CN107548001B - Sensor group and electronic equipment - Google Patents
Sensor group and electronic equipment Download PDFInfo
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- CN107548001B CN107548001B CN201710841029.6A CN201710841029A CN107548001B CN 107548001 B CN107548001 B CN 107548001B CN 201710841029 A CN201710841029 A CN 201710841029A CN 107548001 B CN107548001 B CN 107548001B
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Abstract
The embodiment of the invention discloses a sensor and electronic equipment. The sensor includes: a housing having a collection aperture; the microphone MIC sensing assembly is positioned in the shell and corresponds to the acquisition hole; the air pressure sensing assembly is positioned in the shell and corresponds to the acquisition hole; the MIC sensing assembly and the air pressure sensing assembly are arranged in a stacked mode.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a sensor and electronic equipment.
Background
Microphone (MIC) sensor, can be used for sound collection.
And the air pressure sensor can be used for collecting air pressure.
Electronic devices, such as cell phones, may include both sensors. In addition, in practical application, the electronic equipment has the problem of large volume, and the difficulty of realizing the lightness and thinness of the electronic equipment is increased.
Disclosure of Invention
It is desirable to provide a sensor and an electronic device, at least part of which are solved
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a sensor, including:
a housing having a collection aperture;
the microphone MIC sensing assembly is positioned in the shell and corresponds to the acquisition hole;
the air pressure sensing assembly is positioned in the shell and corresponds to the acquisition hole; the MIC sensing assembly and the air pressure sensing assembly are arranged in a stacked mode.
Optionally, the MIC sensing assembly, comprising:
a first fixed plate;
the first movable polar plate is arranged at a distance from the first fixed polar plate, is closer to the acquisition hole relative to the first fixed polar plate, and is used for changing the position relation between the first movable polar plate and the first fixed polar plate based on the air vibration generated by sound, so that the MIC induction assembly generates a first capacitance value matched with the sound.
Optionally, the air pressure sensing assembly comprises:
a second fixed pole plate;
the second movable polar plate is arranged at an interval with the first fixed polar plate, and a closed vacuum cavity is formed by connecting the second fixed polar plate and the side wall of the second movable polar plate; the second movable polar plate is used for changing the position relation with the second fixed polar plate according to the air pressure so as to enable a second capacitance value which is generated by the air pressure sensing assembly and is matched with the air pressure.
Optionally, the MIC sensing component and the air pressure sensing component at least partially overlap in a direction perpendicular to a plane of the collection well.
Optionally, a fixed polar plate shared by the MIC induction assembly and the air pressure induction assembly is a common polar plate;
the MIC sensing assembly further comprises: a third movable polar plate, wherein the third movable polar plate is used for changing the position relation between the third movable polar plate and the common polar plate based on the air vibration generated by the sound, so as to change a third capacitance value which is matched with the sound generated by the MIC induction assembly;
the air pressure sensing assembly further comprises: a fourth movable plate; the fourth movable polar plate is positioned between the common polar plate and the fourth movable polar plate, forms a vacuum cavity with the fixed polar plate through the side wall, and is used for changing the position relation between the fourth movable polar plate and the common polar plate according to the pressure intensity of the air pressure so as to change a fourth capacitance value which is generated by the air pressure induction assembly and is matched with the air pressure.
Optionally, the distance between the third movable polar plate and the collecting hole is a first distance;
the distance between the fourth movable polar plate and the collecting hole is a second distance;
wherein the first distance is less than the second distance
Optionally, the sensor further comprises:
the processing assembly is respectively connected with the MIC induction assembly and the air pressure induction assembly and is used for acquiring a first electric signal generated by the MIC induction assembly and a second electric signal generated by the air pressure induction assembly; and generating a first audio signal according to the first telecommunication, and acquiring the air pressure parameter according to the second electric signal.
Optionally, the processing component is specifically configured to generate the first audio signal according to a variation frequency and a variation amplitude of the first electrical signal;
and/or the presence of a gas in the gas,
the processing component is further used for generating a gas pressure parameter which is matched with the amplitude of the second electric signal when the change frequency of the second electric signal is lower than a preset frequency; or, when the variation frequency of the second electric signal is higher than the preset frequency, the original air pressure parameter is kept unchanged; or when the variation amplitude of the second electric signal is within a preset amplitude range, maintaining the original air pressure parameter unchanged.
