CN107553995A - Enhancing film with dividing plate - Google Patents

Enhancing film with dividing plate Download PDF

Info

Publication number
CN107553995A
CN107553995A CN201710521337.0A CN201710521337A CN107553995A CN 107553995 A CN107553995 A CN 107553995A CN 201710521337 A CN201710521337 A CN 201710521337A CN 107553995 A CN107553995 A CN 107553995A
Authority
CN
China
Prior art keywords
dividing plate
layer
enhancing
antistatic
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710521337.0A
Other languages
Chinese (zh)
Inventor
佐佐木翔悟
设乐浩司
徐创矢
越智元气
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60948547&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN107553995(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN202010284459.4A priority Critical patent/CN111497361A/en
Priority to CN202010284169.XA priority patent/CN111497360A/en
Publication of CN107553995A publication Critical patent/CN107553995A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The enhancing film with dividing plate is provided, it includes enhancing film P and dividing plate Q and has following characteristics：When peeling off dividing plate, generable stripping electrification can be suppressed；Even if when enhancing with dividing plate of the dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. in advance is peeled off with film, it can also mitigate the infringement to optical component or electronic unit.Wherein：Enhancing includes substrate layer A1 and adhesive phase A2 with film P；Dividing plate Q includes antistatic release layer B and substrate layer B3；Adhesive phase A2 and antistatic release layer B are directly laminated；With when dividing plate Q is peeled off from enhancing with film P with 150 ° of peel angle and 10m/min detachment rate at 23 DEG C of temperature and 50%RH humidity, adhesive phase A2 surface has 10kV or lower stripping electrification voltage, and antistatic release layer B surface has 5.0kV or lower stripping electrification voltage.

