CN107513683A - Plate and preparation method thereof is prevented in one kind vapour deposition - Google Patents
Plate and preparation method thereof is prevented in one kind vapour deposition Download PDFInfo
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- CN107513683A CN107513683A CN201710783549.6A CN201710783549A CN107513683A CN 107513683 A CN107513683 A CN 107513683A CN 201710783549 A CN201710783549 A CN 201710783549A CN 107513683 A CN107513683 A CN 107513683A
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- plate
- mixed liquor
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- prevent
- adhesive film
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses one kind vapour deposition to prevent plate, and described to prevent that plate surface is attached with metal adhesive film, the metal adhesive film has metal corsslinking network structure.In the PVD equipment course of work, the presence of metal adhesive film can be such that relatively firm being grown in of film plating layer prevents on plate, difficult for drop-off, while can also increase and prevent adsorbance of the plate to film plating layer；So as to extend service life and the cleaning frequency of preventing plate, and then reduce the cleaning cost for preventing plate.
Description
Technical field
The present invention relates to surface diposition field, prevents plate and preparation method thereof more particularly to one kind vapour deposition.
Background technology
Vapour deposition (Physical Vapor Deposition, PVD) is that atom or molecule are transferred into base material table by source
Process on face, it is usually used in substrate surface film forming.PVD basic skills includes vacuum evaporation, sputtering, ion plating etc., its principle
It is under vacuum, using low-voltage, the arc-discharge technique of high current, to evaporate target using gas discharge and make to be steamed
Stimulating food matter and gas all ionize, and using the acceleration of electric field, make to be deposited on base material by evaporated material and its reaction product
On surface, the purpose in substrate surface plated film is finally reached.But in film forming procedure, by evaporated material and its reaction product
Target substrate surface can't be completely deposited at, moieties can be deposited in the substrate that should not be deposited or equipment cavity, from
And influence follow-up quality of forming film.Therefore, it can be added in PVD equipment and prevent plate to prevent unnecessary film plating layer is attached to from should not adhere to
Substrate or equipment cavity on.
Present inventor has found in long-term research and development, during PVD equipment continuously works, prevents above plate
Thick film plating layer can be accumulated out, when film plating layer reaches certain thickness, its adhesive force will be deteriorated, and drop therewith in substrate table
Particle is caused in face, so as to cause component failure or surface defect occur, at this moment with regard to needing to preventing that plate carries out the clear of film plating layer
Wash.But prevent that plate is the fine features in PVD equipment, cleaning is difficult and spends substantial amounts of fund, greatly improve plated film into
This, therefore urgently need to find a kind of method for reducing and preventing plate cleaning cost.
The content of the invention
The present invention solves the technical problem of providing a kind of vapour deposition to prevent plate and preparation method thereof, can reduce
The cleaning cost of plate is prevented in vapour deposition.
In order to solve the above technical problems, one aspect of the present invention is：A kind of vapour deposition is provided and prevents plate,
Described to prevent that plate surface is attached with metal adhesive film, the metal adhesive film has metal corsslinking network structure.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of vapour deposition is provided to prevent
The preparation method of plate, this method include：Plate is prevented in offer, there is provided the first mixed liquor, the first mixed liquor is coated in and prevents plate
Surface, solidify under the first preparatory condition；Plate is prevented in vacuum high-temperature baking, and being formed on the surface for preventing plate has metal corsslinking net
The metal adhesive film of shape structure.
The beneficial effects of the invention are as follows：The situation of prior art is different from, the present invention provides a kind of vapour deposition and prevents plate,
Described to prevent that plate surface is attached with metal adhesive film, the metal adhesive film has metal corsslinking network structure.Worked in PVD equipment
During, evaporated or the material that sputters can penetrate into the inside of metal adhesive film by the hole of cross-linked structure, with
Metal adhesive film mutually merges, and relatively firm being grown in of film plating layer is prevented on plate, difficult for drop-off, while can also increase and prevent
Adsorbance of the plate to film plating layer；So as to extend service life and the cleaning frequency of preventing plate, and then reduce the cleaning for preventing plate
Cost.
