicon chip is placed.Place among a lucifuge glass dish, drip afterwards
Enter trim,ethylchlorosilane solution 2 to drip, taken out after stifling 2min, obtain the good silicon chip of photoetching.PDMS is poured on the good silicon chip of photoetching
On, it is put into baking oven baking 30min.Cut after taking-up, obtain the chip base layer 3 with wide/narrow electrode irrigation canals and ditches of interdigitated.Its
Outside Dimensions are 5cm × 2cm.
The preparation technology of driven by electroosmosis layer 2：PDMS colloids, conductive black, curing agent are taken according to 10:4:1 ratio is carried out
Mixing, is put into planet batch mixer and is mixed, and the slurry after being well mixed is poured into squash type 3D printer.3D printer sprays
Head is scanned along the top of wide electrode liquid metal flow passage and narrow electrode liquid metal flow passage, and sweep speed is set in
0.5mm/s, squeeze pressure 500psi, slurry are covered on wide electrode liquid metal flow passage and narrow electrode liquid metal flow passage
Portion, closed channel is formed with three faces of wide/narrow electrode irrigation canals and ditches of runner interdigitated of chip base layer 3, as shown in Figure 4.Wide electricity
The floor height of polar region printing is 8 layers, and thickness is 300 μm, and the floor height of narrow electrode district is 16 layers, and thickness is 60 μm.Treat that PDMS solidifies
Afterwards, driven by electroosmosis layer 2 is that making finishes.4 correspondence positions for carrying out pouring into region 207 on interdigital structure in liquid metal are beaten
Through hole footpath is 1mm holes.
Assembling：Chip base layer 3 together, the assembly of driven by electroosmosis layer 2 and microfluidic layer 1 will be had been incorporated into be put into
Ion Cleaning machine, it is passed through oxygen, plasma cleaning 20s.The bottom of microfluidic layer 1 and the top of driven by electroosmosis layer 2 are entered after taking-up
Row fitting, hole is alignd.85 DEG C of baking oven baking 30min are put into after posting, bonding finishes.
Liquid filling is the same as embodiment 2.
Use：Wide/narrow electrode liquid metallic tines in the chip base layer 3 refer to structure and connect respectively by metal electrode 4
Two ports that indirect current source 6 exports.The frequency range of AC power 6 is in 20kHz, and voltage range is in 50Vpp.Microfluid
Flow velocity is 0.35 μm/s, and bubble-free produces after being continuously powered 1 day, and electrode does not react with solution.
Embodiment 5
The difference of the present embodiment and embodiment 4 is the preparation technology of driven by electroosmosis layer 2：
PDMS colloids, conductive black, curing agent are taken according to 10:2:0.5 ratio is mixed, and is put into planet batch mixer
Row mixing, the slurry after being well mixed are poured into squash type 3D printer.3D printer shower nozzle is along wide electrode flow of liquid metal
The top of road and narrow electrode liquid metal flow passage is scanned, and sweep speed is set in 0.5mm/s, and squeeze pressure is
500psi, slurry are covered in wide electrode liquid metal flow passage and narrow electrode liquid metal flow passage top, the stream with chip base layer 3
Three faces of wide/narrow electrode irrigation canals and ditches of road interdigitated form closed channel.The floor height of wide electrode district printing is 8 layers, and thickness is 300 μ
M, the floor height of narrow electrode district is 16 layers, and thickness is 60 μm.Graphene conversion is carried out on Kapton with laser, with this
Pattern is affixed on printed slurry, and the graphene of one layer of 5 μ m-thick is so attached on printed wide/narrow electrode district
Powder.After PDMS solidifications, driven by electroosmosis layer 2 is that making finishes.Carry out pouring into region 207 in liquid metal on interdigital structure
4 correspondence positions to get through aperture be 1mm holes.
Use：Wide/narrow electrode liquid metallic tines in the chip base layer 3 refer to structure and connect respectively by metal electrode 4
Two ports that indirect current source 6 exports.The frequency range of AC power 6 is in 10kHz, and voltage range is in 5Vpp.Microfluid
Flow velocity is 0.5 μm/s, and bubble-free produces after being continuously powered 1 day, and electrode does not react with solution.
Embodiment 6
The difference of the present embodiment and embodiment 4 is the preparation technology of driven by electroosmosis layer 2：
PDMS colloids, porous carbon, curing agent are taken according to 10:2:2 ratios are mixed, and are put into planet batch mixer and are mixed
Close, the slurry after being well mixed is poured into squash type 3D printer.3D printer heads along wide electrode liquid metal flow passage with
And the top of narrow electrode liquid metal flow passage is scanned, sweep speed is set in 0.5mm/s, squeeze pressure 500psi, slurry
Material is covered in wide electrode liquid metal flow passage and narrow electrode liquid metal flow passage top, the runner interdigitated with chip base layer 3
Three faces of wide/narrow electrode irrigation canals and ditches form closed channel.The floor height of wide electrode district printing is 8 layers, and thickness is 300 μm, narrow electrode
The floor height in area is 16 floor, and thickness is 60 μm.Graphene conversion is carried out on Kapton with laser, is affixed on the pattern
On printed slurry, the graphene powder of one layer of 1 μ m-thick is so attached on printed wide/narrow electrode district.Treat
After PDMS solidifications, driven by electroosmosis layer 2 is that making finishes.Carried out on interdigital structure liquid metal pour into 4 of region 207 it is right
It is 1mm holes to answer position to get through aperture.