Description

Enhancing film with dividing plate
Technical field
The present invention relates to the enhancing film with dividing plate.
Background technology
In order to assign optical component, electronic unit etc. with rigidity or impact resistance, will have in advance in some cases every The enhancing of plate with film conform to optical component, electronic unit etc. exposure face side to be strengthened (day to such part Present patent application unexamined publication No.2014-234460).
However, when the increasing with dividing plate by dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. When being peeled off with film by force, there arises a problem that：It is peeling-off electrification and cause the infringement to optical component or electronic unit.
The content of the invention
It is an object of the present invention to provide the enhancing film with dividing plate, and it includes enhancing film and dividing plate, the tool The enhancing film for having dividing plate has following characteristics：When peeling off dividing plate, generable stripping electrification can be suppressed；Even if will with working as When the enhancing with dividing plate of dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. in advance is peeled off with film, Also the infringement to optical component or electronic unit can be mitigated.
Included according to the enhancing with dividing plate of an embodiment of the invention with film：Film P is used in enhancing；With dividing plate Q, its In：Enhancing includes substrate layer A1 and adhesive phase A2 with film P；Dividing plate Q includes antistatic release layer B and substrate layer B3；Adhesive Layer A2 and antistatic release layer B is directly laminated；With when at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle With 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, adhesive phase A2 surface has 10kV or lower Stripping electrification voltage, and antistatic release layer B surface has 5.0kV or lower stripping electrification voltage.
In one embodiment, when at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/ Min detachment rate by dividing plate Q from enhancing peeled off with film P when, antistatic release layer B surface has 1.0 × 104Ω-1.0× 1012Ω sheet resistance value.
In one embodiment, antistatic release layer B includes conducting polymer.
In one embodiment, antistatic release layer B includes release layer B1 and antistatic layer B2, adhesive phase A2 and de- Mold layer B1 is directly laminated, and is worked as at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min stripping From speed by dividing plate Q from enhancing peeled off with film P when, release layer B1 surface has 5.0kV or lower stripping electrification voltage.
In one embodiment, in the enhancing film with dividing plate according to embodiment of the present invention, when at 23 DEG C Temperature and 50%RH humidity under with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q from enhancing with film P shell From when, release layer B1 surface has 1.0 × 104Ω-1.0×1012Ω sheet resistance value.
In one embodiment, antistatic layer B2 includes conducting polymer.
In one embodiment, enhancing film P includes antistatic layer A3, substrate layer A1 with the order stated and glued Mixture layer A2.
In one embodiment, dividing plate Q includes antistatic release layer B, substrate layer B3 with the order stated and resisted quiet Electric layer B4.
In one embodiment, antistatic layer B4 includes conducting polymer.
In one embodiment, in the enhancing film with dividing plate according to embodiment of the present invention, exist At 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate from enhancing film After P is peeled off, glued under the rate of extension of the humidity of temperature, 50%RH at 23 DEG C, 180 ° of peel angle and 300mm/min Mixture layer A2 is 1.0N/25mm or bigger to the initial adhesion strength of glass plate.
In one embodiment, in the enhancing film with dividing plate according to embodiment of the present invention, when at 23 DEG C Temperature and 50%RH humidity under with 180 ° of peel angle and 300mm/min rate of extension by dividing plate Q from enhancing use Peel strength when film P is peeled off is 0.30N/25mm or smaller.
According to the present invention, it is possible to provide such enhancing film with dividing plate, it includes enhancing film and dividing plate, the tool The enhancing film for having dividing plate has following characteristics：When peeling off dividing plate, generable stripping electrification can be suppressed；Even if will with working as When the enhancing with dividing plate of dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. in advance is peeled off with film, Also the infringement to optical component or electronic unit can be mitigated.
Brief description of the drawings
Fig. 1 is the schematic sectional view of an enhancing film P embodiment.
Fig. 2 is the schematic sectional view of enhancing film P another embodiment.
Fig. 3 is the schematic sectional view of a dividing plate Q embodiment.
Fig. 4 is the schematic sectional view of dividing plate Q another embodiment.
Fig. 5 is the schematic sectional view of an embodiment of the enhancing film with dividing plate of the present invention.
Fig. 6 is the schematic sectional view of another embodiment of the enhancing film with dividing plate of the present invention.
Fig. 7 is the schematic sectional view of another embodiment of the enhancing film with dividing plate of the present invention.
Fig. 8 is the schematic sectional view of another embodiment of the enhancing film with dividing plate of the present invention.
Embodiment
When in this manual using statement " quality ", the statement is available typically to be made frequently as unit of weight so far Statement " weight " replaces.In turn, when in this manual using statement " weight ", the statement is available frequently as expression The statement " quality " that the SI units of weight use replaces.
In this manual, statement " (methyl) acrylic compounds " means " acrylic compounds and/or methacrylic ", states " (methyl) acrylate " means " acrylate and/or methacrylate ", and statement " (methyl) pi-allyl " means " pi-allyl And/or methacrylic ", and state " (methyl) methacrylaldehyde " and mean " methacrylaldehyde and/or MAL ".
<<<<Enhancing film with dividing plate>>>>
The enhancing with dividing plate of the present invention is to include enhancing film with dividing plate of the enhancing with film P and dividing plate Q with film. As long as the enhancing with dividing plate of the present invention includes enhancing film P and dividing plate Q with film, the enhancing film with dividing plate can be Do not damage in the range of the effect of the present invention including any suitable other layers.
In the enhancing film with dividing plate of the present invention, enhancing includes substrate layer A1 and adhesive phase A2, dividing plate with film P Q includes antistatic release layer B and substrate layer B3, and adhesive phase A2 and antistatic release layer B are directly laminated.
As the thickness of the enhancing film with dividing plate of the present invention, can in the range of effect of the invention is not damaged root Any suitable thickness is used according to intention.Such thickness is preferably 9 μm -1,300 μm, more preferably 20 μm -1,050 μm, also more It is preferred that 35 μm -900 μm, it is particularly preferred 45 μm -750 μm.
<<Film P is used in enhancing>>
Thickness as enhancing with film P, any conjunction can be used according to intention in the range of the effect of the present invention is not damaged Suitable thickness.Such thickness is preferably 5 μm -800 μm, more preferably 10 μm -650 μm, even more preferably from 20 μm -550 μm, it is especially excellent Select 25 μm -450 μm.
Enhancing includes substrate layer A1 and adhesive phase A2 with film P.As long as enhancing includes substrate layer A1 and adhesive phase with film P A2, the enhancing can include any suitable other layers in the range of the effect of the present invention is not damaged with film according to intention.
Enhancing is with film P 100 embodiment as shown in fig. 1 by substrate layer A1 10 and the shapes of adhesive phase A2 20 Into.
The order that enhancing film P can be stated includes antistatic layer A3, substrate layer A1 and adhesive phase A2.
Enhancing is with film P 100 another embodiment as shown in Figure 2 by antistatic layer A3 60, the and of substrate layer A1 10 Adhesive phase A2 20 is formed.
<Substrate layer A1>
As substrate layer A1, can be used in the range of the effect of the present invention is not damaged according to intention by any suitable material Expect the base material formed.The example of such material includes resin sheet, non-woven fabrics, paper, metal foil, textile cloth, rubber sheet, bubble Foam sheet material and its layered product (layered product for particularly, including resin sheet).
As the composition resin of resin sheet, provide for example as follows：Polyethylene terephthalate (PET)；Poly- naphthalene two Formic acid glycol ester (PEN)；Polybutylene terephthalate (PBT) (PBT)；Acrylic resin, such as polymethyl methacrylate (PMMA)；Makrolon；Tri acetyl cellulose (TAC)；Polysulfones；Polyarylate；Polyethylene (PE)；Polypropylene (PP)；Ethene-the third Alkene copolymer；Vinyl-vinyl acetate copolymer (EVA)；Polyamide (nylon)；Polyamide (the aromatics polyamides of Wholly aromatic Amine)；Polyimides (PI)；Polyvinyl chloride (PVC)；Polyvinyl acetate；Polyphenylene sulfide (PPS)；Resin based on fluorine；Polyethers ether Ketone (PEEK)；With the polymer based on cyclic olefin.
The example of non-woven fabrics includes：The non-woven fabrics made of the natural fiber with heat resistance, such as include abaca Non-woven fabrics；With synthetic resin non-woven fabrics, such as acrylic resin non-woven fabrics, polyvinyl resin non-woven fabrics and the tree based on ester Fat non-woven fabrics.
Substrate layer A1 quantity can be only one, or can be two or more.
, can be any suitable according to use is intended in the range of the effect of the present invention is not damaged as substrate layer A1 thickness Thickness.Such thickness is preferably 4 μm -500 μm, more preferably 10 μm -400 μm, even more preferably from 15 μm -350 μm, particularly preferably 20μm-300μm。
Substrate layer A1 can include antistatic additive.The resin sheet for having antistatic additive is wherein mediated as bag for example, can be used Substrate layer A1 containing antistatic additive.Such resin sheet can be by for forming the substrate layer A1's comprising resin and antistatic additive Composition is formed.
Substrate layer A1 can play a part of antistatic additive in itself.For example, work as using metal foil as substrate layer A1's During material, substrate layer A1 can play a part of antistatic additive in itself.
Substrate layer A1 can undergo surface treatment.The example of surface treatment includes sided corona treatment, corona treatment, at chromic acid Manage, shocked by electricity exposed to ozone, exposed to flame, exposed to high voltage, ionising radiation is handled and the coating process with priming paint.
Organic coating materials as priming paint are such as " Plastic Hard Coat Material II " (CMC Publishing Co., Ltd., (2004)) disclosed in material.Such Organic coating materials are preferably, for example, being based on ammonia The polymer of carbamate, and more preferably, for example, urethane acrylate, polyester-polyurethane or its precursor.This is Due to following reason：Any such material easily can be coated with and be applied on substrate layer A1；And industrially there is many The material of species is available and it is individually inexpensive to obtain.Such polymer based on carbamate For for example, by isocyanate-monomer and the monomer comprising alcoholic extract hydroxyl group (for example, acrylic compounds or bag comprising hydroxyl The ester compounds of hydroxyl) reactant mixture formed polymer.It is for example more that the Organic coating materials can include chain extender First amine, age resistor, oxidation stabilizers etc. are as optional additive.
Substrate layer A1 basis can be intended to encompass any suitable other additions in the range of the effect of the present invention is not damaged Agent.
<Adhesive phase A2>
As adhesive phase A2 thickness, any conjunction can be used according to intention in the range of the effect of the present invention is not damaged Suitable thickness.Such thickness is preferably 1 μm -300 μm, more preferably 2 μm -250 μm, even more preferably from 4 μm -200 μm, particularly preferably 5μm-150μm。
Adhesive phase A2 quantity can be only one, or can be two or more.
Adhesive phase A2 is formed by adhesive composition a2.Adhesive phase A2 can be formed by any suitable method, only Adhesive composition a2 can be formed as by a layer shape by methods described.For example, adhesive phase A2 can be by forming as follows：Will Adhesive composition a2 is applied on any suitable base material；Optionally gains are heated, use active energy beam (for example, UV light) irradiation etc..
Adhesive composition a2 preferably includes acrylic polymer.Such acrylic polymer preferably by The acrylic polymer for polymerizeing following monomer component and obtaining：It is used with the alkyl for possessing 4-12 carbon atom (methyl) alkyl acrylate (sometimes referred to as " (methyl) acrylic acid C4-C12 Arrcostabs ") is used as key component, and it is wrapped Containing relative to the parts by weight of total amount 100 monomer component for the parts by weight of 1 parts by weight -10 the carboxylic monomer of bag as monomer group Point.
The content of acrylic polymer in adhesive composition a2 in terms of solids content be preferably 50 weight % or More, more preferably 50 weight %-99.99 weight %, even more preferably from 55 weight %-99 weight %, particularly preferred 60 weight %-95 Weight %, most preferably 70 weight %-90 weight %.
As (methyl) acrylic acid C4-C12 Arrcostabs, can be adopted in the range of the effect of the present invention is not damaged according to intention With any suitable (methyl) acrylic acid C4-C12 Arrcostabs, as long as (methyl) the acrylic acid C4-C12 Arrcostabs are with gathering around There is (methyl) alkyl acrylate (alkyl acrylate or alkyl methacrylate) of the alkyl of 4-12 carbon atom.So (methyl) acrylic acid C4-C12 Arrcostabs example include (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (first Base) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) third Olefin(e) acid heptyl ester, (methyl) 2-ethyl hexyl acrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (methyl) third Olefin(e) acid nonyl ester, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid Hendecane base ester and (methyl) dodecylacrylate.In such (methyl) acrylic acid C4-C12 Arrcostabs, preferably (methyl) n-butyl acrylate.
Serving as (methyl) acrylic acid C4-C12 Arrcostabs of the key component of monomer component can combine individually or with it Use.
The content of (methyl) acrylic acid C4-C12 Arrcostabs in the total amount of monomer component is preferably 50 weight %-99 weights Measure %, more preferably 80 weight %-98 weight %, even more preferably from 90 weight %-97 weight %.When (methyl) acrylic acid C4-C12 alkane When the content of base ester is fallen within the noted range, effect of the invention can be showed largely.
Monomer component includes carboxylic monomer.The example of such carboxylic monomer of bag includes (methyl) acrylic acid (acrylic or methacrylic acid), itaconic acid, maleic acid, fumaric acid and crotonic acid.In addition, the carboxylic monomer of bag Example also includes the acid anhydrides of those carboxylic monomers of bag (for example, the monomer comprising anhydride group, such as maleic anhydride and clothing health Acid anhydrides).
