CN107560750A - A kind of temperature measurement circuit and a kind of temperature measurement structure - Google Patents
A kind of temperature measurement circuit and a kind of temperature measurement structure Download PDFInfo
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- CN107560750A CN107560750A CN201610502483.4A CN201610502483A CN107560750A CN 107560750 A CN107560750 A CN 107560750A CN 201610502483 A CN201610502483 A CN 201610502483A CN 107560750 A CN107560750 A CN 107560750A
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000306 component Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011430 maximum method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention, which provides a kind of temperature measurement circuit and a kind of temperature measurement structure, the temperature measurement circuit, to be included：Temperature detecting resistance, it is made up of the snakelike cabling copper foil on printed circuit board, temperature element is treated for connecting；Measuring circuit, for measure it is described when the temperature change of temperature element when the temperature detecting resistance that changes of resistance on voltage；Analog to digital conversion circuit, the photovoltaic conversion for that will measure the analog signal form of acquisition are the voltage of digital signal form；Processor, for obtaining temperature corresponding with the resistance value that the temperature detecting resistance is current with the corresponding relation of temperature according to the voltage.The present invention by the snakelike cabling copper foil on printed circuit board by forming temperature detecting resistance, thermistor equitemperature sensor is replaced using PCB trace, realize the temperature survey of the devices such as laser diode, it can make there was only printed circuit board between laser diode and semiconductor cooler, it is simple in the absence of the structural members such as other sensors, package assembly.
Description
Technical field
The present invention relates to electronic circuit technology field, specially a kind of temperature measurement circuit and a kind of temperature measurement structure.
Background technology
Laser diode (LD, Laser Diode) is used as core component, its Output optical power and light in optical fiber laser
Wavelength has vital influence to the performance of laser.LD is temperature sensor, and 0.1 DEG C of temperature change is to optical wavelength
Just have a significant effect.LD is generally made as power device with semiconductor cooler (TEC, Thermoelectric Cooler)
For refrigeration device.Such LD, TEC and the heat sink structure formed similar to sandwich, and in order to test LD temperature, generally in LD
Thermistor NTC etc temperature sensor is put between TEC.Because NTC has certain thickness, it usually needs trough of belt
Aluminium sheet or the metallic plate such as copper coin in LD and TEC between the two, wherein slotting for placing thermistor.In order to engage fixation
LD and TEC, metallic plate need perforate.This package assembly is complicated, and assembling is relatively difficult, causes reliability also than relatively low.
The content of the invention
In view of the above the shortcomings that prior art, it is an object of the invention to provide a kind of temperature measurement circuit and a kind of thermometric
Structure, for solve in the prior art using the temperature band of thermistor testing laser diode come package assembly complexity with can
By property it is low the problem of.
In order to achieve the above objects and other related objects, the present invention provides a kind of temperature measurement circuit, and the temperature measurement circuit includes：
Temperature detecting resistance, it is made up of the snakelike cabling copper foil on printed circuit board, temperature element is treated for connecting；Measuring circuit, it is and described
Temperature detecting resistance is connected, for measure it is described when the temperature change of temperature element when the temperature detecting resistance that changes of resistance
Voltage；Analog to digital conversion circuit, it is connected with the measuring circuit, for the photovoltaic conversion of the analog signal form obtained will to be measured
For the voltage of digital signal form；Processor, for being obtained and thermometric electricity according to the corresponding relation of the voltage and temperature
Hinder temperature corresponding to current resistance value.
In one embodiment of the invention, the measuring circuit includes：Measuring bridge, for the electricity in the temperature detecting resistance
Resistance is with the voltage on the temperature detecting resistance described when the temperature of temperature element changes；Amplifier, with the measuring bridge
It is connected, the voltage for being inputted to the measuring bridge is amplified.
In one embodiment of the invention, the first bridge arm of the measuring bridge is by first resistor and the temperature detecting resistance structure
Into the second bridge arm is made up of second resistance and 3rd resistor；The normal phase input end of the amplifier is connected to the first resistor
Between the temperature detecting resistance, the inverting input of the amplifier be connected to the second resistance and the 3rd resistor it
Between.
In one embodiment of the invention, the resistance of the resistance of the second resistance and the 3rd resistor is equal.
