CN107525183A - A kind of semiconductor refrigerating heating fan device and elevator applied to elevator - Google Patents
A kind of semiconductor refrigerating heating fan device and elevator applied to elevator Download PDFInfo
- Publication number
- CN107525183A CN107525183A CN201710951939.XA CN201710951939A CN107525183A CN 107525183 A CN107525183 A CN 107525183A CN 201710951939 A CN201710951939 A CN 201710951939A CN 107525183 A CN107525183 A CN 107525183A
- Authority
- CN
- China
- Prior art keywords
- caloriscope
- elevator
- semiconductor
- air
- lift car
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 187
- 238000010438 heat treatment Methods 0.000 title claims abstract description 80
- 238000001816 cooling Methods 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 23
- 238000010792 warming Methods 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 36
- 238000000034 method Methods 0.000 description 20
- 230000001954 sterilising effect Effects 0.000 description 15
- 238000004659 sterilization and disinfection Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000004378 air conditioning Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0003—Exclusively-fluid systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
- B66B11/00—Main component parts of lifts in, or associated with, buildings or other structures
- B66B11/02—Cages, i.e. cars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/20—Casings or covers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Air-Conditioning For Vehicles (AREA)
Abstract
The present invention discloses a kind of semiconductor refrigerating heating fan device and elevator applied to elevator, including crossflow fan and semiconductor cooler, the crossflow fan includes shell and the cross flow fan being fixed in shell, the shell is provided with air inlet and air outlet, the air inlet and air outlet are arranged on the both sides of cross flow fan, the semiconductor cooler includes semiconductor chilling plate, first caloriscope and the second caloriscope, first caloriscope is arranged on crossing current air channel, the crossing current air channel is by the air inlet, air outlet and shell are formed in shell, second caloriscope is arranged at outside shell；The air inlet is towards in elevator, or the air inlet is connected towards in elevator by guide duct；And the air outlet is towards in elevator, or the air outlet is connected towards in elevator by guide duct.The present invention can be directed to the effect that elevator realizes semiconductor refrigerating heating.
Description
Technical field
The present invention relates to elevator technology field, more particularly to a kind of semiconductor refrigerating heating fan device applied to elevator
And elevator.
Background technology
The supply air system that present lift car uses typically uses conventional fan, crossflow fan (also referred to as cross flow fan),
There are individual elevators that common air-conditioning is installed.Conventional fan, crossflow fan do not reach control lift car humiture and other effects, in sweltering heat
Summer and cold winter, seating elevator can be made to become extremely uncomfortable.Lift car installs common air-conditioning, although electricity can be solved
Terraced car temperature problem, but due to：1) limited by lift car space, make the installation of air-conditioning, maintenance extremely difficult；2) by
More in elevator hoistways dust, heat sink of air conditioner is difficult easily to block, and makes air-conditioning is more difficult to reach expected cooling or heating effect；
3) air-conditioning is expensive, and power consumption is big；4) traditional air conditioner carries compressor, and running noises are larger.Because traditional air conditioner is arranged on
Used on elevator, a large amount of water droplets can be produced on the ceiling of car top, influenceed elevator safety and passenger uses, in addition traditional air conditioner
Caused water is also required to uninterrupted inspection and processing, so the scheme of elevator installation common air-conditioning hardly results in popularization, it is also more difficult
Solve the problems, such as that elevator ride is comfortable.
The content of the invention
For overcome the deficiencies in the prior art, the invention provides a kind of semiconductor refrigerating heating fan dress applied to elevator
Put and elevator, the effect that elevator realize semiconductor refrigerating heating can be directed to.
The invention provides a kind of semiconductor refrigerating heating fan device applied to elevator, the semiconductor refrigerating heating
Fan assembly can be fixed on elevator car top or in car, including crossflow fan and semiconductor cooler, the crossing current wind
Machine includes shell and the cross flow fan that is fixed in shell, and the shell is provided with air inlet and air outlet, the air inlet and
Air outlet is arranged on the both sides of cross flow fan, semiconductor cooler described in elevator include semiconductor chilling plate, the first caloriscope and
Second caloriscope, first caloriscope are arranged on crossing current air channel, and the crossing current air channel is by the air inlet, air outlet and outer
Shell is formed in shell, and second caloriscope is arranged at outside shell；The air inlet towards in lift car, or it is described enter
Air port is connected towards in lift car by guide duct；And the air outlet is towards in lift car, or the air outlet by
Guide duct is connected towards in lift car.
Radiator fan is additionally provided with second caloriscope.
The semiconductor cooler is arranged in semiconductor refrigerating heating fan device using integral way, wherein：
The semiconductor cooler is integrally fixed on the housing using embedded mode, and first caloriscope is fixed
On the crossing current air channel, second caloriscope is located at outside the shell.
The semiconductor cooler is arranged in semiconductor refrigerating heating fan device using split mode, wherein：
The body of the semiconductor cooler can be fixed on elevator or on the shell, and first caloriscope includes
Liquid transmits pump and evaporator, is connected between evaporator and liquid the transmission pump by liquid delivery line, the liquid transmission
Pump is located on body, and the evaporator is on the crossing current air channel.
First caloriscope is located on the crossing current air channel of air outlet side, or first caloriscope is located at air inlet
On the crossing current air channel of side.
Collecting box or drainage pipeline are provided with the shell.
Discharge outlet is provided with the collecting box.
When first caloriscope is radiator, second caloriscope is cooler；Or first caloriscope is
During cooler, second caloriscope is radiator.
The semiconductor chilling plate includes the semiconductor chilling plate of one or more.