Optionally, the sensitivity of the MIC sensing assembly for detecting the air pressure is matched with the air pressure change rate caused by sound; the sensitivity of the air pressure sensing assembly for detecting air pressure is matched with the air pressure change rate.
In a second aspect, an embodiment of the present invention further provides an electronic device, including: a housing and any one of the sensors of the above aspects;
the sensor is positioned in the shell, and an opening communicated with the acquisition hole of the sensor is formed in the shell.
According to the sensor and the electronic equipment provided by the embodiment of the invention, the air pressure sensing assembly and the MIC sensing assembly are packaged in one shell and share one acquisition hole, so that the volume of the whole sensor and the electronic equipment can be reduced compared with the case that the two assemblies are independently packaged, and the volume of the electronic equipment can be reduced, and the opening formed in the electronic equipment and communicated with the acquisition hole can also be reduced. Therefore, the structure of the electronic equipment is simplified, and the electronic equipment is convenient to realize lightness and thinness.
Additionally, in some embodiments, the sensor includes a common plate that is structurally common to both the MIC and the pressure sensing, and the acquisition of the MIC and the acquisition of the pressure are achieved by capacitive sensing. Where MIC is normal pressure, air pressure is sensed in a vacuum chamber. Since the air pressure is slowly changed and is pressed by the air pressure to bend towards the vacuum cavity, high-frequency vibration is avoided. On the contrary, MIC is to respond to the high frequency vibration of voice, so the working frequency bands of the two are different, and therefore, the two do not interfere with each other.
Drawings
Fig. 1A is a schematic structural diagram of a first sensor according to an embodiment of the present invention;
FIG. 1B is a schematic structural diagram of a second sensor according to an embodiment of the present invention
FIG. 2 is a schematic structural diagram of a third sensor according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a fourth sensor according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further described in detail with reference to the drawings and the specific embodiments of the specification.
As shown in fig. 1A, the present embodiment provides a sensor including:
a housing 110, the housing 110 having a collection aperture 111;
an MIC sensing component 120 located in the housing 110 and corresponding to the collection hole 111;
the air pressure sensing assembly 130 is positioned in the shell 110 and corresponds to the collecting hole 111; the MIC sensing component 120 and the air pressure sensing component 130 are stacked.
The housing 110 may be a structure that protects the MIC sensing component 120 and the air pressure sensing component 130.
The housing 110 is provided with a collecting hole 111, and the collecting hole 111 is used for air flow to enter. The airflow may be an air flow generated by the atmosphere or an air flow formed by the vibration of the airflow caused by sound.
The number of collection wells 111 may be one or more, but these collection wells 111 are shared by the MIC sensing component 120 and the pneumatic sensing component 130.
The air pressure sensing assembly 130 and the MIC sensing assembly 120 are stacked, where the stacking may include: the MIC sensing element 120 is layered on the air pressure sensing element 130, or the air pressure sensing element 130 is layered on the MIC sensing element 120. In this embodiment, preferably, the MIC sensing element 120 is stacked on the air pressure sensing element 130, and a distance from the MIC sensing element 120 to the collecting hole 111 is smaller than a distance from the air pressure sensing element 130 to the collecting hole 111, so that a path length between the MIC sensing element 120 and a sound source is shortened, and thus, the collection of the audio signal can be better achieved. The stack here comprises: the stacks are not crossed with each other, and can be stacked with crossed parts.
Alternatively, the air pressure sensing assembly 130 and the MIC sensing assembly 120 may be capacitance sensors based on the principle of capacitance, and when air pressure acts on the movable plate of the capacitor, the movable plate moves or deforms relative to the fixed plate, so as to cause the capacitance value to send out a change matched with the change, thereby realizing the detection of sound and/or air pressure.
In this embodiment, the MIC sensor assembly 120 and the air pressure sensor assembly 130 are disposed in a single housing 110, and the common collecting hole 111 is used to collect air pressure and/or sound, and the air pressure sensor assembly 130 and the MIC sensor assembly 120 are respectively packaged, and the housings 110 are respectively disposed and provided with the collecting holes 111, so that the number of independent components is reduced, the size of the sensor is reduced, and the electronic device using the sensor is light and thin.
