CN107541711A - Clamping device, film formation device, the substrate-placing devices and methods therefor of substrate - Google Patents
Clamping device, film formation device, the substrate-placing devices and methods therefor of substrate Download PDFInfo
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- CN107541711A CN107541711A CN201710483111.6A CN201710483111A CN107541711A CN 107541711 A CN107541711 A CN 107541711A CN 201710483111 A CN201710483111 A CN 201710483111A CN 107541711 A CN107541711 A CN 107541711A
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- substrate
- mask
- placing
- bearing member
- pressing force
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- 239000000758 substrate Substances 0.000 title claims abstract description 364
- 238000000034 method Methods 0.000 title claims abstract description 119
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 59
- 230000008569 process Effects 0.000 claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 claims description 28
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- 238000001704 evaporation Methods 0.000 claims description 19
- 230000008020 evaporation Effects 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
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- 239000010408 film Substances 0.000 description 69
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
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- 239000011241 protective layer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
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- 238000002224 dissection Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
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- 239000011368 organic material Substances 0.000 description 2
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of clamping device of substrate, film formation device, substrate-placing devices and methods therefor are provided, substrate and mask can not only be made to be close to well, and substrate can be made stably to move, and can prevent from being placed on the position skew of substrate when on mask.With the substrate-placing process being placed on substrate (1) in the state of substrate keeping body (3) is pressed to press tool (8) on mask (2), on substrate (1) is pressed into substrate keeping body (3) by press tool (8) in the substrate-placing process, at least in the contact start of substrate (1) and mask (2), the pressing force that substrate (1) is abutted to press tool (8) is pushed, after the substrate-placing process, pass through press tool (8), substrate (1) is pressed to substrate keeping body (3) by strong pressing force during with than the contact start.
Description
Technical field
The present invention relates to the clamp method of substrate, the clamping device of substrate, film build method, film formation device and electronic equipment
Manufacture method.
Background technology
In recent years, maximization/slimming of substrate is developed, and the influence of the bending caused by the deadweight of substrate becomes big.Separately
Outside, due to film-forming region is arranged at into substrate center portion, the region that can clamp substrate is restricted to the peripheral part of substrate.
Therefore, the peripheral part of substrate keeping body supporting substrate is made, and by the peripheral part of substrate (such as a pair of opposite sides
Portion) when being held on substrate-placing in the state of substrate keeping body to mask, the clamped substrate of peripheral part is due to substrate
Freely activity is hindered when the central portion and mask conducted oneself with dignity and bent contact, and is produced in a substrate crooked.
Because this is crooked, gap, the close property reduction of mask and substrate, so as to turn into film are produced between mask and substrate
Fuzzy the reason for waiting.
Thus, for example, in order to also make substrate and mask be close to well even if maximizations such as substrates, it is proposed that such as patent text
Technology disclosed in 1 is offered, but it is expected further improve.
【Prior art literature】
【Patent document】
Patent document 1：Japanese Unexamined Patent Publication 2009-277655 publications
The content of the invention
Therefore, when by substrate-placing to mask, consider to load with liberation state, so that substrate can be with respect to mask certainly
By ground activity, but in this case, due to influence of the bending of each substrate etc., produced in the position for initially touching mask inclined
Difference.
For example, as shown in figure 1, substrate A bending in the case of approximate centre position (a) and right side to center
In the case of skew (b), when substrate A is placed on mask B, compared with (a), substrate A position keeps left lateral deviation in (b)
Move.In Fig. 1, symbol C is substrate keeping body.
That is, the position of mask is initially touched according to substrate, the position of substrate occurs when by substrate-placing to mask
Skew, so substrate does not have repeatability in the offset manner on mask, it is difficult to by substrate-placing in the desired position on mask
Put.
The present invention be in view of above-mentioned present situation and complete, there is provided a kind of clamp method of substrate, substrate clamping device,
Film build method, the manufacture method of film formation device and electronic equipment, substrate-placing method, alignment methods, substrate-placing device,
Substrate and mask can not only be made to be close to well, and substrate can be made stably to move, and can prevent from being placed on covering
The position skew of substrate when on mould.
In order to solve above-mentioned problem, using following method.
That is, the present invention provides a kind of clamp method, and the clamp method is to be projected on substrate by making from evaporation source
Filmogen substrate is clamped when making substrate-placing to the mask to carry out film forming across mask accumulation method, the folder
The method of holding is characterised by,
With the substrate is carried with being pressed to substrate that the state of substrate keeping body is placed on mask with press tool
Process is put, on the substrate is pressed into the substrate keeping body by the press tool in the substrate-placing process
Operation, at least in the contact start of the substrate and the mask, the pressing of the substrate is abutted to the press tool
Power is pushed, after the substrate-placing process, by the press tool, and strong pressing during with than the contact start
The substrate is pressed to the substrate keeping body by power.
It is as described above, according to the present invention, substrate and mask can not only be made to be close to well, and substrate can be made steady
Surely it is mobile, and can prevent from being placed on the position skew of substrate when on mask.
Brief description of the drawings
Fig. 1 is the outline figure of previous example.
Fig. 2 is that the present embodiment 1 outlines profile.
Fig. 3 is the process outline figure of the present embodiment 1.
Fig. 4 is the process outline figure of the present embodiment 1.
Fig. 5 is the process outline figure of the present embodiment 1.
Fig. 6 is the process outline figure of the present embodiment 1.
Fig. 7 is that the major part of the present embodiment 1 outlines stereogram.
Fig. 8 is the top view of a part for the structure of the manufacture device for the electronic equipment for showing schematically the present embodiment 2.
Fig. 9 is the profile of the structure for the film formation device for showing schematically the present embodiment 2.
Figure 10 is the stereogram of the substrate holder of the present embodiment 2.
Figure 11 is the skeleton diagram of the organic el device of the present embodiment 2.
(symbol description)
1：Substrate；2、220：Mask；3：Substrate keeping body；4：Mask keeping body；5：Pressing force controlling organization；6：Substrate moves
Motivation structure；7、300：Branch stake tool；8、302：Press tool；210：Substrate holder (suitable with substrate keeping body)；221：
Mask platform (suitable with mask keeping body)；250：Substrate Z actuators (suitable with substrate travel mechanism)；251：Fixture Z actuators
(suitable with pressing force controlling organization).
Embodiment
Hereinafter, referring to the drawings, embodiment is illustratively described in detail according to embodiment.But the embodiment is remembered
The size of the structure member of load, material, shape, its relative configuration etc. are recorded as long as no especially specific, then not by the present invention
Scope be only defined in this.
(embodiment)
In the present embodiment, substrate 1 is being abutted to press tool 8 and the generation of substrate keeping body 3 position can be directed to
Putting makes substrate 1 decline and touch mask 2 in the state of the peripheral part of the false clamping substrate 1 of pressing force of the degree of skew, enters one
Step declines and substrate 1 is positioned on mask 2.Afterwards, turn into the pressing force of press tool 8 not produce for substrate keeping body 3
The stronger pressing force of the degree of raw position skew is true to clamp substrate 1.
Now, at least in contact start, the position of the associated opposing substrate keeping body 3 of substrate 1 of the contact with mask 2
Skew is allowed, thus substrate 1 due to deadweight bending and the central portion of substrate 1 contact in advance with mask 2 it is caused deform not by
Hinder, the stretching, extension of substrate 1 outward is allowed.And then it is 3 entirely free on his state of opposing substrate keeping body that substrate 1, which is not, and
Be the instrument that is pressed and substrate keeping body 3 clamps and it is false fixed, so preventing the whole of when substrate 1 is placed on into mask 2 substrate 1
Body phase significantly produces position skew to mask 2.
Therefore, it is possible to substrate 1 is placed on mask 2 with not producing position skew, can be aligned well.Separately
Outside, can be in not crooked and true clamping substrate 1 in the state of being close to mask 2.Therefore, it is possible to carry out substrate-placing work well
Alignment process and evaporation process after sequence.
In addition, the peripheral part of substrate 1 is pressed using press tool 8 for substrate keeping body 3, so as to the periphery quilt of substrate 1
Pressing, the middle body of the substrate 1 of downward lateral bend are pushed due to lever principle.Thus, the amount of bow of substrate 1 is reduced, base
The dropping distance that the middle body of plate 1 touches after mask 2 untill substrate 1 is placed into mask 2 is reduced, so by substrate
The offset of 1 substrate 1 when being placed on mask 2 diminishes.
Hereinafter, with reference to the accompanying drawings, embodiments of the invention are illustrated.
(embodiment 1)
The present embodiment is the example that the present invention is applied in film formation device, as illustrated in Figure 2, in the film formation device,
Placement substrate 1 and mask 2 and film forming is carried out in vacuum chamber 10 using the film forming mechanism including evaporation source 13 grade.Filled in the film forming
Center：Thickness monitor, monitor the evaporation rate of the evaporation particle projected from evaporation source 13；Film thickness gauge, it is arranged at true
Outside cavity 10, the amount for monitoring obtained evaporation particle is scaled thickness；And heater power supply, in order to control filmogen
Evaporation rate so that the thickness conversed turn into desired thickness and evaporation source 13 is heated；Deng.For example, for having
The film formation device is used in the manufacture of the display panel of organic electro luminescent display device.
Specifically, it is provided with vacuum chamber 10 and keeps the substrate keeping body 3 of substrate 1, keeps covering as bearing member
The mask keeping body 4 of mould 2 and the substrate travel mechanism 6 as mounting unit, the substrate travel mechanism 6 are used to keep substrate
Body 3 moves and substrate 1 is placed on the mask 2 for being held in mask keeping body 4.
In addition, the press tool that the substrate 1 that will be kept is pressed to substrate keeping body 3 is provided with substrate keeping body 3
8 and change the press tool 8 offer pressing force the pressing force controlling organization 5 as grip force controlling organization.
Substrate travel mechanism 6 includes：Mechanism is moved forward and backward, including is installed on the fixed part of the wall of vacuum chamber 10 and enters
Move back and be arranged at fixed part freely mobile move portion is left with the contact of the wall of relative vacuum chamber 10；And all around move
Mechanism (diagram is omitted).Substrate keeping body 3 is arranged at the leading section of the move portion for moving forward and backward mechanism.
Therefore, by substrate travel mechanism 6, the substrate 1 for being held in substrate keeping body 3 leaves movement relative to the contact of mask 2
And all around move.
The branch stake tool 7 contacted with the lower surface peripheral part of substrate 1 is provided with substrate keeping body 3 and is arranged at
The press tool 8 of the upper surface side of substrate 1.Substrate 1 is clamped by these branch stake tools 7 and press tool 8.In addition, by propping up
Stake tool 7, press tool 8 and pressing force controlling organization 5 form the grip unit of the periphery for clamping substrate 1.
Specifically, substrate keeping body 3 is hung down in the left and right of trunk is provided with sleeve portion, with from the front end inwardly projecting in sleeve portion
Mode be provided with branch stake tool 7.In addition, by with the branch stake tool 7 it is opposite respectively in a manner of be provided with guide portion 9, the guiding
Portion 9 is provided with the inserting hole that press tool 8 is inserted through.In addition, substrate keeping body 3 trunk with guide portion 9 insert
The opposite position of through hole is also equipped with the inserting hole that press tool 8 is inserted through.In addition, in fig. 2, symbol 11 is bellows
(bellows)。
Press tool 8 is configured to include the leading section for abutting to substrate 1 and the cardinal extremity linked with pressing force controlling organization 5
Portion, by being protruded from base portion 9 and substrate 1 being pressed into branch stake tool 7 to clamp substrate 1 with leading section.The support can be passed through
Instrument 7 and press tool 8 (clamping device), suitably switch to by press tool 8 be pressed into substrate 1 clamp position and
The state for making press tool 8 keep out of the way from substrate 1 and liberate substrate 1.
In addition, pressing force controlling organization 5 includes the fixed part in outside for being arranged at the wall of vacuum chamber 10 and free to advance or retreat
Ground is arranged at the move portion of the fixed part.Carry out contact being moved forward and backward by this and the wall of relative vacuum chamber 10 and leave movement
Move portion front end link press tool 8 base end part, the advance and retreat journey of the move portion of press tool controlling organization 5 can be passed through
Degree, adjust the pressing force that the leading section of press tool 8 is provided substrate 1.The leading section of press tool 8 is set to apply metal material
Add the structure of fluorine coating, to be easy to allow the stretching, extension of substrate 1 outward.In addition, the leading section of press tool 8 can also use rubber
The appropriate elastomeric element such as system is formed, not cause to damage to substrate 1.
Pressing force controlling organization 5 had both been configured to periodically adjust pressing force, can also the company of being configured to
Pressing force is adjusted continuously.The pressing force controlling organization 5 of the present embodiment is in general electric cylinder, is configured to continuously adjust
Pressing force.
In the present embodiment, pressing force controlling organization 5 is at least in the contact start of substrate 1 and mask 2, turn into allow with
With the pressing force of the false clamping of position skew of the associated substrate 1 of the contact of the mask 2 in substrate keeping body 3.That is, press
Power controlling organization 5, by branch stake tool 7 and press tool 8, is controlled as clamping substrate 1 but its clamping in the contact start
Position-movable grip force.In addition, " the moveable grip force of clip position " be by it is aftermentioned mounting process in from mask 2 to base
The reinforcing of plate 1 and the moveable grip force of clip position.In addition, pressing force controlling organization 5 is after substrate 1 is placed on mask 2,
In order to prevent position skew of the substrate 1 in substrate keeping body 3, pressing for true clamping strong during for than the contact start is controlled
Pressure.That is, pressing force controlling organization 5 passes through branch stake tool 7 and press tool 8, control after substrate 1 is placed on into mask 2
For the fixable grip force of clip position of substrate 1.
The pressing force of false clamping be at least make branch stake tool 7 and press tool 8 at intervals of identical with the thickness of substrate 1
Degree and the peripheral part of substrate 1 is engaged to substrate keeping body 3 and the degree of press tool 8.Specifically, in this reality
Apply in example, be set as being pressed and the periphery of substrate 1 by pressing the peripheral part of substrate 1 and make the substrate 1 of downward lateral bend
The pressing force for the degree that middle body is somewhat above pushed away due to lever principle.
In addition, the pressing force of true clamping be with to make substrate 1 not produced in a manner of position is offset securely with respect to mask 2
The in general clamp position identical degree of clamping.
In addition, substrate travel mechanism 6 be configured to when pressing force controlling organization 5 is changed to than the contact start it is strong by
After pressure, move substrate keeping body 3 to carry out the alignment of substrate 1 and mask 2.That is, the state for maintaining really to clamp is come
Alignment process after progress substrate-placing process etc..In addition, alignment is the operation for the relative position for adjusting substrate 1 and mask 2.
To be provided with multiple stake tools 7 and the (clamping machine of press tool 8 in a manner of the multiple edge for abutting to substrate 1
Structure).In the present embodiment, a pair stake tools 7 and press tool are provided with a manner of abutting to a pair of opposite edge
8.In the present embodiment, with clamping device accordingly, a pair of pressing force controlling organizations 5 are additionally provided with.
In addition, in the present embodiment, as shown in Fig. 7, the pair of branch stake tool 7 and press tool 8 are respectively structured as
The length direction that one edge of opposing substrate 1 abuts to the edge is substantially overall.In addition it is also possible to as described in Example 2, into
An edge is supported and clamped at many points to set multiple stake tools 7 and press tool 8 for an edge
Structure.Alternatively, it is also possible to as in the structure in the corner of multiple positions clamping substrate 1.
Peripheral part is clamped the false clamping of mechanism by the substrate travel mechanism 6 and clamping device of the structure more than use
After substrate 1 is placed on mask 2, peripheral part is really clamped.
That is, by substrate travel mechanism 6, make peripheral part close by the relative distance of the substrate 1 of vacation clamping and mask 2, extremely
It is few to turn into false clamp position in the contact of substrate 1 and mask 2, touch mask 2 in the entirety of substrate 1 and load end
Afterwards, the peripheral part of substrate 1 is really clamped.
Specifically, as shown in Fig. 3~Fig. 6, for example, the base that will be moved from the substrate transport mechanism outside vacuum chamber 10
Plate 1 is moved in vacuum chamber 10 and receives (Fig. 3) with substrate keeping body 3, afterwards, vacation clamping substrate 1 (clamping process).Connect down
Come, in the decline sart point in time (Fig. 4) for substrate 1 to be placed on to mask 2, from the contact start with mask 2 to mounting way
Middle time point (Fig. 5) and substrate 1 maintain false clamping, afterwards, at least to the mounting deadline point (mounting process) of mask 2
Carry out really clamping (Fig. 6) before the alignment process as process below.In figure 6, symbol 12 is in alignment with using video camera.
Thus, while the contact area increase with mask 2 is made substrate 1 decline when, false clamp position infrabasal plate 1 with
Mask 2 contacts, and so as to hinder the deformation of substrate 1 due to clamping device, when substrate 1 stretches outward, can make substrate 1
Well along mask 2, substrate 1 can be made without on the skew overlapping in a close state with mask 2.Therefore, it is possible to stably
While transporting substrate 1, deformation when preventing from contacting with mask 2 and prevent film from obscuring well.
And then under false clamp position, substrate 1 be not be 3 entirely free on his state of opposing substrate keeping body, but by by
Pressure instrument 8 and substrate keeping body 3 are clamped and vacation is fixed, so preventing the overall phase of the substrate 1 when substrate 1 is placed on into mask 2
Position skew is significantly produced to mask 2.
(embodiment 2)
Hereinafter, illustrate applied to the more specifically example (embodiment 2) in the case of film formation device.But following reality
It is only the embodiment for illustrating the preferable structure of the present invention to apply example, and the scope of the present invention is not limited to these structures.In addition, on
Under explanation in device hardware configuration and software configuration, handling process, manufacturing condition, size, material, shape etc., only
Recorded without especially specific, then the scope of the present invention is not only limited to this.
The present invention relates to the film formation device and its control method that film is formed on substrate, the more particularly to height for substrate
The technology of conveyance and the position adjustment of precision.It is of the invention to be preferably applied to pass through vacuum on the surface of the substrate of parallel flat
Evaporation forms the device of the film (material layer) of desired pattern.As the material of substrate, glass, resin, metal can be selected
Etc. arbitrary material, in addition, as deposition material, organic material, inorganic material (metal, metal oxide etc.) can be also selected
Etc. arbitrary material.The technology of the present invention specifically can be applied to organic electronic device (such as organic EL display, film
Solar cell), the manufacture device of optical component etc..Especially, the manufacture device of organic EL display is large-scale due to substrate
Change or display panel High precision and require substrate conveyance precision and the alignment precision of substrate and mask it is further
One of improve, so be the preferable application examples of the present invention.
<Manufacture device and manufacturing process>
Fig. 8 is the top view of a part for the structure for the manufacture device for showing schematically electronic equipment.Fig. 8 manufacture device
Such as smart mobile phone organic EL display display panel manufacture.In the feelings of the display panel of smart mobile phone
Under condition, after organic EL film forming is carried out to the substrate of e.g., from about 1800mm × about 1500mm, thickness about 0.5mm size,
The substrate is cut to make the panel of multiple small sizes.
The manufacture device of electronic equipment is general as shown in figure 8, having multiple film forming room 111,112 and carrying room 110.Removing
Send to be provided with room 110 and keep and transport the conveying machine people 119 of substrate 1.Conveying machine people 119 is, for example, to have to multi-joint
Arm is mounted with to keep the robot of the construction of the mechanical hand of substrate 1, by each film forming room of the move-in/move-out of substrate 1.
Film formation device (also known as evaporation coating device) is respectively arranged with each film forming room 111,112.It is automatic by film formation device
Ground carries out a series of film-forming process, i.e., joins the relative of substrate 1, adjustment (alignment) substrate 1 and mask with conveying machine people 119
Position, substrate 1 is fixed on mask, film forming (evaporation) etc..Although the film formation device of each film forming room has the difference of vapor deposition source, covered
The part different trickle in terms of such as difference of mould, but basic structure (conveyance particularly with substrate, is directed at relevant knot
Structure) it is substantially common.Hereinafter, the common structure of the film formation device of each film forming room is illustrated.
<Film formation device>
Fig. 9 is the profile for the structure for showing schematically film formation device.In the following description, set using by vertical direction
For the XYZ orthogonal coordinate system of Z-direction.It is set to the substrate in film forming to fix in a manner of parallel with horizontal plane (X/Y plane), by this
When the width (direction parallel with short side) of substrate be set to X-direction, length direction (direction parallel with long side) is set
For Y-direction.In addition, represent the anglec of rotation about the z axis with θ.
Film formation device has vacuum chamber 200.The inside of vacuum chamber 200 is maintained the inert gases such as vacuum atmosphere or nitrogen
Atmosphere.Substantially be provided with the inside of vacuum chamber 200 substrate holder 210, mask 220, mask platform 221, coldplate 230 with
And vapor deposition source 240.
Substrate holder 210 is to maintain/transported the unit of the substrate 1 received from conveying machine people 119, is also known as base
Plate retainer.The substrate holder 210 is suitable with the substrate keeping body 3 in above-described embodiment 1.Mask 220 be have with
The metal mask of patterns of openings corresponding to the Thinfilm pattern formed on substrate 1, is fixed on the mask platform 221 of frame-shaped.In addition,
Mask platform 221 is suitable with the mask keeping body 4 in above-described embodiment 1.
In film forming, substrate 1 is loaded on mask 220.Therefore, mask 220 also undertakes the bearing member as mounting substrate 1
Effect.Coldplate 230 is to be close in film forming with substrate 1 (face of the side opposite with mask 220), suppresses substrate 1
Temperature rises so as to suppress rotten, deterioration the part of organic material.Coldplate 230 can also have the effect of magnet plate concurrently.Magnetic
The part of the close property of substrate 1 and mask 220 when iron plate refers to attract mask 220 by using magnetic force to improve film forming.Steam
Plating source 240 includes (all not shown) such as deposition material, heater, baffle plate, the drive mechanism of evaporation source, evaporation rate monitors.
(outside) is provided with substrate Z actuators 250, fixture Z actuators 251, coldplate Z actuatings on vacuum chamber 200
Device 252, X actuators (not shown), Y actuators (not shown), θ actuators (not shown).These actuators for example by motor and
Ball-screw, motor and line slideway etc. are formed.Substrate Z actuators 250 are the integral elevatings for making substrate holder 210
The driver element of (Z-direction movement).Substrate Z actuators 250 are suitable with the substrate travel mechanism 6 in above-described embodiment 1.Fixture
Z actuators 251 are the driver elements for making (aftermentioned) opening and closing of the clamping device of substrate holder 210.Fixture Z actuators
251 is suitable with the pressing force controlling organization 5 in above-described embodiment 1.
Coldplate Z actuators 252 are the driver elements for lifting coldplate 230.X actuators, Y actuators, θ actuatings
Device (being hereinafter collectively referred to as " XY θ actuators ") is the driver element for the alignment of substrate 1.XY θ actuators make substrate holder
210 and the overall of coldplate 230 carry out that X-direction is mobile, Y-direction is mobile, θ rotations.In addition, in the present embodiment, turn into
In the state of permanent mask 220 adjust substrate 1 X, Y, θ structure, but can also by adjust mask 220 position or
The position of both adjustment substrate 1 and mask 220, to carry out the alignment of substrate 1 and mask 220.