Accordingly, present invention also offers a kind of elevator, it is any that the elevator includes lift car such as claim 1 to 9
Semiconductor refrigerating heating fan device described in, the air inlet is towards in lift car, or the air inlet is by wind-guiding
Pipe is connected towards in lift car；And the air outlet is towards in lift car, or the air outlet is connected by guide duct
Towards in lift car.
Corresponding semiconductor cooler is provided with semiconductor refrigerating heating fan device in the embodiment of the present invention, is based on
Semiconductor cooler produces heat, and the air circulation of cab interior is realized by cross flow fan, it is achieved thereby that elevator interior
Air cooling or the effect of heating.Because the air outlet and air inlet of whole semiconductor refrigerating heating fan device are all directed towards electricity
In terraced car, the control flow that can be realized under the work of cross flow fan inside lift car is imported and exported, in semiconductor system
When cooler works, air can realize cold or hot effect under heat effect caused by semiconductor cooler in whole elevator,
Entering in whole elevator, so as to realize the cold or hot effect of air in whole lift space.Using this semiconductor
Refrigerator, cold and hot control by multiple semiconductor chilling plates on semiconductor cooler complete cold-thermal effect, in the absence of compressor,
Also without equipment such as refrigerants, and whole equipment is also convenient for installation on the elevator car, and whole power consumption is also more much smaller than air-conditioning,
Influence of noise caused by compressor-free.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is that the semiconductor refrigerating heating fan device first embodiment structure applied to lift car in the present invention is shown
It is intended to；
Fig. 2 is that the semiconductor refrigerating heating fan device second embodiment structure applied to lift car in the present invention is shown
It is intended to；
Fig. 3 is that the semiconductor refrigerating heating fan device 3rd embodiment structure applied to lift car in the present invention is shown
It is intended to；
Fig. 4 is that the semiconductor refrigerating heating fan device fourth embodiment structure applied to lift car in the present invention is shown
It is intended to；
Fig. 5 is the elevator car roof structural representation in the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained all other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Semiconductor refrigerating heating fan device applied to elevator involved in the present invention, this semiconductor refrigerating heat wind
Fan device can be fixed on elevator car top or in car, including crossflow fan and semiconductor cooler, the crossflow fan
Including shell and the cross flow fan being fixed in shell, the shell is provided with air inlet and air outlet, the air inlet and air outlet
The both sides of cross flow fan are arranged on, the semiconductor cooler includes semiconductor chilling plate, the first caloriscope and the second caloriscope, institute
The first caloriscope to be stated to be arranged on crossing current air channel, the crossing current air channel is formed by the air inlet, air outlet and shell in shell,
Second caloriscope is arranged at outside shell.
In specific implementation process, air inlet and air outlet here directly can be set towards in lift car, here
Air inlet, air outlet can also be realized by guide duct, for example be connected on air inlet in guide duct access lift car, in air-out
Connected on mouth in guide duct access lift car.
It should be noted that air inlet and air outlet here is accessed in lift car, it is and the air in lift car
The air circulation that can be formed in lift car.
In specific implementation process, the semiconductor cooler is integrally fixed on semiconductor refrigerating heating wind using embedded mode
On the shell of fan device；Or the semiconductor cooler is arranged in semiconductor refrigerating heating fan device using split mode.
In specific implementation process, first caloriscope and the second caloriscope realize that cooling and warming exchanges according to control system,
When the first caloriscope is radiator, the second caloriscope is cooler；Or when the first caloriscope is cooler, the second heat
Device is radiator.The semiconductor chilling plate includes the semiconductor chilling plate of one or more.
Specifically, Fig. 1 shows that the semiconductor refrigerating heating fan applied to lift car in the embodiment of the present invention fills
First embodiment structural representation is put, it is cross-sectional view, is specifically included：Lift car (10), crossflow fan (11)
With semiconductor cooler (12), the crossflow fan (11) includes shell (111) and the cross flow fan (112) being fixed in shell.
With reference to lift car (10) practical application scene, semiconductor refrigerating heating fan device is fixed at the top of lift car (10) the most
It is good, it can also be fixed on the top of lift car (10), detailed description below this structure particular content.
Crossflow fan (11) includes：Air inlet (113), air outlet (118), cross flow fan (112) and shell (111), enter
Air port (113) and air outlet (118) may be provided at the both sides of cross flow fan (112), air inlet (113) and air outlet (118) court
In to lift car (10), crossflow fan (11), can be by the sky in lift car (10) under the work of cross flow fan (112)
Gas is entered by air inlet (113), then promotes the air of circulation to go out via crossing current air channel (114) to air outlet (118).Here horizontal stroke
Stream air channel (114) is formed by air inlet (113), air outlet (118) and shell in shell, based on crossflow fan (11) realization pair
Elevator car structure inner air circulation principle designs.
It should be noted that crossflow fan (11) typically comes with motor (not shown), this motor can drive crossing current wind
The rotation of (112) is fanned, so as to promote the air in lift car (10) to realize circulation.Certainly, it is also not necessarily limited to motor drive mode
To realize the rotation to cross flow fan (112).
