CN107520541A - The method of cutting brittle materials by laser - Google Patents
The method of cutting brittle materials by laser Download PDFInfo
- Publication number
- CN107520541A CN107520541A CN201610446933.2A CN201610446933A CN107520541A CN 107520541 A CN107520541 A CN 107520541A CN 201610446933 A CN201610446933 A CN 201610446933A CN 107520541 A CN107520541 A CN 107520541A
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- Prior art keywords
- laser
- cut
- fragile material
- cutting
- thermal laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a kind of method of cutting brittle materials by laser, belong to field of laser processing.Laser cutting method comprises the following steps：Thermal laser illumination bands cutting brittle material is utilized along cutting path so that fragile material to be cut is formed respectively positioned at the first area of cutting path opposite sides and second area.Along cutting path fragile material to be cut is irradiated using non-thermal laser.Make the breaking step of first area and second area separation.By non-thermal laser action before fragile material, fragile material is acted on using thermal laser, its local temperature is increased and then is softened, so as to suppress to occur fragile material in cutting process micro-crack and fragment occur, prevents the uncontrollable of fragile material from fractureing.
Description
Technical field
The present invention relates to field of laser processing, and fragility material is cut by laser in particular to one kind
The method of material.
Background technology
In tradition machinery processing, high accuracy and production efficiency are inversely relateds, thus it is guaranteed that
High accuracy and high quality are realized under appropriate production efficiency with regard to relatively difficult, especially, by crisp
Property material (glass, crystalline material, ceramics etc.) with high accuracy manufacture 2D or 3D works
Part.At present, manufacturer carries out high accuracy processing to carry by laser system more and more
High yield and production efficiency.But exist however, handling these fragile materials with laser system
Problem, although some trials have been carried out, also without that can have, cost is low, can weigh
The laser cutting method of renaturation and the cutting effect that can have been realized.In existing laser cutting side
Method in process, easily makes fragile material produce microcrack and fragment, if unappropriate control
System, the crack generated during cutting can cause uncontrolled fracture.In order to overcome these problems,
Traditional laser treatment usually slows down, and causes production efficiency to be lost.
The content of the invention
It is an object of the invention to provide a kind of method of cutting brittle materials by laser, is cut with reducing
The microcrack and fragment of fragile material during cutting, the work for improving the efficiency of cutting operation and making
The quality of part.
The present invention is solved its technical problem and realized using following technical scheme.
A kind of method of cutting brittle materials by laser, comprises the following steps：
Heat shock light irradiation fragility material is utilized along cutting path so that fragile material formation is located at respectively
The first area of cutting path opposite sides and second area；
Non- thermal laser irradiation fragile material is utilized along cutting path；And
Make the breaking step of first area and second area separation.
The beneficial effect of the method for the cutting brittle materials by laser of the embodiment of the present invention is：
The laser cutting method irradiates fragility material to be cut using thermal laser and non-thermal laser in combination
Material, then carries out operation of breakage again.In advance can be with using heat shock light irradiation fragile material to be cut
The problem of reducing the micro-crack and fragment of fragile material to be cut when fractureing extraction workpiece.In addition,
Cutting brittle material is treated by thermal laser to be anticipated, and is reused non-thermal laser irradiation and is treated
Cutting brittle material, the cutting mode then to be fractureed can improve cutting speed, improve effect
Rate and the higher part of quality can be obtained.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in embodiment
The required accompanying drawing used is briefly described, it will be appreciated that the following drawings illustrate only this hair
Bright some embodiments, therefore the restriction to scope is not construed as, it is common for this area
, on the premise of not paying creative work, can also be according to these accompanying drawings for technical staff
Obtain other related accompanying drawings.
The first signal of Fig. 1 fragile material laser cutting methods provided in an embodiment of the present invention
Figure；
Second of signal of Fig. 2 fragile material laser cutting methods provided in an embodiment of the present invention
Figure；
Fig. 3 show fragile material laser cutting method provided in an embodiment of the present invention crisp
Property material formed first area and second area schematic diagram；
Fig. 4 shows crisp in fragile material laser cutting method provided in an embodiment of the present invention
Property material mechanical is broken off the schematic diagram of process.