Optionally, as shown in fig. 1B, the MIC sensing assembly 120 includes:
a first fixed plate 121;
the first movable polar plate 122 is spaced from the first fixed polar plate 121, is closer to the collecting hole 111 than the first fixed polar plate 121, and is configured to change a position relationship with the first fixed polar plate 121 based on air vibration generated by sound, so that the MIC inductive component 120 generates a first capacitance value adapted to the sound.
In this embodiment, the first fixed plate 121, which is usually a plate holding different plates, is usually a rigid plate, and may be an integral part of the housing 110, so that multiple functions of one structure can be realized, and thus, the structure can be reused.
And a second movable plate 132, wherein the second movable plate 132 is spaced apart from the first fixed plate 121, and air flows between the first movable plate 122 and the second movable plate 132.
The first movable plate 122 may be a conductive film that can be charged.
When a sound source is arranged near the collecting hole 111 to generate sound, the airflow near the collecting hole 111 vibrates, and the vibrations act on the first movable polar plate 122 through the collecting hole 111, and the airflow vibrates at different moments and at different intensities and frequencies, which correspondingly causes different deformation or displacement of the first movable polar plate 122. In this embodiment, the first movable plate 122 may change a position relationship with the first fixed plate 121 through deformation and/or displacement thereof, so as to change a first capacitance value generated by the first movable plate 122 and the first fixed plate 121 as a whole.
The change parameter of the first capacitance value reflects the attribute of the sound signal. For example, the frequency of the change of the first capacitance value may reflect the frequency of the sound signal, the amplitude of the change of the first capacitance value may reflect the loudness of the sound signal, and the like. In summary, the variation parameter of the first capacitance value is adapted to the sound causing the air flow to vibrate, so that the first capacitance value can be converted into a corresponding audio signal.
Optionally, the air pressure sensing assembly 130 includes:
a second fixed pole plate 131;
a second movable plate 132 spaced apart from the first fixed plate, and forming a closed vacuum chamber by connecting the second fixed plate 131 and a side wall of the second movable plate 132; the second movable plate 132 is configured to change a position relationship with the second fixed plate 131 according to the air pressure, so that the air pressure sensing assembly 130 generates a second capacitance value adapted to the air pressure.
In this embodiment, the second fixed plate 131 is also a stationary plate fixed in the housing 110,
the first fixed pole plate 121 and the second fixed pole plate 131 are both rigid pole plates.
Regardless of the stacking arrangement of the MIC sensing component 120 and the air pressure sensing component 130, at least one of them may be a part of the housing 110, so as to achieve a reuse of one component. If the MIC sensor package 120 is stacked on the air pressure sensor package 130, the back surface of the second movable plate can be used as a component of the outer surface of the housing 110, so as to reduce the volume and mass of the sensor again and reduce the number of components of the sensor.
The second movable plate 132 may also be an inductive film or a flexible plate, etc. capable of changing the relative position with the second fixed plate 131 by its own deformation and/or displacement, thereby generating a second different capacitance value.
In this embodiment, a closed vacuum chamber is formed between the second movable plate 132 and the second fixed plate 131 through a side wall, so that the degree of deformation and/or displacement of the second movable plate 132 is determined by the strength of the air pressure outside the vacuum chamber. Therefore, in the present embodiment, the movement and/or deformation of the second movable plate 132 is determined by the pressure intensity in the environment where the second movable plate is located, and in the present embodiment, the collecting hole 111 is communicated with the atmosphere, so that the atmospheric pressure sensor can measure the atmospheric pressure.
If the sensor of FIG. 1 is used, the MIC sensing element 120 and the pressure sensing element 130 are preceded by an air gap for atmospheric pressure to act on the second movable plate 132.
As shown in fig. 2, the MIC sensing component 120 and the pneumatic sensing component 130 at least partially overlap in a direction perpendicular to a plane of the collection well 111.
The overlapping portion is the intersection of the MIC sensing element 120 and the air pressure sensing element 130.
In this implementation, the overlapping portions of the MIC sensing component 120 and the pneumatic sensing component 130 are in a direction perpendicular to the plane of the collection well 111.