Semiconductor chilling plate is the instrument of a heat transfer, i.e., when one piece of N-type semiconductor material and one block of P-type semiconductor material
Expect the thermocouple centering that is coupled to have electric current by when, heat transfer will be produced between both ends, heat will shift from one end
To the other end, hot and cold side is formed so as to produce the temperature difference.But semiconductor itself resistance be present will when electric current passes through semiconductor
Heat is produced, so as to which heat transfer can be influenceed.And the heat between two pole plates can also pass through air and semi-conducting material itself
Carry out reverse heat transfer.When hot and cold side reaches certain temperature difference, when the amount of both heat transfers is equal, a balance will be reached
Point, just reverse heat transfer are cancelled out each other.Now the temperature of hot and cold side would not continue to change.In order to reach lower temperature
Degree, the modes such as radiating can be taken to reduce the temperature in hot junction to realize.It is cooling piece that the effect of fan and fin, which is mainly,
Hot-side heat dissipation.Between the temperature difference of usual semiconductor chilling plate hot and cold side can reach 40~65 degree, if passing through active heat removal
Mode reduce hot-side temperature, that cold junction temperature can also decline accordingly, so as to reach lower temperature.When one piece of N-type half
When conductor material and one piece of p-type semiconductor material are coupled to galvanic couple pair, after connecting DC current in this circuit, it can just produce
The transfer of energy, the joint that electric current is flowed to p-type element by N-type element absorb heat, turn into cold end；N-type member is flowed to by p-type element
The joint release heat of part, turns into hot junction.The size of heat absorption and heat release is the size and semi-conducting material N, P by electric current
Element logarithm determines.
Semiconductor cooler (12) includes：First caloriscope (123), the second caloriscope (121) and semiconductor chilling plate
(122), according to the cooling and warming operation principle of semiconductor cooler, when one end is heating end, the other end must be refrigeration end.So
During corresponding to cooling and warming effect：When first caloriscope is radiator, second caloriscope is cooler；Or first caloriscope
For cooler when, second caloriscope is radiator.
Whole semiconductor chilling plate (122) is located among the first caloriscope (123) and the second caloriscope (121), semiconductor
Cooling piece (122), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (123) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (121), that is, need real to lift car (10)
When now cooling, then the first caloriscope (123) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (122)
Amount comes out, the air on cooling crossing current air channel (114), so as to realize that the air in lift car (10) cools down, while the
Two caloriscopes (121) are used as hot-side heat dissipation device, and hot junction heat caused by semiconductor chilling plate (122) is come out, with full
Sufficient semiconductor chilling plate (122) continuous firing；When needing to realize heating to lift car (10), then the first caloriscope
(123) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (122) is come out, heating crossing current air channel
(114) air on, so as to realize that the air in lift car (10) heats, while the second caloriscope (121) dissipates as cold end
Hot device, cold end heat caused by semiconductor chilling plate (122) is come out, to meet that semiconductor chilling plate (122) continues
Work.In whole energy transfer process, because the operation principle of semiconductor chilling plate (122) can realize hot junction heat, then
Hot junction heat is transferred out by hot junction heat by the hot-side heat dissipation device supported, cold end heat is by the cold end radiator supported
Cold end hot junction is transferred out.
It should be noted that the first caloriscope (123), the second caloriscope (121) on semiconductor cooler (12), by electricity
Terraced car (10) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are that the cold-thermal effect in lift car can be achieved.
In specific implementation process, the first caloriscope (123) is directly acted on crossing current air channel (114), so as to cool down or add
Moving air on heat crossing current air channel (114), the moving air is formed when being worked by crossflow fan (11), by crossflow fan
(11) in the presence of the cross flow fan (112) and the first caloriscope (123) in, the air stream in lift car (10) can be promoted
It is logical, and accelerate heated or be cooled.Second caloriscope (121) acts on the outside of crossflow fan (115), in order to promote the second heat
Measuring device (121) carries out energy exchange, and radiator fan (124) is additionally provided with the second caloriscope (121).Here the first caloriscope
(123) and the second caloriscope (121) is generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, can be quickly from half
Energy is obtained on conductor cooling piece (12), and energy conduction is gone out, ensures energy thermal source not on semiconductor chilling plate (12)
Accumulation, but (lift car or exterior space) is transferred in corresponding space.Radiator fan (124) can accelerate second
Energy conduction on caloriscope (121), and cross flow fan (112) can also promote the energy conduction on the first caloriscope (123).
Semiconductor cooler (12) shown in Fig. 1 is arranged on semiconductor refrigerating heating fan device using integral way
In, i.e., semiconductor cooler (12) is fixed on the shell (111) of crossflow fan (11) using embedded mode, the first caloriscope
(123) it is fixed on crossing current air channel (114), the second caloriscope (121) is located at shell (111) outside, with reference to crossflow fan (11)
Mode of operation, under controlled effect, only one end thermal source carries out heat conduction, other end heat to the air in lift car (10)
Source is directly discharged to lift car (10) exterior space, so as to realize the air heats in lift car (10) or be cooled.This
Air of the semiconductor cooler (12) by one end Source in lift car (10) in invention, it is achieved thereby that elevator car
Railway carriage or compartment (10) interior air being cooled or being heated.
The semiconductor cooler (12) is arranged on the crossing current air channel (114) of air outlet (118) side, relative to partly leading
Corresponding collecting box (116) is additionally provided with below chiller (12), is had between the collecting box (116) and air outlet (118)
Water proof catch, avoid ponding from entering lift car (10), and also there is discharge outlet (117) on corresponding collecting box (116), should
Discharge outlet (117) can discharge ponding in time.In specific implementation process, collecting box is set in shell with the exception that, can also
Corresponding drainage pipeline is set, in time discharged ponding.Certainly, ponding here, can also also without disposable drained
Reserve corresponding water and realize humidification function for semiconductor refrigerating heating fan device.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (12)
(122) quantity in semiconductor chilling plate (122) actually, is opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, and its integrally cooling heating effect can be than faster realizing.The semiconductor
The multiple semiconductor chilling plates (122) arranged in a certain order are provided with refrigerator (12), it can be along crossing current air channel (114)
Wind direction be arranged in order multiple semiconductor chilling plates (122), according to this sequential arrangement, based on crossing current air channel (114) circulation
Air can be cooled or be heated with continuation.