Further, the metal adhesive film can be with preventing that plate is peeled off, when metal adhesive film reaches the absorption to film plating layer
During the upper limit, it can make to prevent that plate recovers clean together with metal adhesive film and its film plating layer of absorption from preventing tearing on plate,
No longer need, to preventing that plate surface is cleaned, to simplify processing step, while greatly reduce cleaning cost.
Brief description of the drawings
Fig. 1 is the structural representation that the embodiment of plate one is prevented in present invention vapour deposition；
Fig. 2 is the structural representation that the embodiment of plate one is prevented in present invention vapour deposition；
Fig. 3 is the schematic flow sheet for the embodiment of preparation method one that plate is prevented in present invention vapour deposition；
Fig. 4 is the structural representation for the metal adhesive film that plate is prevented in present invention vapour deposition；
Fig. 5 is that the application flow schematic diagram of plate one is prevented in present invention vapour deposition；
Fig. 6 is the schematic flow sheet for the embodiment of preparation method one that plate is prevented in present invention vapour deposition.
Embodiment
To make the purpose of the present invention, technical scheme and effect clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.
Referring to Fig. 1, Fig. 1 is the structural representation that the embodiment of plate one is prevented in present invention vapour deposition.Present embodiment
A kind of vapour deposition is provided and prevents plate, the vapour deposition prevents that the surface attachment of plate 101 has metal adhesive film 102, metal adhesive film
102 have metal corsslinking network structure.
In the embodiment, in the PVD equipment course of work, the material for being evaporated or being sputtered can be by crosslinking net knot
The hole of structure penetrates into the inside of metal adhesive film, is mutually merged with metal adhesive film, make film plating layer it is relatively firm be grown in it is anti-
On plate, it is difficult for drop-off, while can also increase and prevent adsorbance of the plate to film plating layer；Prevent that using for plate is all so as to extend
Phase and cleaning frequency, and then reduce the cleaning cost for preventing plate.
Fig. 2 and Fig. 3 are referred to, Fig. 2 is the structural representation that the embodiment of plate one is prevented in present invention vapour deposition；Fig. 3 is
The schematic flow sheet of the embodiment of preparation method one of plate is prevented in present invention vapour deposition.In one embodiment, metal glued membrane
Layer 102 is included in the basic unit 1021 for preventing sequentially being set on plate 101 and network structure layer 1022, wherein basic unit 1021 and netted knot
Structure layer 1022 is formed in the manufacturing process of metal adhesive film 102.In the embodiment, the making of plate is prevented in vapour deposition
Method is as follows：
(a)：Plate 301 is prevented in offer.
Wherein, it can conventional use of arbitrarily prevent plate to prevent plate 301.
(b)：Second mixed liquor is provided, the second mixed liquor is coated in the surface for preventing plate 301, under the second preparatory condition
It is formed by curing substrate layer 302.
Wherein, the second mixed liquor includes fluorine silicon class compound, surfactant and deionized water；Specifically, fluorine silicon class
Compound can be that ammonium hexafluorosilicate, surfactant can be alkylolamideses (FFA) etc..Wherein, fluorine silicon class compound is
Content in two mixed liquors is 20%~35%, such as 20%, 24%, 28%, 32%, 35% etc.；Surfactant is second
Content in mixed liquor is 5%~10%, such as 5%, 6%, 8%, 9%, 10% etc.；Deionized water is in the second mixed liquor
Content is 55%~75%, such as 55%, 60%, 65%, 70%, 75% etc..
Prevent plate 301 it is alternatively possible to uniformly be coated in the second mixed liquor using modes such as spraying, brushing or bat printings
Surface；Substrate layer 302 is formed by curing under second preparatory condition, allowing for any auxiliary operation can be not added with normal temperatures and pressures
Second mixed liquor spontaneous curing forms substrate layer 302, can also accelerate to solidify by blowing or slightly hot mode.
