CN107526025B - High-temperature aging test device for integrated circuit - Google Patents
High-temperature aging test device for integrated circuit Download PDFInfo
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- CN107526025B CN107526025B CN201710768311.6A CN201710768311A CN107526025B CN 107526025 B CN107526025 B CN 107526025B CN 201710768311 A CN201710768311 A CN 201710768311A CN 107526025 B CN107526025 B CN 107526025B
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- interface board
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- temperature box
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
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- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a high-temperature aging test device for an integrated circuit, which comprises a circuit system and a supporting mechanism, wherein the circuit system comprises a circuit board and a circuit board; the high-temperature-resistant PCB circuit board is used as a carrier of a transmission line introduced into the high-temperature box, a multi-stage interface board is arranged, and a programmable logic device is used for outputting input test signals to a plurality of connectors inserted with modules to be tested respectively, so that batch testing is realized; an adjustable supporting mechanism and a locking device are arranged in the high-temperature box, the high-temperature box is compatible with adapter plates with different sizes, the distance between the adapter plates is adjustable, and the high-temperature box is compatible with modules to be tested with different sizes; the adapter plate is completely kept horizontal under the action of the supporting mechanism, a special power supply line is set, the requirement of large-current power supply is met, and the problem that the connector cannot deliver large current is solved; the components of the direct contact circuit board are made of insulating materials, so that the influence on the operation of the module due to the fact that charges on the high-temperature box body are transmitted to the module is prevented. The invention has simple structure, convenient use, low cost and high stability.
Description
Technical Field
The invention relates to a test device of an integrated circuit chip, in particular to a high-temperature aging test device of an integrated circuit.
Background
in recent years, with the increasing demand for consumers and the strong support of governments at all levels, the development of the integrated circuit industry has been dramatically advanced. However, since the accumulation is small at night, the problem of stability is easy to occur in the mass production of the integrated circuit chips, and the performance of the whole product is affected due to the instability of any chip in the manufactured product circuit board, so that the integrated circuit chips need to be strictly checked and screened, and the service life of the chips can be checked through a necessary aging means.
The chip aging generally needs to select chips in batches, build a test circuit, place the test circuit in a high-temperature box, set the high temperature at 120 ℃, continuously run a test program for more than 1000 hours, and detect whether the chips have abnormal working conditions in real time in the process. Since the number of pins of one chip is tens of pins and the number of pins of one chip is hundreds of pins, the pins of each chip need to be led out in the inspection process. The traditional way generally has two kinds, firstly uses dedicated high temperature box, and the box inner wall is as the backplate, will carry the module of the chip that awaits measuring and insert the inspection in the backplate. However, such a high temperature box and a back plate are expensive, and in the testing process, the phenomenon that the module works abnormally due to the looseness of the connector occurs at a certain probability, so that when the abnormal phenomenon occurs, the problem that whether the abnormal phenomenon is caused by poor connection or the chip is difficult to confirm is caused; in another method, test signals are introduced into the high-temperature box one by one through connecting wires, the tested modules can still operate when the number of the tested modules is small, and when the number of the tested modules is large, the length of the connecting wires of a large number of modules is inevitably larger than 1m, so that large parasitic capacitance and parasitic inductance exist on the long connecting wires, the quantization is difficult, and the transmission and the delay of the test signals are seriously influenced.
Therefore, it is necessary to design a low-cost and highly stable test apparatus for performing burn-in test of integrated circuit chips in batch.
Disclosure of Invention
The invention provides a high-temperature aging test device for an integrated circuit, which aims to solve the problems.