In specific implementation process, air sterilization device (115) is additionally provided with the semiconductor refrigerating heating fan device, should
For air sterilization device (115) on crossing current air channel (114), the air sterilization device (115) can be ultraviolet sterilization, also may be used
To be ozone sterilization etc..
Specifically, Fig. 2 shows that the semiconductor refrigerating heating fan applied to lift car in the embodiment of the present invention fills
Second embodiment structural representation is put, it is cross-sectional view, is specifically included：Lift car (20), crossflow fan (21)
With semiconductor cooler (22), the crossflow fan (21) includes shell (211) and the cross flow fan (212) being fixed in shell.
With reference to lift car (20) practical application scene, semiconductor refrigerating heating fan device is fixed at the top of lift car (20) the most
It is good, detailed description below this structure particular content.
Crossflow fan (21) includes：Air inlet (213), air outlet (218), cross flow fan (212) and shell (211), enter
Air port (213) and air outlet (218) may be provided at the both sides of cross flow fan (212), air inlet (213) and air outlet (218) court
In to lift car (20), crossflow fan (21), can be by the sky in lift car (20) under the work of cross flow fan (212)
Gas is entered by air inlet (213), then promotes the air of circulation to go out via crossing current air channel (214) to air outlet (218).Here horizontal stroke
Stream air channel (214) is formed by air inlet (213), air outlet (218) and shell in shell, based on crossflow fan (21) realization pair
Elevator structure inner air circulation principle designs.
It should be noted that crossflow fan (21) typically comes with motor (not shown), this motor can drive crossing current wind
The rotation of (212) is fanned, so as to promote the air in lift car (20) to realize circulation.Certainly, it is also not necessarily limited to motor drive mode
To realize the rotation to cross flow fan (212).
Semiconductor cooler (22) includes：First caloriscope (223), the second caloriscope (221) and semiconductor chilling plate
(222), according to the cooling and warming operation principle of semiconductor cooler, when one end is heating end, the other end must be refrigeration end.So
During corresponding to cooling and warming effect：When first caloriscope is radiator, second caloriscope is cooler；Or first caloriscope
For cooler when, second caloriscope is radiator.
Whole semiconductor chilling plate (222) is located among the first caloriscope (223) and the second caloriscope (221), semiconductor
Cooling piece (222), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (223) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (221), that is, need real to lift car (20)
When now cooling, then the first caloriscope (223) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (222)
Amount comes out, the air on cooling crossing current air channel (214), so as to realize that the air in lift car (20) cools down, while the
Two caloriscopes (221) are used as hot-side heat dissipation device, and hot junction heat caused by semiconductor chilling plate (222) is come out, with full
Sufficient semiconductor chilling plate (222) continuous firing；When needing to realize heating to lift car (20), then the first caloriscope
(223) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (222) is come out, heating crossing current air channel
(214) air on, so as to realize that the air in lift car (20) heats, while the second caloriscope (221) dissipates as cold end
Hot device, cold end heat caused by semiconductor chilling plate (222) is come out, to meet that semiconductor chilling plate (222) continues
Work.In whole energy transfer process, because the operation principle of semiconductor chilling plate (222) can realize hot junction heat, then
Hot junction heat is transferred out by hot junction heat by the hot-side heat dissipation device supported, cold end heat is by the cold end radiator supported
Cold end hot junction is transferred out.
It should be noted that the first caloriscope (223), the second caloriscope (221) on semiconductor cooler (22), by electricity
Terraced car (20) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are that the cold-thermal effect in lift car can be achieved.
In specific implementation process, the first caloriscope (223) is directly acted on crossing current air channel (214), so as to cool down or add
Moving air on heat crossing current air channel (214), the moving air is formed when being worked by crossflow fan (21), by crossflow fan
(21) in the presence of the cross flow fan (212) and the first caloriscope (223) in, the air stream in lift car (20) can be promoted
It is logical, and accelerate heated or be cooled.Second caloriscope (221) acts on the outside of crossflow fan (215), in order to promote the second heat
Measuring device (221) carries out energy exchange, and radiator fan (224) is additionally provided with the second caloriscope (221).Here the first caloriscope
(223) and the second caloriscope (221) is generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, can be quickly from half
Energy is obtained on conductor cooling piece (22), and energy conduction is gone out, ensures energy thermal source not on semiconductor chilling plate (22)
Accumulation, but (lift car or exterior space) is transferred in corresponding space.Radiator fan (224) can accelerate second
Energy conduction on caloriscope (221), and cross flow fan (212) can also promote the energy conduction on the first caloriscope (223).
Semiconductor cooler (22) shown in Fig. 2 is arranged on semiconductor refrigerating heating fan device using integral way
In, i.e., semiconductor cooler (22) is fixed on the shell (211) of crossflow fan (21) using embedded mode, the first caloriscope
(223) it is fixed on crossing current air channel (214), the second caloriscope (221) is located at shell (211) outside, with reference to crossflow fan (21)
Mode of operation, under controlled effect, only one end thermal source carries out heat conduction, other end heat to the air in lift car (20)
Source is directly discharged to lift car (20) exterior space, so as to realize the air heats in lift car (20) or be cooled.This
Air of the semiconductor cooler (12) by one end Source in lift car (20) in invention, it is achieved thereby that elevator car
Railway carriage or compartment (20) interior air being cooled or being heated.
