CN107567202A - Circuit board assemblies and its manufacture method - Google Patents
Circuit board assemblies and its manufacture method Download PDFInfo
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- CN107567202A CN107567202A CN201710750397.XA CN201710750397A CN107567202A CN 107567202 A CN107567202 A CN 107567202A CN 201710750397 A CN201710750397 A CN 201710750397A CN 107567202 A CN107567202 A CN 107567202A
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- circuit board
- temperature
- lds
- board assemblies
- solder
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Abstract
The present invention relates to technical field of electronic equipment, more particularly to a kind of circuit board assemblies and its manufacture method.The circuit board assemblies include：Circuit board, element, the solder joint for being welded and fixed circuit board and element and the high-temperature plastic being wrapped in outside solder joint, also it is molded outside circuit board assemblies and is higher than injection temperature formed with housing, the heat distortion temperature of high-temperature plastic.The circuit board assemblies of the present invention have welding and be connecteds the advantages of reliable, at the same the limitation to injected plastics material less, Shooting Technique condition it is not harsh, and solder is not leaded used by welding, with it is environmentally friendly, safe the characteristics of.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of circuit board assemblies and its manufacture method.
Background technology
Nowadays, increasing intelligent electronic device (especially Intelligent worn device) requires more frivolous, smaller
Fuselage appearance, this assembling just to the circuit board assemblies inside such frivolous or miniaturized electronics propose it is higher will
Ask.If using split type assembling, because space is limited, structural strength of the assembling difficulty greatly and after assembling be not high, it is difficult to reach
To the quality requirement of product.Therefore currently employed injection molding technology makes circuit board assemblies form an entirety with Plastic implant,
With realize electronic equipment it is lightening or miniaturization purpose.But this technique easily produces other quality in injection moulding process and asked
Topic, such as because injection high temperature and high pressure can cause the solder joint on circuit board assemblies to melt and be rushed to open, and then cause element to lose
Go the fixation of solder joint and produce displacement, product quality problem occur.
The content of the invention
It is an object of the invention to provide a kind of circuit board assemblies and its manufacture method, with solve available circuit board component because
The problem of solder joint caused by Shooting Technique is washed open after melting, element displacement.
One side, the present invention provide a kind of circuit board assemblies, and the circuit board assemblies include：Circuit board, element, use
In the solder joint for being welded and fixed the circuit board and the element and the high-temperature plastic being wrapped in outside the solder joint, the circuit
Also it is molded formed with housing outside board component, the heat distortion temperature of the high-temperature plastic is higher than injection temperature.
Further, the high-temperature plastic is hot-setting adhesive or uv-curable glue.
Further, the heat distortion temperature of the high-temperature plastic is more than or equal to 320 DEG C.
Further, the high-temperature plastic is wrapped in the outside of the part element around the solder joint.
Further, the housing is plastic cement.
Further, injection temperature when injection forms the housing outside the circuit board assemblies is 280-295 DEG C.
Alternatively, the one kind or several of the housing in ABS, PET, PC, PP, PS, TPU, TPE, TPR, LDS material
Kind.
Alternatively, the circuit board uses PCB, FPC or solderable LDS circuit boards.
In the present invention, the element refers to electronic component, the element include resistance, electric capacity, inductance, diode,
Triode etc. is usually used in the part of electronic equipment.In addition, pin is typically provided on the element, can be by the member by pin
Part is electrically connected with the circuit board.
Alternatively, the solder that the solder joint uses is the one or more in unleaded tin solder, silver solder or spelter solder.
Further, the fusing point for the solder that the solder joint uses is 205-220 DEG C.
In the present invention, unleaded tin solder refers on the premise of without metallic lead component, using tin mainly to form into
Point solder, other main constituents such as copper, and secondary constituent such as iron, zinc, aluminium etc. can also be included in the solder.
Similarly, silver solder refers to the solder using silver as main constituents, can also include metallic copper, i.e. the solder can be silver-bearing copper
Alloy；Spelter solder can be ormolu.
Second aspect, the present invention provide a kind of manufacture method of foregoing circuit board component, comprised the following steps：
Welding：Soldered circuit board and element are to form the junction shape of circuit board assemblies, the circuit board and the element
Into solder joint；
Dispensing：By dispensing in the solder joint outer wrap high-temperature plastic；
Injection molding：Injection forms housing outside the circuit board assemblies；
Wherein, the heat distortion temperature of the high-temperature plastic is higher than injection temperature.