In one embodiment of the invention, the measuring circuit also includes being connected to the first reference voltage and first bridge
Between first common port of arm and second bridge arm, it is connected to the second common port of first bridge arm and second bridge arm
It is used for the first current-limiting resistance and the second current limliting electricity that current limliting is carried out to the voltage inputted in the measuring circuit between over the ground
Resistance.
In one embodiment of the invention, the resistance phase of the resistance of first current-limiting resistance and second current-limiting resistance
Deng.
In one embodiment of the invention, the amplifier is the instrument amplifier of high input impedance.
In one embodiment of the invention, the measuring circuit also includes mutually being used in conjunction with the reference input of the amplifier
In the biasing circuit for the output voltage for stablizing the amplifier.
In one embodiment of the invention, the biasing circuit includes：One end and the reference input phase of the amplifier
Even, the 5th resistance of other end ground connection and one end are connected with the reference input of the amplifier, the reference of other end connection second
6th resistance of voltage.
To achieve the above object, the present invention also provides a kind of temperature measurement structure, and the temperature measurement structure includes：Printed circuit board,
The temperature detecting resistance being made up of on the printed circuit board snakelike cabling copper foil is arranged at, the laser two being connected with the temperature detecting resistance
Pole pipe and the semiconductor cooler for being connected to the printed circuit back.
As described above, a kind of temperature measurement circuit and a kind of temperature measurement structure of the present invention, have the advantages that：
1st, the present invention is replaced by forming temperature detecting resistance by the snakelike cabling copper foil on printed circuit board using PCB trace
Thermistor equitemperature sensor, realizes the temperature survey of the devices such as laser diode, can make laser diode and semiconductor
There was only printed circuit board between refrigerator, it is simple in the absence of the structural members such as other sensors, package assembly.
2nd, the present invention is simple in construction, controls flexibility and reliability, economical and practical, has wide applicability.
Brief description of the drawings
Fig. 1 is shown as a kind of principle schematic of temperature measurement circuit in the present invention.
Fig. 2 is shown as the structural representation of measuring circuit in a kind of temperature measurement circuit of the present invention.
Fig. 3 is shown as a kind of principle schematic of temperature measurement structure of the present invention.
Component label instructions
100 temperature measurement circuits
101 temperature detecting resistances
102 measuring circuits
103 analog to digital conversion circuits
104 processors
200 temperature measurement structures
201 printed circuit boards
202 cabling copper foils
203 laser diodes
204 semiconductor coolers
205 connection conductors
206 radiators
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through specific realities different in addition
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
The purpose of the present embodiment is to provide a kind of temperature measurement circuit and a kind of temperature measurement structure, sharp in the prior art for solving
With the temperature band of thermistor testing laser diode come package assembly it is complicated low with reliability the problem of.It will explain in detail below
A kind of temperature measurement circuit of the present embodiment and the principle and embodiment of a kind of temperature measurement structure are stated, makes those skilled in the art need not
Creative work is appreciated that a kind of temperature measurement circuit of the present embodiment and a kind of temperature measurement structure.
A kind of temperature measurement circuit of the present embodiment, specifically, as shown in figure 1, the temperature measurement circuit 100 includes：Temperature detecting resistance
101, measuring circuit 102, analog to digital conversion circuit 103 and processor 104.
The temperature measurement circuit 100 in the present embodiment is described in detail below.
In the present embodiment, as shown in figure 1, the temperature detecting resistance 101 is by the snakelike cabling copper on printed circuit board (PCB)
Paper tinsel is formed, and temperature element is treated for connecting.I.e. in the present embodiment, the temperature detecting resistance 101 is treated under temperature element by being coiled in
The snakelike PCB trace of side is formed, and this section of snakelike cabling provides the resistance required for measurement temperature.Wherein, it is described to treat thermometric member
Part is, for example, laser diode.When the temperature of laser diode changes, the resistance of this section of circuit will change therewith, and it becomes
Change amount is together decided on by the temperature coefficient of the resistivity of copper, temperature variation and trace resistances in copper foil.Use PCB trace
Copper foil substitutes temperature sensor and realizes the temperature test without additional structure, that is, treats that temperature element laser diode can be fixed directly
On Metal Substrate pcb board, there was only pcb board between semiconductor cooler (TEC) and laser diode (LD), it is no longer necessary to other knots
Component, and be that the temperature test to laser diode can be achieved in the top of snakelike cabling copper foil.