On vacuum chamber 200 (outside), for the alignment of substrate 1 and mask 220, be provided with measure substrate 1 and
The video camera 260,261 of 220 respective position of mask.Video camera 260,261 is via the window for being arranged at vacuum chamber 200, to substrate 1
Photographed with mask 220.By from the registration mark on the registration mark and mask 220 on its image recognition substrate 1, energy
Enough measure respective XY positions, the relative skew in XY faces.In order to realize high-precision alignment in the short time, two ranks are preferable to carry out
The alignment of section, i.e. the first alignment as the first position adjustment process for roughly carrying out position alignment are (also known as " thick right
It is accurate ") and the second alignment (being also known as " fine alignment ") as the second place adjustment process for accurately carrying out position alignment.
In this case, using the mutatis mutandis video camera 260 of the first couple of low image dissection but wide visual field and the second couple of narrow visual field but high image dissection
Mutatis mutandis both video cameras of video camera 261.In the present embodiment, on substrate 1 and mask 220, respectively with two
First pair of mutatis mutandis video camera 260 determines the registration mark added at two positions of an opposite opposite side, with four second pair
Mutatis mutandis video camera 261 determines the registration mark added at four angles of substrate 1 and mask 220.In addition, carrying out first
In the case of alignment and the second alignment, after the first alignment is carried out, substrate 1 is placed on mask 220 (mounting process), afterwards
Carry out the second alignment.
Film formation device has control unit 270.Control unit 270 except with substrate Z actuators 250, fixture Z actuators 251,
Beyond the function of the control of coldplate Z actuators 252, XY θ actuators and video camera 260,261, the also conveyance with substrate 1
And the function such as alignment, the control of vapor deposition source, control of film forming.Control unit 270 for example can be by with processor, storage
Device, storage device, I/O etc. computer are formed.In this case, by computing device in memory or storage device
The program of storage, realize the function of control unit 270.As computer, general personal computer can be both used, can also be made
With the computer or PLC (programmable logic controller, programmable logic controller (PLC)) of embedded type.Or
ASIC, FPGA circuit such as can also be used to form some or all of the function of control unit 270.In addition, it can both be directed to
Each film formation device sets control unit 270, can also control multiple film formation devices by a control unit 270.
In addition, with holding/conveyance of substrate 1 and being directed at relevant structure division (substrate holder 210, substrate Z being caused
Dynamic device 250, fixture Z actuators 251, XY θ actuators, video camera 260,261, control unit 270 etc.) it is also known as " substrate-placing
Device ", " substrate holding apparatus ", " base board delivery device " etc..
<Substrate holder>
Reference picture 10, illustrate the structure of substrate holder 210.Figure 10 is the stereogram of substrate holder 210.
Substrate holder 210 is to keep/transport substrate 1 by using the peripheral part of gripper mechanism grips substrate 1
Unit.Specifically, substrate holder 210 has：Support frame 301, it is provided with distinguish supporting substrate 1 from below four
The multiple stake tools 300 on side；And clamp member 303, it is provided with and sandwiches the more of substrate 1 between each branch stake tool 300
Individual press tool 302.A clamping device is formed by a pair stake tools 300 and press tool 302.In Figure 10 example,
Three branch stake tools 300 are configured with as the short side along substrate 1, six clamping device (branch stake tools are configured with along long side
300 and press tool 302 to), clamp two long sides structure.But the structure of clamping device is not limited to Figure 10 example,
Clamping machine can also be suitably changed with the size, shape or membrance casting condition of the substrate as process object etc. matchingly
The quantity of structure, configuration.In addition, branch stake tool 300 is also referred to as " receiving pawl " or " finger piece ", press tool 302 is also claimed
For " fixture ".
For example, join substrate 1 from conveying machine people 119 to substrate holder 210 as described below.First, folder is passed through
Tool Z actuators 251 rise clamp member 303, press tool 302 is left branch stake tool 300, so that clamping device turns into
Liberation state.After by conveying machine people 119, substrate 1 is imported between branch stake tool 300 and press tool 302, pass through
Fixture Z actuators 251 decline clamp member 303, and press tool 302 is pressed into branch stake tool 300 with predetermined pressing force.
Thus, substrate 1 is clamped between press tool 302 and branch stake tool 300.By utilizing substrate Z actuators in this condition
250 driving substrate holders 210, can be such that substrate 1 lifts (Z-direction movement).In addition, fixture Z actuators 251 are protected with substrate
The rise/fall together of part 210 is held, so even if substrate holder 210 lifts, the state of clamping device does not also change.
Here, on receiving substrate 1 to the utilization fixture Z that substrate 1 is placed on to mask 220 from substrate holder 210
The action (mounting process) of actuator 251 and substrate Z actuators 250, it is identical with the situation of embodiment 1.That is, in the present embodiment
In, during declining substrate holder 210 by substrate Z actuators 250, at least connecing in substrate 1 and mask 220
When touching beginning, the pressing force that fixture Z actuators 251 provide also is the pressing force of false clamping.That is, allow and substrate 1 and mask
220 position of the associated substrate 1 on substrate holder 210 that contact is offset.Then, substrate Z actuators 250, base are passed through
Plate holding member 210 further declines, after substrate 1 is placed on mask 220, the pressing force of the offer of fixture Z actuators 251
It is the pressing force of true clamping.That is, by being set to the pressing force of true clamping strong during than above-mentioned contact start, substrate 1 is prevented
Position skew on substrate holder 210.On the details of pressing force etc., as illustrated in embodiment 1, institute
So that the description thereof will be omitted.By the above, in the present embodiment, the effect same with the situation of above-described embodiment 1 can be also obtained certainly
Fruit.
<Alignment>
In the present embodiment, after the first alignment is carried out, substrate 1 is placed on mask 220, in fixture Z actuators 251
After the pressing force of offer turns into the pressing force of true clamping, the second alignment is carried out.In addition, the symbol 101 in Figure 10 represents
The mutatis mutandis registration mark of additional the second couple at four angles of substrate 1, symbol 102 represent additional in the short side center of substrate 1
First pair of mutatis mutandis registration mark.
When carrying out each alignment, by XY θ actuators, in a manner of sliding the not relative mask 220 of substrate 1, make base
Plate 1 in the state of mask 220, carries out the position adjustment of substrate 1 slightly away.First, using two first pair of mutatis mutandis photographies
Machine 260 carries out the position adjustment of substrate 1, so as to the mutatis mutandis mark 102 of the first couple at two positions and be additional to the two of mask 220
The mark (not shown) that the first couple at individual position is mutatis mutandis is all consistent.Afterwards, substrate 1 is temporarily placed on (the mounting work of mask 220
Sequence).After the mounting process, as described above, substrate 1 and substrate holder 210 are clamped by the pressing force of very clamping,
Make mask 200 slightly away again of substrate 1.Then, the position of substrate 1 is carried out using four second pair mutatis mutandis video camera 260
Adjustment, so that the second couple at the mutatis mutandis mark 101 of the second couple at four positions and four positions for being additional to mask 220 is mutatis mutandis
Indicate that (not shown) is all consistent.Afterwards, substrate 1 is placed on mask 220 again.Alignment more than, turns into substrate 1 with covering
The state that mould 220 is close to the state accurately positioned.In addition, on above-mentioned mounting process, additionally it is possible to applied to second
Substrate 1 is placed on to the situation of mask 220 after alignment.
<The embodiment of the manufacture method of electronic equipment>
A next, example of the explanation using the manufacture method of the electronic equipment of the film formation device involved by the present embodiment
Son.Hereinafter, the example as electronic equipment, the structure and manufacture method of organic EL display are illustrated.
First, the organic EL display to be manufactured is illustrated.Figure 11 (a) represents the entirety of organic EL display 60
Figure, Figure 11 (b) represent the profile construction of a pixel.
As shown in Figure 11 (a), in the viewing area 61 of organic EL display 60, it is configured with and multiple possesses rectangularly
The pixel 62 of multiple light-emitting components.Be discussed in detail below, light-emitting component each possess clamped by a pair of electrodes it is organic
The construction of layer.In addition, pixel referred to herein refers to the least unit that desired color can be shown in viewing area 61.
In the case of organic EL display involved by the present embodiment, by the way that mutually different the first luminous light-emitting component is presented
62R, the second light-emitting component 62G, the 3rd light-emitting component 62B combination form pixel 62.Pixel 62 passes through red light-emitting component, green
The situation that the combination of color light-emitting component and blue light emitting device is formed is more, but can also pass through yellow emitting light elements, cyan
The combination of light-emitting component and white-light luminescent component is formed, as long as more than at least one color, is then not particularly limited.
Figure 11 (b) is the partial cutaway schematic view of Figure 11 (a) A-B lines.Pixel 62 has and possessed on substrate 63
Any luminescent layer, electron supplying layer 67 in first electrode (anode) 64, hole transporting layer 65, luminescent layer 66R, 66G, 66B with
And the organic EL element of second electrode (negative electrode) 68.Wherein, hole transporting layer 65, luminescent layer 66R, 66G, 66B, electron supplying layer
67 equivalent to organic layer.In addition, in the present embodiment, luminescent layer 66R is the organic EL layer for sending red, luminescent layer 66G is
The organic EL layer of green is sent, luminescent layer 66B is the organic EL layer for sending blueness.Luminescent layer 66R, 66G, 66B are formed as and sent out
Go out light-emitting component (it is organic EL element also to describe sometimes) pattern corresponding to difference of red, green, blueness.In addition, for every
Individual light-emitting component has been formed separately first electrode 64.Hole transporting layer 65, electron supplying layer 67 and second electrode 68 both may be used
To be collectively form with multiple light-emitting component 62R, 62G, 62B, can also be formed for each light-emitting component.In addition, in order to anti-
Only first electrode 64 and second electrode 68 are short-circuit due to foreign matter, and insulating barrier 69 is provided between first electrode 64.And then have
Machine EL layers due to moisture, oxygen and deteriorate, so be provided with for from moisture, oxygen protection organic EL element protective layer 70.
In order to form organic EL layer according to light-emitting component unit, the method for carrying out film forming across mask is used.In recent years, show
The High precision of showing device is developed, and is tens μm of mask using the width of opening in the formation of organic EL layer.Make
In the case of film forming with such mask, if mask is heated and thermal deformation, mask and substrate in film forming from evaporation source
Position shift, formed to the desired position of pattern shift of the film formed on substrate.It is therefore preferable that by the present invention
Involved film formation device (vacuum deposition apparatus) is used for the film forming of these organic EL layers.
Next, specifically describe the example of the manufacture method of organic EL display.
First, prepare formed with the circuit (not shown) and the base of first electrode 64 for driving organic EL display
Plate 63.
Allyl resin is formed by spin coating on the substrate 63 formed with first electrode 64, by photoetching process, with shape
The mode that opening is formed into the part for having first electrode 64 patterns to allyl resin, forms insulating barrier 69.The opening portion
The light-emitting zone to light actual equivalent to light-emitting component.
The substrate 63 that insulating barrier 69 is patterned is moved to the first film formation device, substrate is kept with substrate holder,
It is layer common on the first electrode 64 of viewing area by the film forming of hole transporting layer 65.By vacuum evaporation to cavity conveying
Layer 65 carries out film forming.Actually hole transporting layer 65 is formed as the size bigger than viewing area 61, so not needing fine
Mask.
Next, being moved to the second film formation device by being formed to the substrate 63 of hole transporting layer 65, substrate holder is used
Keep.The alignment of substrate and mask is carried out, by substrate-placing to mask, the portion of the element of red is sent in the configuration of substrate 63
Point, film forming is carried out to the luminescent layer 66R for sending red.According to this example, mask and substrate can be made overlapping well, Neng Goujin
The high-precision film forming of row.