Alternatively, the thickness of substrate layer 302 is 0.01~1mm, for example, 0.01mm, 0.05mm, 0.1mm, 0.3mm,
0.5mm, 0.8mm, 1mm etc..Substrate layer 302 is to prevent the transition zone between plate 301 and metal adhesive film 304；Served as a contrast by setting
Bottom, it can make metal adhesive film easier with preventing that plate is peeled off.
(c)：First mixed liquor is provided, the first mixed liquor is coated in the surface of substrate layer 302, under the first preparatory condition
Solidification, form metal glued membrane preparation layers 303.
Wherein, the first mixed liquor includes metallics, resinous material and solvent；Specifically, metallics be bismuth, tin,
One or more in indium, magnesium, aluminium, iron, copper, nickel, zinc, or metallics are to contain bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, zinc
Metal alloy in one or more, or metallics is bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, the one or more in zinc
With containing bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, zinc metal alloy in one or more mixtures；In other embodiment party
In formula, metallics can also be the relatively low metal simple-substance or alloy of other fusing points, such as the fusing point of metallics can be 100
DEG C or so；Wherein, metallics can be evenly distributed in the first mixed liquor with the state of fine powder.Resinous material is water
Property polyurethane, polymethyl methacrylate, polyethylene terephthalate, dimethyl acetamide, dibutyl phthalate,
One or more in allyl carbonate, benzoic acid dibutyl ester, makrolon；In other embodiments, resinous material
Can be medium-viscosity, high temperature resistant, the polymer easily solidified.Solvent is deionized water；In other embodiments, solvent also may be used
Think other solvents without oxidisability.
Alternatively, metallics, resinous material and solvent are formed dispersed molten by certain fusion more mutual than row
Liquid, different ratios can be allocated for different PVD equipments.Wherein, content of the metallics in the first mixed liquor is
10%-50%, such as 10%, 20%, 30%, 40%, 50% etc.；Content of the resinous material in the first mixed liquor is 5%-
45%, such as 5%, 10%, 20%, 30%, 45% etc.；Specifically, when resinous material selects aqueous polyurethane
When (Polyurethane Dispersion), its content in the first mixed liquor is 30%-45%, when resinous material selects
During with polyethylene terephthalate (Polyethylene terephthalate), its content in the first mixed liquor is
5%-10%, when resinous material selects dimethyl acetamide (DMAc), its content in the first mixed liquor is 5%-
10%.Content of the solvent in the first mixed liquor is 50%-70%, such as 50%, 55%, 60%, 65%, 70% etc..
It is alternatively possible to the first mixed liquor is uniformly coated in by substrate layer 302 using modes such as spraying, brushing or bat printings
Surface；Metal glued membrane preparation layers 303 are formed by curing under first preparatory condition, any auxiliary can be not added with normal temperatures and pressures
Operation allows mixed liquor spontaneous curing to form metal glued membrane preparation layers 303, can also be accelerated by blowing or slightly hot mode
Solidification.
(d)：Vacuum high-temperature baking prevents plate 301 with substrate layer 302 and metal glued membrane preparation layers 303, is preventing plate
301 surface forms the metal adhesive film 304 with metal corsslinking network structure.
Specifically, baking temperature is 80~200 DEG C, such as 80 DEG C, 110 DEG C, 140 DEG C, 170 DEG C, 200 DEG C etc.；During baking
Between be 1~6 hour, such as 1 hour, 2 hours, 3.5 hours, 5 hours, 6 hours etc..In baking process, metal glued membrane preparation
The basic unit 3041 and network structure layer 3042 that layer 303 can gradually form sequentially to set；Specifically, referring to Fig. 4, Fig. 4 is this
The structural representation of the metal adhesive film of plate is prevented in invention vapour deposition.During vacuum bakeout, metallics is reaching
Start to melt and be cross-linked to form island interconnection architecture 421 after fusing point, island interconnection architecture 421, which floats, forms network structure layer
42, wherein island interconnection architecture 421 can be as the support frame of metal adhesive film；The organic matters such as resinous material volatilize and by
There is contraction and collapsed in the absorption of dissolving each other of substrate layer organic matter, and sinking forms basic unit 41.Wherein, metal is contained in network structure layer 42
And assistant metal produces the resin of crosslinking；Also the larger metal of the density deposited, therefore network structure are contained in basic unit 41
All include metal and resin in layer 42 and basic unit 41, simply both proportional amounts are different with existence form state.