Description of reference numerals：
Fragile material 100 to be cut；Cut direction 101；Cutting path 102；Thermal laser 103；
Non- thermal laser 104；First area 105；Second area 106；First softened zone 107；
Second softened zone 108；First distance 109；Second distance 110；Active compression roller 111；
Static compression roller 112；Thermal laser device 201；Non-thermal laser 202.
Embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but ability
Field technique personnel will be understood that the following example is merely to illustrate the present invention, and is not construed as limiting
The scope of the present invention processed.Unreceipted actual conditions person in embodiment, according to normal condition or manufacture
The condition that business suggests is carried out.The unreceipted production firm person of instrument, being can be by commercially available
Buy the conventional products obtained.
Refering to Fig. 1 to Fig. 4, a kind of method of cutting brittle materials by laser, comprise the following steps：
Step S101：Along cutting path 102 fragility material to be cut is irradiated using thermal laser 103
Material 100 is located at the opposite sides of cutting path 102 respectively so that fragile material to be cut 100 is formed
First area 105 and second area 106.
Step S102：Along cutting path 102 fragility to be cut is irradiated using non-thermal laser 104
Material 100.
Step S103：Make the breaking step of first area 105 and the separation of second area 106.
The method for the laser cutting that the present embodiment provides can be used for the processing of frangible fragile material,
Simple linear incision operation can be carried out, for example, straight line, big curve, or from fragility material
2D and 3D workpiece are cut out in material.The laser cutting method can be used for other materials
Cut, the present invention is not defined to its specific cutting object.
The fragile material referred in embodiment include, but are not limited to such as glass, crystalline material with
And ceramics, the thickness of fragile material also have wider scope.
Glass for example can be transparent, translucent, coloured glass.Crystalline material can be quartz,
Sapphire etc..
Fragile material can be used for such as display device, various lens, ltcc substrate etc..It is crisp
Property material shape can also have multiple choices, such as can be rule flat board, cylindricality (circle
Post or prism, round platform, circular cone), or the structure of other abnormity constructions.
Cutting path 102 can be continuously irradiated to fragile material to be cut (as directly by laser
Line), or fragile material to be cut can be also irradiated to by laser compartment of terrain and is formed (such as intermittent line).
When cutting path 102 is irradiated to fragile material to be cut by laser compartment of terrain to be formed, road is cut
The spacing distance in footpath 102 can according to thermal laser 103 and the size of the hot spot of non-thermal laser 104 with
And act on the size in the region (stimulated light influence region) of fragile material 100 to be cut and enter
Row limits.
The limitation parameter of thermal laser 103 in the present embodiment can use as follows：
Pulse width：>1ns or continuous wave, pulse width refer to that the power of laser maintains spy
Definite value duration, continuous wave refer to laser and exported in a continuous manner, and it is in specific work(
The duration of rate reaches nanosecond (10-9Second) or psec (10-12Second)；
Laser power：≥5W；
Wavelength：It is infrared.
The limitation parameter of non-thermal laser 104 in embodiment can use as follows：
Pulse width：≤30ps；
Energy/pulse：>=1 μ J, each pulse, the energy contained by laser；
Repetition rate：>10KHz；
Wavelength：It is infrared, ultraviolet or green, green refer to be in visible region and wavelength
500~560nm；
Pulse mode：Pulse or burst mode.
Above-mentioned thermal laser 103 and non-thermal laser 104 can be by gas laser, solids
Laser, semiconductor laser etc. produce, and gas laser can for example use CO2Laser
Device.
The design parameter of thermal laser 103 and non-thermal laser 104 can be according to laser and fragility to be cut
Interaction situation between material 100 is selected, and the present invention is not construed as limiting to it.It is foregoing
Interaction situation between laser and fragile material to be cut 100, it is including but not limited to be cut
The characteristics such as absorption of the fragile material 100 to laser, reflection, projection, and fragility material to be cut
Material 100 is excited the deformation after light irradiation, physical property (yield strength, density, band gap etc.).