In the same manner as luminescent layer 66R film forming, by the 3rd film formation device to send green luminescent layer 66G carry out into
Film, and then film forming is carried out to the luminescent layer 66B for sending blueness by the 4th film formation device.Luminescent layer 66R, 66G, 66B into
After film is completed, film forming is carried out to electron supplying layer 67 in the overall of viewing area 61 by the 5th film formation device.Electron transport
Layer 67 is formed as the common layer of luminescent layer 66R, 66G, 66B to three colors.
Make to be formed to the base plate transfer of electron supplying layer 67 to sputter equipment, film forming, Zhi Houyi are carried out to second electrode 68
Move plasma CVD equipment and film forming is carried out to protective layer 70, organic EL display 60 is completed.
Film formation device is moved to untill the film forming of protective layer 70 is completed from the substrate 63 for being patterned insulating barrier 69, such as
Fruit is exposed to the atmosphere comprising moisture, oxygen, it is likely that by the luminescent layer that organic EL Material is formed due to moisture, oxygen and deteriorate.
Therefore, in the present example, the carrying-in/carrying-out of the substrate between film formation device is carried out under vacuum atmosphere or inert gas atmosphere.
In the organic EL display so obtained, luminescent layer is accurately formed for each light-emitting component.Therefore,
If using above-mentioned manufacture method, the organic EL display unfavorable condition offset due to the position of luminescent layer can be suppressed
Generation.
Claims (36)
1. a kind of clamp method of substrate, the clamp method is for the filmogen on substrate by making to project from evaporation source
Across the method that mask accumulation clamps substrate when making substrate-placing to the mask to carry out film forming, the clamp method
It is characterised by,
With by the substrate to be pressed to the substrate-placing work that the state of substrate keeping body is placed on mask with press tool
Sequence, on the behaviour that the substrate is pressed to the substrate keeping body by the press tool in the substrate-placing process
Make, at least in the contact start of the substrate and the mask, the pressing force of the substrate is abutted to the press tool
Pushed, after the substrate-placing process, by the press tool, strong pressing force during with than the contact start
The substrate is pressed to the substrate keeping body.
2. a kind of film build method, carried out on substrate by making from the filmogen of evaporation source injection across mask accumulation
Film, the film build method be characterised by,
In order that substrate-placing to the mask and when clamping substrate, the clamp method of the substrate described in usage right requirement 1,
And
The substrate is pressed to the substrate and protected by strong pressing force when by the press tool with than the contact start
In the state of holding body, make the substrate keeping body mobile and carry out carrying out film forming after the alignment of the substrate and the mask.
3. film build method according to claim 2, it is characterised in that
In the alignment, in the state of making the substrate and the mask leaves, the relative of these substrates and mask is adjusted
Position.
A kind of 4. clamping device of substrate, in order to be accumulated on substrate by making from the filmogen that evaporation source projects across mask
Substrate is clamped when making substrate-placing to the mask to carry out film forming, the clamping device is characterised by, is possessed：
Substrate keeping body, keep the substrate；
Mask keeping body, keep the mask；And
Substrate travel mechanism, the substrate-placing is kept to the mask is held in for making the substrate keeping body mobile
On the mask of body,
It is provided with the substrate keeping body：
Press tool, the substrate being kept is pressed to the substrate keeping body；And
Pressing force controlling organization, change the pressing force of press tool offer.
5. the clamping device of substrate according to claim 4, it is characterised in that
The pressing force controlling organization is configured at least in the contact start of the substrate and the mask, be set to allow with and
The pressing force for contacting position skew of the associated substrate in the substrate keeping body of the mask, is carried by the substrate
After putting on the mask, in order to prevent position skew of the substrate in the substrate keeping body, it is set to than the contact
Strong pressing force during beginning.
6. the clamping device of substrate according to claim 5, it is characterised in that
The substrate travel mechanism is configured to the pressing strong when the pressing force controlling organization is changed to than the contact start
After power, in order to carry out the alignment of the substrate and the mask, move the substrate keeping body.
7. the clamping device of the substrate according to claim 5 or 6, it is characterised in that
The pressing force controlling organization is configured to periodically adjust pressing force.
8. the clamping device of the substrate according to claim 5 or 6, it is characterised in that
The pressing force controlling organization is configured to continuously adjust pressing force.
A kind of 9. film formation device to substrate film forming, by making the filmogen from evaporation source injection across mask heap on substrate
Accumulating to carry out film forming, the film formation device is characterised by,
The film formation device be provided with make substrate-placing to during the mask clamp substrate claim 4~8 in it is any one
Clamping device described in.
10. the manufacture method of a kind of electronic equipment, the electronic equipment has the metal film formed on substrate, and the electronics is set
Standby manufacture method is characterised by,
The metal film is formed by the film build method described in Claims 2 or 3.
11. the manufacture method of a kind of electronic equipment, the electronic equipment has the organic film formed on substrate, and the electronics is set
Standby manufacture method is characterised by,
The organic film is formed by the film build method described in Claims 2 or 3.
12. the manufacture method of electronic equipment according to claim 11, it is characterised in that
The electronic equipment is the display panel of organic EL display.
13. a kind of substrate-placing method, has：Process is clamped, clamps the periphery of substrate；And mounting process, by what is be clamped
To on bearing member, the substrate-placing method is characterised by substrate-placing,
The grip force that can be moved with clip position carries out the clamping of the substrate in the mounting process.
14. substrate-placing method according to claim 13, it is characterised in that
The grip force that the clip position can move is pressed from both sides by the reinforcing from bearing member to substrate in the mounting process
Hold the grip force that position can move.
15. the substrate-placing method according to claim 13 or 14, it is characterised in that
After the mounting process, the substrate is clamped with bigger grip force.
16. substrate-placing method according to claim 15, it is characterised in that
The bigger grip force is the grip force that clip position can be fixed.
17. the substrate-placing method according to claim 13 or 14, it is characterised in that
Grip force in the clamping process is the grip force that clip position can be fixed.