As can be seen here, in the present embodiment, directly it is used as temperature detecting resistance 101 by the use of PCB copper foils, it is not necessary to use thermistor
NTC or other kinds of temperature sensors, without interface unit, so add system reliability.Meanwhile PCB copper foils do not account for
With volume, it is not necessary to using the temperature measurement structure of other thermometric modes, also simplify the complexity of system mechanics structure design.
In the present embodiment, the measuring circuit 102 is connected with the temperature detecting resistance 101, for measuring described to be measured
The voltage on the temperature detecting resistance 101 that resistance changes during the temperature change of warm element.The measuring circuit 102 is use
In the resistive voltage change-over circuit for realizing copper foil resistance microvariations.
Specifically, as shown in Fig. 2 in the present embodiment, the measuring circuit 102 includes：Measuring bridge, for described
The resistance of temperature detecting resistance 101 is with the voltage on the temperature detecting resistance 101 described when the temperature of temperature element changes；Amplification
Device, it is connected with the measuring bridge, the voltage for being inputted to the measuring bridge is amplified.
In the present embodiment, the first bridge arm of the measuring bridge is made up of first resistor R1 and the temperature detecting resistance 101,
Second bridge arm is made up of second resistance R2 and 3rd resistor R3；The normal phase input end of the amplifier is connected to the first resistor
Between R1 and the temperature detecting resistance 101, the inverting input of the amplifier is connected to the second resistance R2 and the described 3rd
Between resistance R3.Wherein, the resistance of the second resistance R2 and the resistance of the 3rd resistor R3 are equal.It can be seen that the present embodiment
Described in measuring bridge use class Huygens's bridge circuit, can be realized under power consumption constraint small-signal input accurate survey
Amount.Wherein, the amplifier is preferably the instrument amplifier or instrument amplifier circuit of high input impedance.
So the measuring circuit 102 in the present embodiment is the instrument amplifier by measuring bridge and high input impedance
AFE (the Analog Front End) analog front end circuit for the micro resistance change test that INA is formed.The both ends of snakelike cabling copper foil
It is connected respectively to the both ends of measuring bridge.
In the present embodiment, the measuring circuit 102 also includes being connected to the first reference voltage Vcc and first bridge arm
Between the first common port of second bridge arm, be connected to first bridge arm and second bridge arm the second common port and
It is used for the limits of the first current-limiting resistance Ru1 and second that current limliting is carried out to the voltage inputted in the measuring circuit 102 between over the ground
Leakage resistance Ru2.Wherein, the resistance of the first current-limiting resistance Ru1 and the resistance of the second current-limiting resistance Ru2 are preferably phase
Deng.
The first current-limiting resistance Ru1 and the second current-limiting resistance Ru2 main function are that measuring bridge is flowed through in limitation
Electric current and the output level of measuring bridge is adjusted near instrument amplifier INA power supply intermediate level.Because thermometric is electric
It is smaller to hinder Rs resistance, if directly electric bridge both ends, which are connected between reference power source and ground network, to cause high current to flow through
Rs, and then cause the temperature rises of Rs in itself to influence test result.Here it is the effect of current-limiting resistance Ru1 and Ru2 place.Meanwhile because
For instrument amplifier circuit INA input signal at the centre position of its power rail, the index such as INA linearity is best.In electricity
Bridge both ends respectively add a current-limiting resistance Ru1 and Ru2 that the output level of electric bridge is adjusted into the INA input areas.For convenience of implementation,
Instrument amplifier circuit uses single supply circuit in the present embodiment, and electric bridge is output near Vcc/2 by adjustment circuit parameter.Such as
Fruit uses dual power supply instrument amplifier circuit, and the output should be just near ground level.
In the present embodiment, the measuring circuit 102 also includes being used in conjunction with the reference input Vref phases of the amplifier
In the biasing circuit for the output voltage for stablizing the amplifier.