In step S101, when thermal laser 103 is treated cutting brittle material 100 and is irradiated,
Thermal laser 103 and fragile material to be cut 100 can be moved mutually, by different mechanisms or
Person component is realized.Thermal laser 103 and fragile material to be cut 100 can be one of fixed,
Another motion.
Specifically, for example, it may be the thermal laser device 201 for producing thermal laser 103 is fixed, treat
Cutting brittle material 100 moves relative to thermal laser device 201, and fragile material to be cut
100 movement is with the hot spot of thermal laser 103 on the motion road on the surface of fragile material 100 to be cut
Footpath is consistent with the direction of cutting path 102.
Or it can also be：Fragile material 100 to be cut is fixed, and produces the heat of thermal laser 103
Laser 201 moves relative to fragile material 100 to be cut, and the shifting of thermal laser device 201
Dynamic motion path and cutting with the hot spot of thermal laser 103 on the surface of fragile material 100 to be cut
The direction of path 102 is consistent.
In step s 102, when non-thermal laser 104 treats the irradiation of cutting brittle material 100,
Non- thermal laser 104 and fragile material to be cut 100 can also be by different configuration or mechanism arrangements
Control is mutually moved.Non- thermal laser 104 and fragile material to be cut 100 can be with wherein one
Individual fixation, another motion.
Specifically, for example, it may be the non-thermal laser 202 for producing non-thermal laser 104 is fixed,
Fragile material 100 to be cut moves relative to non-thermal laser 202, and fragility material to be cut
The movement of material 100 is with fortune of the hot spot of non-thermal laser 104 on the surface of fragile material 100 to be cut
Dynamic path is consistent with the direction of cutting path 102.
Or it can also be：Fragile material 100 to be cut is fixed, and produces non-thermal laser 104
Non-thermal laser 202 moved relative to fragile material 100 to be cut, and non-thermal laser
202 movement is with motion of the hot spot of non-thermal laser 104 on the surface of fragile material 100 to be cut
Path is consistent with the direction of cutting path 102.
In step S101 and step S102, generation thermal laser 103 mentioned above
Thermal laser device 201 and the non-thermal laser 202 for producing non-thermal laser 104 can be independently
Set or integrate in one apparatus, and thermal laser device 201 and non-thermal laser
202 can adjust its move mode using control system.
When thermal laser device 201 and non-thermal laser 202 are independently set, both can distinguish
Independently motion or static, and can also independently produce thermal laser 103 or non-thermal laser
104.Specifically, thermal laser device 201 works and is emitted thermal laser 103, while non-thermal laser
Device 202 is stopped；After thermal laser 103 works along cutting path 102, thermal laser device
201 are stopped, and non-thermal laser 202 works and is emitted non-thermal laser 104, and along cutting
Path 102 works.Now, step S101 and step S102 are carried out successively, refer to Fig. 1.
Thermal laser device 201 and non-thermal laser 202 it is integrally disposed in one apparatus when, heat shock
Light device 201 and non-thermal laser 202 can be linearly arranged, for example, in cut direction
On 101, preceding, non-thermal laser 202 produces thermal laser 103 caused by thermal laser device 201
Non- thermal laser 104 rear.Now, step S101 and step S102 are carried out successively.
Above-mentioned, the effect that the scheme that step S101 and step S102 are carried out successively is realized is：
With the phase between thermal laser device 201, non-thermal laser 202 and fragile material to be cut 100
Mutually motion, in cut direction 101, thermal laser 103 acts on cutting path 102 first
The surface of fragile material to be cut 100, then non-thermal laser 104 remake for cutting path
The surface of 102 fragile material to be cut 100, so that fragile material to be cut 100 is successively
By the processing of thermal laser 103 and non-thermal laser 104.
