CN107567178A - Reinforced type FPC harden structures based on pasted sheet type thermistor - Google Patents
Reinforced type FPC harden structures based on pasted sheet type thermistor Download PDFInfo
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- CN107567178A CN107567178A CN201710607119.9A CN201710607119A CN107567178A CN 107567178 A CN107567178 A CN 107567178A CN 201710607119 A CN201710607119 A CN 201710607119A CN 107567178 A CN107567178 A CN 107567178A
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- plate portion
- middle plate
- folding
- flexible substrate
- stiffening plates
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Abstract
The present invention discloses a kind of reinforced type FPC harden structures based on pasted sheet type thermistor, including flexible substrate layer, flexible substrate layer has main part and folding portion, and the main part has middle plate portion and several the lateral plate portions integrally to stretch out from middle plate portion left and right side respectively；The first side external surface is each separately provided with the first FR4 stiffening plates in the middle plate portion, lateral plate portion, and in offering some first edge PTH holes and at least one second edge PTH hole on the first FR4 stiffening plates, pasted sheet type thermistor is connected with second edge PTH hole；The first side outer surface of the folding portion is further provided with the 2nd FR4 stiffening plates, and the corresponding 2nd FR4 stiffening plates region in second side outer surface of the folding portion is done into there is some Lu Tong areas；For the folding portion after turning down and being located at main part over top, its Lu Tong area is located at the top of the first side in middle plate portion；Thereby, the reliable connection of stiffening plate and flexible substrate layer is realized, its process controllability is good.
Description
Technical field
The present invention relates to FPC plate arts, and it is hardened to refer in particular to a kind of reinforced type FPC based on pasted sheet type thermistor
Structure.
Background technology
It is common phenomenon in combining stiffening plate on FPC plates for FPC plates, still, for stiffening plate is more, reinforcement
For the thicker FPC products of plate thickness, the intact combination of stiffening plate and flexible base board is difficult to realize, when actual production makes,
Its production yield is relatively low, and similar FPC plates also easily occur bad in actual application, have impact on FPC plates and are applied
The performance and service life of the corresponding electronic products of FPC plates, are unfavorable for the development of related electronic products, therefore, the present invention
In patent application, applicant has studied intensively a kind of new technical scheme, efficiently solves foregoing problems.
The content of the invention
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of based on SMD the present invention
The reinforced type FPC harden structures of thermistor, it realizes the reliable connection of stiffening plate and flexible substrate layer, its process controllability
It is good.
To achieve the above object, the present invention is using following technical scheme：
A kind of reinforced type FPC harden structures based on pasted sheet type thermistor, include flexible substrate layer, the flexible substrate layer tool
There are main part and main body one end integrally to extend and turn down the folding portion positioned at main part over top, the main part has
Middle plate portion and several the lateral plate portions integrally to stretch out from middle plate portion left and right side respectively；
The flexible substrate layer has the first side, the second side being oppositely arranged；The flexible substrate layer includes from the first side court
The first antistatic backing, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers, the PE set gradually to the second side is thin
Film layer, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing；
The first side external surface is each separately provided with the first FR4 stiffening plates in the middle plate portion, lateral plate portion, in the first FR4
Some first edge PTH holes and at least one second edge PTH hole are offered on stiffening plate, first edge PTH hole, the second edge PTH hole are
Step pore structure, the step pore structure have set gradually from the first side towards the second side and the first hole section for being mutually communicated and
Second hole section, the aperture of first hole section are more than the aperture of the second hole section, SMD temperature-sensitive are connected with second edge PTH hole
Resistance；
The first side outer surface of the folding portion is further provided with the 2nd FR4 stiffening plates, the second side of the folding portion
Do into there are some Lu Tong areas the corresponding 2nd FR4 stiffening plates region in outer surface；The folding portion is located at main part top through turnover
After above portion, its Lu Tong area is located at the top of the first side in middle plate portion.
It is each to be laterally connected between plate portion and middle plate portion by arc bending connecting portion as a kind of preferred scheme,
The arc bends connecting portion from the first side towards the domed setting in the second side, and the arc bends the width of connecting portion along the longitudinal direction
Degree is less than corresponding lateral plate portion width.
