CN107508570A - A kind of adhering method for quartz wafer - Google Patents
A kind of adhering method for quartz wafer Download PDFInfo
- Publication number
- CN107508570A CN107508570A CN201710778642.8A CN201710778642A CN107508570A CN 107508570 A CN107508570 A CN 107508570A CN 201710778642 A CN201710778642 A CN 201710778642A CN 107508570 A CN107508570 A CN 107508570A
- Authority
- CN
- China
- Prior art keywords
- quartz wafer
- dispensing
- conducting resinl
- adhering method
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 83
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004070 electrodeposition Methods 0.000 claims abstract description 11
- 239000007767 bonding agent Substances 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 62
- 230000000694 effects Effects 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention discloses a kind of adhering method for quartz wafer, and this method comprises the following steps：Prepare bonding agent, cleaning object to be bonded and bonding.The present invention to 2 electrode positions and the predeterminated position in 2 non-electrode regions by carrying out dispensing, add dispensing position, make it have big adhesive strength, structure fixing compact, bear the features such as environmental impact magnitude is big, disclosure satisfy that requirement of the quartz wafer under high operating environment.And by gluing process twice, the fastness of quartz wafer bonding is strengthened while having saved the space on one side quartz wafer, is easy to the technique in later stage to encapsulate.
Description
Technical field
The present invention relates to adhesive technology field.More particularly, to a kind of adhering method for quartz wafer.
Background technology
As shown in Fig. 2 quartz-crystal resonator generally comprises electroded quartz wafer 5, pedestal 2 and metal shell 1.Its
Connected between middle quartz wafer and pedestal by the bonding realization of bonding agent.Quartz wafer passes through the bonding real of bonding agent with pedestal
After now connecting, pedestal is used to supporting and fixing quartz wafer, and for realizing the electrical connection between quartz wafer and pedestal.Pass through
Peripheral circuit realizes the vibration of quartz wafer, quartz wafer is produced frequency of oscillation, so that quartz wafer can be used as frequency source
Use.
It is conducting resinl mostly to be presently used for general adhesive be bonded between quartz wafer and pedestal, and its main component is
Silver powder and resin.It is liquid before conductive adhesive curing, is solid-state after solidification.In use, by the conductive glue of liquid in quartz-crystal
Piece is treated abutting edge, to cool down after baking-curing and complete bonding.And the currently used quartz wafer method of being adhesively fixed be by
Then conductive glue carries out baking-curing in 2 single-ended electrode districts of quartz wafer, bonding is completed after cooling.Due to quartz
Chip only has single-ended (electrode tip) by conductive adhesive on pedestal, and the other end (nonelectrode end) of chip is free state,
Belong to single-ended 2 fixed forms, although which can realize good electrical performance, because chip has one end (nonelectrode end)
For free state, it is affected by it, it is not high and be subjected to conducting resinl being present after HI high impact and open there is adhesive strength after quartz wafer bonding
Split, the problem of chip comes off, seriously constrain the Surface Mount quartz resonator containing quartz wafer or crystal oscillator uses field
Use reliability in one's power, requirement of the quartz wafer under high operating environment can not be met.
Therefore need to provide a kind of adhering method for quartz wafer, make it have that adhesive strength is big, structure is fixed tightly
It is close, bear the features such as environmental impact magnitude is big.
The content of the invention
In view of this, it is an object of the present invention to provide a kind of adhering method for quartz wafer, make it have
Adhesive strength is big, structure fixing compact and bears the features such as environmental impact magnitude is big, disclosure satisfy that quartz wafer operates ring in height
Requirement under border.
To reach above-mentioned purpose, the present invention uses following technical proposals：
A kind of adhering method for quartz wafer, this method comprise the following steps：
S1, prepare bonding agent：The material of bonding agent is conducting resinl, and the composition of the conducting resinl includes silver powder and resin；
S2, cleaning object to be bonded：Pedestal with sticky object quartz wafer and fixed quartz wafer is immersed into acid cleaning
Liquid simultaneously cleans 1-2 minutes using ultrasonic wave, then natural cooling；Cleaning fluid is poured out after cooling and using in sodium hydroxide solution
With；Then quartz wafer and pedestal are rinsed well with the distilled water or deionized water of boiling, after absolute ethyl alcohol dewater treatment
Drying；
S3, bonding:Electroded quartz wafer is placed on fixed position, by spot gluing equipment in base interior region
2 electrode positions and the predeterminated position in 2 non-electrode regions carry out first time dispensing, and the predeterminated position meets the support of chip
It is required that.Quartz wafer is drawn by spot gluing equipment pick device, and quartz wafer is pressed on the conducting resinl of the base interior,
Then the position that former conducting resinl is corresponded on quartz wafer carries out second of dispensing, together with base after the completion of the quartz wafer dispensing
Seat is together put into baking oven and carries out baking-curing.