Wherein, as shown in Fig. 2 the biasing circuit includes：One end is connected with the reference input Vref of the amplifier,
5th resistance R5 of other end ground connection and one end are connected with the reference input Vref of the amplifier, the ginseng of other end connection second
Examine the 6th resistance R6 of voltage vcc.
In the present embodiment, analog-digital conversion circuit as described 103 is connected with the measuring circuit 102, for measurement to be obtained
Analog signal form photovoltaic conversion be digital signal form voltage；The processor 104 be used for according to the voltage with
The corresponding relation of temperature obtains temperature corresponding with the resistance value that the temperature detecting resistance 101 is current.
The temperature-measurement principle of temperature measurement circuit in the present embodiment 100 is described in detail below.
From circuit voltage divider principle, when at a temperature of some, the output of measuring bridge is determined by formula below：
Vin=Vin+-Vin-
Wherein：Vin-=Vcc/2；
If Ru1=Ru2=Ru, R2=R3=R0 are then：
R=Rs (20 DEG C), if R3=R2=R1=Ru=R, A=α × (T-20).
If R=Rs (20 DEG C), R1=R3=R2=R, A=α × (T-20), then
Temperature detecting resistance Rs (T)=R × (1+A),
It can obtain
Temperature detecting resistance Rs is the resistance of PCB trace copper foil in this patent.PCB trace resistance formula is Rs (T)=ρ × L/
Area, ρ are copper resistance rate；Area is the cross-sectional area of PCB trace, and Area=line width * copper is thick；L is track lengths.By above-mentioned
Formula understands that Rs to be made is big relative to the variable quantity of temperature change, should just increase line length L, reduces line width and copper is thick.Using snakelike
Cabling is exactly to reach to cause that the length of cabling is most long in same area, the maximum method of resistance.
Below to treating that the projected area of temperature element laser diode illustrates in the present embodiment.
By taking the laser diode of the less 8W power of a volume ratio as an example, its base plane a length of 11.9mm is a width of
8.5mm, the projected area on printing board PCB are 8.5x11.9mm2.Serpentine fashion cabling is used in the region, then
Line length L=projected areas/(line width+line-spacing).PCB making technology can also be led using that can obtain big resistance compared with high technology
The increase of PCB production costs is caused, horizontal using general PCB making technology here, line taking wide 0.1mm, line-spacing 0.1mm, copper foil
Thickness 0.5oz.So：Area=line widths × copper thickness=1.75e-3mm2；L is track lengths,
The Ω mm2/m of ρ=0.0175 at 20 DEG C, then
This shows that generally the PCB trace of laser diode projection lower section may be larger than 5 Ω.In Vcc=
5.0V, during 1 DEG C of temperature change, it be 100 Ω to select Ru, now knowable to：
After gain is 1000 instrument amplifier INA, corresponding output voltage Vout=0.12V.The work of laser diode
Make temperature range typically at 20~40 DEG C, so when range of temperature is at 20 DEG C, Vout_max≈ 2.4V are for input range
Significance bit for 3.0V is 14bit, and 0.12V corresponds to 164 least significant bits (LSB), i.e. 0.006 DEG C/LSB.
In addition, as shown in figure 3, the present embodiment also provides a kind of temperature measurement structure 200, the temperature measurement structure 200 includes：Printing
Circuit board 201, the temperature detecting resistance being made up of on the printed circuit board 201 snakelike cabling copper foil 202 is arranged at, with the thermometric
The laser diode 203 of resistance connection and the semiconductor cooler 204 for being connected to the back side of printed circuit board 201.Wherein,
The laser diode 203 can be connected on the cabling copper foil 202 by connecting conductor 205 (such as solder or colloid),
The semiconductor cooler 204 can also connect radiator 206.
From the it can be seen from the figure that of temperature measurement structure 200 in Fig. 3, laser diode 203 can be directly anchored to Metal Substrate PCB
On plate, there was only pcb board between semiconductor cooler 204 (TEC) and laser diode 203 (LD), it is no longer necessary to other structures part,
And the temperature test to laser diode 203 can be achieved in the top of snakelike cabling copper foil 202.