Optionally, the fixed plate shared by the MIC sensing assembly 120 and the air pressure sensing assembly 130 is a common plate 141;
the MIC sensing assembly 120 further includes: a third movable plate 142, wherein the third movable plate 142 is configured to change a position relationship with the common plate 141 based on an air vibration generated by a sound, so as to change a third capacitance value generated by the MIC sensing component 120 and adapted to the sound;
the air pressure sensing assembly 130 further comprises: a fourth movable plate 143;
the fourth movable plate 143 is located between the fixed plate and the third movable plate 142, and forms a vacuum chamber with the fixed plate through a sidewall, so as to change a position relationship with the common plate 141 according to a pressure change of the air pressure, thereby changing a fourth capacitance value adapted to the air pressure generated by the air pressure sensing assembly 130.
In order to further simplify the structure of the sensor and reduce the volume of the sensor in this embodiment, the air pressure sensing assembly 130 and the MIC sensing assembly 120 share a common plate 141, which may be referred to as a common plate 141 in this embodiment, and the common plate 141 may be a stationary plate that is different from the stationary plate.
In this embodiment, the third movable plate of the MIC sensing assembly 120 and the fourth movable plate 143 of the pneumatic pressure sensing assembly 130 are both spaced apart from the common plate 141. And the third movable polar plate is located between the third movable polar plate and the common polar plate 141, and the fourth movable polar plate 143 and at least part of the common polar plate 141 are sealed by the side wall to form a vacuum cavity, so that the detection of the air pressure can be realized.
The third movable polar plate and the first movable polar plate can both face the collecting hole 111, so that the collecting hole 111 is formed, air flow vibration caused by sound is even smaller, and the third movable polar plate 142 and the first movable polar plate also have corresponding deformation and/or displacement, so that the sensitivity of the MIC sensing assembly 120 is improved.
Optionally, the third movable plate 142 is a first distance from the collecting hole 111;
the distance between the fourth movable polar plate 143 and the collecting hole 111 is a second distance;
wherein the first distance is less than the second distance.
The third movable plate is closer to the collection aperture 111 than the fourth movable plate 143, which may improve the collection sensitivity of the MIC sensing assembly 120, and the fourth movable plate 143 is further from the collection aperture 111 than the third movable plate 142, such that the airflow caused by the sound is enhanced, and the effect on the fourth movable plate 143 is smaller, which may improve the accuracy of the pressure sensing assembly 130. In this embodiment, the first distance and the second distance are both distances between the surface with the largest surface area of the movable electrode plate and the collecting opening.
As shown in fig. 3, the sensor further includes:
a processing component 150, respectively connected to the MIC sensing component 120 and the air pressure sensing component 130, for acquiring a first electrical signal generated by the MIC sensing component 120 and a second electrical signal generated by the air pressure sensing component 130; and generating a first audio signal according to the first telecommunication, and acquiring the air pressure parameter according to the second electric signal.
The processing assembly 150 may be located within the housing 110 or may be located outside the housing 110. The processing component 150 may be: various processing chips such as microprocessor chips, microcontroller chips, digital signal circuits, programmable arrays or application processors, etc.
The processing assembly 150 is respectively connected to the MIC sensing assembly 120 and the pressure sensing assembly 130, for example, respectively connected to the MIC sensing assembly 120 through a wire, and respectively connected to two substrates of the pressure sensing assembly 130 through a wire.
In this embodiment, the processing module 150 may include two processing modules, namely a first processing module and a second processing module, wherein the first processing module is connected to the MIC sensing component 120, and the second processing module is connected to the air pressure processing module, so as to implement separate processing of air pressure detection and sound detection. In other implementations, the sensor is reduced in size in order to further simplify its construction. The processing component 150 may be a common processing component 150 of the MIC sensing component 120 and the pressure sensing component 130.
In some embodiments, the processing component 150 detects the capacitance value of the MIC sensing component 120 or the voltage signal or the current signal positively correlated to the capacitance value thereof at a first period, and detects the capacitance value of the pneumatic pressure sensing component 130 or the voltage signal or the current signal positively correlated to the capacitance value thereof at a second period, wherein the first period is less than the second period, and the first period is much less than the second period. In other embodiments, the MIC sensing element 120 and the air pressure sensing element 130 are always powered on, a change in capacitance of the MIC sensing element 120 and the air pressure sensing element 130 acts on a change in an electrical signal, and the processing element 150 obtains the first electrical signal and the second electrical signal, respectively, applies the electrical signals at different periods, or processes the electrical signals.