In addition, thermal laser device 201 and non-thermal laser 202 are integrated and are arranged on an integrating device
When middle, what thermal laser 103 and non-thermal laser 104 were formed on the surface of fragile material 100 to be cut
Hot spot is irradiated to the same position of fragile material 100 to be cut, thermal laser 103 and non-thermal
Laser 104 moves along cutting path 102.Now, step S101 and step S102 be successively
Carry out, refer to Fig. 2.It should be noted, thermal laser 103 and non-thermal laser 104 are irradiated to
The same position of fragile material 100 to be cut refers to：Thermal laser 103 and non-thermal laser
104 locus are overlapping, but in time, are still thermal laser 103 in preceding, non-thermal laser
104 rear.
Above step S101 and step S102 is carried out or carried out successively simultaneously during,
Thermal laser device 201 and non-thermal laser 202 can be single or multiple.It should be noted that
The outgoing beam of thermal laser 103 and non-thermal laser 104 (can be irradiated in be cut with a luminous point
Fragile material 100 forms a hot spot), thermal laser 103 and non-thermal laser 104 are continuously moved,
To form continuous cutting path 102, or the mode that can be also spaced is moved, and is formed more
The cutting path 102 of section and spaced certain distance.Thermal laser 103 can be with multiple light sources
Combination, non-thermal laser 104 can also multiple light sources combination so that the shape of outgoing beam
Annular (cutting path is circular), rectangle (cutting path is rectangle) etc. can be made.
In addition, the outgoing beam of thermal laser 103 and non-thermal laser 104 be except that can be spot light,
It can also be area source.When laser is area source, laser can arrange along cutting path 102,
So as to which laser can disposably directly act on brittle whole cutting paths 102 to be cut.Face light
The outgoing beam of the laser in source, on the cutting path 102 of fragile material 100 to be cut, heat
Laser 103 or non-thermal laser 104 can irradiate all cutting paths 102 or irradiation cutting simultaneously
The part in path 102.
It should be noted that in cutting process, can also be to thermal laser 103, non-thermal laser
104 design parameter and spot size regulation, to obtain more preferable cutting effect.Heat shock
The size and shape of light 103 and the hot spot of non-thermal laser 104 can be identical, can also differ.Heat
The hot spot of laser 103 and the spot size of non-thermal laser 104, can also be according to fragile material to be cut
100 specific property and cutting mode is combined.For example, thermal laser 103 and non-heat shock
The hot spot of light 104 is circle, and the diameter of the hot spot of thermal laser 103 is more than non-thermal laser
The diameter of 104 hot spot.When treating cutting brittle material 100 and being cut, thermal laser 103
Act on cutting path 102 and time that non-thermal laser 104 is acted between cutting path 102
Interval can be increased and decreased as needed, or can also control thermal laser 103 and non-thermal laser
104 edges and the movement velocity of cutting path 102.
The laser cutting method of fragile material provided by the invention is made to be cut by thermal laser 103
The temperature for cutting fragile material 100 significantly raises, its local softening, to suppress follow-up non-
Caused micro-crack, fragment in the irradiating step of thermal laser 104 and breaking step, so as to obtain compared with
High process velocity and efficiency.
Before non-thermal laser 104 handles fragile material 100 to be cut, with thermal laser 103
Impacting on the surface of fragile material 100 to be cut, makes the temperature of fragile material 100 to be cut local
Increase, for example, fragile material to be cut 100 is exposed to before non-thermal laser 104, will be to be cut
Cut fragile material 100 and be exposed to thermal laser 103, make the temperature liter of fragile material 100 to be cut
It is up to higher than its softening point temperature by most 20%.
It is preferred that by rationally design thermal laser 103, non-thermal laser 104 hot spot size
With mutual position, movement velocity, 50% energy of laser is set to concentrate on cutting path
On 102.