The semiconductor cooler (22) is arranged on the crossing current air channel (214) of air inlet (213) side, relative to partly leading
Corresponding collecting box (216) is additionally provided with below chiller (22), is had between the collecting box (216) and air inlet (213)
Water proof catch, avoid ponding from entering lift car (20), and also there is discharge outlet (217) on corresponding collecting box (216), should
Discharge outlet (217) can discharge ponding in time.In specific implementation process, collecting box is set in shell with the exception that, can also
Corresponding drainage pipeline is set, in time discharged ponding.Certainly, ponding here, can also also without disposable drained
Reserve corresponding water and realize humidification function for semiconductor refrigerating heating fan device.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (22)
(222) quantity in semiconductor chilling plate (222) actually, is opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, and its integrally cooling heating effect can be than faster realizing.The semiconductor
The multiple semiconductor chilling plates (222) arranged in a certain order are provided with refrigerator (22), it can be along crossing current air channel (214)
Wind direction be arranged in order multiple semiconductor chilling plates (222), according to this sequential arrangement, based on crossing current air channel (214) circulation
Air can be cooled or be heated with continuation.
In specific implementation process, air sterilization device (215) is additionally provided with the semiconductor refrigerating heating fan device, should
For air sterilization device (215) on crossing current air channel (214), the air sterilization device (215) can be ultraviolet sterilization, also may be used
To be ozone sterilization etc..
The semiconductor cooler in semiconductor refrigerating heating fan device shown in Fig. 1 and Fig. 2 is overall with embedded mode
In semiconductor refrigerating heating fan device, the cold end of semiconductor cooler or hot-side heat dissipation device are placed in crossing current air channel
On, other end radiator is placed in outside crossflow fan, and the radiator for being placed in crossing current air channel can be complete machine installation by adhering to partly
In the shell of conductor cooling and warming fan assembly or split type pattern is installed in the shell of distinguished and admirable fan assembly, only
Need to be fixed on the radiator on the crossing current air channel of semiconductor refrigerating heating fan device, play cooling and warming effect,
Therefore it be able to can also be positioned adjacent on the distinguished and admirable air channel of air outlet on the crossing current air channel of air inlet is positioned adjacent to.
Fig. 3 and Fig. 4 illustrate by taking split installation as an example, and its concrete application principle is similar with Fig. 1 and Fig. 2.
Fig. 3 shows that the semiconductor refrigerating heating fan device the 3rd applied to lift car in the embodiment of the present invention is real
A structural representation is applied, it is cross-sectional view, is specifically included：Lift car (30), crossflow fan (31) and semiconductor
Refrigerator (32), the structure of the crossflow fan (31) no longer repeat one by one, see the technology description described in Fig. 1 and Fig. 2.
Semiconductor cooler (32) in the embodiment is provided with body and split, and body is independently installed in crossflow fan (31)
Outside, it can be fixed on lift car (30), can also be fixed on crossflow fan (31) shell, and split is then positioned at crossing current
On crossing current air channel in blower fan (31).
The semiconductor cooler (32) includes：First caloriscope (323), the second caloriscope (321) and semiconductor chilling plate
(322), liquid transmission pump (327) and evaporator (325), passed between evaporator (325) and liquid transmission pump (327) by liquid
Pipe (326) is sent to connect, liquid transmission pump is located on the first caloriscope (323) of body, and the evaporator (325) is positioned at crossing current wind
On road.
Whole semiconductor chilling plate (322) is located among the first caloriscope (323) and the second caloriscope (321), semiconductor
Cooling piece (322), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (323) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (321), that is, need real to lift car (30)
When now cooling, then the first caloriscope (323) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (322)
Amount comes out, and the liquid (i.e. coolant) that liquid transmission pump (327) is stored in the first caloriscope of cooling (323), liquid passes
Send the coolant of pump (327) driving storage to be moved to evaporator (325), heat is distributed in air channel of flowing over by evaporator (325)
Amount, cooling flow through the air in crossing current air channel, so as to realize that the air in lift car (30) cools down, while the second caloriscope
(321) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (322) is come out, to meet semiconductor
Cooling piece (322) continuous firing；When needing to realize heating to lift car (30), then the first caloriscope (323) is as warm
Radiator is held, hot junction heat caused by semiconductor chilling plate (322) is come out, liquid in the first caloriscope of heating (323)
The liquid (i.e. heat but liquid) that body transmission pump (327) is stored, the hot but liquid of liquid transmission pump (327) driving storage is to evaporator
(325) move, heat is distributed in air channel of flowing over by evaporator (325), heating flows through the air in crossing current air channel, so as to realize
Air heating in lift car (30), while the second caloriscope (321) is used as cold end radiator, by semiconductor chilling plate
(322) cold end heat comes out caused by, to meet semiconductor chilling plate (322) continuous firing.In whole energy transfer
During, because the operation principle of semiconductor chilling plate (322) can realize hot junction heat, then hot junction heat is by the warm supported
Hot junction heat is transferred out by end radiator, and cold end hot junction is transferred out of by cold end heat by the cold end radiator supported
Go.
It should be noted that the first caloriscope (223), the second caloriscope (321) on semiconductor cooler (32), by electricity
Terraced car (20) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are that the cold-thermal effect in lift car can be achieved.