The invention is implemented according to the following technical scheme.
the integrated circuit high-temperature aging test device comprises a circuit system and a supporting mechanism; the supporting mechanism comprises a base, two groups of second rails which are parallel to each other are arranged on the base, a vertical plate which is perpendicular to the base is arranged on the base, and a protruding part which is embedded in the second rails is formed at the bottom of the vertical plate; the bottom of the vertical plate is connected with one side of the angle steel, a threaded through hole is formed in the middle of the other side of the angle steel and clings to the base, and a first bolt is arranged in the threaded through hole; a first rail which penetrates through the vertical plate and is vertical to the base is formed on each of the two sides of the vertical plate; a clamp group is arranged in the first rail and comprises a U-shaped clamp, a second bolt sequentially penetrates through the clamping plate and the first rail, and the tail end of the second bolt is screwed into the bottom of the U-shaped clamp; two sides of one end of the base are respectively provided with a second supporting column perpendicular to the base, external threads are formed on the second supporting columns, the second supporting columns are nested with the clamping supports, and the middle parts of the clamping supports are protruded towards the periphery to form flat annular wing parts;
the circuit system comprises a first interface board, wherein the first interface board is provided with a power supply module and a second connector, the first interface board is vertically connected with the second interface board through the first connector arranged at the bottom, and the second interface board is provided with a plurality of third connectors; circular through holes are formed in the first interface board on two sides of the first connector, and the threading pipe penetrates through the circular through holes and is perpendicular to the first interface board; at least one circular wire outlet hole is formed in the threading pipe; the output end of the power supply module is led out through a high-temperature wire, and the high-temperature wire penetrates through the threading pipe to form a plurality of branches and respectively penetrates out of each wire outlet hole; a golden finger embedded into the third connector is formed at one end of the third interface board, the third interface board is provided with a fifth connector used as a power input plug, and the third interface board is also provided with at least four fourth connectors used for inserting the module to be detected;
The first interface board is provided with a programmable logic device, the input end of the programmable logic device is connected with the second connector, and the output end of the programmable logic device is connected with the first connector; the second connector is connected with the test host through a cable; pins of the first connector are connected with pins of the third connector in a chain or star connection mode, pins of each third connector are connected with corresponding pins of a fourth connector plugged on a third interface board in the third connector in a chain or star connection mode, and pins of a fifth connector on each third interface board are connected with power supply pins in the fourth connector on the third interface board.
The width of the clamping plate is larger than that of the first rail.
at least one clamp group is arranged in the first rail, and at least one embedded support is embedded on the second support column.
The base, the vertical plate and the clamping plate are all made of stainless steel; the clamp, the clamping support and the threading pipe are all made of polytetrafluoroethylene materials.
The four corners of the first interface board are provided with first support columns, and the first support columns are locked and fixed with the first interface board through first nuts.
The second interface board, the third connector, the fourth connector and the fifth connector are all made of high-temperature-resistant materials.
The second interface board is a multilayer PCB board.
The supporting mechanism is arranged in the high-temperature box, the first interface board is arranged at the top of the high-temperature box, the second interface board penetrates through a pore passage at the top of the high-temperature box and penetrates into the high-temperature box, one end of the third interface board is embedded into the third connector, the other end of the third interface board is embedded into the clip, and two sides of the third interface board are lapped on wing parts of the clamping supports and are kept to be arranged in parallel with the horizontal plane; the tail ends of the branches of the high-temperature lead are respectively inserted into the fifth connector, and the module to be detected is inserted into the fourth connector.
The present invention obtains the following advantageous effects.
the invention provides a high-temperature aging test device for an integrated circuit, which uses a common high-temperature box to replace a connecting cable introduced into the high-temperature box with a high-temperature-resistant PCB circuit board. An adjustable supporting mechanism is arranged in the high-temperature box, the high-temperature box can be compatible with adapter plates with different sizes, the distance between the adapter plates can be adjusted, and therefore the high-temperature box can be compatible with modules to be tested with different sizes; the adapter plate is completely kept horizontal under the action of the supporting mechanism, and the connector almost has no stress, so that the connector is prevented from deforming at high temperature; a special power supply line is set to meet the requirement of large-current power supply and prevent the problem that the connector cannot deliver large current; the components of the direct contact circuit board are made of insulating materials, so that the influence on the operation of the module due to the fact that charges on the high-temperature box body are transmitted to the module is prevented. The invention has simple structure, convenient use, low cost and high stability.