As a kind of preferred scheme, space type is disposed with several foregoing first FR4 stiffening plates in the middle plate portion.
As a kind of preferred scheme, the folding portion is connected to one end of middle plate portion, the folding portion and middle plate portion
Between be connected with the L-shaped folding part for being easy to turnover, the L-shaped folding part has supporting part and oblique portion, and supporting part is connected to oblique portion
Between upper end and middle plate portion one end, the oblique portion is connected between supporting part upper end and folding portion, in the middle plate portion
Position corresponding with oblique portion is provided with foregoing first FR4 stiffening plates.
As a kind of preferred scheme, the outer surface of the L-shaped folding part is provided with silk marks area.
As a kind of preferred scheme, the width of the L-shaped folding part in left-right direction is less than the width of folding portion.
As a kind of preferred scheme, the thickness of the flexible substrate layer is 0.21 ± 0.02 millimeter, and the first FR4 is mended
The thickness of strong plate is 0.41 ± 0.02 millimeter.
The present invention has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technical proposal
Understand, it is mainly the reliable connection that stiffening plate and flexible substrate layer are realized by the ingehious design to FPC harden structures, together
When, its process controllability is good, improves the crudy, processing validity and making yield of such product.
More clearly to illustrate the architectural feature and effect of the present invention, come below in conjunction with the accompanying drawings with specific embodiment to this hair
It is bright to be described in detail.
Brief description of the drawings
Fig. 1 is the stereochemical structure diagram of embodiments of the present invention；
Fig. 2 is the expansion diagram of embodiments of the present invention（Second side of major embodiment FPC products）
Fig. 3 is the expansion diagram of embodiments of the present invention（First side of major embodiment FPC products）
Fig. 4 is the right end view of embodiments of the present invention；
Fig. 5 is the partial enlargement diagram at A in Fig. 4；
Fig. 6 is the cross section structure diagram at D-D in Fig. 3；
Fig. 7 is the partial enlargement diagram at B in Fig. 3.
Accompanying drawing identifier declaration：
10th, middle plate portion 20, lateral plate portion
30th, folding portion 31, Lu Tong areas
40th, the first FR4 stiffening plates 51, the first edge PTH hole
52nd, the second edge PTH hole 53, pasted sheet type thermistor
60th, the 2nd FR4 stiffening plates 70, arc bending connecting portion
80th, L-shaped folding part 81, supporting part
82nd, oblique portion.
Embodiment
It refer to shown in Fig. 1 to Fig. 7, it is described based on SMD that show the concrete structure of embodiments of the present invention
The reinforced type FPC harden structures of thermistor 53, include flexible substrate layer, and the flexible substrate layer has main part and autonomous agent
Portion one end integrally extends and turns down the folding portion 30 positioned at main part over top, and the main part has middle plate portion 10 and divided
Several the lateral plate portions 20 not stretched out integrally from the middle left and right side of plate portion 10.
The flexible substrate layer has the first side, the second side being oppositely arranged；The flexible substrate layer includes from first
The first antistatic backing that side is set gradually towards the second side, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers,
PE film layers, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing.
First side external surface is each separately provided with the first FR4 stiffening plates 40 in the middle plate portion 10, lateral plate portion 20,
In offering some first edge PTH holes 51 and at least one second edge PTH hole 52, first edge PTH hole on the first FR4 stiffening plates 40
51st, the second edge PTH hole 52 is step pore structure, and the step pore structure has to be set gradually and phase from the first side towards the second side
The first hole section and the second hole section mutually penetrated, the aperture of first hole section are more than the aperture of the second hole section, second edge PTH hole
Pasted sheet type thermistor 53 is connected with 52；
The first side outer surface of the folding portion 30 is further provided with the 2nd FR4 stiffening plates 60, and the of the folding portion 30
Do into there are some Lu Tong areas 31 the corresponding region of 2nd FR4 stiffening plates 60 in two side faces outer surface；The folding portion 30 is through turnover
After main part over top, its Lu Tong area 31 is located at the top of the first side in middle plate portion 10.
Herein, it is each to be laterally connected between plate portion 20 and middle plate portion 10 by arc bending connecting portion 70, the arc
Shape bends connecting portion 70 from the first side towards the domed setting in the second side, and the arc bends the width of connecting portion 70 along the longitudinal direction
Less than the corresponding lateral width of plate portion 20.Space type is disposed with several foregoing first FR4 stiffening plates in the middle plate portion 10
40。
The folding portion 30 is connected to one end of middle plate portion 10, is connected between the folding portion 30 and middle plate portion 10
It is easy to the L-shaped folding part 80 of turnover, the L-shaped folding part 80 has supporting part 81 and oblique portion 82, and supporting part 81 is connected to oblique portion
Between 82 upper ends and the one end of middle plate portion 10, the oblique portion 82 is connected between the upper end of supporting part 81 and folding portion 30, described
Position corresponding with oblique portion is provided with foregoing first FR4 stiffening plates 40 in middle plate portion 10.The outer surface of the L-shaped folding part 80
It is provided with silk marks area.The width of the L-shaped folding part 80 in left-right direction is less than the width of folding portion 30.
The thickness of the flexible substrate layer is 0.21 ± 0.02 millimeter, and the thickness of the first FR4 stiffening plates 40 is 0.41
± 0.02 millimeter.The entire length of the flexible substrate layer in the deployed state along the longitudinal direction is 21.60 ± 0.15 millimeters, institute
The left and right side that lateral plate portion 20 is stated in middle plate portion 10 is arranged symmetrically, the spacing between the external end edge of lateral plate portion 20 of left and right side
For 10.91 ± 0.15 millimeters, herein, three lateral plate portions 20 are each provided with the left and right side of middle plate portion 10, and, Yu Zhong
Between be provided with seven the first FR4 stiffening plates 40 in plate portion 10, in this way, being provided with 13 the first FR4 reinforcement on whole FPC plates
Plate 40.
In summary, design focal point of the invention is, it mainly by the ingehious design to FPC harden structures, is realized
The reliable connection of stiffening plate and flexible substrate layer, meanwhile, its process controllability is good, improve such product crudy,
Process validity and make yield.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore any subtle modifications, equivalent variations and modifications that every technical spirit according to the present invention is made to above example, still
Belong in the range of technical solution of the present invention.
Claims (7)
- A kind of 1. reinforced type FPC harden structures based on pasted sheet type thermistor, it is characterised in that：Include flexible substrate layer, institute Stating flexible substrate layer, there is main part and main body one end integrally to extend and turn down the folding portion positioned at main part over top, The main part has middle plate portion and several the lateral plate portions integrally to stretch out from middle plate portion left and right side respectively；The flexible substrate layer has the first side, the second side being oppositely arranged；The flexible substrate layer includes from the first side court The first antistatic backing, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers, the PE set gradually to the second side is thin Film layer, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing；The first side external surface is each separately provided with the first FR4 stiffening plates in the middle plate portion, lateral plate portion, in the first FR4 Some first edge PTH holes and at least one second edge PTH hole are offered on stiffening plate, first edge PTH hole, the second edge PTH hole are Step pore structure, the step pore structure have set gradually from the first side towards the second side and the first hole section for being mutually communicated and Second hole section, the aperture of first hole section are more than the aperture of the second hole section, SMD temperature-sensitive are connected with second edge PTH hole Resistance；The first side outer surface of the folding portion is further provided with the 2nd FR4 stiffening plates, the second side of the folding portion Do into there are some Lu Tong areas the corresponding 2nd FR4 stiffening plates region in outer surface；The folding portion is located at main part top through turnover After above portion, its Lu Tong area is located at the top of the first side in middle plate portion.
- 2. the reinforced type FPC harden structures according to claim 1 based on pasted sheet type thermistor, it is characterised in that：Each Laterally bend connecting portion by arc between plate portion and middle plate portion to be connected, the arc bends connecting portion from the first side direction The domed setting in second side, the width of the arc bending connecting portion along the longitudinal direction are less than corresponding lateral plate portion width.