In specific implementation process, this split type semiconductor cooler is by the first caloriscope (323) indirectly-acting in crossing current
On air channel (314), it needs to be combined with realization energy by liquid transmission pump (327), evaporator (325) and liquid delivery line (326)
Amount conduction, so as to cool down or heat the moving air on crossing current air channel, the moving air is by crossflow fan (31) work when institute's shape
Into in the presence of the cross flow fan in crossflow fan (31) and the first caloriscope (323), can promoting in lift car (30)
Air circulation, and accelerate heated or be cooled.Radiator fan (324) is additionally provided with the second caloriscope (321).Here
One caloriscope (323) and the second caloriscope (321) are generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, energy
Energy quickly is obtained from semiconductor chilling plate (32), and energy conduction is gone out, ensures energy thermal source not in semiconductor refrigerating
Piece gathers on (322), but is transferred in corresponding space (lift car or exterior space).Radiator fan (324) can
To accelerate the energy conduction on the second caloriscope (321), and cross flow fan (312) can also promote on the first caloriscope (323)
Energy conduction.
Semiconductor cooler (22) split can be arranged on the crossing current air channel of air inlet side, relative to semiconductor
Refrigerator is additionally provided with corresponding collecting box below (32), has water proof catch between the collecting box and air inlet, avoids ponding
Lift car (30) is entered, and also there is discharge outlet on corresponding collecting box, the discharge outlet can discharge ponding in time.
In specific implementation process, collecting box is set in shell with the exception that, corresponding drainage pipeline can also be set, in time discharge ponding
Go.Certainly, ponding here can also reserve corresponding water for semiconductor refrigerating heating fan dress also without disposable drained
Put and realize humidification function.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (32)
(322) quantity in semiconductor chilling plate (322) actually, is opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, and its integrally cooling heating effect can be than faster realizing.
In specific implementation process, air sterilization device is additionally provided with the semiconductor refrigerating heating fan device, the air
For sterilizing unit on crossing current air channel, the air sterilization device can be ultraviolet sterilization or ozone sterilization etc..
Fig. 4 shows that the semiconductor refrigerating heating fan device the 4th applied to lift car in the embodiment of the present invention is real
A structural representation is applied, it is cross-sectional view, is specifically included：Lift car (40), crossflow fan (41) and semiconductor
Refrigerator (42), the structure of the crossflow fan (41) no longer repeat one by one, see the technology description described in Fig. 1 and Fig. 2.
Semiconductor cooler (42) in the embodiment is provided with body and split, in its specific body, Split type structure and Fig. 3
It is identical, except that, the Split type structure is located on the crossing current air channel of the air inlet side of crossflow fan (41), and Fig. 3 point
Body structure is located on the cross-flow passes of the air outlet side of crossflow fan (31), no longer repeat one by one here whole implementation process and
Principle, in detail refering to the content shown in Fig. 1 to Fig. 3.
In the split installation shown in Fig. 3 and Fig. 4, liquid delivery line can penetrate shell and is connected with evaporator, this reality
The crossing current air channel that crossflow fan in example internally forms a sealing based on shell is applied, avoids flow over air channel and the sky of non-lift car
Gas swaps.
Semiconductor refrigerating heating fan device may be mounted at forward and backward, left in lift car involved by the embodiment of the present invention
, can also be using furred ceiling by the way of installed in the space of elevator car roof, or installed in elevator car with either party right position
On top outside railway carriage or compartment.Lift car inner top, side wall surrounding, bottom etc. are fixed on according to lift car form, ensure semiconductor system
Cold heating fan device can be specifically used, and air inlet, the air outlet of this cross flow fan are embedded into elevator structure, is partly leading
Blower fan in the cold heating fan device of system promotees under wind circulation, can promote the air in lift car by semiconductor cooler
Effect, complete the heated or effect that is cooled, improve the comfort level of air in lift car space.
The semiconductor refrigerating heating fan device may be mounted in elevator car either party position of forward and backward, left and right；The wind
Mouthful and the shape of air outlet include but is not limited to flute profile, square or circular；Formed on the lift car by several air inlet/outlets
Mouthful, separated with semiconductor refrigerating heating fan device, the air inlet and air outlet realize that multiple inlet and outlets connect by guide duct
Connect.The shape of air inlet and air outlet can be with the semiconductor that flows over including but not limited to flute profile, square or circular, inlet and outlet
Refrigerating and heating combined equipment separates, and realizes that multiple inlet and outlets connect by guide duct.Fig. 5 shows the elevator in the embodiment of the present invention
Top structure for elevator car schematic diagram, it is provided with elevator cage door 51 and several inlet and outlets 52, semiconductor refrigerating heating fan dress
Air inlet in putting can select several inlet and outlets 52 to be used as air intake passage by several guide ducts, the semiconductor refrigerating system
Air outlet in cold wind fan device can select several inlet and outlets 52 to be used as exit passageway by several guide ducts.
To sum up, the embodiment of the present invention is provided with corresponding semiconductor cooler on semiconductor refrigerating heating fan device,
Heat is produced based on semiconductor cooler, the air circulation of cab interior is realized by cross flow fan, it is achieved thereby that in elevator
The air cooling in portion or the effect of heating.Because the air outlet and air inlet of whole semiconductor refrigerating heating fan device are all courts
Into lift car, the control flow that can be realized under the work of cross flow fan inside lift car is imported and exported, is partly being led
When chiller works, in whole lift car air can under heat effect caused by semiconductor cooler, realize it is cold or
The effect of heat, is being entered in whole lift car, so as to realize the cold or hot effect of air in whole lift car space
Should.Using this semiconductor cooler, cold and hot control is cold and hot to complete by multiple semiconductor chilling plates on semiconductor cooler
Effect, in the absence of compressor, there is no the equipment such as refrigerant, and whole equipment is also convenient for installation on the elevator car, overall consumption yet
Electricity is also more much smaller than air-conditioning, influence of noise caused by compressor-free.