18. the substrate-placing method according to claim 13 or 14, it is characterised in that
Entered by the branch stake tool for supporting substrate and the press tool for the substrate to be pressed into the branch stake tool
The clamping of the row substrate.
A kind of 19. alignment methods, it is characterised in that
With position adjustment process, in the position adjustment process, described in any one in by claim 13~18
Substrate-placing method by after on substrate-placing to bearing member, and then adjust the relative position of the substrate and the bearing member
Put.
20. alignment methods according to claim 19, it is characterised in that
The bearing member is the mask with predetermined pattern for carrying out the film forming of predetermined pattern on substrate.
A kind of 21. alignment methods, it is characterised in that
With position adjustment process, in the position adjustment process, described in any one in by claim 13~18
Substrate-placing method makes the substrate leave the bearing member by after on substrate-placing to bearing member, adjusts the base
The relative position of plate and the bearing member.
22. alignment methods according to claim 21, it is characterised in that
The bearing member is the mask with predetermined pattern for carrying out the film forming of predetermined pattern on substrate.
23. a kind of alignment methods, it is characterised in that have：
First position adjusts process, adjusts the relative position of substrate and bearing member；And
The second place adjusts process, after adjusting process in first position, than the situation higher precision of first position adjustment process
Ground adjusts the relative position of the substrate and the bearing member, and
After first position adjustment process is carried out, pass through the substrate-placing side described in any one in claim 13~18
Method on the substrate-placing to the bearing member, will carry out second place adjustment process afterwards.
24. alignment methods according to claim 23, it is characterised in that
The bearing member is the mask with predetermined pattern for carrying out the film forming of predetermined pattern on substrate.
25. a kind of alignment methods, it is characterised in that have：
First position adjusts process, adjusts the relative position of substrate and bearing member；And
The second place adjusts process, after adjusting process in first position, than the situation higher precision of first position adjustment process
Ground adjusts the relative position of the substrate and the bearing member, and
After first position adjustment process is carried out, pass through the substrate-placing side described in any one in claim 13~18
Method makes the substrate leave the bearing member by after on the substrate-placing to the bearing member, carries out the second place
Adjust process.
26. alignment methods according to claim 25, it is characterised in that
The bearing member is the mask with predetermined pattern for carrying out the film forming of predetermined pattern on substrate.
27. a kind of film build method, it is the film build method for the film forming that predetermined pattern is carried out on substrate, it is characterised in that
The relative position of the substrate and the mask is being carried out by the alignment methods described in claim 20,22,24 or 26
After the adjustment put, the film forming of predetermined pattern is carried out on the substrate.
28. the manufacture method of a kind of electronic equipment, the electronic equipment has the metal film formed on substrate, and the electronics is set
Standby manufacture method is characterised by,
The metal film is formed by the film build method described in claim 27.
29. the manufacture method of a kind of electronic equipment, the electronic equipment has the organic film formed on substrate, and the electronics is set
Standby manufacture method is characterised by,
The organic film is formed by the film build method described in claim 27.
30. the manufacture method of electronic equipment according to claim 29, it is characterised in that
The electronic equipment is the display panel of organic EL display.
31. a kind of substrate-placing device, has：Grip unit, for clamping the periphery of substrate；And mounting unit, for inciting somebody to action
To on bearing member, the substrate-placing device is characterised by substrate-placing,
The grip unit also has the grip force controlling organization of the grip force of change clamping substrate.
32. substrate-placing device according to claim 31, it is characterised in that
The grip unit has：
Branch stake tool, for supporting substrate；And
Press tool, for the substrate to be pressed into the branch stake tool.
33. substrate-placing device according to claim 32, it is characterised in that
The grip force controlling organization is the pressing force controlling organization for the pressing force that the change press tool provides.
34. the substrate-placing device described in any one in claim 31~33, it is characterised in that
The grip force controlling organization can be controlled to enable the grip unit to clamp the folder that substrate but its clip position move
Power.
35. the substrate-placing device described in any one in claim 31~33, it is characterised in that
The grip force controlling organization, which can control, to be enable the grip unit clamping substrate and fixes its clip position
Grip force.
36. the substrate-placing device described in any one in claim 31~33, it is characterised in that
The grip force controlling organization can become from the grip force for enabling the grip unit clamping substrate but its clip position to move
The grip force that more its clip position can be fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111098152.6A CN113802106B (en) | 2016-06-24 | 2017-06-23 | Substrate mounting method, electronic device manufacturing method, and substrate mounting apparatus |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-125835 | 2016-06-24 | ||
| JP2016125835 | 2016-06-24 | ||
| JP2017-101232 | 2017-05-22 | ||
| JP2017101232A JP6876520B2 (en) | 2016-06-24 | 2017-05-22 | Substrate sandwiching method, substrate sandwiching device, film forming method, film forming device, and electronic device manufacturing method, substrate mounting method, alignment method, substrate mounting device |
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| CN202111098152.6A Active CN113802106B (en) | 2016-06-24 | 2017-06-23 | Substrate mounting method, electronic device manufacturing method, and substrate mounting apparatus |
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| CN110416140A (en) * | 2018-04-26 | 2019-11-05 | 佳能特机株式会社 | The manufacturing method of substrate transfer system, the manufacturing device of electronic equipment and electronic equipment |
| CN111218660A (en) * | 2018-11-27 | 2020-06-02 | 佳能特机株式会社 | Film forming apparatus, film forming method, and electronic device manufacturing method |
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| CN111378925B (en) * | 2018-12-27 | 2023-09-29 | 佳能特机株式会社 | Alignment system, film forming apparatus, film forming method, and method for manufacturing electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2021008668A (en) | 2021-01-28 |
| JP6876520B2 (en) | 2021-05-26 |
| KR20180001472A (en) | 2018-01-04 |
| CN113802106B (en) | 2023-09-12 |
| JP2018003151A (en) | 2018-01-11 |
| KR101901066B1 (en) | 2018-09-20 |
| JP6999769B2 (en) | 2022-01-19 |
| CN113802106A (en) | 2021-12-17 |
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