Use：Wide/narrow electrode liquid metallic tines in the chip base layer 3 refer to structure and connect respectively by metal electrode 4
Two ports that indirect current source 6 exports.The frequency range of AC power 6 is in 40kHz, and voltage range is in 100Vpp.Microfluid
Flow velocity be 0.38 μm/s, it is continuous be powered 1 day after bubble-free produce, electrode does not react with solution.
Obviously, above-described embodiment is used for the purpose of clearly demonstrating example, rather than the limitation to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.As long as made on the basis of the embodiment of the present invention
The change scheme of common-sense, among protection scope of the present invention.
Claims (10)
1. a kind of self-loopa micro-fluidic chip, including top-down microfluidic layer, driven by electroosmosis layer and chip base layer, institute
State driven by electroosmosis layer and limit separate fluidic channel and width/narrow electrode solution with microfluidic layer and chip base layer respectively
State metal flow passage, solution to be driven and liquid gold are perfused with respectively in fluidic channel and wide/narrow electrode liquid metal flow passage
Category, wherein the driven by electroosmosis layer and wide/narrow electrode liquid metal flow passage are in interdigitated, and the following table of the driven by electroosmosis layer
Wide/narrow electrode liquid metal flow passage is completely covered in face, and the upper surface of driven by electroosmosis layer is exposed in fluidic channel, wide/narrow electricity
The both ends of pole liquid metal runner are connected by four metal electrodes with power supply respectively.
2. self-loopa micro-fluidic chip according to claim 1, it is characterised in that：The driven by electroosmosis layer is mainly by PDMS
It is combined with carbon material；Preferably, the carbon material include graphene, CNT, porous carbon, one kind in carbon fiber or
It is a variety of；Preferably, the dosage of the carbon material is 2~40%wt of PDMS dosages.
3. self-loopa micro-fluidic chip according to claim 1, it is characterised in that：In driven by electroosmosis layer close to fluid channel
Side is covered with carbon material.
4. self-loopa micro-fluidic chip according to claim 1, it is characterised in that：The driven by electroosmosis layer of the wide electrode district
Width be 10~200 μm, the width of the driven by electroosmosis layer of the narrow electrode district is 5~50 μm, the wide electrode district of a pair of interdigitateds
Spacing with the driven by electroosmosis layer of narrow electrode district is 5~50 μm, and the spacing of two adjacent electrode pairs is 10~50 μm.
5. self-loopa micro-fluidic chip according to claim 1, it is characterised in that：The liquid metal runner is using back-shaped
Interdigital runner or/and single interdigital runner；Preferably, the width of the wide electrode liquid metal flow passage is 5~80 μm, described narrow
The width of electrode liquid metal flow passage is 1~20 μm.
6. self-loopa micro-fluidic chip according to claim 1, it is characterised in that：The fluidic channel is trained including cell
Pond is supported, columnar arrays are provided with cell culture insert；Preferably, the microtrabeculae gap of the columnar arrays is 3~13 μm；It is preferred that
Ground, the microchannel structural design circularize closed, and cell culture insert both sides are provided with cell suspension and pour into hole.
7. the preparation method of the self-loopa micro-fluidic chip as described in claim any one of 1-6, comprises the following steps：（1）Profit
Microfluidic layer and chip base layer are prepared with PDMS,（2）It is combined with each other using PDMS and carbon and prepares driven by electroosmosis layer,（3）Will
Microfluidic layer, driven by electroosmosis layer and chip base layer are bonded together according to order from top to down,（4）In wide/narrow electrode solution
State metal flow passage both ends make four liquid metals and pour into hole, and microfluid is made in fluidic channel and pours into hole,（5）By liquid
Metal and microfluid are poured into liquid metal runner and fluidic channel,（6）Four metal electrodes are inserted into liquid metal to pour into
Hole, then connected with power supply.
8. according to the method for claim 7, it is characterised in that：After being mixed using PDMS, curing agent and carbon material
It is cast on the silicon chip with interdigital pattern, face corresponding with silicon chip is struck off, then curing molding, recycles laser incising eating away
Unwanted region, is made driven by electroosmosis layer, and the top view of the driven by electroosmosis layer is mutually only for wide electrode district and narrow electrode district
Vertical interdigitated configuration；Or the chip basic unit with wide/narrow electrode liquid metal flow passage of interdigitated is prepared first with PDMS, so
After being afterwards well mixed PDMS, curing agent and carbon material, it is fitted into squash type 3D printer, makes 3D printer shower nozzle electric along width
Pole liquid metal runner and the scanning of narrow electrode liquid metal flow passage top so that the upper of liquid metal runner is completely covered in mixture
Surface, curing molding, driven by electroosmosis layer is made.
9. according to the method for claim 8, it is characterised in that：Before curing molding, first on uncured mixture surface
Cover one layer of carbon material.
10. the purposes of the self-loopa micro-fluidic chip as described in claim any one of 1-6, it is characterised in that：For dynamic ring
The flowing of cell culture, cell detection, cell screening or simulation blood in the blood vessels under border.
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