Optionally, the processing component 150 is specifically configured to generate the first audio signal according to a variation frequency and a variation amplitude of the first electrical signal.
And/or the presence of a gas in the gas,
the processing component 150 is further configured to generate a pressure parameter adapted to the amplitude of the second electrical signal when the variation frequency of the second electrical signal is lower than a predetermined frequency; or, when the variation frequency of the second electric signal is higher than the preset frequency, the original air pressure parameter is kept unchanged; or when the variation amplitude of the second electric signal is within a preset amplitude range, maintaining the original air pressure parameter unchanged.
In this embodiment, the first audio signal adapted to the sound is generated according to the variation frequency and the variation amplitude of the first electrical signal, so that the collection of the sound is realized, and thus, the function of the MIC is realized.
The processing component 150 can also be reused to process the interference of the air pressure acquisition, so as to improve the air pressure sensing precision.
For example, the change of the atmospheric pressure is generally relatively slow, and the change of the atmospheric pressure is relatively smooth except for a special weather and a special position, so according to this feature, the processing component 150 is further configured to generate the pressure parameter, such as the atmospheric pressure, adapted to the second electrical signal when the change frequency of the second electrical signal is lower than the predetermined frequency. And/or, when the variation frequency of the second electrical signal is higher than the predetermined frequency, there is a very high probability that the user speaks towards the collecting hole 111, which causes the airflow vibration around the collecting hole 111 to change rapidly, thereby causing the air pressure variation frequency acting on the sensing surface of the air pressure sensing assembly 130 to increase, which indicates that the speaking sound interferes with the air pressure detection of the air pressure sensing assembly 130, and in order to ensure the accuracy of the air pressure parameter, the processing assembly 150 will mask the second signal and maintain the original air pressure parameter output, for example, maintain the last output air pressure parameter unchanged. Or, the air pressure intensity caused by the user speaking sound is obviously very small relative to the atmospheric pressure, and if the atmospheric pressure around the air pressure sensor changes due to the user speaking sound, the change is also relatively weak, which is reflected in that the change amplitude of the second electrical signal is also very weak, so in this embodiment, the processing component 150 shields the second electrical signal whose change amplitude is within the preset amplitude range, and maintains the air pressure parameter determined at the previous time unchanged.
In some further embodiments, the processing component 150 is further configured to mask the second electrical signal and maintain the air pressure parameter unchanged at the previous time when the first electrical signal indicates that the MIC sensing component 120 has picked up sound within a predetermined frequency range. The preset frequency range may be a frequency range of human voice. If the user speaks towards the collecting hole 111, in order to avoid interference of the user's voice with the air pressure sensor, the processing component 150 maintains the air pressure parameter unchanged when the MIC sensing component 120 collects the voice in the predetermined frequency range, so as to reduce the inaccuracy of the air pressure parameter output by the second electrical signal caused by both voice and atmosphere.
Specifically, the processing component 150 is further configured to shield the second electrical signal from the output of the air pressure parameter when the variation frequency of the first electrical signal is within a specific frequency range.
Optionally, the sensitivity of the MIC sensing component 120 for detecting air pressure is adapted to the rate of change of air pressure caused by sound; the sensitivity of the air pressure sensing assembly 130 for detecting air pressure is adapted to the air pressure change rate.
In this embodiment, the sensitivity of the MIC sensing element 120 to detect air pressure is adapted to the rate of change of air pressure caused by sound, while the air pressure sensing element 130 is adapted to the rate of change of air pressure of atmospheric pressure. Typically, the sensitivity of the MIC sensing component 120 may be higher than the sensitivity of the air pressure sensor. I.e., the same magnitude of pressure change, the degree of deformation and/or displacement range of the movable plate of the MIC sensing assembly 120 is greater than the degree of deformation and/or displacement range of the movable plate of the pressure sensing assembly 130.
As shown in fig. 4, the present embodiment further provides an electronic device, including: a housing 210 and a sensor 220 provided in any one or more of the above-described embodiments. The sensor 220 is located in the housing 210, and an opening communicated with the collecting hole 111 of the sensor 220 is formed in the housing 210.