The content of the carboxylic monomer of bag in monomer component is preferably 1 weight %-10 weight %, more preferably 3 weight %- 10 weight %, even more preferably from 3 weight %-5 weight %.When the content of the carboxylic monomer of bag in the total amount of monomer component falls When in the scope, effect of the invention can be showed largely.
For by polymerization and obtain the monomer component of acrylic polymer can be optionally comprising can be with (methyl) propylene The monomer (monomer that can be copolymerized) of sour C4-C12 Arrcostabs or the carboxylic monomer copolymerization of bag.Such monomer that can be copolymerized Content is less than 50 weight % preferably relative to the total amount of monomer component.In order to show gratifying adhesive properties, this The content of the monomer that can be copolymerized of sample, which is more preferably, causes the glass transition temperature for the acrylic polymer to be obtained to become Into -20 DEG C or lower content, the content that still more preferably causes glass transition temperature to become -70 DEG C to -35 DEG C.
The example for the monomer that can be copolymerized includes：(methyl) acrylic acid C1-C3 Arrcostabs, such as (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate and (methyl) isopropyl acrylate；(methyl) acrylic acid C13-C20 alkane Base ester, such as (methyl) tridecyl acrylate, (methyl) acrylic acid tetradecane base ester, (methyl) acrylic acid pentadecyl Ester, (methyl) aliphatic acrylate, (methyl) acrylic acid heptadecane base ester, (methyl) octadecyl acrylate, (first Base) acrylic acid nonadecane base ester and (methyl) acrylic acid eicosane base ester；(methyl) acrylate comprising non-aromatic ring, example Such as (methyl) acrylate base ester (for example, (methyl) cyclohexyl acrylate) and (methyl) isobornyl acrylate；Include virtue (methyl) acrylate of race's ring, such as (methyl) benzyl acrylate (for example, (methyl) phenyl acrylate), (methyl) propylene Sour aryloxy group alkyl base ester (for example, (methyl) acrylate) and (methyl) acrylic acid aralkyl ester ((methyl) propylene Acid benzyl ester)；Acrylic monomer comprising epoxide group, such as (methyl) glycidyl acrylate and (methyl) acrylic acid first Base ethylene oxidic ester；Monomer based on vinyl esters, such as vinyl-acetic ester and vinyl propionate base ester；The list of styrene-based Body, such as styrene and α-methylstyrene；Monomer comprising hydroxyl, such as (methyl) Hydroxyethyl Acrylate, (methyl) third Olefin(e) acid hydroxy propyl ester and (methyl) hydroxy butyl acrylate；Based on the monomer of (methyl) alkoxyalkyl acrylate, such as (methyl) methoxyethyl acrylate and (methyl) ethoxyethyl acrylate；Monomer based on alkene, for example, ethene, propylene, Isoprene and butadiene；With the monomer based on vinyl ethers, such as vinyl ethers.
The example for the monomer that can be copolymerized also includes polyfunctional monomer, such as hexylene glycol two (methyl) acrylate, (poly-) second Glycol two (methyl) acrylate, (poly-) propane diols two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, season penta Tetrol two (methyl) acrylate, glycerine two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, Ji Wusi Alcohol three (methyl) acrylate, dipentaerythritol six (methyl) acrylate, epoxy acrylate, polyester acrylate, Urethane acrylate, divinylbenzene, (methyl) acrylate of butyl two and hexyl two (methyl) acrylate.
The example for the monomer that can be copolymerized also includes the monomer comprising nitrogen-atoms (for example, being based on (methyl) acrylic-amino alkane The monomer of base ester, such as (methyl) acrylate, (methyl) acrylic acid N, N- dimethylamino ethyl ester and (methyl) third Olefin(e) acid t-butylaminoethyl；Based on the monomer of (N- substitutions) acid amides, such as (methyl) acrylamide, N, N- dimethyl (first Base) acrylamide, N- butyl (methyl) acrylamide and N- hydroxyls (methyl) acrylamide；List based on cyanoacrylate Body, such as acrylonitrile and methacrylonitrile；It is different with the monomer comprising isocyanate groups, such as 2- methacryloxyethyls Cyanate).However, such monomer comprising nitrogen-atoms can cause the flavescence of described adhesive under heating, and therefore work as It is not that must use during the monomer preferably to avoid its use.
Acrylic polymer can pass through any suitable polymerization system in the range of the effect of the present invention is not damaged It is standby.The example of the polymerization of acrylic polymer include solution polymerization process, emulsion polymerisation process, bulk polymerization, With the polymerization irradiated based on UV.Among these, for the transparency, water resistance, cost etc., preferred solution polymerization process.
As polymerization initiator, the chain-transferring agent etc. that can be used in the polymerization of acrylic polymer, can not damage Any suitable product is used in the range of the effect of the present invention.
, can be in the range of the effect of the present invention not be damaged using any suitable as the usage amount of polymerization initiator Amount.Such usage amount is preferably 0.01 weight %-1 weight % of the total amount for example relative to monomer component.
, can be in the range of the effect of the present invention not be damaged using any suitable amount as the usage amount of chain-transferring agent. Such usage amount is preferably 0.01 weight %-15 weight % of the total amount for example relative to monomer component.
In solution polymerization process, various common solvents can be used.The example of such solvent includes organic solvent, example Such as：Ester, such as ethyl acetate and n-butyl acetate；Aromatic hydrocarbon, such as toluene and benzene；Aliphatic hydrocarbon, such as n-hexane and normal heptane； Clicyclic hydrocarbon, such as hexamethylene and hexahydrotoluene；And ketone, such as methyl ethyl ketone and methyl iso-butyl ketone (MIBK).Solvent can be independent Ground is applied in combination with it.
The weight average molecular weight of acrylic polymer is preferably 500,000-900,000, more preferably 550,000-850, 000th, even more preferably from 600,000-800,000.When the weight average molecular weight of acrylic polymer is fallen within the noted range, this hair Bright effect can be showed largely.
The weight average molecular weight of acrylic polymer except polymerization initiator and chain-transferring agent species and usage amount and The speed etc. that can also be dripped outside temperature and time during polymerization by monomer concentration, monomer controls.
Adhesive composition a2 can include oligomer component.
Oligomer component is preferably by the oligomer component for polymerizeing following monomer component and obtaining：Its use is in shape Into glass transition temperature during homopolymer be 60 DEG C -190 DEG C and with cyclic structure ethylenically unsaturated monomer (sometimes by Referred to as " ethylenically unsaturated monomer for including ring with 60 DEG C -190 DEG C of Tg ") key component is used as, and it is included relatively In the carboxylic monomer of bag that the monomer component of the parts by weight of total amount 100 is the parts by weight of 1 parts by weight -10.
Oligomer component is alternatively for example by making the glass transition temperature when forming homopolymer be 60 DEG C or higher And the oligomer component that the ethylenically unsaturated monomer with cyclic structure polymerize and obtained.
As the ethylenically unsaturated monomer for including ring with 60 DEG C -190 DEG C of Tg in oligomer component, can not damage Any suitable monomer component is used in the range of the effect of the evil present invention, as long as the monomer component is when forming homopolymer Glass transition temperature (Tg) is 60 DEG C -190 DEG C and has the ethylenically unsaturated monomer of cyclic structure in the molecule thereof.So The ethylenically unsaturated monomer comprising ring with 60 DEG C -190 DEG C of Tg in ring can be aromatic ring and non-aromatic ring any Kind, preferably non-aromatic ring.The example of aromatic ring includes aromatics hydrocarbon ring (for example, phenyl ring and the fusion carbon in the form of naphthalene etc. Ring) and various aromatic heterocycles.The example of non-aromatic ring includes：Non-aromatic alicyclic ring (for example, cycloalkanes hydrocarbon ring, such as pentamethylene Ring, cyclohexane ring, cycloheptane ring and cyclooctane ring, and cyclenes hydrocarbon ring, such as cyclohexene ring)；With non-aromatic bridged rings (for example, The hydrocarbon ring of bridging, such as the bicyclic hydrocarbon ring in the form of pinane, firpene, camphane, norcamphane, ENB etc., with adamantane etc. Form tricyctic hydrocarbon ring, and Fourth Ring hydrocarbon ring).
As the ethylenically unsaturated monomer for including ring of the Tg with 60 DEG C -190 DEG C, the vitrifying when forming homopolymer The ethylenically unsaturated monomer comprising ring that transition temperature is 60 DEG C -190 DEG C can be from each in the molecule thereof with cyclic structure Ethylenically unsaturated monomer properly selects, such as：(methyl) acrylate comprising non-aromatic ring, for example, (methyl) acrylic acid Cycloalkyl ester such as (methyl) cyclohexyl acrylate and (methyl) isobornyl acrylate；(methyl) propylene comprising aromatic ring Acid esters, for example, (methyl) benzyl acrylate such as (methyl) phenyl acrylate, (methyl) acrylic acid aryloxy group alkyl base ester are for example (methyl) acrylate and (methyl) acrylic acid aralkyl ester such as (methyl) benzyl acrylate；With based on benzene second The monomer of alkene, such as styrene and α-methylstyrene.
The ethylenically unsaturated monomer comprising ring with 60 DEG C -190 DEG C of Tg is preferably, for example, with non-aromatic ring (methyl) acrylate such as cyclohexyl methacrylate or (methyl) isobornyl acrylate, and from the transparency viewpoint From the point of view of, more preferably such as cyclohexyl methacrylate.
The ethylenically unsaturated monomer comprising ring each with 60 DEG C -190 DEG C of Tg can make individually or with its combination With.
Relative to the total amount of monomer component, the content of the ethylenically unsaturated monomer comprising ring with 60 DEG C -190 DEG C of Tg Preferably 50 weight % or more, more preferably 80 weight %-99 weight %, even more preferably from 90 weight %-97 weight %.When with When the content of 60 DEG C -190 DEG C of the Tg ethylenically unsaturated monomer comprising ring is fallen within the noted range, effect of the invention can obtain Largely to show.
Oligomer component may include to wrap carboxylic monomer as monomer component.As it may make up acrylic polymer Wrap in carboxylic monomer like that, the example of such carboxylic monomer of bag includes (methyl) acrylic acid, itaconic acid, Malaysia Acid, fumaric acid and crotonic acid.The example of the carboxylic monomer of bag also includes the acid anhydrides (example of those carboxylic monomers of bag Such as, the monomer comprising anhydride group, such as maleic anhydride and itaconic anhydride).
Relative to the monomer component of the parts by weight of total amount 100, the content of the carboxylic monomer of bag of oligomer component may make up Preferably the parts by weight of 1 parts by weight -10, more preferably the parts by weight of 3 parts by weight -10, even more preferably from the parts by weight of 3 parts by weight -5.When comprising When the content of the monomer of carboxyl is fallen within the noted range, effect of the invention can be showed largely.
Can optionally introduce can be with the ethylenically unsaturated monomer comprising ring of the Tg with 60 DEG C -190 DEG C or comprising carboxylic The monomer (monomer that can be copolymerized) of the monomer copolymerization of base is as the monomer component that may make up oligomer component.Such energy copolymerization The content of monomer is preferably to be less than 50 weight % relative to the monomer component of the parts by weight of total amount 100.Such monomer that can be copolymerized Content for cause the glass transition temperature of oligomer component can be arranged to more preferably 60 DEG C or higher, even more preferably from 65 DEG C -180 DEG C of content, because gratifying adhesive properties can be shown.
The example for the monomer that can be copolymerized includes：(methyl) alkyl acrylate, such as (methyl) methyl acrylate, (methyl) Ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) propylene Sour isobutyl ester, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) acrylic acid Own ester, (methyl) heptylacrylate, (methyl) 2-ethyl hexyl acrylate, (methyl) 2-EHA, (methyl) acrylic acid are different Monooctyl ester, (methyl) acrylic acid nonyl ester, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate and (methyl) Isodecyl Ester；Acrylic monomer comprising epoxide group, such as (methyl) glycidyl acrylate and (methyl) propylene acid methyl contract Water glyceride；Monomer based on vinyl esters, such as vinyl-acetic ester and vinyl propionate base ester；Monomer comprising hydroxyl, example Such as (methyl) Hydroxyethyl Acrylate, (methyl) hydroxypropyl acrylate and (methyl) hydroxy butyl acrylate；Based on (methyl) The monomer of alkoxyalkyl acrylate, such as (methyl) methoxyethyl acrylate and (methyl) ethoxyethyl acrylate； Monomer based on alkene, such as ethene, propylene, isoprene and butadiene；With the monomer based on vinyl ethers, such as ethene Base ether.
The example for the monomer that can be copolymerized also includes polyfunctional monomer, such as hexylene glycol two (methyl) acrylate, (poly-) second Glycol two (methyl) acrylate, (poly-) propane diols two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, season penta Tetrol two (methyl) acrylate, glycerine two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, Ji Wusi Alcohol three (methyl) acrylate, dipentaerythritol six (methyl) acrylate, epoxy acrylate, polyester acrylate, Urethane acrylate, divinylbenzene, (methyl) acrylate of butyl two and hexyl two (methyl) acrylate.
The example for the monomer that can be copolymerized also includes the monomer comprising nitrogen-atoms (for example, being based on (methyl) acrylic-amino alkane The monomer of base ester, such as (methyl) acrylate, (methyl) acrylic acid N, N- dimethylamino ethyl ester and (methyl) third Olefin(e) acid t-butylaminoethyl；Based on the monomer of (N- substitutions) acid amides, such as (methyl) acrylamide, N, N- dimethyl (first Base) acrylamide, N- butyl (methyl) acrylamide and N- hydroxyls (methyl) acrylamide；List based on cyanoacrylate Body, such as acrylonitrile and methacrylonitrile；It is different with the monomer comprising isocyanate groups, such as 2- methacryloxyethyls Cyanate).However, such monomer comprising nitrogen-atoms can cause the flavescence of described adhesive under heating, and therefore work as It is not that must use during the monomer preferably to avoid its use.
Oligomer component can be prepared in the range of the effect of the present invention is not damaged by any suitable polymerization.It is low The example of the polymerization of copolymer component is included solution polymerization process, emulsion polymerisation process, bulk polymerization and shone based on UV The polymerization penetrated.Among these, for the transparency, water resistance, cost etc., preferred solution polymerization process.