Referring to Fig. 5, Fig. 5, which is present invention vapour deposition, prevents the application flow schematic diagram of plate one.In this embodiment, will
Prevent that plate 501 is inserted in PVD equipment with metal adhesive film 503 and apply, with the continuous work of PVD equipment, metal glued membrane
One layer of film plating layer 504 is gradually adsorbed on layer 503, please continue to refer to Fig. 4, the material for being evaporated or being sputtered can pass through crosslinking net
The hole of structure 421 penetrates into the inside of metal adhesive film, is mutually merged with metal adhesive film, makes the growth that film plating layer is more firm
It is difficult for drop-off on plate is prevented, while can also increase and prevent adsorbance of the plate to film plating layer.In one embodiment, also may be used
With by with metal adhesive film 503 prevent that plate 501 inserts PVD equipment before, first metal adhesive film 503 surface high power
One layer of film plating layer of pre-sputtering (the pre- film plating layer shown in Fig. 4).
, can be together with substrate layer 502, metal glued membrane when metal adhesive film 503 reaches the absorption upper limit to film plating layer 504
Layer 503 and its film plating layer 504 of absorption make to prevent that plate 501 recovers clean, it is no longer necessary to right together from preventing tearing on plate 501
Prevent that the surface of plate 501 is cleaned, recover it is clean prevent plate 501 can also again in its surface metallization adhesive film 304,
So recycling PVD prevents plate.In the embodiment, the manufacture craft for preventing plate with metal adhesive film is simple, is made
Prevent plate convenient use, and need not clean, being capable of effectively save cost.
Referring to Fig. 6, Fig. 6 is the schematic flow sheet for the embodiment of preparation method one that plate is prevented in present invention vapour deposition.
The embodiment provides a kind of be vapor-deposited and prevents the preparation method of plate, and this method comprises the following steps：
S601：Plate is prevented in offer.
S602：First mixed liquor is provided, the first mixed liquor is coated in the surface for preventing plate, it is solid under the first preparatory condition
Change.
S603：Plate is prevented in vacuum high-temperature baking, and the metal with metal corsslinking network structure is formed on the surface for preventing plate
Adhesive film.
Wherein, in one embodiment, also include before step S602：The second mixed liquor is provided, by the second mixed liquor
Coated in the surface for preventing plate, solidify under the second preparatory condition；Specific method implementation procedure refer in above-mentioned embodiment
Description, will not be repeated here.
Plate is prevented in a kind of vapour deposition that presently filed embodiment is provided, described to prevent that plate surface is attached with metal-to-metal adhesive
Film layer, the metal adhesive film have metal corsslinking network structure.In the PVD equipment course of work, the material that is evaporated or sputtered
The inside of metal adhesive film can be penetrated into by the hole of cross-linked structure, is mutually merged with metal adhesive film, makes plated film
Relatively firm being grown in of layer is prevented on plate, difficult for drop-off, while can also increase and prevent adsorbance of the plate to film plating layer；So as to prolong
The service life for preventing plate and cleaning frequency have been grown, and then has reduced the cleaning cost for preventing plate.
Further, the metal adhesive film can be with preventing that plate is peeled off, when metal adhesive film reaches the absorption to film plating layer
During the upper limit, it can make to prevent that plate recovers clean together with metal adhesive film and its film plating layer of absorption from preventing tearing on plate,
No longer need, to preventing that plate surface is cleaned, to simplify processing step, while greatly reduce cleaning cost.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
The equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, it is included within the scope of the present invention.
Claims (10)
1. plate is prevented in one kind vapour deposition, it is characterised in that described to prevent that plate surface is attached with metal adhesive film, the metal-to-metal adhesive
Film layer has metal corsslinking network structure.