Because the fuel factor for treating cutting brittle material 100 of thermal laser 103 is higher, therefore,
The energy of thermal laser 103 can be made in cut direction 101, in the table of fragile material 100 to be cut
Face carries out in check spatial distribution, so as to irradiate fragile material to be cut in thermal laser 103
In 100 the step of, first area 105 is in the model of the first distance 109 apart from cutting path 102
The first softened zone 107 of interior formation is enclosed, while second area 106 is apart from cutting path 102
The second softened zone 108 is formed in the range of second distance 110, refers to Fig. 3.First distance 109
Keep constant on the bearing of trend of cutting path 102, second distance 110 is in cutting path
Keep constant on 102 bearing of trend, or, the first distance 109, second distance 110 are equal
Change on cutting path 102.In addition, the first distance 109 and second distance 110 can phases
Deng or.In the first softened zone 107 and the second softened zone 108, fragile material to be cut
100 density gradient and internal stress gradient are smaller, are less susceptible to cause uncontrollable crack, broken
Piece and situation about fractureing occur.
In step S101 and step S102, cutting path 102 can be straight line, Daqu
Line, or for cutting out the solid of 2D and 3D workpiece from fragile material 100 to be cut
Line of cut.
In step s 103, breaking step is to be shone using thermal laser 103 along cutting path 102
Penetrate fragile material 100 to be cut, i.e. the thermal effect using thermal laser 103 is with making fragility material to be cut
Material 100 melts and is automatically separated out first area 105 and second area 106.Meanwhile also
The near zone of cutting path 102 can be cooled down or heated using the mode of gas, be blown
Walk fragile material scrap.
In addition to performing breaking step using above-mentioned thermal laser 103, it can also be fractureed using machinery
The mode of separation performs breaking step.Machinery be broken off operation include as using gas impact,
Vibrations or acoustic energy etc..Specifically, gas impact can for example use gases at high pressure nozzle to treating
The cutting path 102 of cutting brittle material 100 carries out injection high-speed gas, utilizes high-speed gas
Kinetic energy impact fragile material 100 to be cut realize cutting path 102 both sides first area
105 and the separation of second area 106.Or Mechanical Contact can also be directly utilized, such as treating
Cutting brittle material 100 sets an active compression roller away from the side of cutting path 102
111, set one respectively at first area 105 and second area 106 in the side of cutting path 102
Individual static compression roller 112, then by active compression roller 111 to fragile material apply one to
The active force of static compression roller 112, so as to realize first area 105 and second area 106
Separation, refers to Fig. 4.
Using the method for cutting brittle materials by laser provided by the invention, to non-reinforced manosil AS
Salt glass is cut, it is possible to achieve fragmentation size<50 μm, microcrack<10 μm, bending is strong
Degree>100Mpa, and effective feed rate>20mm/s.
Although illustrate and describing the present invention with specific embodiment, but will be appreciated that
Many other changes can be made in the case of without departing substantially from the spirit and scope of the present invention and is repaiied
Change.It is, therefore, intended that include belonging to all in the scope of the invention in the following claims
These are changed and modifications.
Claims (10)
- A kind of 1. method of cutting brittle materials by laser, it is characterised in that comprise the following steps：Heat shock light irradiation fragile material to be cut is utilized along cutting path, so that described to be cut crisp Property material formed respectively positioned at the cutting path opposite sides first area and second area；Along the cutting path fragile material to be cut is irradiated using non-thermal laser；AndMake the breaking step of the first area and second area separation.
- 2. the method for cutting brittle materials by laser according to claim 1, its feature exists In the breaking step is described to be cut along cutting path irradiation using the thermal laser Fragile material.
- 3. the method for cutting brittle materials by laser according to claim 1, its feature exists In the breaking step is that machinery is broken off.
- 4. the method for cutting brittle materials by laser according to claim 3, its feature exists It is broken off impacting using gas in, the machinery, shakes or acoustic energy fracture point From.
- 5. the method for cutting brittle materials by laser according to claim 1, its feature exists In being irradiated described in the heat shock light irradiation the step of fragile material to be cut with the non-thermal laser The step of fragile material to be cut, is carried out simultaneously.
- 6. the method for cutting brittle materials by laser according to claim 1, its feature exists In after being completed described in the heat shock light irradiation the step of fragile material to be cut, described in progress Non- thermal laser irradiates the step of fragile material to be cut.