As polymerization initiator, the chain-transferring agent etc. that can be used in the polymerization of oligomer component, this hair can not damaged Any suitable product is used in the range of bright effect.
, can be in the range of the effect of the present invention not be damaged using any suitable as the usage amount of polymerization initiator Amount.Such usage amount is preferably 0.1 weight %-15 weight % of the total amount for example relative to monomer component.
, can be in the range of the effect of the present invention not be damaged using any suitable amount as the usage amount of chain-transferring agent. Such usage amount is preferably 0.01 weight %-15 weight % of the total amount for example relative to monomer component.
In solution polymerization process, various common solvents can be used.The example of such solvent includes organic solvent, example Such as：Ester, such as ethyl acetate and n-butyl acetate；Aromatic hydrocarbon, such as toluene and benzene；Aliphatic hydrocarbon, such as n-hexane and normal heptane； Clicyclic hydrocarbon, such as hexamethylene and hexahydrotoluene；And ketone, such as methyl ethyl ketone and methyl iso-butyl ketone (MIBK).Solvent can be independent Ground is applied in combination with it.
The weight average molecular weight of oligomer component is preferably 3,000-6,000, more preferably 3,300-5,500, even more preferably from 3, 500-5,000.When the weight average molecular weight of oligomer component is fallen within the noted range, effect of the invention can be able in larger journey Showed on degree.
Species and usage amount and polymerization of the weight average molecular weight of oligomer component except polymerization initiator and chain-transferring agent When temperature and the speed etc. that can also be dripped outside period by monomer concentration, monomer control.
Adhesive composition a2 preferably includes acrylic polymer.Adhesive composition a2 can include oligomer group Point.
When adhesive composition a2 includes acrylic polymer and oligomer component, said composition can show excellent The transparency, and the excellent property (resistant blister fissility) for preventing from floating (floating)/peel off can be shown, due to this And floating or peeling off for adhesive phase hardly occurs at the adhesive interface between substrate layer and adhesive phase.
In the case that adhesive composition a2 includes acrylic polymer and oligomer component wherein, acrylic polymer Ratio between compound and oligomer component is as follows：Relative to the acrylic polymer of 100 parts by weight, the amount of oligomer component The preferably parts by weight of 10 parts by weight -35, the more preferably parts by weight of 15 parts by weight -30.Adhesive composition a2 includes propylene wherein In the case of acids polymers and oligomer component, when the ratio between acrylic polymer and oligomer component falls described In the range of when, effect of the invention can be showed largely.
Adhesive composition a2 can also be optionally comprising known in addition to acrylic polymer and oligomer component Additive for example crosslinking agent, UV absorbents, antioxidant, light stabilizer, age resistor, tackifier, plasticizer, softening agent, filler, Colouring agent (for example, pigment or dyestuff), surfactant or antistatic additive.When acrylic polymer or oligomer component lead to Cross when using cross-linking agents, aggegation (cohesion, cohesive) intensity as the composition of adhesive can further increase.Cause This, adhesive composition a2 preferably includes crosslinking agent.Crosslinking agent can be applied in combination individually or with it.
The example of crosslinking agent includes the crosslinking agent based on isocyanates, the crosslinking agent based on epoxy, based on melamine Crosslinking agent, the crosslinking agent based on peroxide, the crosslinking agent based on urea, the crosslinking agent based on metal alkoxide, based on metal-chelating The crosslinking agent of thing, the crosslinking agent based on metal salt, the crosslinking agent based on carbodiimide, it is based onThe crosslinking agent of oxazoline, based on a word used for translation The crosslinking agent of third pyridine and the crosslinking agent based on amine.Among these, the crosslinking agent of isocyanates or the friendship based on epoxy are preferably based on Join agent.
The content of crosslinking agent based on isocyanates can be arranged to any suitable amount according to desired bonding strength, and And relative to the acrylic polymer of 100 parts by weight, preferably the parts by weight of 0.01 parts by weight -20, more preferably 0.01 parts by weight - 10 parts by weight, even more preferably from the parts by weight of 0.03 parts by weight -5.
The content of crosslinking agent based on epoxy can be arranged to any suitable amount, and phase according to desired bonding strength For the acrylic polymer of 100 parts by weight, the preferably parts by weight of 0.01 parts by weight -20, the more preferably weight of 0.01 parts by weight -10 Measure part, even more preferably from the parts by weight of 0.03 parts by weight -5.
As tackifier, any suitable tackifier are used.
Relative to the acrylic polymer of 100 parts by weight, the contents of tackifier is preferably parts by weight of 1 parts by weight -80, more It is preferred that the parts by weight of 5 parts by weight -70, even more preferably from the parts by weight of 10 parts by weight -50, the particularly preferred parts by weight of 10 parts by weight -40.Thickening The addition of agent can improve the bonding strength of adhesive composition.
Adhesive composition a2 can be prepared for example, by following：Oligomer group by acrylic polymer and optionally Divide and such as crosslinking agent of any other additive optionally mixes.
, can be in the scope for the effect for not damaging the present invention as the method that adhesive phase A2 is formed by adhesive composition a2 It is interior to use any suitable method.Adhesive phase A2 for example, by forming as follows：Adhesive composition a2 is applied and taken office On what suitable base material (for example, PET base material), and said composition is heated, dried.Adhesive phase A2 preferably passes through It is following to be formed：Adhesive composition a2 is applied on substrate layer A1, and said composition is heated, dried.For example, can Apply adhesive composition a2 using any suitable coating method.The example of such coating method is including the use of conventional painting Cloth device such as gravure roll applicator, inverse roll coating machine, roller lick formula spreader, immerse roll coating machine, bar coater (rod Apply device, bar coater), Scraper applicator, sprayer, comma spreader and directly spreader coating method.
<Antistatic layer A3>
As antistatic layer A3 thickness, any conjunction can be used according to intention in the range of the effect of the present invention is not damaged Suitable thickness.Such thickness be preferably 1nm-1,000nm, more preferably 5nm-900nm, even more preferably from 7.5nm-800nm, especially It is preferred that 10nm-700nm.
Antistatic layer A3 quantity can be only one, or can be two or more.
As antistatic layer A3, any suitable antistatic layer can be used in the range of the effect of the present invention is not damaged, As long as antistatic effect can be presented in the layer.Such antistatic layer is used preferably by by the top of any suitable substrate layer Conductive coating solution comprising conducting polymer and the antistatic layer formed.The layer is in particular for example, by by base material The antistatic layer that layer A1 top is formed with the conductive coating solution comprising conducting polymer.Coating method specifically exemplified by Such as method of roll coating, scraping article coating method or gravure coating method.
As conducting polymer, any suitable conducting polymer can be used in the range of the effect of the present invention is not damaged Thing.The example of such conducting polymer is that wherein polyanion is doped to the conducting polymer in pi-conjugated conducting polymer. The example of pi-conjugated conducting polymer includes chain conducting polymer, such as polythiophene, polypyrrole, polyaniline and polyacetylene.Poly- the moon The example of ion include poly styrene sulfonate, polyisoprene sulfonate, polyvinylsulfonic acid salt, polyallyl sulfonate, Polyacrylic acid ethyl sulfonate and polymethacryl carboxylic acid.
<<Dividing plate Q>>
, can be any suitable according to use is intended in the range of the effect of the present invention is not damaged as dividing plate Q thickness Thickness.Such thickness is preferably 4 μm -500 μm, more preferably 10 μm -400 μm, even more preferably from 15 μm -350 μm, particularly preferred 20 μm-300μm。
Dividing plate Q includes antistatic release layer B and substrate layer B3.As long as dividing plate Q includes antistatic release layer B and substrate layer B3, dividing plate can include any suitable other layers in the range of the effect of the present invention is not damaged according to intention.
As antistatic release layer B thickness, it can be used and appointed according to intention in the range of the effect of the present invention is not damaged What suitable thickness.Such thickness is preferably 10nm-3,000nm, more preferably 15nm-2,400nm, even more preferably from 17.5nm- 1,800nm, particularly preferred 20nm-1,200nm.
Antistatic release layer B quantity can be only one, or can be two or more.
As antistatic release layer B, any suitable layer can be used, as long as the layer is the demoulding with antistatic property Layer.Such antistatic release layer B is included, for example, at least one selected from alkali metal salt, ionic liquid and conducting polymer, And preferably include conducting polymer.As conducting polymer, it can use and appoint in the range of the effect of the present invention is not damaged What suitable conducting polymer.The example of such conducting polymer is included in entry<Antistatic layer A3>In list those.
Antistatic release layer B for example will be described below by the way that conducting polymer is incorporated into<Release layer B1>In and The layer of acquisition.
Antistatic release layer B preferably includes release layer B1 and antistatic layer B2.That is, dividing plate Q is preferably to be stated Order includes release layer B1, antistatic layer B2 and substrate layer B3.As long as dividing plate Q includes release layer B1 with the order stated, resisted Electrostatic layer B2 and substrate layer B3, dividing plate can not damage the present invention effect in the range of according to be intended to include it is any suitably Other layers.
Dividing plate Q 200 embodiment is as shown in Figure 3 by release layer B1 30, antistatic layer B2 40 and base material Layer B3 50 is formed.
The order that dividing plate Q can be stated includes release layer B1, antistatic layer B2, substrate layer B3 and antistatic layer B4.
Dividing plate Q 200 another embodiment is as shown in Figure 4 by release layer B1 30, antistatic layer B2 40, substrate layer B3 50 and antistatic layer B4 70 are formed.
<Release layer B1>
Release layer B1 is arranged to improve dividing plate from adhesive phase A2 fissility.As the formation material for release layer, Can be in the range of the effect of the present invention not be damaged using any suitable formation material.Such example for forming material includes Releasing agent based on organosilicon, the releasing agent based on fluorine, the releasing agent based on chain alkyl and the demoulding based on fatty acid amide Agent.Among these, the releasing agent of organosilicon is preferably based on.Release layer B1 can be formed as the layer applied.
, can be any suitable according to use is intended in the range of the effect of the present invention is not damaged as release layer B1 thickness Thickness.Such thickness be preferably 10nm-2,000nm, more preferably 10nm-1,500nm, even more preferably from 10nm-1,000nm, Particularly preferred 10nm-500nm.
Release layer B1 quantity can be only one, or can be two or more.
As the release layer based on organosilicon, provide, for example, addition reaction type silicone resin.The example includes：By KS-774, KS-775, KS-778, KS-779H, KS-847H and KS- of Shin-Etsu Chemical Co., Ltd. manufactures 847T；By Toshiba Silicone Co., TPR-6700, TPR-6710 and TPR-6721 of Ltd. manufactures；And by Dow The SD 7220 and SD 7226 of Corning Toray Co., Ltd. manufactures.The applied amount of release layer based on organosilicon (is dried It is preferably 0.01g/m afterwards)2-2g/m2, more preferably 0.01g/m2-1g/m2, even more preferably from 0.01g/m2-0.5g/m2。
Release layer B1 formation can be for example, by being carried out as follows：According to for example reverse intaglio plate coating of known application system, Scraping article is coated with or die head coating will form material and be applied on any suitable layer, then to the material that is applied in typical case About 120 DEG C-about 200 DEG C at be heat-treated with by the material solidification.In addition, by heat treatment and activity optionally can be used The irradiation of energy-ray such as UV irradiations are applied in combination.
<Antistatic layer B2>
As antistatic layer B2 thickness, any conjunction can be used according to intention in the range of the effect of the present invention is not damaged Suitable thickness.Such thickness be preferably 1nm-1,000nm, more preferably 5nm-900nm, even more preferably from 7.5nm-800nm, especially It is preferred that 10nm-700nm.
Antistatic layer B2 quantity can be only one, or can be two or more.
As antistatic layer B2, any suitable antistatic layer can be used in the range of the effect of the present invention is not damaged, As long as antistatic effect can be presented in the layer.Such antistatic layer is used preferably by by the top of any suitable substrate layer Conductive coating solution comprising conducting polymer and the antistatic layer formed.The layer is in particular, for example, by by base material The antistatic layer that layer B3 top is formed with the conductive coating solution comprising conducting polymer.Coating method specifically exemplified by Such as method of roll coating, scraping article coating method or gravure coating method.
As conducting polymer, any suitable conducting polymer can be used in the range of the effect of the present invention is not damaged Thing.The example of such conducting polymer is included in entry<Antistatic layer A3>In list those.
<Substrate layer B3>
As substrate layer B3, can be used in the range of the effect of the present invention is not damaged according to intention by any suitable material Expect the base material formed.The example of such material is included in entry<Substrate layer A1>In list those.
Substrate layer B3 quantity can be only one, or can be two or more.
, can be any suitable according to use is intended in the range of the effect of the present invention is not damaged as substrate layer B3 thickness Thickness.Such thickness is preferably 4 μm -500 μm, more preferably 10 μm -400 μm, even more preferably from 15 μm -350 μm, particularly preferably 20μm-300μm。
Substrate layer B3 can include antistatic additive.The resin sheet for having antistatic additive is wherein mediated as bag for example, can be used Substrate layer B3 containing antistatic additive.Such resin sheet can be by for forming the substrate layer B3's comprising resin and antistatic additive Composition is formed.
Substrate layer B3 can play a part of antistatic additive in itself.For example, work as using metal foil as substrate layer B3's During material, substrate layer B3 can play a part of antistatic additive in itself.