Drawings
FIG. 1 is a schematic diagram of the connection mode of each interface board in the present invention;
FIG. 2 is a schematic view of the support mechanism of the present invention;
FIG. 3 is a schematic view of the present invention deployed within a high temperature enclosure;
FIG. 4 is a schematic view of the structure of the clamp group of the present invention;
FIG. 5 is a schematic structural view of an angle steel fixing seat in the invention;
FIG. 6 is a schematic view of the structure of the clamping bracket of the present invention;
FIG. 7 is a front view of a second interface board and a conduit according to the present invention;
FIG. 8 is a schematic view of the structure of the high temperature chamber of the present invention;
FIG. 9 is a block diagram of circuitry in the present invention;
FIG. 10 is a schematic view of the deployment of the insulation blanket of the present invention.
Wherein, 1, a high temperature box; 2. a duct; 3. a first interface board; 4. a first nut; 5. a first support column; 6. a first connector; 7. a second connector; 8. a second interface board; 9. a third interface board; 10. a threading tube; 11. a third connector; 12. a fourth connector; 13. a vertical plate; 14. angle steel; 15. a clamping support; 16. a second support column; 17. a clip; 18. a first track; 19. a first bolt; 20. a splint; 21. a second bolt; 22. a fifth connector; 23. a wire outlet hole; 24. a base; 25. a second track; 26. a power supply module; 27. a high-temperature wire; 28. a heat insulating pad.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
as shown in fig. 1 to 10, an apparatus for testing high temperature aging of an integrated circuit includes a circuit system and a supporting mechanism;
The supporting mechanism comprises a base 24, two groups of second rails 25 which are parallel to each other are arranged on the base 24, a vertical plate 13 which is perpendicular to the base 24 is arranged on the base 24, and a protruding part which is embedded in the second rails 25 is formed at the bottom of the vertical plate 13; the bottom of the vertical plate 13 is connected with one side of an angle steel 14, a threaded through hole is formed in the middle of the other side of the angle steel 14 and clings to a base 24, and a first bolt 19 is arranged in the threaded through hole; a first rail 18 which penetrates through the vertical plate 13 and is perpendicular to the base 24 is formed on each of two sides of the vertical plate 13; a clamp group is arranged in the first track 18 and comprises a U-shaped clamp 17, a second bolt 21 sequentially penetrates through the clamping plate 20 and the first track 18, and the tail end of the second bolt is screwed into the bottom of the U-shaped clamp 17; two sides of one end of the base 24 are respectively provided with a second supporting column 16 perpendicular to the base 24, external threads are formed on the second supporting column 16, the clamping support 15 is embedded in the second supporting column 16, and the middle of the clamping support 15 protrudes towards the periphery to form a flat annular wing part;
the circuit system comprises a first interface board 3, wherein the first interface board 3 is provided with a power supply module 26 and a second connector 7, the first interface board 3 is vertically connected with a second interface board 8 through a first connector 6 arranged at the bottom, and the second interface board 8 is provided with a plurality of third connectors 11; circular through holes are formed in the first interface board 3 on two sides of the first connector 6, and the threading pipe 10 penetrates through the circular through holes and is perpendicular to the first interface board 3; at least one circular wire outlet hole 23 is formed on the threading pipe 10; the output end of the power module 26 is led out through a high-temperature wire 27, the high-temperature wire 27 passes through the threading pipe 10 and forms a plurality of branches, and the branches respectively penetrate out of the wire outlet holes 23; a golden finger embedded in the third connector 11 is formed at one end of the third interface board 9, a fifth connector 22 serving as a power input plug is arranged on the third interface board 9, and at least four fourth connectors 12 for inserting the module to be detected are further arranged on the third interface board 9;
A programmable logic device (CPLD) is arranged on the first interface board 3, the input end of the CPLD is connected with the second connector 7, and the output end of the CPLD is connected with the first connector 6; the second connector 7 is connected with the test host through a cable; pins of the first connector 6 are connected with pins of the third connector 11 in a chain or star connection manner, pins of each third connector 11 are connected with corresponding pins of a fourth connector 12 plugged on a third interface board 9 in the third connector 11 in a chain or star connection manner, and pins of a fifth connector 22 on each third interface board 9 are connected with power supply pins in the fourth connector 12 on the third interface board 9.