The electronic equipment can be mobile phones, tablet computers, wearable equipment and other electronic equipment. The electronic device includes a housing 210. For example, when the electronic device is a mobile phone, the mobile phone includes a mobile phone housing 210.
In this embodiment, the sensor 220 is located within the housing 210 of the electronic device. The case 210 is provided with an opening for communicating the collecting hole 111, so that an air flow can enter the collecting hole 111 conveniently and act on the air pressure sensing assembly 130 and the MIC sensing assembly 120 respectively.
In this embodiment, since the sensor 220 is packaged with the air pressure sensing component 130 and the MIC sensing component 120 at the same time, only one opening needs to be opened on the housing 210 of the electronic device, and the openings of the housing 210 on the electronic device are obviously fewer for the air pressure sensing component 130 and the MIC sensing component 120 being packaged respectively, so that the water resistance or the dust resistance of the electronic device can be improved, and the aesthetic degree of the electronic device is improved.
In the embodiment, the sensor 220 has the characteristics of small volume, simple structure and small mass relative to the two separately packaged air pressure sensing elements 130 and MIC sensing element 120, so in the embodiment, the electronic device uses the sensor 220 having the characteristics, and thus, the electronic device has the characteristics of simple structure, small volume and small mass, and can be light and thin.
In some embodiments, the electronic device further comprises: a display screen 230;
the opening is located on the same surface of the electronic device as the display screen 230, or the opening is located on a side surface adjacent to the display screen 230.
The display screen 230 may be a liquid crystal display screen 230, an electronic ink display screen 230, or an Organic Light Emitting Diode (OLED) display screen 230.
One specific example is provided below in connection with any of the embodiments described above:
as shown in fig. 2, if the volume is small, two sensing elements, i.e., the air pressure sensing element and the MIC sensing element, must be integrated. The movable capacitance films are stacked by using a detection principle that is a capacitance effect. Since the air pressure is slowly changed and is pressed by the air pressure to bend towards the vacuum cavity, high-frequency vibration is avoided. On the contrary, MIC is to respond to the high frequency vibration such as voice, and the operating frequency bands of the two are different, so that they do not interfere with each other, and thus a composite sensor as shown in fig. 2 can be formed.
In an embodiment of the present invention, the MIC sensing component may be a silicon MIC sensor capable of collecting an acoustic signal.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all the functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may be separately used as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A sensor, the sensor comprising:
a housing having a collection aperture;
the microphone MIC sensing assembly is positioned in the shell, corresponds to the acquisition hole and can acquire sound through the acquisition hole;
the air pressure sensing assembly is positioned in the shell, corresponds to the collecting hole and can collect air pressure through the collecting hole; the MIC sensing assembly and the air pressure sensing assembly are arranged in a stacked mode.
2. The sensor of claim 1,
the MIC sensing assembly comprises:
a first fixed plate;
the first movable polar plate is arranged at a distance from the first fixed polar plate, is closer to the acquisition hole relative to the first fixed polar plate, and is used for changing the position relation between the first movable polar plate and the first fixed polar plate based on the air vibration generated by sound, so that the MIC induction assembly generates a first capacitance value matched with the sound.
3. The sensor of claim 2,
the air pressure sensing assembly comprises:
a second fixed pole plate;
the second movable polar plate is arranged at an interval with the first fixed polar plate, and a closed vacuum cavity is formed by connecting the second fixed polar plate and the side wall of the second movable polar plate; the second movable polar plate is used for changing the position relation with the second fixed polar plate according to the air pressure so as to enable a second capacitance value which is generated by the air pressure sensing assembly and is matched with the air pressure.
4. The sensor of claim 1,
the MIC sensing assembly and the air pressure sensing assembly are at least partially overlapped in the direction vertical to the plane of the collecting hole.