- 7. the method for cutting brittle materials by laser according to claim 1, its feature exists In, in the step of fragile material to be cut described in the heat shock light irradiation, the first area The first softened zone, secondth area are formed in the first distance range apart from the cutting path Domain forms the second softened zone in the range of the second distance apart from the cutting path.
- 8. the method for cutting brittle materials by laser according to claim 1, its feature exists In the non-thermal laser is irradiated before the fragile material to be cut, utilizes heat shock light irradiation institute State fragile material to be cut, make the fragile material to be cut temperature be increased to it is more to be cut than described Cut the softening point temperature height most 20% of fragile material.
- 9. the method for cutting brittle materials by laser according to claim 1, its feature exists In the fragile material to be cut includes glass, sapphire and ceramics.
- 10. the method for cutting brittle materials by laser according to claim 1, its feature exists In the parameter of the non-thermal laser is：Pulse width：≤30ps；Energy/pulse：≥1μJ；Repetition rate：>10KHz；Wavelength：It is infrared, green or ultraviolet；Pulse mode：Pulse or burst mode；The parameter of the thermal laser is：Pulse width：>1ns or continuous wave；Laser power：≥5W；Wavelength：It is infrared.
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| CN201610446933.2A CN107520541B (en) | 2016-06-20 | 2016-06-20 | Method for laser cutting brittle material |
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| CN201610446933.2A CN107520541B (en) | 2016-06-20 | 2016-06-20 | Method for laser cutting brittle material |
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| CN107520541B CN107520541B (en) | 2020-05-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109396661A (en) * | 2018-11-09 | 2019-03-01 | 上海申和热磁电子有限公司 | One kind being used for CO2The processing method of laser aiming optical fiber processing aluminium oxide ceramics |
| CN109732198A (en) * | 2019-01-31 | 2019-05-10 | 华中科技大学 | A kind of hard brittle material dual-beam hot tearing processing unit (plant) and method |
| CN110316950A (en) * | 2018-03-31 | 2019-10-11 | 财团法人工业技术研究院 | Hard brittle material cutting method and its device |
| CN110340542A (en) * | 2019-06-29 | 2019-10-18 | 汕尾市索思电子封装材料有限公司 | A method of cutting oxide ceramics substrate |
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| CN1413136A (en) * | 1999-11-24 | 2003-04-23 | 应用光子学公司 | Method and apparatus for separating non-metallic materials |
| JP2006035710A (en) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | Glass processing method using laser and device |
| CN102642082A (en) * | 2011-02-16 | 2012-08-22 | 埃瓦格股份公司 | Laser processing device with switchable laser assembly and laser processing method |
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| CN1413136A (en) * | 1999-11-24 | 2003-04-23 | 应用光子学公司 | Method and apparatus for separating non-metallic materials |
| JP2006035710A (en) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | Glass processing method using laser and device |
| CN102642082A (en) * | 2011-02-16 | 2012-08-22 | 埃瓦格股份公司 | Laser processing device with switchable laser assembly and laser processing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316950A (en) * | 2018-03-31 | 2019-10-11 | 财团法人工业技术研究院 | Hard brittle material cutting method and its device |
| CN109396661A (en) * | 2018-11-09 | 2019-03-01 | 上海申和热磁电子有限公司 | One kind being used for CO2The processing method of laser aiming optical fiber processing aluminium oxide ceramics |
| CN109732198A (en) * | 2019-01-31 | 2019-05-10 | 华中科技大学 | A kind of hard brittle material dual-beam hot tearing processing unit (plant) and method |
| CN109732198B (en) * | 2019-01-31 | 2020-05-19 | 华中科技大学 | Double-beam hot cracking processing device and method for hard and brittle materials |
| CN110340542A (en) * | 2019-06-29 | 2019-10-18 | 汕尾市索思电子封装材料有限公司 | A method of cutting oxide ceramics substrate |
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| Publication number | Publication date |
|---|---|
| CN107520541B (en) | 2020-05-15 |
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