Further, the high-temperature plastic is hot-setting adhesive or uv-curable glue.
Further, the heat distortion temperature of the high-temperature plastic is more than or equal to 320 DEG C.
For example, the heat distortion temperature of the high-temperature plastic be 320 DEG C, 330 DEG C, 350 DEG C, 370 DEG C, 400 DEG C, 420 DEG C or
450℃。
Further, the high-temperature plastic is wrapped in the outside of the part element around the solder joint.
Further, the housing is plastic cement.
Further, injection temperature when injection forms the housing outside the circuit board assemblies is 280-295 DEG C.
Wherein, the injection temperature is the 280-295 DEG C of any point value included in the number range, such as the injection
Temperature is 280 DEG C, 285 DEG C, 288 DEG C, 290 DEG C, 292 DEG C or 295 DEG C.
Alternatively, the one kind or several of the housing in ABS, PET, PC, PP, PS, TPU, TPE, TPR, LDS material
Kind.
Wherein, ABS (Acrylonitrile Butadiene Styrene plastic) is acrylonitrile-butadiene-benzene second
Alkene plastics.PET (Polyethylene terephthalate) is polyethylene terephthalate.PC
(Polycarbonate) it is makrolon.PP (Polypropylene) is high polymer polypropylene.PS (Polystyrene) is poly-
Styrene.TPU (Thermoplastic polyurethanes) is TPUE rubber.TPE
(Thermoplastic Elastomer) and TPR (ThermopPastic Rubber) are thermoplastic elastomers.
Alternatively, the circuit board uses PCB, FPC or solderable LDS circuit boards.
Wherein, LDS (Laser Direct Structuring) refers to laser direct structuring technique, solderable LDS circuits
Plate refers to electricity being coated with metal circuit pattern by the surface that LDS technologies are formed, being welded between electronic component
Road plate.
Further, the circuit board uses solderable LDS circuit boards, and the manufacture method is further comprising the steps of：
Before the welding step, processing forms the solderable LDS circuit boards.
Further, described processing the step of forming the solderable LDS circuit boards, is：LDS materials are carried out for the first time
Injection molding, laser activation and chemical plating are carried out successively to the LDS materials after shaping, metallic pattern are formed in LDS material surfaces,
Obtain the solderable LDS circuit boards.
Further, described processing the step of forming the solderable LDS circuit boards, is：First time injection is carried out to plastic cement
Shaping, and plastic surface coating activating substance after shaping, the plastic cement for being coated with activating substance is carried out successively laser activation and
Chemical plating, metallic pattern is formed in plastic surface, obtains the solderable LDS circuit boards.
In the present invention, the element refers to electronic component, the element include resistance, electric capacity, inductance, diode,
Triode etc. is usually used in the part of electronic equipment.In addition, pin is typically provided on the element, can be by the member by pin
Part is electrically connected with the circuit board.Alternatively, the solder that the solder joint uses is unleaded tin solder, silver solder or spelter solder
In one or more.
Further, the fusing point for the solder that the solder joint uses is 205-220 DEG C.
In the present invention, unleaded tin solder refers on the premise of without metallic lead component, using tin mainly to form into
Point solder, other main constituents such as copper, and secondary constituent such as iron, zinc, aluminium etc. can also be included in the solder.
Similarly, silver solder refers to the solder using silver as main constituents, can also include metallic copper, i.e. the solder can be silver-bearing copper
Alloy；Spelter solder can be ormolu.
Compared with prior art, the present invention possesses following beneficial effect：
First, ensure circuit board assemblies is welded to connect reliability.To ensure that circuit board assemblies and housing can form one
Individual entirety, there is the characteristics of frivolous, miniaturization, the two is molded using Shooting Technique.In the present invention, to the two progress
Before injection, the dispensing parcel high-temperature plastic outside the solder joint of circuit board Yu element junction, and the thermal deformation of the high-temperature plastic
Temperature (being more than or equal to 320 DEG C) is higher than the temperature (between 280-295 DEG C) being molded to circuit board assemblies and housing, therefore
High-temperature plastic still non-fusible consistency in the case where being molded high temperature can be ensured using technical scheme, keep good and glue
Property, even if solder joint solder (solder melt point is 205-220 DEG C) is melted in the case where being molded high temperature, also fixed all the time by high-temperature plastic
Firmly, it will not be flushed away because of injection high pressure, therefore the fixation to element can be remained, ensure that element will not be high because of injection high temperature
Press and shift, finally ensure that the reliability being welded to connect.Preferably to ensure that element does not shift effect, the present invention is preferred to be expanded
The parcel scope of high-temperature plastic, on the basis of parcel solder joint outside, the subelement near solder joint is further wrapped,
To strengthen the fixation to element, ensure that element does not shift.