5. The sensor of claim 4,
the fixed polar plate shared by the MIC induction assembly and the air pressure induction assembly is a common polar plate;
the MIC sensing assembly further comprises: a third movable polar plate, wherein the third movable polar plate is used for changing the position relation between the third movable polar plate and the common polar plate based on the air vibration generated by the sound, so as to change a third capacitance value which is matched with the sound generated by the MIC induction assembly;
the air pressure sensing assembly further comprises: a fourth movable plate; the fourth movable polar plate is positioned between the common polar plate and the fourth movable polar plate, forms a vacuum cavity with the fixed polar plate through the side wall, and is used for changing the position relation between the fourth movable polar plate and the common polar plate according to the pressure intensity of the air pressure so as to change a fourth capacitance value which is generated by the air pressure induction assembly and is matched with the air pressure.
6. The sensor of claim 5,
the distance between the third movable polar plate and the collecting hole is a first distance;
the distance between the fourth movable polar plate and the collecting hole is a second distance;
wherein the first distance is less than the second distance.
7. The sensor of claim 1, further comprising:
the processing assembly is respectively connected with the MIC induction assembly and the air pressure induction assembly and is used for acquiring a first electric signal generated by the MIC induction assembly and a second electric signal generated by the air pressure induction assembly; and generating a first audio signal according to the first telecommunication, and acquiring the air pressure parameter according to the second electric signal.
8. The sensor of claim 7,
the processing component is specifically configured to generate the first audio signal according to a variation frequency and a variation amplitude of the first electrical signal;
and/or the presence of a gas in the gas,
the processing component is further used for generating a gas pressure parameter which is matched with the amplitude of the second electric signal when the change frequency of the second electric signal is lower than a preset frequency; or, when the variation frequency of the second electric signal is higher than the preset frequency, the original air pressure parameter is kept unchanged; or when the variation amplitude of the second electric signal is within a preset amplitude range, maintaining the original air pressure parameter unchanged.
9. The sensor of claim 1,
the sensitivity of the MIC sensing assembly for detecting the air pressure is matched with the air pressure change rate caused by sound; the sensitivity of the air pressure sensing assembly for detecting air pressure is matched with the air pressure change rate.
10. An electronic device, comprising: a housing and a sensor as provided in any one of claims 1 to 9;
the sensor is positioned in the shell, and an opening communicated with the acquisition hole of the sensor is formed in the shell.
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| CN109005490B (en) * | 2018-06-25 | 2020-01-21 | 歌尔股份有限公司 | MEMS capacitive microphone |
| CN108924720B (en) * | 2018-06-25 | 2020-07-24 | 歌尔股份有限公司 | MEMS microphone |
| CN109686158A (en) * | 2019-01-07 | 2019-04-26 | 九江学院 | A kind of method of accountant management system ability culture simulation and training |
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| CN102180435A (en) * | 2011-03-15 | 2011-09-14 | 迈尔森电子（天津）有限公司 | Integrated micro electro-mechanical system (MEMS) device and forming method thereof |
| CN102768093A (en) * | 2011-05-04 | 2012-11-07 | Nxp股份有限公司 | MEMS capacitive pressure sensor, operating method and manufacturing method |
| CN205179361U (en) * | 2015-12-04 | 2016-04-20 | 歌尔声学股份有限公司 | MEMS microphone, environmental sensor's integrated morphology |
| WO2016160327A1 (en) * | 2015-03-31 | 2016-10-06 | Qualcomm Incorporated | Dual diaphragm microphone |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101929898A (en) * | 2009-12-01 | 2010-12-29 | 苏州扩达微电子有限公司 | Pressure sensing device |
| CN102158787A (en) * | 2011-03-15 | 2011-08-17 | 迈尔森电子（天津）有限公司 | MEMS (Micro Electro Mechanical System) microphone and pressure integration sensor, and manufacturing method thereof |
| CN102180435A (en) * | 2011-03-15 | 2011-09-14 | 迈尔森电子（天津）有限公司 | Integrated micro electro-mechanical system (MEMS) device and forming method thereof |
| CN102768093A (en) * | 2011-05-04 | 2012-11-07 | Nxp股份有限公司 | MEMS capacitive pressure sensor, operating method and manufacturing method |
| WO2016160327A1 (en) * | 2015-03-31 | 2016-10-06 | Qualcomm Incorporated | Dual diaphragm microphone |
| CN205179361U (en) * | 2015-12-04 | 2016-04-20 | 歌尔声学股份有限公司 | MEMS microphone, environmental sensor's integrated morphology |
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