2. according to claim 1 prevent plate, it is characterised in that the metal adhesive film be included in it is described prevent on plate according to
The basic unit and network structure layer that sequence is set.
3. according to claim 1 prevent plate, it is characterised in that
The metal adhesive film is coated by the first mixed liquor to be formed, and first mixed liquor includes metallics, resinous material
And solvent；Wherein, content of the metallics in first mixed liquor is 10%-50%, and the resinous material exists
Content in first mixed liquor is 5%-45%, and content of the solvent in first mixed liquor is 50%-70%；
The metallics be bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, the one or more in zinc, or the metallics be containing
Have an one or more in the metal alloy of bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, zinc, or the metallics be bismuth, tin,
In indium, magnesium, aluminium, iron, copper, nickel, zinc one or more with containing bismuth, tin, indium, magnesium, aluminium, iron, copper, nickel, zinc metal alloy
In one or more mixtures；
The resinous material is aqueous polyurethane, polymethyl methacrylate, polyethylene terephthalate, dimethyl second
One or more in acid amides, dibutyl phthalate, allyl carbonate, benzoic acid dibutyl ester, makrolon；
The solvent is deionized water.
4. according to claim 1 prevent plate, it is characterised in that the thickness of the metal adhesive film is 0.1~2mm.
5. according to claim 1 prevent plate, it is characterised in that described to prevent also wrapping between plate and the metal adhesive film
Include substrate layer；
The substrate layer is coated by the second mixed liquor and formed, and second mixed liquor includes fluorine silicon class compound, surfactant
And deionized water；Wherein, content of the fluorine silicon class compound in second mixed liquor is 20%~35%, the surface
Content of the activating agent in second mixed liquor is 5%~10%, the deionized water containing in second mixed liquor
Measure as 55%~75%.
6. according to claim 5 prevent plate, it is characterised in that the thickness of the substrate layer is 0.01~1mm.
7. prevent plate according to claim any one of 1-6, it is characterised in that the metal adhesive film can be prevented with described
Plate stripping.
8. a kind of be vapor-deposited prevents the preparation method of plate, it is characterised in that methods described includes：
Plate is prevented in offer；
First mixed liquor is provided, first mixed liquor is coated in the surface for preventing plate, it is solid under the first preparatory condition
Change；
Vacuum high-temperature baking is described to prevent plate, and the metal-to-metal adhesive with metal corsslinking network structure is formed on the surface for preventing plate
Film layer.
9. according to the method for claim 8, it is characterised in that described that first mixed liquor is prevented into plate coated in described
Surface step before also include：Second mixed liquor is provided, second mixed liquor is coated in the surface for preventing plate,
Substrate layer is formed by curing under second preparatory condition.
10. according to the method for claim 8, it is characterised in that the vacuum high-temperature baking is described to prevent plate, described anti-
Surface metal adhesive film step of the formation with metal corsslinking network structure of plate includes：Baking temperature is 80~200 DEG C, is dried
The roasting time is 1~6 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710783549.6A CN107513683A (en) | 2017-08-31 | 2017-08-31 | Plate and preparation method thereof is prevented in one kind vapour deposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710783549.6A CN107513683A (en) | 2017-08-31 | 2017-08-31 | Plate and preparation method thereof is prevented in one kind vapour deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107513683A true CN107513683A (en) | 2017-12-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710783549.6A Pending CN107513683A (en) | 2017-08-31 | 2017-08-31 | Plate and preparation method thereof is prevented in one kind vapour deposition |
Country Status (1)
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| CN (1) | CN107513683A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109652773A (en) * | 2019-02-25 | 2019-04-19 | 京东方科技集团股份有限公司 | One kind preventing component and evaporated device |
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| CN109652773A (en) * | 2019-02-25 | 2019-04-19 | 京东方科技集团股份有限公司 | One kind preventing component and evaporated device |
| WO2020173413A1 (en) * | 2019-02-25 | 2020-09-03 | 京东方科技集团股份有限公司 | Deposition-preventing assembly and vapor deposition device |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No.9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: No.9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171226 |