In summary, the present invention is walked by forming temperature detecting resistance by the snakelike cabling copper foil on printed circuit board using PCB
Line replaces thermistor equitemperature sensor, realizes the temperature survey of the devices such as laser diode, can make laser diode and
There was only printed circuit board between semiconductor cooler, it is simple in the absence of the structural members such as other sensors, package assembly；Present invention knot
Structure is simple, controls flexibility and reliability, economical and practical, has wide applicability.So the present invention effectively overcomes in the prior art
Various shortcoming and have high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (10)
- A kind of 1. temperature measurement circuit, it is characterised in that：The temperature measurement circuit includes：Temperature detecting resistance, it is made up of the snakelike cabling copper foil on printed circuit board, temperature element is treated for connecting；Measuring circuit, be connected with the temperature detecting resistance, for measure it is described when the temperature change of temperature element when resistance occur Voltage on the temperature detecting resistance of change；Analog to digital conversion circuit, it is connected with the measuring circuit, for being by the photovoltaic conversion for measuring the analog signal form obtained The voltage of digital signal form；Processor, for corresponding with the resistance value that the corresponding relation of temperature obtains with the temperature detecting resistance is current according to the voltage Temperature.
- 2. temperature measurement circuit according to claim 1, it is characterised in that：The measuring circuit includes：Measuring bridge, for the temperature detecting resistance resistance with the thermometric described when the temperature of temperature element changes Ohmically voltage；Amplifier, it is connected with the measuring bridge, the voltage for being inputted to the measuring bridge is amplified.
- 3. temperature measurement circuit according to claim 2, it is characterised in that：First bridge arm of the measuring bridge is by first resistor Formed with the temperature detecting resistance, the second bridge arm is made up of second resistance and 3rd resistor；The normal phase input end of the amplifier connects Be connected between the first resistor and the temperature detecting resistance, the inverting input of the amplifier be connected to the second resistance and Between the 3rd resistor.
- 4. temperature measurement circuit according to claim 3, it is characterised in that：The resistance of the second resistance and the 3rd resistor Resistance it is equal.
- 5. temperature measurement circuit according to claim 3, it is characterised in that：The measuring circuit also includes being connected to the first reference Between voltage and the first common port of first bridge arm and second bridge arm, it is connected to first bridge arm and described second Second common port of bridge arm and over the ground between be used for the first current limliting that current limliting is carried out to the voltage inputted in the measuring circuit Resistance and the second current-limiting resistance.
- 6. temperature measurement circuit according to claim 5, it is characterised in that：The resistance of first current-limiting resistance and described second The resistance of current-limiting resistance is equal.
- 7. temperature measurement circuit according to claim 2, it is characterised in that：The amplifier amplifies for the instrument of high input impedance Device.
- 8. the temperature measurement circuit according to claim 2 or 7, it is characterised in that：The measuring circuit also includes and the amplification The reference input of device is connected the biasing circuit of the output voltage for stablizing the amplifier.
- 9. temperature measurement circuit according to claim 8, it is characterised in that：The biasing circuit includes：One end and the amplification The reference input of device is connected, and the 5th resistance of other end ground connection and one end are connected with the reference input of the amplifier, separately One end connects the 6th resistance of the second reference voltage.
- 10. a kind of temperature measurement structure, it is characterised in that the temperature measurement structure includes：Printed circuit board, it is arranged at the printed circuit The temperature detecting resistance being made up of on plate snakelike cabling copper foil, the laser diode being connected with the temperature detecting resistance and is connected to described The semiconductor cooler of printed circuit back.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112212999A (en) * | 2020-09-25 | 2021-01-12 | 国网山东省电力公司桓台县供电公司 | Optical fiber temperature sensor packaging structure |
| CN112865792A (en) * | 2021-01-08 | 2021-05-28 | 胜达克半导体科技(上海)有限公司 | Method for testing linearity of analog-digital converter at low cost |
| CN113865739A (en) * | 2021-08-30 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Temperature detection device and server |
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| CN112865792A (en) * | 2021-01-08 | 2021-05-28 | 胜达克半导体科技(上海)有限公司 | Method for testing linearity of analog-digital converter at low cost |
| CN112865792B (en) * | 2021-01-08 | 2021-11-19 | 胜达克半导体科技(上海)有限公司 | Method for testing linearity of analog-digital converter at low cost |
| CN113865739A (en) * | 2021-08-30 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Temperature detection device and server |
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