The semiconductor refrigerating heating fan device and elevator applied to elevator provided above the embodiment of the present invention enters
Go and be discussed in detail, specific case used herein is set forth to the principle and embodiment of the present invention, and the above is implemented
The explanation of example is only intended to help the method and its core concept for understanding the present invention；Meanwhile for the general technology people of this area
Member, according to the thought of the present invention, there will be changes in specific embodiments and applications, in summary, this explanation
Book content should not be construed as limiting the invention.
One of ordinary skill in the art will appreciate that all or part of step in the various methods of above-described embodiment is can
To instruct the hardware of correlation to complete by program, the program can be stored in a computer-readable recording medium, storage
Medium can include：Read-only storage (ROM, Read Only Memory), random access memory (RAM, Random
Access Memory), disk or CD etc..
Claims (10)
1. a kind of semiconductor refrigerating heating fan device applied to elevator, it is characterised in that the semiconductor refrigerating heats wind
Fan device can be fixed on elevator car top or in car, including crossflow fan and semiconductor cooler, the crossflow fan
Including shell and the cross flow fan that is fixed in shell, the shell is provided with air inlet and air outlet, the air inlet and goes out
Air port is arranged on the both sides of cross flow fan, and semiconductor cooler described in elevator includes semiconductor chilling plate, the first caloriscope and the
Two caloriscopes, first caloriscope are arranged on crossing current air channel, and the crossing current air channel is by the air inlet, air outlet and shell
Formed in shell, second caloriscope is arranged at outside shell；The air inlet is towards in lift car, or the air intake
Mouth is connected towards in lift car by guide duct；And the air outlet is towards in lift car, or the air outlet is by leading
Airduct is connected towards in lift car.
2. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described second
Radiator fan is additionally provided with caloriscope.
3. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
Chiller is arranged in semiconductor refrigerating heating fan device using integral way, wherein：The semiconductor cooler is overall
Fixed on the housing using embedded mode, first caloriscope is fixed on the crossing current air channel, second heat
Measuring device is located at outside the shell；
Or the semiconductor cooler is arranged in semiconductor refrigerating heating fan device using split mode, wherein：It is described
The body of semiconductor cooler can be fixed on elevator or on the shell, first caloriscope include liquid transmission pump and
Evaporator, the evaporator and liquid are connected between transmitting pump by liquid delivery line, and the liquid transmission pump is located on body,
The evaporator is on the crossing current air channel.
4. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
The cold heating fan device of system is arranged on either party position of forward and backward, left and right in elevator car；The shape of institute's air inlet and air outlet
Including：It is flute profile, square or circular；Formed on the lift car by several inlet and outlets, wind is heated with semiconductor refrigerating
Fan device separates, and the air inlet realizes that multiple inlet and outlets connect with air outlet by guide duct.
5. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described first
Caloriscope is located on the crossing current air channel of air outlet side, or first caloriscope is located at the crossing current air channel of air inlet side
On.
6. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that the shell
Inside it is provided with collecting box or drainage pipeline.
7. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 6, it is characterised in that described to catchment
Discharge outlet is provided with box.
8. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described first
Caloriscope and second caloriscope realize that cooling and warming exchanges according to control system, when first caloriscope is radiator,
Second caloriscope is cooler；Or first caloriscope, when being cooler, second caloriscope is radiator.
9. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
The multiple semiconductor chilling plates arranged in a certain order are provided with chiller.
10. a kind of elevator, it is characterised in that the elevator includes lift car partly leading as described in any one of claim 1 to 9
The cold heating fan device of system, the air inlet is towards in lift car, or the air inlet is connected towards electricity by guide duct
In terraced car；And the air outlet is towards in lift car, or the air outlet is connected towards lift car by guide duct
It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710951939.XA CN107525183A (en) | 2017-10-13 | 2017-10-13 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710951939.XA CN107525183A (en) | 2017-10-13 | 2017-10-13 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107525183A true CN107525183A (en) | 2017-12-29 |
Family
ID=60684707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710951939.XA Pending CN107525183A (en) | 2017-10-13 | 2017-10-13 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107525183A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108869367A (en) * | 2018-09-21 | 2018-11-23 | 重庆迈高电梯有限公司 | A kind of lift car automatic ventilation fan and its control method |
| CN110319496A (en) * | 2019-05-09 | 2019-10-11 | 广东工业大学 | A kind of semiconductor refrigerating Elevator cage air conditioner system |
| CN110836427A (en) * | 2019-12-12 | 2020-02-25 | 华南理工大学广州学院 | Elevator air conditioner adopting semiconductor refrigeration technology |
| CN110925919A (en) * | 2019-12-12 | 2020-03-27 | 华南理工大学广州学院 | Working method of elevator air conditioner capable of optimizing air quality |