The width of the clamping plate 20 is greater than the width of the first track 18.
at least one clamp group is arranged in the first rail 18, and the number of the nested clamping brackets 15 on the second supporting column 16 is not less than one.
The base 24, the vertical plate 13 and the clamping plate 20 are all made of stainless steel; the clip 17, the clamping support 15 and the threading tube 10 are all made of polytetrafluoroethylene materials.
four corners of the first interface board 3 are provided with first support columns 5, and the first support columns 5 are locked and fixed with the first interface board 3 through first nuts 4.
The second interface board 8, the third interface board 9, the third connector 11, the fourth connector 12 and the fifth connector 22 are made of high-temperature resistant materials.
The second interface board 8 is a multilayer PCB board.
The supporting mechanism is arranged in the high-temperature box 1, the first interface board 3 is arranged at the top of the high-temperature box 1, the second interface board 8 penetrates into the high-temperature box 1 through the pore channel 2 at the top of the high-temperature box 1, one end of the third interface board 9 is embedded into the third connector 11, the other end of the third interface board is embedded into the clamp 17, and the two sides of the third interface board are lapped on the wing parts of the clamping supports 15 and are kept to be arranged in parallel with the horizontal plane; the ends of the branches of the high-temperature conductor 27 are respectively inserted into the fifth connector 22, and the module to be tested is inserted into the fourth connector 12.
the using method and the principle of the invention are as follows:
1. Two sets of support mechanisms are deployed within the high temperature box 1.
2. The second interface board 8 penetrates through the pore channel 2 at the top of the high temperature box 1 and penetrates into the high temperature box 1, the top of the second interface board 8 is connected with the first interface board 3 through the first connector 6, and the first support column 5 with proper length is selected and fixed around the first interface board 3, so that the first interface board 3 is kept horizontal.
3. The top opening 2 of the high temperature box 1 is plugged by two semicircular truncated cone-shaped heat insulation pads 28, and the second interface board 8 is clamped between the two heat insulation pads 28 and fixed on the second interface board 8.
4. the first bolt 19 is loosened to push the vertical plate 13 to slide in the second rail 25, so that the distance between the vertical plate 13 and the second interface plate 8 is slightly larger than that between the vertical plate 13 and the third interface plate 9.
5. the golden finger ends of two third interface boards 9 are respectively inserted into the third connectors 11 at the bottom ends of the two sides of the second interface board 8, the other end of the third interface board 9 is embedded into a clip 17, a group of clamping supports 15 are rotated to enable the wing parts of the clamping supports 15 to support the edge of the third interface board 9, and the clamping supports 15 are finely adjusted up and down to enable the third interface board 9 to be horizontal.
6. The modules to be tested are inserted into the fourth connector 12 of the third interface board 9 one by one, and the tail end of the high-temperature lead 27 led out from the wire outlet hole 23 closest to the third interface board 9 is inserted into the fifth connector 22.
7. The above steps 5, 6 are repeated until all the third connectors 11 are plugged with the third interface board 9.
8. The vertical plate 13 is pushed towards the direction of the second interface board 8, all the third interface boards 9 are embedded into different clips 17, the third interface boards 9 are kept horizontal, the second bolts 21 in each clamp group are sequentially locked, the clamp plate 20 and the clips 17 clamp the edge of the first rail 18, and the third interface boards 9 are prevented from inclining or falling off.
9. The first bolt 19 is screwed so that its tip abuts against the base 24, and the position of the vertical plate 13 is locked on the base 24.