Base material B3 can undergo surface treatment.The example of surface treatment includes sided corona treatment, corona treatment, at chromic acid Manage, shocked by electricity exposed to ozone, exposed to flame, exposed to high voltage, ionising radiation is handled and the coating process with priming paint.
The example of Organic coating materials as priming paint is included in entry<Substrate layer A1>In list those.
Substrate layer B3 basis can be intended to encompass any suitable other additions in the range of the effect of the present invention is not damaged Agent.
<Antistatic layer B4>
As antistatic layer B4 thickness, any conjunction can be used according to intention in the range of the effect of the present invention is not damaged Suitable thickness.Such thickness be preferably 1nm-1,000nm, more preferably 5nm-900nm, even more preferably from 7.5nm-800nm, especially It is preferred that 10nm-700nm.
Antistatic layer B4 quantity can be only one, or can be two or more.
As antistatic layer B4, any suitable antistatic layer can be used in the range of the effect of the present invention is not damaged, As long as antistatic effect can be presented in the layer.Such antistatic layer is used preferably by by the top of any suitable substrate layer Conductive coating solution comprising conducting polymer and the antistatic layer formed.The layer is in particular, for example, by by base material The antistatic layer that layer B3 top is formed with the conductive coating solution comprising conducting polymer.Coating method specifically exemplified by Such as method of roll coating, scraping article coating method or gravure coating method.
As conducting polymer, any suitable conducting polymer can be used in the range of the effect of the present invention is not damaged Thing.The example of such conducting polymer is included in entry<Antistatic layer A3>In list those.
<<Enhancing film with dividing plate>>
The enhancing film with dividing plate of the present invention can be obtained by following：Enhancing is pasted each other with film P and dividing plate Q Close so that adhesive phase A2 and antistatic release layer B can be directly laminated.
Antistatic release layer B preferably includes release layer B1 and antistatic layer B2.That is, dividing plate Q is preferably to be stated Order includes release layer B1, antistatic layer B2 and substrate layer B3.Therefore, the enhancing film with dividing plate of the invention is preferable Ground is obtained by following：Enhancing is bonded each other with film P and dividing plate Q so that adhesive phase A2 and release layer B1 can direct layer It is folded.
One embodiment of the enhancing film 1000 with dividing plate of the present invention is the side of being implemented as follows as shown in Figure 5 Formula：The enhancing film P 100 wherein formed by substrate layer A1 10 and adhesive phase A2 20, and by release layer B1 30, antistatic The dividing plate Q 200 that layer B2 40 and substrate layer B3 50 is formed is bonded each other so that adhesive phase A2 20 and release layer B1 30 can Directly it is laminated.
Another embodiment of the enhancing film 1000 with dividing plate of the present invention is the side of being implemented as follows as shown in Figure 6 Formula：The enhancing film P 100 wherein formed by substrate layer A1 10 and adhesive phase A2 20, and by release layer B1 30, antistatic The dividing plate Q 200 that layer B2 40, substrate layer B3 50 and antistatic layer B4 70 are formed is bonded each other so that the Hes of adhesive phase A2 20 Release layer B1 30 can be directly laminated.
Another embodiment of the enhancing film 1000 with dividing plate of the present invention is the side of being implemented as follows as shown in Figure 7 Formula：The enhancing film P 100 wherein formed by antistatic layer A3 60, substrate layer A1 10 and adhesive phase A2 20, and by taking off The dividing plate Q 200 that mold layer B1 30, antistatic layer B2 40 and substrate layer B3 50 are formed is bonded each other so that adhesive phase A2 20 and release layer B1 30 can be directly laminated.
Another embodiment of the enhancing film 1000 with dividing plate of the present invention is the side of being implemented as follows as shown in Figure 8 Formula：The enhancing film P 100 wherein formed by antistatic layer A3 60, substrate layer A1 10 and adhesive phase A2 20, and by taking off The dividing plate Q 200 that mold layer B1 30, antistatic layer B2 40, substrate layer B3 50 and antistatic layer B4 70 are formed is bonded each other, is made Obtaining adhesive phase A2 20 and release layer B1 30 can directly be laminated.
The present invention the enhancing film with dividing plate in, when at 23 DEG C of temperature and 50%RH humidity with 150 ° Peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, adhesive phase A2 surface has 10kV Or lower stripping electrification voltage, and antistatic release layer B surface has 5.0kV or lower stripping electrification voltage. The stripping electrification voltage on the wherein stripping electrification voltage on adhesive phase A2 surface and antistatic release layer B surface falls described In the range of in the case of, when peeling off dividing plate, generable stripping electrification can be suppressed, and even if when by dividing plate from advance fitting When being peeled off to the enhancing with dividing plate of the face side of the exposure of optical component, electronic unit etc. with film, it can also mitigate to optics The infringement of part or electronic unit.
The stripping electrification voltage on adhesive phase A2 surface is preferably 10kV or lower, more preferably 0.05kV-9.0kV, gone back More preferably 0.075kV-8.0kV, particularly preferred 0.1kV-7.0kV.
The stripping electrification voltage on antistatic release layer B surface is preferably 5.0kV or lower, more preferably 0.05kV- 4.9kV, even more preferably from 0.075kV-4.8kV, particularly preferred 0.1kV-4.7kV.
In the enhancing film with dividing plate of the present invention, antistatic release layer B includes release layer B1 and resisted quiet wherein In the case that electric layer B2 and adhesive phase A2 and release layer B1 are directly laminated, when at 23 DEG C of temperature and 50%RH humidity With 150 ° of peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, release layer B1 surface tool There is 5.0kV or lower stripping electrification voltage.The stripping electrification voltage on release layer B1 surface is fallen within the noted range wherein In the case of, when peeling off dividing plate, generable stripping electrification can be suppressed, and dividing plate is conformed into optics from advance even if working as When the enhancing with dividing plate of the face side of the exposure of part, electronic unit etc. is peeled off with film, can also mitigate to optical component or The infringement of electronic unit.
The stripping electrification voltage on release layer B1 surface is preferably 5.0kV or lower, more preferably 0.05kV-4.9kV, also more It is preferred that 0.075kV-4.8kV, particularly preferred 0.1kV-4.7kV.
The present invention the enhancing film with dividing plate in, when at 23 DEG C of temperature and 50%RH humidity with 150 ° Peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, antistatic release layer B surface has excellent Select 1.0 × 104Ω-1.0×1012Ω, more preferably 5.0 × 104Ω-7.5×1011Ω, even more preferably from 7.5 × 104Ω-5.0× 1011Ω, particularly preferred 1.0 × 105Ω-1.0×1011Ω sheet resistance value.The table on antistatic release layer B surface wherein In the case that surface resistance value is fallen within the noted range, when peeling off dividing plate, generable stripping electrification can be suppressed, and even if be worked as The enhancing with dividing plate of dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. in advance is peeled off with film When, it also can further mitigate the infringement to optical component or electronic unit.
In the enhancing film with dividing plate of the present invention, antistatic release layer B includes release layer B1 and resisted quiet wherein In the case that electric layer B2 and adhesive phase A2 and release layer B1 are directly laminated, when at 23 DEG C of temperature and 50%RH humidity With 150 ° of peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, release layer B1 surface tool Have preferably 1.0 × 104Ω-1.0×1012Ω, more preferably 5.0 × 104Ω-7.5×1011Ω, even more preferably from 7.5 × 104Ω- 5.0×1011Ω, particularly preferred 1.0 × 105Ω-1.0×1011Ω sheet resistance value.The table on release layer B1 surface wherein In the case that surface resistance value is fallen within the noted range, when peeling off dividing plate, generable stripping electrification can be suppressed, and even if be worked as The enhancing with dividing plate of dividing plate from the face side for the exposure for conforming to optical component, electronic unit etc. in advance is peeled off with film When, it also can further mitigate the infringement to optical component or electronic unit.
The present invention the enhancing film with dividing plate in, at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q after enhancing is peeled off with film P, temperature at 23 DEG C, 50% Adhesive phase A2 is strong to the initial adhesion of glass plate under the rate of extension of RH humidity, 180 ° of peel angle and 300mm/min Degree be preferably 1.0N/25mm or bigger, more preferably 1.0N/25mm-50N/25mm, even more preferably from 1.0N/25mm-45N/25mm, Particularly preferred 1.0N/25mm-40N/25mm.When adhesive phase A2 is fallen within the noted range to the initial adhesion strength of glass plate When, obtain gratifying bonding strength and therefore can mitigate insufficient adhesion of the layer to adherend.
The present invention the enhancing film with dividing plate in, when at 23 DEG C of temperature and 50%RH humidity with 180 ° Peel angle and 300mm/min rate of extension by dividing plate Q from enhancing peeled off with film P when peel strength be preferably 0.30N/ 25mm or smaller, more preferably 0.005N/25mm-0.30N/25mm, even more preferably from 0.0075N/25mm-0.30N/25mm, especially It is preferred that 0.01N/25mm-0.30N/25mm.When peel strength is fallen within the noted range, can mitigate in increasing of the operation with dividing plate Dividing plate is peeled off from the mistake of enhancing film when using film by force.In addition, the adhesive phase of enhancing film when dividing plate is peeled off can be mitigated Aggegation destruction or fastening destruction.
Now, the present invention is specifically described by embodiment.However, the present invention is not limited to embodiment.In embodiment etc. Experiment and evaluation method as described below.Unless otherwise stated, the term " part " in following description means " weight Part ", and unless otherwise stated, the term " % " in following description means " weight % ".
<The measurement of weight average molecular weight>
Weight average molecular weight is measured by gel permeation chromatography (GPC) method.Specifically, it is described measurement be by using Can using trade name " HLC-8120GPC " obtain equipment (being manufactured by Tosoh Corporation) as gpc measurement equipment with Carried out under the conditions of lower, and weight average molecular weight is calculated as polystyrene standard scaled value.
(molecular weight measurement condition)
Sample concentration：0.2 weight % (tetrahydrofuran solution)
Sample injection rate：10μL
Post：Trade name " TSKguardcolumn SuperHZ-H (one)+TSKgel SuperHZM-H (two) " (being manufactured by Tosoh Corporation)
Reference column：Trade name " TSKgel SuperH-RC (one) " (being manufactured by Tosoh Corporation)
Eluant, eluent：Tetrahydrofuran (THF)
Flow velocity：0.6mL/min
Detector：Refractive index detector (RI)
Column temperature (measurement temperature)：40℃
<The measurement of sheet resistance value>
With 150 ° of peel angle and 10m/min detachment rate by dividing plate at 23 DEG C of temperature and 50%RH humidity Peeled off from the enhancing with dividing plate with film.Afterwards, it is left with MODEL152-1 (152P-2P probes) measurements manufactured by TREK Enhancing with the substrate layer side surface of film part and adhesive phase side surface and peel off partition part release layer side surface and The sheet resistance value of substrate layer side surface.The measurement is carried out under the voltage at 23 DEG C of temperature and 50%RH humidity in 10V 10 second time.<The measurement of the stripping electrification voltage on the surface of adhesive phase>
By in advance from its except electricity the enhancing with dividing plate with film cut into 70mm it is wide × 130mm grow size, and And with electrostatic potential measuring instrument (Shishido Electrostatic, Ltd., STATIRON DZ4) measurement peel off dividing plate it The potential on the surface of adhesive phase afterwards, the instrument are fixed on the opening position apart from the surface 30mm.Measurement is with 23 DEG C temperature and 50%RH humidity in the environment of carry out.Dividing plate is peeled off as follows：Dividing plate is fixed to sutomatic winding machine, and Peeled off at 23 DEG C of temperature and 50%RH humidity so that peel angle becomes 150 ° and detachment rate becomes 10m/ min。
<The measurement of the stripping electrification voltage on the surface of release layer>
By in advance from its except electricity the enhancing with dividing plate with film cut into 70mm it is wide × 130mm grow size, and And with electrostatic potential measuring instrument (Shishido Electrostatic, Ltd., STATIRON DZ4) measurement peel off dividing plate it The potential on the surface of release layer afterwards, the instrument are fixed on the opening position apart from the surface 30mm.Measurement is with 23 DEG C Temperature and 50%RH humidity in the environment of carry out.Dividing plate is peeled off as follows：Dividing plate is fixed to sutomatic winding machine, and Peeled off under 23 DEG C of temperature and 50%RH humidity so that peel angle becomes 150 ° and detachment rate becomes 10m/ min。
<Measurement of the adhesive phase to the initial adhesion strength of glass plate>
By in advance from it except the enhancing with dividing plate of electricity cuts into film the length of width and 150mm with 25mm Degree, and gains are used as evaluation sample.By making 2.0 under the atmosphere with 23 DEG C of temperature and 50%RH humidity Kilogram roller, which moves back and forth, once makes the surface of the adhesive phase of evaluation sample conform to glass plate (by Matsunami Glass Ind., Ltd. is manufactured, trade name MICRO SLIDE GLASS S).By gains in the temperature with 23 DEG C and 50% After being aged 30 minutes under the atmosphere of RH humidity, by by sample with universal tensile testing machine (by Minebea Co., Ltd.s Manufacture, ProductName：TCM-1kNB) peeled off with 180 ° of peel angle and 300mm/min rate of extension, measure the bonding of sample Intensity.
<The measurement of the peel strength of dividing plate>
By in advance from it except the enhancing with dividing plate of electricity cuts into film the length of width and 150mm with 25mm Degree, and gains are used as evaluation sample.Enhancing is fixed with film so that the substrate surface and acrylic compounds of enhancing film Plate contacts, and by the way that dividing plate is used into universal tensile testing machine under the atmosphere with 23 DEG C of temperature and 50%RH humidity (manufactured by Minebea Co., Ltd.s, ProductName：TCM-1kNB) with 180 ° of peel angle and 300mm/min rate of extension Peel off and measure dividing plate peel strength.
[manufacture embodiment 1]：The manufacture of (methyl) acrylic polymer (1)
By butyl acrylate (being manufactured by Nippon Shokubai Co., Ltd.), the propylene of 5 parts by weight of 95 parts by weight Acid (by Toagosei Co., Ltd. manufacture), serve as polymerization initiator 0.2 parts by weight 2,2 '-azodiisobutyronitrile (by Wako Pure Chemical Industries, Ltd. manufacture) and the ethyl acetate of 156 parts by weight be loaded into including stirring Oar, thermometer, nitrogen introducing tube and condenser four-neck flask in.While mixture is gently stirred for, introduce nitrogen gas into Into flask.While the fluid temperature in flask is remained into about 63 DEG C, polymerisation is carried out 10 hours.Thus, it is made The solution (40 weight %) of (methyl) acrylic polymer (1) with 700,000 weight average molecular weight.
[manufacture embodiment 2]：The manufacture of (methyl) acrylic polymer (2)
Cyclohexyl methacrylate (the homopolymer (polycyclohexyl methacrylate) of 95 parts by weight of monomer component will be served as Glass transition temperature：66 DEG C) and 5 parts by weight acrylic acid, serve as chain-transferring agent 3 parts by weight 2 mercapto ethanol, fill When 0.2 parts by weight of polymerization initiator 2,2 '-azodiisobutyronitrile and serve as polymer solvent 103.2 parts by weight toluene It is loaded into separable flask, and is stirred the mixture for while introducing nitrogen gas into flask 1 hour.More than such as After the oxygen in polymerization system is removed as described, the temperature in system is increased to 70 DEG C, and carry out mixture Reaction 3 hours.Further, mixture is made to carry out reaction 2 hours at 75 DEG C.Thus, obtain with 4,000 weight average molecular weight (methyl) acrylic polymer (2) solution (50 weight %).
[manufacture embodiment 3]：The manufacture of acrylic pressure-sensitive adhesive compositions (1)
Crosslinking agent is served as in the solution addition of (methyl) acrylic polymer (1) obtained into manufacture embodiment 1 TETRAD-C (is manufactured) by Mitsubishi Gas Chemical Company, Inc..Relative to (methyl) acrylic The parts by weight of solids content 100 of the solution of thing (1), the amount of the crosslinking agent are calculated as 0.075 parts by weight with solids content.Will be mixed Compound is diluted with ethyl acetate so that total solid content becomes 25 weight %, is stirred afterwards with disperser.Thus, wrapped Acrylic pressure-sensitive adhesive compositions (1) containing acrylic resin.
[manufacture embodiment 4]：The manufacture of acrylic pressure-sensitive adhesive compositions (2)
Crosslinking agent is served as in the solution addition of (methyl) acrylic polymer (1) obtained into manufacture embodiment 1 TETRAD-C (being manufactured by Mitsubishi Gas Chemical Company, Inc.) and manufacture the (first that obtains in embodiment 2 Base) acrylic polymer (2) solution.Relative to the solids content 100 of the solution of (methyl) acrylic polymer (1) Parts by weight, the amount of the crosslinking agent are calculated as 0.075 parts by weight with solids content, and (methyl) acrylic polymer (2) The amount of solution is calculated as 20 parts by weight with solids content.Mixture is diluted with ethyl acetate so that total solid content becomes 25 weight %, are stirred with disperser afterwards.Thus, the acrylic pressure-sensitive adhesive compositions (2) for including acrylic resin are obtained.
[manufacture embodiment 5]：The manufacture of layered product (A) " [antistatic layer]/[substrate layer] "
The S-948 (being manufactured by Chukyo Yushi Co., Ltd.) and 10 weights of 100 parts by weight of conductive coating agent will be served as The P-795 (being manufactured by Chukyo Yushi Co., Ltd.) for measuring part uses pure water and EKINEN F6 (by Japan Alcohol Trading Co., Ltd. manufacture) mixed solution be diluted to 0.3 weight %.Thus, conductive coating fluid (a) is obtained.By gained Conductive coating fluid (a) is applied to base material " LUMIRROR the S10 " (thickness formed by polyester resin with bar：38 μm, by Toray Industries, Inc. are manufactured) so that the thickness after it is dried becomes 20nm.By drying of the liquid applied at 130 DEG C Temperature and solidification and drying under conditions of the drying time of 3 minutes.Thus, layered product (A) " [antistatic layer]/[base material is made Layer] ".
[manufacture embodiment 6]：The manufacture of layered product (B) " [antistatic layer]/[substrate layer]/[antistatic layer] "
The conductive coating fluid (a) prepared in manufacture embodiment 5 is applied to the stacking obtained into manufacture embodiment 5 with bar The substrate layer side surface of body (A) " [antistatic layer]/[substrate layer] " so that the thickness after it is dried becomes 20nm.It will be applied The liquid added in 130 DEG C of drying temperature and solidifies and dried under conditions of the drying time of 3 minutes.Thus, layered product is made (B) " [antistatic layer]/[substrate layer]/[antistatic layer] ".
[manufacture embodiment 7]：The system of layered product (C) " [release layer]/[antistatic layer]/[substrate layer]/[antistatic layer] " Make
By the silicone release of 100 parts by weight (being manufactured by Shin-Etsu Chemical Co., Ltd.s, KS-847) and 1.0 parts by weight catalyst (by Shin-Etsu Chemical Co., Ltd.s manufacture, CAT-PL-50T) with dilution with toluene extremely 1.0 weight %.Thus, Si releasing agent treatment fluids are obtained.Gained Si releasing agent treatment fluid bars are applied to manufacture embodiment 6 The surface of one antistatic layer of the layered product (B) " [antistatic layer]/[substrate layer]/[antistatic layer] " of middle acquisition so that its Thickness after drying becomes 100nm.By the liquid applied in 130 DEG C of drying temperature and the bar of the drying time of 3 minutes Solidify under part and dry.Thus, layered product (C) " [release layer]/[antistatic layer]/[substrate layer]/[antistatic layer] " is made.
[manufacture embodiment 8]：The manufacture of layered product (D) " [release layer]/[antistatic layer]/[substrate layer] "
The Si releasing agents treatment fluid obtained in manufacture embodiment 7 is applied to the layer obtained into manufacture embodiment 5 with bar The surface of the antistatic layer of stack (A) " [antistatic layer]/[substrate layer] " so that the thickness after it is dried becomes 100nm.Will The liquid applied in 130 DEG C of drying temperature and solidifies and dried under conditions of the drying time of 3 minutes.Thus, layer is made Stack (D) " [release layer]/[antistatic layer]/[substrate layer] ".
[manufacture embodiment 9]：The manufacture of layered product (E) " [release layer]/[substrate layer]/[antistatic layer] "
The Si releasing agents treatment fluid obtained in manufacture embodiment 7 is applied to the layer obtained into manufacture embodiment 5 with bar The surface of the substrate layer of stack (A) " [antistatic layer]/[substrate layer] " so that the thickness after it is dried becomes 100nm.By institute The liquid of application in 130 DEG C of drying temperature and solidifies and dried under conditions of the drying time of 3 minutes.Thus, stacking is made Body (E) " [release layer]/[substrate layer]/[antistatic layer] ".
[embodiment 1]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied with for slurry roller (fountain roll) Add to base material " LUMIRROR the S10 " (thickness formed by polyester resin：38 μm, by Toray Industries, Inc. systems Make) so that the thickness after it is dried becomes 25 μm.By the composition applied in the dry of 130 DEG C of drying temperature and 3 minutes Solidify under conditions of the dry time and dry.Thus, layered product (P1) " [substrate layer]/[adhesive phase] " is obtained.Gained is laminated The layered product (C) " [release layer]/[antistatic obtained in body (P1) " [substrate layer]/[adhesive phase] " and manufacture embodiment 7 Layer]/[substrate layer]/[antistatic layer] " it is bonded each other so that adhesive phase and release layer are directly laminated.Thus, obtain have every The enhancing of plate is with film (1).The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (1), then carries out various evaluations. As a result it is shown in Table 1.
[embodiment 2]
The acrylic pressure-sensitive adhesive compositions (2) obtained in manufacture embodiment 4 are applied to by polyester resin with for slurry roller Base material " LUMIRROR the S10 " (thickness of formation：38 μm, manufactured by Toray Industries, Inc.) so that it dries it Thickness afterwards becomes 25 μm.The composition applied is consolidated in 130 DEG C of drying temperature and under conditions of the drying time of 3 minutes Change and dry.Thus, layered product (P2) " [substrate layer]/[adhesive phase] " is obtained.By gained layered product (P2) " [substrate layer]/ Layered product (C) " [release layer]/[antistatic layer]/[substrate layer]/[anti-quiet obtained in [adhesive phase] " and manufacture embodiment 7 Electric layer] " it is bonded each other so that adhesive phase and release layer are directly laminated.Thus, the enhancing with dividing plate is obtained with film (2).Will The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (2), then carries out various evaluations.As a result it is shown in Table 1.
[embodiment 3]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied to manufacture embodiment 5 with for slurry roller The surface of the substrate layer of the layered product (A) " [antistatic layer]/[substrate layer] " of middle acquisition so that the thickness after it is dried becomes 25μm.The composition applied in 130 DEG C of drying temperature and is solidified and dried under conditions of the drying time of 3 minutes.By This, obtains layered product (P3) " [antistatic layer]/[substrate layer]/[adhesive phase] ".Gained layered product (P3) is " [antistatic Layer]/[substrate layer]/[adhesive phase] " and manufacture embodiment 7 in obtain layered product (C) " [release layer]/[antistatic layer]/ [substrate layer]/[antistatic layer] " is bonded each other so that adhesive phase and release layer are directly laminated.Thus, obtain with dividing plate Film (3) is used in enhancing.The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (3), then carries out various evaluations.As a result It is shown in Table 1.
[embodiment 4]
The acrylic pressure-sensitive adhesive compositions (2) obtained in manufacture embodiment 4 are applied to manufacture embodiment 5 with for slurry roller The surface of the substrate layer of the layered product (A) " [antistatic layer]/[substrate layer] " of middle acquisition so that the thickness after it is dried becomes 25μm.The composition applied in 130 DEG C of drying temperature and is solidified and dried under conditions of the drying time of 3 minutes.By This, obtains layered product (P4) " [antistatic layer]/[substrate layer]/[adhesive phase] ".Gained layered product (P4) is " [antistatic Layer]/[substrate layer]/[adhesive phase] " and manufacture embodiment 7 in obtain layered product (C) " [release layer]/[antistatic layer]/ [substrate layer]/[antistatic layer] " is bonded each other so that adhesive phase and release layer are directly laminated.Thus, obtain with dividing plate Film (4) is used in enhancing.The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (4), then carries out various evaluations.As a result It is shown in Table 1.
[embodiment 5]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied to by polyester resin with for slurry roller Base material " LUMIRROR the S10 " (thickness of formation：38 μm, manufactured by Toray Industries, Inc.) so that it dries it Thickness afterwards becomes 25 μm.The composition applied is consolidated in 130 DEG C of drying temperature and under conditions of the drying time of 3 minutes Change and dry.Thus, layered product (P5) " [substrate layer]/[adhesive phase] " is obtained.By gained layered product (P5) " [substrate layer]/ The layered product (D) " [release layer]/[antistatic layer]/[substrate layer] " obtained in [adhesive phase] " and manufacture embodiment 8 pastes each other Close so that adhesive phase and release layer are directly laminated.Thus, the enhancing with dividing plate is obtained with film (5).Gained had into dividing plate Enhancing be aged 7 days at normal temperatures with film (5), then carry out various evaluations.As a result it is shown in Table 1.
[embodiment 6]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied to manufacture embodiment 5 with for slurry roller The surface of the substrate layer of the layered product (A) " [antistatic layer]/[substrate layer] " of middle acquisition so that the thickness after it is dried becomes 25μm.The composition applied in 130 DEG C of drying temperature and is solidified and dried under conditions of the drying time of 3 minutes.By This, obtains layered product (P6) " [antistatic layer]/[substrate layer]/[adhesive phase] ".Gained layered product (P6) is " [antistatic Layer]/[substrate layer]/[adhesive phase] " and manufacture embodiment 8 in obtain layered product (D) " [release layer]/[antistatic layer]/ [substrate layer] " is bonded each other so that adhesive phase and release layer are directly laminated.Thus, the enhancing film with dividing plate is obtained (6).The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (6), then carries out various evaluations.As a result it is shown in table 1 In.
[comparative example 1]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied to by polyester resin with for slurry roller Base material " LUMIRROR the S10 " (thickness of formation：38 μm, manufactured by Toray Industries, Inc.) so that it dries it Thickness afterwards becomes 25 μm.The composition applied is consolidated in 130 DEG C of drying temperature and under conditions of the drying time of 3 minutes Change and dry.Thus, layered product (CP1) " [substrate layer]/[adhesive phase] " is obtained.By gained layered product (CP1) " [base material Layer]/[adhesive phase] " and manufacture in embodiment 9 layered product (E) " [release layer]/[substrate layer]/[antistatic layer] " that obtains that This fitting so that adhesive phase and release layer are directly laminated.Thus, the enhancing with dividing plate is obtained with film (C1).Gained is had The enhancing for having dividing plate is aged 7 days at normal temperatures with film (C1), then carries out various evaluations.As a result it is shown in Table 1.
[comparative example 2]
The acrylic pressure-sensitive adhesive compositions (1) obtained in manufacture embodiment 3 are applied to manufacture embodiment 5 with for slurry roller The surface of the substrate layer of the layered product (A) " [antistatic layer]/[substrate layer] " of middle acquisition so that the thickness after it is dried becomes 25μm.The composition applied in 130 DEG C of drying temperature and is solidified and dried under conditions of the drying time of 3 minutes.By This, obtains layered product (CP2) " [antistatic layer]/[substrate layer]/[adhesive phase] ".Gained layered product (CP2) is " [antistatic Layer]/[substrate layer]/[adhesive phase] " and manufacture embodiment 9 in obtain layered product (E) " [release layer]/[substrate layer]/[resist Electrostatic layer] " it is bonded each other so that adhesive phase and release layer are directly laminated.Thus, the enhancing film with dividing plate is obtained (C2).The enhancing that gained has dividing plate is aged 7 days at normal temperatures with film (C2), then carries out various evaluations.As a result it is shown in table 1 In.
The enhancing film with dividing plate of the present invention can be used as conforming to the increasing of the dorsal part of the substrate of such as semiconductor element Use film by force.

Claims (11)

1. the enhancing film with dividing plate, it includes：
Film P is used in enhancing；With
Dividing plate Q,
Wherein：
Enhancing includes substrate layer A1 and adhesive phase A2 with film P；
Dividing plate Q includes antistatic release layer B and substrate layer B3；
Adhesive phase A2 and antistatic release layer B are directly laminated；
When at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q When being peeled off from enhancing with film P, adhesive phase A2 surface has 10kV or lower stripping electrification voltage, and the antistatic demoulding Layer B surface has 5.0kV or lower stripping electrification voltage.
2. the enhancing film according to claim 1 with dividing plate, wherein when at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, antistatic release layer B surface With 1.0 × 104Ω-1.0×1012Ω sheet resistance value.
3. the enhancing film according to claim 1 with dividing plate, wherein antistatic release layer B includes conducting polymer.
4. the enhancing film according to claim 1 with dividing plate, wherein：
Antistatic release layer B includes release layer B1 and antistatic layer B2；
Adhesive phase A2 and release layer B1 are directly laminated；
When at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q When being peeled off from enhancing with film P, release layer B1 surface has 5.0kV or lower stripping electrification voltage.
5. the enhancing film according to claim 4 with dividing plate, wherein when at 23 DEG C of temperature and 50%RH humidity with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q from enhancing peeled off with film P when, release layer B1 surface has 1.0×104Ω-1.0×1012Ω sheet resistance value.
6. the enhancing film according to claim 4 with dividing plate, wherein antistatic layer B2 include conducting polymer.
7. the enhancing film according to claim 1 with dividing plate, wherein enhancing film P is included antistatic with the order stated Layer A3, substrate layer A1 and adhesive phase A2.
8. the enhancing film according to claim 1 with dividing plate, its median septum Q includes the antistatic demoulding with the order stated Layer B, substrate layer B3 and antistatic layer B4.
9. the enhancing film according to claim 8 with dividing plate, wherein antistatic layer B4 include conducting polymer.
10. the enhancing film according to claim 1 with dividing plate, wherein in 23 DEG C of temperature and 50%RH humidity Under with 150 ° of peel angle and 10m/min detachment rate by dividing plate Q after enhancing is peeled off with film P, temperature at 23 DEG C, Adhesive phase A2 is to the initial viscous of glass plate under the rate of extension of 50%RH humidity, 180 ° of peel angle and 300mm/min Conjunction intensity is 1.0N/25mm or bigger.
11. the enhancing film according to claim 1 with dividing plate, wherein when at 23 DEG C of temperature and 50%RH humidity with 180 ° of peel angle and 300mm/min rate of extension by dividing plate Q from enhancing peeled off with film P when peel strength be 0.30N/ 25mm or smaller.
CN201710521337.0A 2016-06-30 2017-06-30 Enhancing film with dividing plate Pending CN107553995A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010284459.4A CN111497361A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator
CN202010284169.XA CN111497360A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016130641A JP6366199B2 (en) 2016-06-30 2016-06-30 Reinforcing film with separator
JP2016-130641 2016-06-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202010284169.XA Division CN111497360A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator
CN202010284459.4A Division CN111497361A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator

Publications (1)

Publication Number Publication Date
CN107553995A true CN107553995A (en) 2018-01-09

Family

ID=60948547

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201710521337.0A Pending CN107553995A (en) 2016-06-30 2017-06-30 Enhancing film with dividing plate
CN202010284169.XA Pending CN111497360A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator
CN202010284459.4A Pending CN111497361A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202010284169.XA Pending CN111497360A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator
CN202010284459.4A Pending CN111497361A (en) 2016-06-30 2017-06-30 Reinforcing membrane with separator

Country Status (4)

Country Link
JP (1) JP6366199B2 (en)
KR (1) KR101962019B1 (en)
CN (3) CN107553995A (en)
TW (1) TWI649396B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7253391B2 (en) * 2019-01-21 2023-04-06 日東電工株式会社 Laminated film for reinforcement
WO2021106272A1 (en) 2019-11-26 2021-06-03 日東電工株式会社 Reinforcing film
JP2024007852A (en) 2022-07-06 2024-01-19 日東電工株式会社 Optical member having surface protective film, optical laminate, and manufacturing method of optical device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867643A (en) * 2003-10-15 2006-11-22 徐光锡 Antistatic tapes and method for producing thereof
JP2010017931A (en) * 2008-07-10 2010-01-28 Toyobo Co Ltd Mold releasing film
CN106467710A (en) * 2015-08-20 2017-03-01 日东电工株式会社 Surface protection film with isolating membrane

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11115107A (en) * 1997-10-15 1999-04-27 Toray Ind Inc Glass scattering-preventing laminated film
JP2003105278A (en) * 2001-09-28 2003-04-09 Nitto Denko Corp Pressure-sensitive adhesive sheet for reinforcing electronic parts and reinforced electronic parts
JP4439886B2 (en) * 2003-11-25 2010-03-24 リンテック株式会社 Method for producing release film having antistatic property
CN2930193Y (en) * 2006-05-12 2007-08-01 叶隆泰 Protective film for preventing static production
TWM318900U (en) * 2006-10-03 2007-09-11 Long-Tai Yeh Internal type electrostatic protection film
CN101357521B (en) * 2008-09-02 2012-06-13 中国乐凯胶片集团公司 Off film
JP5625556B2 (en) * 2010-07-08 2014-11-19 東洋紡株式会社 Antistatic film
JP2013052552A (en) * 2011-09-02 2013-03-21 Mitsubishi Plastics Inc Mold release film
JP5658711B2 (en) * 2012-05-25 2015-01-28 藤森工業株式会社 Release film for adhesive film and adhesive film using the same
JP5852998B2 (en) * 2013-07-29 2016-02-09 藤森工業株式会社 Surface protective film and optical component on which it is bonded
JP5963788B2 (en) * 2014-01-10 2016-08-03 藤森工業株式会社 Method for producing antistatic surface protective film, and antistatic surface protective film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867643A (en) * 2003-10-15 2006-11-22 徐光锡 Antistatic tapes and method for producing thereof
JP2010017931A (en) * 2008-07-10 2010-01-28 Toyobo Co Ltd Mold releasing film
CN106467710A (en) * 2015-08-20 2017-03-01 日东电工株式会社 Surface protection film with isolating membrane

Also Published As

Publication number Publication date
JP6366199B2 (en) 2018-08-01
CN111497360A (en) 2020-08-07
TWI649396B (en) 2019-02-01
KR101962019B1 (en) 2019-03-25
KR20180003455A (en) 2018-01-09
TW201811953A (en) 2018-04-01
CN111497361A (en) 2020-08-07
JP2018002850A (en) 2018-01-11

Similar Documents

Publication Publication Date Title
CN1724605B (en) Adhesive tape
CN107553995A (en) Enhancing film with dividing plate
CN105647410A (en) Surface protective film, method for manufacturing surface protective film and optical member
JP2015187245A (en) adhesive tape
JPWO2013129303A1 (en) Removable protective adhesive film and method for producing the same
CN103254829B (en) Anti-finger printing adhesive tape
CN101646738A (en) Coating protective sheet
JP5497258B2 (en) Removable adhesive sheet
CN106167662A (en) Thermohardening type antistatic coating agent and curing overlay film, plastic foil
CN108728016A (en) Composition, pressure sensitive adhesive resin band and harness for contact adhesive
CN109593503A (en) Removeability contact adhesive with high-peeling strength and removeability
JP6056434B2 (en) Adhesive composition and surface protective film
CN110003818A (en) Contact adhesive with super removeability and solvent resistance
WO2018021051A1 (en) Separator-covered reinforcing film
CN107556935A (en) Enhancing film with dividing plate
JP2016225388A (en) Back grind tape
JP2016130294A (en) Adhesive sheet, use method of adhesive sheet and precision electronic apparatus
CN105358648B (en) Adhesive composition, transparency conducting layer adhesive phase, laminated body and image display device
JP5105655B2 (en) Primer composition for adhesive tape or sheet, and adhesive tape or sheet
JP6361911B2 (en) Adhesive tape
JP6594636B2 (en) Adhesive sheet and optical member
CN107083197A (en) Surface protection film and the optical component for being fitted with the surface protection film
CN109749671A (en) The acrylate pressure-sensitive adhesive adhesive of the condensation product of siloxanes containing nanometer, bonding sheet and preparation method thereof
CN106414639A (en) Adhesive sheet
TW201920570A (en) Adhesive composition and adhesive sheet

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180109