Second, injected plastics material is limited few, and Shooting Technique condition is not harsh.In the present invention, injection temperature that use more often selects
The Shooting Technique condition such as degree and pressure, rather than higher low temperature injection is required to using technique and material selection.It is applicable at present
Only have a few materials such as silica gel in the material of low temperature injection, in general plastic material can not meet that low temperature injection requires.It is in addition, low
Temperature injection is respectively provided with compared with rigors for technique and equipment.By comparison, Shooting Technique of the invention is joined for material, technique
The requirement of number and equipment is not harsh, and the less-restrictive especially to materials'use, in general plastic material can meet this hair
Bright Shooting Technique requirement.
3rd, welding uses solder not leaded, and the feature of environmental protection is good, safe.
Brief description of the drawings
Fig. 1 is the structural representation of the circuit board assemblies of embodiment one；
Fig. 2 is one of distressed structure of the circuit board assemblies of embodiment one；
Fig. 3 is the welding step schematic diagram of manufacture method in embodiment one；
Fig. 4 is the dispensing step schematic diagram of manufacture method in embodiment one；
Fig. 5 is the injection-moulding step schematic diagram of manufacture method in embodiment one；
Fig. 6 is the structural representation of the circuit board assemblies of embodiment two.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
The every other embodiment that art personnel are obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
It should be noted that the term " comprising " and " having " of the embodiment of the present invention and their any deformation, it is intended that
Be to cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, product or equipment not
Be necessarily limited to those steps or the unit clearly listed, but may include not list clearly or for these processes, side
The intrinsic other steps of method, product or equipment or unit.
Embodiment one
The present embodiment provides a kind of circuit board assemblies, as shown in figure 1, the circuit board assemblies include：Circuit board 1, element 2,
Solder joint 3 and high-temperature plastic 4.Wherein, it is welded and fixed between circuit board 1 and element 2, and the place of being welded to connect of the two forms solder joint 3,
For the solder used at solder joint 3 for unleaded tin solder, the fusing point of the tin solder is about 215 DEG C.High-temperature plastic 4 is wrapped in solder joint 3
Outside, played for butt welding point 3 and strengthen fixed effect, the heat distortion temperature of the high-temperature plastic is more than 320 DEG C.In circuit board
The outside of component is also enclosed with housing 5 by injection molding process, and the injection temperature in this injection molding process is 280 DEG C.
Housing 5 uses ABS material in the present embodiment, actually also can use other plastic materials, example according to use demand
Such as the one or more in PET, PC, PP, PS, TPU, TPE, TPR, LDS material.In addition, the circuit board of the present embodiment can be adopted
With PCB, FPC plates can be also used, can also use other common circuit forms.High-temperature plastic in the present embodiment can be with
Using hot-setting adhesive, uv-curable glue can be also used.It is understood that in the present embodiment, element refers to electronic component, member
Part includes the part that resistance, electric capacity, inductance, diode, triode etc. are usually used in electronic equipment, can be actually needed according to circuit board
The function of realization welds different elements.In addition, being typically provided pin on element, element is electrically connected with circuit board by pin
Connect.
As a kind of technical scheme of optimization, as shown in Fig. 2 the hot-setting adhesive 4 of the present embodiment is wrapped in the outside of solder joint 3
Meanwhile the outside of the subelement 2 around solder joint 3 is also further wrapped in, to strengthen the fixation to element.
The manufacture method of the circuit board assemblies of the present embodiment comprises the following steps：
Welding：As shown in figure 3, soldered circuit board 1 and element 2 are to form the company of circuit board assemblies, circuit board 1 and element 2
The place of connecing forms solder joint 3, and solder is unleaded tin solder, and the unleaded tin solder fusing point is about 215 DEG C；
Dispensing：As shown in figure 4, by dispensing in the outer wrap high-temperature plastic 4 of solder joint 3, the thermal deformation temperature of the high-temp glue
Degree is more than 320 DEG C；
Injection molding：As shown in figure 5, injection forms housing 5 outside circuit board assemblies, and injection temperature is 280 DEG C.
In the present embodiment, high-temperature plastic first is wrapped to form in the outside dispensing of solder joint, then to circuit board assemblies and housing
Material is molded, and because the heat distortion temperature of high-temperature plastic is higher than injection temperature, therefore even if injection high temperature makes to be located at high temperature resistant
Solder joint inside glue melts, the still non-fusible consistency of high-temperature plastic, remains its viscosity, can be to being wrapped in its inside
Solder joint plays effective fixation, solder joint is not also injection molding high pressure in the blown state and washes away, final to ensure electronics member
Device position fixes non-wiping effect, ensures welding and the reliability being connected.
Embodiment two
The present embodiment provides a kind of circuit board assemblies, as shown in fig. 6, the circuit board assemblies include：Circuit board 1, element 2,
Solder joint 3 and high-temperature plastic 4.Wherein, it is welded and fixed between circuit board 1 and element 2, and the place of being welded to connect of the two forms solder joint 3,
For the solder used at solder joint 3 for unleaded tin solder, the fusing point of the tin solder is about 215 DEG C.High-temperature plastic 4 is wrapped in solder joint 3
Outside, played for butt welding point 3 and strengthen fixed effect, the heat distortion temperature of the high-temperature plastic is more than 320 DEG C.In circuit board
The outside of component is also enclosed with housing 5 by injection molding process, and the injection temperature in this injection molding process is 280 DEG C.
Housing 5 uses ABS material in the present embodiment, actually also can use other plastic materials, example according to use demand
Such as the one or more in PET, PC, PP, PS, TPU, TPE, TPR, LDS material.High-temperature plastic in the present embodiment can use
Hot-setting adhesive, it can also use uv-curable glue.It is understood that in the present embodiment, element is as circuit board and electronics member
Connector between device, one end of element are then electrically connected with welding circuit board, the other end with electronic component.
The present embodiment and the main distinction of embodiment one are that the circuit board 1 in the present embodiment uses solderable LDS circuits
Plate, rather than pcb board or FPC plates, therefore in manufacture method, the present embodiment is additionally included in before welding step first processing formation can
Weld LDS circuit boards.Specifically, the manufacture method of the circuit board assemblies of the present embodiment comprises the following steps：
Processing forms solderable LDS circuit boards：First time injection molding is carried out from LDS materials, to the LDS materials after shaping
Material carries out laser activation and chemical plating successively, forms metallic circuit figure in LDS material surfaces, obtains solderable LDS circuit boards；
Welding：Solderable LDS circuit boards and element are welded to form circuit board assemblies, solderable LDS circuit boards and element
Junction formed solder joint；
Dispensing：By dispensing in solder joint outer wrap high-temperature plastic；
Injection molding：Injection forms housing outside circuit board assemblies, and injection temperature is 280 DEG C.
In the present embodiment, high-temperature plastic first is wrapped to form in the outside dispensing of solder joint, then to circuit board assemblies and housing
Material is molded, and because the heat distortion temperature of high-temperature plastic is higher than injection temperature, therefore even if injection high temperature makes to be located at high temperature resistant
Solder joint inside glue melts, the still non-fusible consistency of high-temperature plastic, remains its viscosity, can be to being wrapped in its inside
Solder joint plays effective fixation, solder joint is not also injection molding high pressure in the blown state and washes away, final to ensure electronics member
Device position fixes non-wiping effect, ensures welding and the reliability being connected.
Embodiment three
The present embodiment is differed only in embodiment two, and the step for forming solderable LDS circuit boards is processed in the present embodiment
Rapid different, in the present embodiment, the step of forming solderable LDS circuit boards, is：From plastic material be molded into for the first time
Type, and plastic surface coating activation film after shaping or ink is as activating substance, to be coated with the plastic cement of activating substance according to
Secondary progress laser activation and chemical plating, metallic circuit figure is formed in plastic surface, obtains solderable LDS circuit boards.Wherein, mould
Glue material uses ebonite, such as ABS, PC, PP or PS.
Above to a kind of circuit board assemblies and its manufacture method disclosed in the embodiment of the present invention.It is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the present invention, the explanation of above example is only intended to
Help to understand method and its core concept of the invention；Meanwhile for those of ordinary skill in the art, the think of according to the present invention
Think, in specific embodiments and applications there will be changes, in summary, this specification content should not be construed as pair
The limitation of the present invention.
Claims (10)
- A kind of 1. circuit board assemblies, it is characterised in that：Including circuit board, element, for being welded and fixed the circuit board and described The solder joint of element and the high-temperature plastic being wrapped in outside the solder joint, also it is molded formed with shell outside the circuit board assemblies Body, the heat distortion temperature of the high-temperature plastic are higher than injection temperature.
- 2. circuit board assemblies according to claim 1, it is characterised in that：The high-temperature plastic is hot-setting adhesive or ultra-violet curing Glue, the heat distortion temperature of the high-temperature plastic are more than or equal to 320 DEG C.
- 3. circuit board assemblies according to claim 1, it is characterised in that：The high-temperature plastic is wrapped in positioned at the solder joint The outside of the part element of surrounding.
- 4. according to the circuit board assemblies described in any one of claims 1 to 3, it is characterised in that：The housing is plastic cement, and described Injection temperature when injection forms the housing outside circuit board assemblies is 280-295 DEG C.
- 5. according to the circuit board assemblies described in any one of claims 1 to 3, it is characterised in that：The circuit board uses PCB, FPC Or solderable LDS circuit boards.
- 6. according to the circuit board assemblies described in any one of claims 1 to 3, it is characterised in that：The solder that the solder joint uses for One or more in unleaded tin solder, silver solder or spelter solder, and the fusing point of solder that the solder joint uses is 205-220 ℃。
- 7. the manufacture method of a kind of circuit board assemblies as described in any one of claim 1 to 6, it is characterised in that including following Step：Welding：To form circuit board assemblies, the junction formation of the circuit board and the element is welded for soldered circuit board and element Point；Dispensing：By dispensing in the solder joint outer wrap high-temperature plastic；Injection molding：Injection forms housing outside the circuit board assemblies；Wherein, the heat distortion temperature of the high-temperature plastic is higher than injection temperature.
- 8. manufacture method according to claim 7, it is characterised in that：The circuit board uses PCB, FPC or solderable LDS Circuit board.
- 9. manufacture method according to claim 8, it is characterised in that：The circuit board uses solderable LDS circuit boards, institute It is further comprising the steps of to state manufacture method：Before the welding step, processing forms the solderable LDS circuit boards.
- 10. manufacture method according to claim 9, it is characterised in that：The processing forms the solderable LDS circuit boards The step of be：First time injection molding is carried out to LDS materials, laser activation and chemistry are carried out successively to the LDS materials after shaping Plating, metallic pattern is formed in LDS material surfaces, obtains the solderable LDS circuit boards；Or can described in the processing formation Weld LDS circuit boards the step of be：First time injection molding, and plastic surface coating activator after shaping are carried out to plastic cement Matter, laser activation and chemical plating are carried out successively to the plastic cement for being coated with activating substance, form metallic pattern in plastic surface, obtain institute State solderable LDS circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710750397.XA CN107567202A (en) | 2017-08-28 | 2017-08-28 | Circuit board assemblies and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710750397.XA CN107567202A (en) | 2017-08-28 | 2017-08-28 | Circuit board assemblies and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107567202A true CN107567202A (en) | 2018-01-09 |
Family
ID=60977505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710750397.XA Pending CN107567202A (en) | 2017-08-28 | 2017-08-28 | Circuit board assemblies and its manufacture method |
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| CN (1) | CN107567202A (en) |
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| CN111465205A (en) * | 2020-05-18 | 2020-07-28 | 广东小天才科技有限公司 | Circuit manufacturing method and L DS antenna |
| CN114050661A (en) * | 2021-11-17 | 2022-02-15 | 维沃移动通信有限公司 | Preparation method of shell, wireless charging equipment and kit thereof |
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Application publication date: 20180109 |
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| RJ01 | Rejection of invention patent application after publication |