10. Closing the door of the high-temperature box 1, adjusting the temperature to gradually rise to 120 ℃, starting the tester, and executing the aging test program.
Claims (8)
1. The integrated circuit high-temperature aging test device comprises a circuit system and a supporting mechanism; it is characterized in that the preparation method is characterized in that,
The supporting mechanism comprises a base (24), two groups of second rails (25) which are parallel to each other are arranged on the base (24), a vertical plate (13) which is perpendicular to the base (24) is arranged on the base (24), and a protruding part which is embedded in the second rails (25) is formed at the bottom of the vertical plate (13); the bottom of the vertical plate (13) is connected with one side of an angle steel (14), a threaded through hole is formed in the middle of the other side of the angle steel (14) and is tightly attached to the base (24), and a first bolt (19) is arranged in the threaded through hole; two sides of the vertical plate (13) are respectively provided with a first rail (18) which penetrates through the vertical plate (13) and is vertical to the base (24); a clamp group is arranged in the first track (18), the clamp group comprises a U-shaped clamp (17), a second bolt (21) sequentially penetrates through the clamping plate (20) and the first track (18), and the tail end of the second bolt is screwed into the bottom of the U-shaped clamp (17); two sides of one end of the base (24) are respectively provided with a second supporting column (16) which is vertical to the base (24), an external thread is formed on the second supporting column (16), the clamping support (15) is embedded in the second supporting column (16), and the middle part of the clamping support (15) protrudes towards the periphery to form a flat annular wing part;
the circuit system comprises a first interface board (3), a power supply module (26) and a second connector (7) are arranged on the first interface board (3), the first interface board (3) is vertically connected with a second interface board (8) through a first connector (6) arranged at the bottom, and a plurality of third connectors (11) are arranged on the second interface board (8); circular through holes are formed in two sides of the first connector (6) on the first interface board (3), and the threading pipe (10) penetrates through the circular through holes and is perpendicular to the first interface board (3); at least one circular wire outlet hole (23) is formed in the threading pipe (10); the output end of the power supply module (26) is led out through a high-temperature lead (27), the high-temperature lead (27) penetrates through the threading pipe (10) to form a plurality of branches, and the branches respectively penetrate out of the wire outlet holes (23); a golden finger embedded into the third connector (11) is formed at one end of the third interface board (9), a fifth connector (22) serving as a power input plug is arranged on the third interface board (9), and at least four fourth connectors (12) used for inserting the module to be detected are further arranged on the third interface board (9);
the first interface board (3) is provided with a programmable logic device, the input end of the programmable logic device is connected with the second connector (7), and the output end of the programmable logic device is connected with the first connector (6); the second connector (7) is connected with the test host through a cable; pins of the first connector (6) are connected with pins of the third connector (11) in a chain or star connection mode, pins of each third connector (11) are connected with corresponding pins of a fourth connector (12) plugged on a third interface board (9) in the third connector (11) in a chain or star connection mode, and pins of a fifth connector (22) on each third interface board (9) are connected with power supply pins in the fourth connector (12) on the third interface board (9).
2. an apparatus for burn-in testing of integrated circuits as claimed in claim 1, characterized in that the width of the clamping plate (20) is greater than the width of the first track (18).
3. The high-temperature burn-in tester for the integrated circuits of claim 1, wherein the first rail (18) is provided with at least one clamp group, and the number of the embedded clamping brackets (15) on the second supporting posts (16) is not less than one.
4. The high-temperature aging test device for the integrated circuit according to claim 1, wherein the base (24), the vertical plate (13) and the clamping plate (20) are made of stainless steel; the clip (17), the clamping support (15) and the threading tube (10) are all made of polytetrafluoroethylene materials.
5. the high-temperature aging test device for the integrated circuit according to claim 1, wherein the first interface board (3) is provided with first support columns (5) at four corners, and the first support columns (5) are locked and fixed with the first interface board (3) through first nuts (4).
6. The high-temperature burn-in tester for integrated circuits according to claim 1, wherein the second interface board (8), the third interface board (9), the third connector (11), the fourth connector (12) and the fifth connector (22) are made of high-temperature-resistant materials.
7. an integrated circuit high temperature burn-in test device according to claim 1, characterized in that the second interface board (8) is a multilayer PCB board.
8. The high-temperature aging test device for the integrated circuit according to claim 1, wherein the supporting mechanism is disposed in the high-temperature box (1), the first interface board (3) is disposed on the top of the high-temperature box (1), the second interface board (8) penetrates through the hole (2) on the top of the high-temperature box (1) and penetrates into the high-temperature box (1), one end of the third interface board (9) is embedded into the third connector (11), the other end of the third interface board is embedded into the clip (17), and the two sides of the third interface board are lapped on the wing parts of the embedding support (15) and are kept to be placed in parallel with the horizontal plane; the tail ends of the branches of the high-temperature lead (27) are respectively inserted into the fifth connector (22) in the near direction, and the module to be detected is inserted into the fourth connector (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710768311.6A CN107526025B (en) | 2017-08-31 | 2017-08-31 | High-temperature aging test device for integrated circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710768311.6A CN107526025B (en) | 2017-08-31 | 2017-08-31 | High-temperature aging test device for integrated circuit |
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| Publication Number | Publication Date |
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| CN107526025A CN107526025A (en) | 2017-12-29 |
| CN107526025B true CN107526025B (en) | 2019-12-13 |
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| CN201710768311.6A Active CN107526025B (en) | 2017-08-31 | 2017-08-31 | High-temperature aging test device for integrated circuit |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111123004A (en) * | 2019-12-25 | 2020-05-08 | 广州路派电子科技有限公司 | Burn-in board test system and burn-in board test method for vehicle |
| CN114062907B (en) * | 2022-01-18 | 2022-04-26 | 江山季丰电子科技有限公司 | Chip aging test monitoring method, electronic device and storage medium |
| CN117368702B (en) * | 2023-12-08 | 2024-02-13 | 深圳市英迈通信技术有限公司 | Device and method for detecting heat dissipation performance of mobile phone motherboard |
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| JPH08122243A (en) * | 1994-10-26 | 1996-05-17 | Yokohama Rubber Co Ltd:The | Heat aging testing device |
| CN102539984A (en) * | 2012-01-13 | 2012-07-04 | 深圳市江波龙电子有限公司 | Mass production tester and mass production aging test system |
| CN203965478U (en) * | 2014-07-09 | 2014-11-26 | 深圳市大稳科技有限公司 | The ageing oven of power module shell temperature constant temperature |
| CN204241990U (en) * | 2014-11-17 | 2015-04-01 | 浪潮电子信息产业股份有限公司 | Movable automatic temperature control server aging device |
| CN204807639U (en) * | 2015-06-09 | 2015-11-25 | 苏州韦德韦诺电气科技有限公司 | Simple and easy high temperature aging testing device |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08122243A (en) * | 1994-10-26 | 1996-05-17 | Yokohama Rubber Co Ltd:The | Heat aging testing device |
| CN102539984A (en) * | 2012-01-13 | 2012-07-04 | 深圳市江波龙电子有限公司 | Mass production tester and mass production aging test system |
| CN203965478U (en) * | 2014-07-09 | 2014-11-26 | 深圳市大稳科技有限公司 | The ageing oven of power module shell temperature constant temperature |
| CN204241990U (en) * | 2014-11-17 | 2015-04-01 | 浪潮电子信息产业股份有限公司 | Movable automatic temperature control server aging device |
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Effective date of registration: 20191122 Address after: No. 10, Zijing Road, Pingdi street, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Jiantao Technology Co., Ltd. Address before: Jingxian County Liang Ji Xiang He Gou Cun, Hengshui City, Hebei province 053500 311 Applicant before: Zhao Jing |