- 3. the reinforced type FPC harden structures according to claim 1 based on pasted sheet type thermistor, it is characterised in that：It is described Space type is disposed with several foregoing first FR4 stiffening plates in middle plate portion.
- 4. the reinforced type FPC harden structures according to claim 1 based on pasted sheet type thermistor, it is characterised in that：It is described Folding portion is connected to one end of middle plate portion, and the L-shaped folding part for being easy to turnover, institute are connected between the folding portion and middle plate portion Stating L-shaped folding part has supporting part and oblique portion, and supporting part is connected between oblique portion upper end and middle plate portion one end, described oblique Portion is connected between supporting part upper end and folding portion, and position corresponding with oblique portion is provided with foregoing first in the middle plate portion FR4 stiffening plates.
- 5. the reinforced type FPC harden structures according to claim 4 based on pasted sheet type thermistor, it is characterised in that：The L The outer surface of shape folding part is provided with silk marks area.
- 6. the reinforced type FPC harden structures according to claim 4 based on pasted sheet type thermistor, it is characterised in that：The L The width of shape folding part in left-right direction is less than the width of folding portion.
- 7. the reinforced type FPC harden structures according to claim 1 based on pasted sheet type thermistor, it is characterised in that：It is described The thickness of flexible substrate layer is 0.21 ± 0.02 millimeter, and the thickness of the first FR4 stiffening plates is 0.41 ± 0.02 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607119.9A CN107567178A (en) | 2017-07-24 | 2017-07-24 | Reinforced type FPC harden structures based on pasted sheet type thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607119.9A CN107567178A (en) | 2017-07-24 | 2017-07-24 | Reinforced type FPC harden structures based on pasted sheet type thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107567178A true CN107567178A (en) | 2018-01-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710607119.9A Pending CN107567178A (en) | 2017-07-24 | 2017-07-24 | Reinforced type FPC harden structures based on pasted sheet type thermistor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108449864A (en) * | 2018-05-18 | 2018-08-24 | 湖南粤港模科实业有限公司 | A kind of cross FPC conductions soft board |
| CN111897176A (en) * | 2020-08-10 | 2020-11-06 | 谷麦光电科技股份有限公司 | Flash lamp module and manufacturing method thereof |
| CN112867245A (en) * | 2021-03-11 | 2021-05-28 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method |
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| US4495546A (en) * | 1981-05-18 | 1985-01-22 | Matsushita Electric Industrial Co., Ltd. | Hybrid integrated circuit component and printed circuit board mounting said component |
| FR2754416B1 (en) * | 1996-10-04 | 1998-12-18 | Thomson Csf | ELECTRONIC MODULE AND ITS MANUFACTURING METHOD |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| US20150373830A1 (en) * | 2014-06-19 | 2015-12-24 | Kabushiki Kaisha Toshiba | Composite substrate including foldable portion |
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2017
- 2017-07-24 CN CN201710607119.9A patent/CN107567178A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4495546A (en) * | 1981-05-18 | 1985-01-22 | Matsushita Electric Industrial Co., Ltd. | Hybrid integrated circuit component and printed circuit board mounting said component |
| FR2754416B1 (en) * | 1996-10-04 | 1998-12-18 | Thomson Csf | ELECTRONIC MODULE AND ITS MANUFACTURING METHOD |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| US20150373830A1 (en) * | 2014-06-19 | 2015-12-24 | Kabushiki Kaisha Toshiba | Composite substrate including foldable portion |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108449864A (en) * | 2018-05-18 | 2018-08-24 | 湖南粤港模科实业有限公司 | A kind of cross FPC conductions soft board |
| CN108449864B (en) * | 2018-05-18 | 2024-04-30 | 湖南粤港模科实业有限公司 | Cross FPC conductive flexible board |
| CN111897176A (en) * | 2020-08-10 | 2020-11-06 | 谷麦光电科技股份有限公司 | Flash lamp module and manufacturing method thereof |
| CN112867245A (en) * | 2021-03-11 | 2021-05-28 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method |
| CN112867245B (en) * | 2021-03-11 | 2022-07-26 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method |
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Application publication date: 20180109 |
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