| CN112897289A (en) * | 2021-01-18 | 2021-06-04 | 杨斌 | Inside air purification epidemic prevention system of public place elevator |
| CN114857692A (en) * | 2022-05-13 | 2022-08-05 | 浙江丹森智能家居科技有限公司 | Household elevator air conditioning system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2106318U (en) * | 1991-09-29 | 1992-06-03 | 顾立楠 | Semi-conductor cold and hot air conditioner for lift |
| KR20030063595A (en) * | 2002-01-23 | 2003-07-31 | 보텍스 세마이콘덕터 | air conditioning system of elevator using the thermoelectric module |
| CN201100717Y (en) * | 2007-09-05 | 2008-08-13 | 郭自刚 | Air adjusting device for lifter box |
| CN201522049U (en) * | 2009-11-04 | 2010-07-07 | 李孝龙 | Minitype air-conditioner |
| CN102121734A (en) * | 2009-11-04 | 2011-07-13 | 合肥博普高新科技有限公司 | Small energy-saving environment-friendly refrigerating air conditioner |
| CN203478686U (en) * | 2013-10-13 | 2014-03-12 | 上海炯歌电子科技有限公司 | Cold and hot all-in-one machine based on semiconductor refrigeration and heating technology |
| CN207299347U (en) * | 2017-10-13 | 2018-05-01 | 广东寰宇电子科技股份有限公司 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
-
2017
- 2017-10-13 CN CN201710951939.XA patent/CN107525183A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2106318U (en) * | 1991-09-29 | 1992-06-03 | 顾立楠 | Semi-conductor cold and hot air conditioner for lift |
| KR20030063595A (en) * | 2002-01-23 | 2003-07-31 | 보텍스 세마이콘덕터 | air conditioning system of elevator using the thermoelectric module |
| CN201100717Y (en) * | 2007-09-05 | 2008-08-13 | 郭自刚 | Air adjusting device for lifter box |
| CN201522049U (en) * | 2009-11-04 | 2010-07-07 | 李孝龙 | Minitype air-conditioner |
| CN102121734A (en) * | 2009-11-04 | 2011-07-13 | 合肥博普高新科技有限公司 | Small energy-saving environment-friendly refrigerating air conditioner |
| CN203478686U (en) * | 2013-10-13 | 2014-03-12 | 上海炯歌电子科技有限公司 | Cold and hot all-in-one machine based on semiconductor refrigeration and heating technology |
| CN207299347U (en) * | 2017-10-13 | 2018-05-01 | 广东寰宇电子科技股份有限公司 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
Non-Patent Citations (1)
| Title |
|---|
| 北京农业工程大学: "《农业机械学 下 第2版》", vol. 2, 30 November 1996, 北京：中国农业出版社, pages: 317 - 319 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108869367A (en) * | 2018-09-21 | 2018-11-23 | 重庆迈高电梯有限公司 | A kind of lift car automatic ventilation fan and its control method |
| CN110319496A (en) * | 2019-05-09 | 2019-10-11 | 广东工业大学 | A kind of semiconductor refrigerating Elevator cage air conditioner system |
| CN110319496B (en) * | 2019-05-09 | 2024-07-09 | 广东工业大学 | Semiconductor refrigeration elevator car air conditioning system |
| CN110836427A (en) * | 2019-12-12 | 2020-02-25 | 华南理工大学广州学院 | Elevator air conditioner adopting semiconductor refrigeration technology |
| CN110925919A (en) * | 2019-12-12 | 2020-03-27 | 华南理工大学广州学院 | Working method of elevator air conditioner capable of optimizing air quality |
| CN110925919B (en) * | 2019-12-12 | 2022-02-08 | 华南理工大学广州学院 | Working method of elevator air conditioner capable of optimizing air quality |
| CN110836427B (en) * | 2019-12-12 | 2024-06-11 | 华南理工大学广州学院 | Elevator air conditioner adopting semiconductor refrigeration technology |
| CN112897289A (en) * | 2021-01-18 | 2021-06-04 | 杨斌 | Inside air purification epidemic prevention system of public place elevator |
| CN112897289B (en) * | 2021-01-18 | 2022-06-24 | 珠江富士电梯（中国）有限公司 | Inside air purification epidemic prevention system of public place elevator |
| CN114857692A (en) * | 2022-05-13 | 2022-08-05 | 浙江丹森智能家居科技有限公司 | Household elevator air conditioning system |
| CN114857692B (en) * | 2022-05-13 | 2024-02-27 | 浙江丹森智能家居科技有限公司 | Household elevator air conditioning system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107525183A (en) | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator | |
| CN107720498A (en) | One kind realizes temperature controlled method and elevator device in lift car | |
| CN104837657B (en) | Heat exchanger and the heat pump using the heat exchanger | |
| KR101189417B1 (en) | Temperature Control Apparatus for Vehicle | |
| CN101223837B (en) | Air conditioning system for communication equipment | |
| KR101367212B1 (en) | Electric vehicle hvac and battery temperature management system using the self heating plate heat exchanger and its operating method | |
| CN109455059B (en) | Heat pump air conditioner and heat management system integrating water-cooled condenser and water-cooled evaporator | |
| CN102442174A (en) | Cooling and heating device for electric vehicle | |
| CN107631514A (en) | Air conditioning system | |
| KR20120100776A (en) | Vehicle air conditioner | |
| US11441789B2 (en) | Convection/radiation air conditioning terminal and air conditioning system | |
| CN207299229U (en) | A kind of double condensation double mode energy storage type mobile air conditioners | |
| RU2531659C2 (en) | Set composed by wall and electrical device and appropriate railway car | |
| CN207299347U (en) | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator | |
| CN204548131U (en) | The a/c system of guideway vehicle | |
| CN103762397A (en) | Battery cooling and heating device for electric automobile | |
| CN207515060U (en) | A kind of distribution Fresh air handing unit | |
| CN101122412B (en) | Air conditioner for elevator | |
| CN207688466U (en) | A kind of heat exchanger and air-conditioning system | |
| CN113566297B (en) | Air conditioner indoor unit and control method thereof | |
| CN205942594U (en) | Novel computer cooling device | |
| CN206420198U (en) | A kind of air conditioner condensation and motor low temperature radiation heat exchanger | |
| JP2007238065A (en) | Roof heat insulation system and method for automobile or the like | |
| CN205227904U (en) | Collect air source heat pump and fresh air processing just need not defrosting in an organic whole device | |
| CN109159637A (en) | Vehicle-mounted refrigeration semiconductor blower system and its control method, vehicle-mounted refrigeration semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |