CN107553064A - Copper phosphorus board production technology - Google Patents
Copper phosphorus board production technology Download PDFInfo
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- CN107553064A CN107553064A CN201610503665.3A CN201610503665A CN107553064A CN 107553064 A CN107553064 A CN 107553064A CN 201610503665 A CN201610503665 A CN 201610503665A CN 107553064 A CN107553064 A CN 107553064A
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- copper
- phosphorus
- copper phosphorus
- blanket
- production technology
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Abstract
The present invention provides a kind of copper phosphorus board production technology, and it comprises the following steps：S1, copper material and phosphorus raw material are provided, the two is melted, the feed liquid after thawing is incubated；S2, the raw material after insulation is crystallized, and copper phosphorus blanket is stretched by crystallizer；S3, surface trimming is carried out to stretched copper phosphorus blanket, obtain the copper phosphorus blanket of some given sizes；S4, after being punched, polished to obtained each copper phosphorus blanket, being cleaned, the copper phosphorus plate that is molded, to the copper phosphorus plate packaging and storage of shaping.Its technique of copper phosphorus board production technology of the present invention is simple, production efficiency is high, and it can be avoided producing accessory substance, pollute environment, have preferable environmental benefit and economic benefit while copper phosphorus plate plate is produced.
Description
Technical field
The present invention relates to a kind of production technology, more particularly to a kind of copper phosphorus board production technology.
Background technology
Copper phosphorus plate is a kind of conventional plated material, and its main component is phosphorus and copper.However, existing copper phosphorus plate production work
Skill is complex, and not environmentally friendly enough, and cost is higher.In this way, existing copper phosphorus board production technology can not fully meet modern metaplasia
The demand of production.
Therefore, in view of the above-mentioned problems, being necessary to propose further solution.
The content of the invention
It is an object of the invention to provide a kind of copper phosphorus board production technology, to overcome problems of the prior art.
For achieving the above object, the present invention provides a kind of copper phosphorus board production technology, and it comprises the following steps：
S1, copper material and phosphorus raw material are provided, the two is melted, the feed liquid after thawing is incubated；
S2, the raw material after insulation is crystallized, and copper phosphorus blanket is stretched by crystallizer；
S3, surface trimming is carried out to stretched copper phosphorus blanket, obtain the copper phosphorus blanket of some given sizes；
S4, after being punched, polished to obtained each copper phosphorus blanket, being cleaned, the copper phosphorus plate that is molded, to the copper of shaping
Phosphorus plate packaging and storage.
As the improvement of the copper phosphorus board production technology of the present invention, in the step S1, copper material is put into melting furnace, carried out high
Temperature fusing, and carries out the operation that phosphorates, and the temperature control of fusing is at 1035 DEG C -1100 DEG C, voltage 330V.
As the improvement of the copper phosphorus board production technology of the present invention, in the step S1, the holding temperature control is 1135
DEG C or so, voltage is in 180V-260V.
As the improvement of the copper phosphorus board production technology of the present invention, in the step S2, pass through crystallizer and stretch copper phosphorus base
Before plate, in addition to：Corresponding mould is installed, and crystallizer is formed with graphite crystallizer, copper sheathing, connecting plate, installed in guarantor
On warm stove, liquid copper material is converted to by cooling water by solid copper coin, then, copper phosphorus blanket is stretched by crystallizer.
As the improvement of the copper phosphorus board production technology of the present invention, the specification of the mould is：200MM×20MM.
As the improvement of the copper phosphorus board production technology of the present invention, in the step S3, the size of the copper phosphorus blanket is：
610mm × 80mm × 10mm, 680mm × 90mm × 15mm or 720mm × 95mm × 18mm.
As the improvement of the copper phosphorus board production technology of the present invention, in the step S4, the aperture of the hole formed after punching
For 10.5mm.
Compared with prior art, the beneficial effects of the invention are as follows：Its technique of copper phosphorus board production technology of the present invention is simple, production
Efficiency high, it can be avoided producing accessory substance, pollute environment, have preferable environmental benefit while copper phosphorus plate plate is produced
And economic benefit.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments described in invention, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the method flow schematic diagram of the embodiment of copper phosphorus board production technology one of the present invention.
Embodiment
The present invention provides a kind of copper phosphorus board production technology, and it comprises the following steps：
S1, copper material and phosphorus raw material are provided, the two is melted, the feed liquid after thawing is incubated；
S2, the raw material after insulation is crystallized, and copper phosphorus blanket is stretched by crystallizer；
S3, surface trimming is carried out to stretched copper phosphorus blanket, obtain the copper phosphorus blanket of some given sizes；
S4, after being punched, polished to obtained each copper phosphorus blanket, being cleaned, the copper phosphorus plate that is molded, to the copper of shaping
Phosphorus plate packaging and storage.
The present invention is described in detail for shown each embodiment below in conjunction with the accompanying drawings, but it should explanation, these
Embodiment is not limitation of the present invention, those of ordinary skill in the art according to these embodiment institute work energy, method,
Or equivalent transformation or replacement in structure, belong within protection scope of the present invention.
As shown in figure 1, the present invention provides a kind of copper phosphorus board production technology, it comprises the following steps：
S1, copper material and phosphorus raw material are provided, the two is melted, the feed liquid after thawing is incubated.
In the step S1, copper material is put into melting furnace, carries out high temperature melting, and carry out the operation that phosphorates, the temperature of fusing
Control is at 1035 DEG C -1100 DEG C, voltage 330V.Further, at 1135 DEG C or so, voltage exists for the holding temperature control
180V-260V。
S2, the raw material after insulation is crystallized, and copper phosphorus blanket is stretched by crystallizer.
In the step S2, before stretching copper phosphorus blanket by crystallizer, in addition to：Corresponding mould is installed, and
With graphite crystallizer, copper sheathing, connecting plate composition crystallizer, on holding furnace, liquid copper material is converted to by cooling water
Solid copper coin, then, copper phosphorus blanket is stretched by crystallizer.Preferably, the specification of the mould is：200MM×20MM.
S3, surface trimming is carried out to stretched copper phosphorus blanket, obtain the copper phosphorus blanket of some given sizes.
In the step S3, the size of the copper phosphorus blanket is：610mm×80mm×10mm、680mm×90mm×15mm
Or 720mm × 95mm × 18mm.
S4, after being punched, polished to obtained each copper phosphorus blanket, being cleaned, the copper phosphorus plate that is molded, to the copper of shaping
Phosphorus plate packaging and storage.
In the step S4, the aperture of the hole formed after punching is 10.5mm.
In summary, its technique of copper phosphorus board production technology of the present invention is simple, production efficiency is high, and it can be in production copper phosphorus plate
While plate, avoid producing accessory substance, pollute environment, there is preferable environmental benefit and economic benefit.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (7)
1. a kind of copper phosphorus board production technology, it is characterised in that the copper phosphorus board production technology comprises the following steps：
S1, copper material and phosphorus raw material are provided, the two is melted, the feed liquid after thawing is incubated；
S2, the raw material after insulation is crystallized, and copper phosphorus blanket is stretched by crystallizer；
S3, surface trimming is carried out to stretched copper phosphorus blanket, obtain the copper phosphorus blanket of some given sizes；
S4, after being punched, polished to obtained each copper phosphorus blanket, being cleaned, the copper phosphorus plate that is molded, to the copper phosphorus plate of shaping
Packaging and storage.
2. copper phosphorus board production technology according to claim 1, it is characterised in that in the step S1, copper material is put into molten
Change stove, carry out high temperature melting, and carry out the operation that phosphorates, the temperature control of fusing is at 1035 DEG C -1100 DEG C, voltage 330V.
3. copper phosphorus board production technology according to claim 1, it is characterised in that in the step S1, the holding temperature
Control is at 1135 DEG C or so, and voltage is in 180V-260V.
4. copper phosphorus board production technology according to claim 1, it is characterised in that in the step S2, drawn by crystallizer
Stretch out before copper phosphorus blanket, in addition to：Corresponding mould is installed, and is crystallized with graphite crystallizer, copper sheathing, connecting plate composition
Device, on holding furnace, liquid copper material is converted to by cooling water by solid copper coin, then, copper is stretched by crystallizer
Phosphorus blanket.
5. copper phosphorus board production technology according to claim 4, it is characterised in that the specification of the mould is：200MM×
20MM。
6. copper phosphorus board production technology according to claim 1, it is characterised in that in the step S3, the copper phosphorus blanket
Size be：610mm × 80mm × 10mm, 680mm × 90mm × 15mm or 720mm × 95mm × 18mm.
7. copper phosphorus board production technology according to claim 1, it is characterised in that in the step S4, formed after punching
The aperture of hole is 10.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610503665.3A CN107553064A (en) | 2016-06-30 | 2016-06-30 | Copper phosphorus board production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610503665.3A CN107553064A (en) | 2016-06-30 | 2016-06-30 | Copper phosphorus board production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107553064A true CN107553064A (en) | 2018-01-09 |
Family
ID=60969774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610503665.3A Pending CN107553064A (en) | 2016-06-30 | 2016-06-30 | Copper phosphorus board production technology |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1245225A (en) * | 1998-08-18 | 2000-02-23 | 广东南方特种铜材有限公司 | Technology for producing Cu-P anode |
| JP2003231995A (en) * | 2002-02-13 | 2003-08-19 | Nikko Materials Co Ltd | Phosphor-containing copper anode for copper electroplating, copper electroplating method using phosphor-containing copper anode, and semiconductor wafer plated by using them with few adhering particles |
| CN101914801A (en) * | 2010-08-24 | 2010-12-15 | 胜华电子（惠阳）有限公司 | Anodic phosphorous copper balls and preparation method thereof |
| CN201979055U (en) * | 2011-03-30 | 2011-09-21 | 金川集团有限公司 | Horizontal continuous ingot casting crystallizer |
| CN102476177A (en) * | 2010-11-29 | 2012-05-30 | 株洲南方有色焊材有限公司 | Upward drawing method for copper alloy wire blank |
| CN102517622A (en) * | 2011-12-31 | 2012-06-27 | 宁波江丰电子材料有限公司 | Method for preparing anode made of copper-phosphorus alloy |
-
2016
- 2016-06-30 CN CN201610503665.3A patent/CN107553064A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1245225A (en) * | 1998-08-18 | 2000-02-23 | 广东南方特种铜材有限公司 | Technology for producing Cu-P anode |
| JP2003231995A (en) * | 2002-02-13 | 2003-08-19 | Nikko Materials Co Ltd | Phosphor-containing copper anode for copper electroplating, copper electroplating method using phosphor-containing copper anode, and semiconductor wafer plated by using them with few adhering particles |
| CN101914801A (en) * | 2010-08-24 | 2010-12-15 | 胜华电子（惠阳）有限公司 | Anodic phosphorous copper balls and preparation method thereof |
| CN102476177A (en) * | 2010-11-29 | 2012-05-30 | 株洲南方有色焊材有限公司 | Upward drawing method for copper alloy wire blank |
| CN201979055U (en) * | 2011-03-30 | 2011-09-21 | 金川集团有限公司 | Horizontal continuous ingot casting crystallizer |
| CN102517622A (en) * | 2011-12-31 | 2012-06-27 | 宁波江丰电子材料有限公司 | Method for preparing anode made of copper-phosphorus alloy |
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Application publication date: 20180109 |
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