Preferably, the predeterminated position is the marginal position of the corresponding quartz wafer.
Preferably, the predeterminated position is two corners of the corresponding quartz wafer away from the electrode position.
Preferably, second of conducting resinl for dispensing glue and conductive gemel connection for dispensing glue for the first time.
Beneficial effects of the present invention are as follows：
The present invention provides a kind of adhering method for quartz wafer, by 2 electrode positions and 2 non-electrode regions
Predeterminated position carry out dispensing, add dispensing position, make it have adhesive strength big, structure fixing compact, bear environment punching
The features such as magnitude is big is hit, disclosure satisfy that requirement of the quartz wafer under high operating environment.And gluing process twice is used,
The fastness of quartz wafer bonding is strengthened while having saved the space on one side quartz wafer, is easy to the technique in later stage to seal
Dress.
Brief description of the drawings
The embodiment of the present invention is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 shows the adhering method provided by the present invention for quartz wafer.
Fig. 2 shows to use the quartz wafer schematic diagram of the adhering method provided by the present invention for quartz wafer.
Reference：1- metal shells, 2- pedestals, 3- electrodes, 311- first electrodes, 312- second electrodes, 4- dispensings position
Put, 5- quartz wafers.
Embodiment
In order to illustrate more clearly of the present invention, the present invention is done further with reference to preferred embodiments and drawings
It is bright.Similar part is indicated with identical reference in accompanying drawing.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
The present invention provides a kind of adhering method for quartz wafer 5, and with reference to Fig. 1, this method comprises the following steps：
S1, prepare bonding agent：The material of bonding agent is conducting resinl, and the composition of the conducting resinl includes silver powder and resin；
S2, cleaning object to be bonded：Pedestal 2 with sticky object quartz wafer 5 and fixed quartz wafer 5 is immersed into the clear of acidity
Washing lotion simultaneously cleans 1-2 minutes using ultrasonic wave, then natural cooling；Cleaning fluid is poured out after cooling and uses sodium hydroxide solution
Neutralize；Then quartz wafer 5 and pedestal 2 are rinsed well with the distilled water or deionized water of boiling, at absolute ethyl alcohol dehydration
Dried after reason；
S3, bonding:Electroded quartz wafer 5 is placed on fixed position, by spot gluing equipment to the interior zone of pedestal 2
In 2 predeterminated positions in 2 electrode positions (first electrode 311 and second electrode 312) and non-electrode region carry out first time point
Glue, the predeterminated position meet the support requirement of chip.Quartz wafer 5 is drawn by spot gluing equipment pick device, and by quartz
Chip 5 is pressed on the position progress second for then corresponding to former conducting resinl on the conducting resinl inside the pedestal 2 on quartz wafer 5
Secondary dispensing, together it is put into baking oven together with pedestal 2 after the completion of the dispensing of quartz wafer 5 and carries out baking-curing.
A kind of adhering method for quartz wafer 5 provided by the invention, by non-electrode to 2 electrode positions and 2
The predeterminated position in region carries out dispensing, adds dispensing position 4, makes it have big adhesive strength, structure fixing compact, bears ring
The features such as border impact magnitude is big, disclosure satisfy that requirement of the quartz wafer 5 under high operating environment.And use dispensing twice
Technique, the fastness of the bonding of quartz wafer 5 is strengthened while having saved the space on one side quartz wafer 5, is easy to the later stage
Technique encapsulates.It should be noted that this dispensing amount differs twice, its content is preset according to concrete technology, the present invention no longer
Repeat.The predeterminated position can be non-edge position, marginal position or the corner location of corresponding quartz wafer 5, but described
Predeterminated position needs the requirement for the support for meeting chip.When the predeterminated position is corresponding non-edge position, the energy of quartz wafer 5
Enough meet the requirement of the support of chip, but it is poor compared to marginal position or corner location, its oscillation effect effect.
In addition, in order that quartz wafer 5 has more preferable oscillation effect, with reference to Fig. 2 on the premise of wafer support is ensured
It is shown, it is preferable that the predeterminated position is corresponds to the marginal position of the quartz wafer 5, compared to non-edge position, margin location
One is put to make quartz wafer 5 that there is more preferable oscillation effect, two to be beneficial to vibration when stress balance.
In addition, compared to a upper specific embodiment, it is preferable that with reference to shown in Fig. 2, the predeterminated position is corresponding
Two corners of the quartz wafer 5 away from the electrode position.Generally, the electrode position corresponds to quartz wafer mostly
5 two corner locations, therefore when predeterminated position is two other corner of quartz wafer 5, equivalent to by quartz wafer 5 four
Individual corner is adhesively fixed so that the non-edge position of quartz wafer 5 has a best oscillation effect, and in vibration due to
Corner location is symmetrical structure, therefore the position mean forced of conductive adhesive, disclosure satisfy that the use under higher operating environment
It is required that.
In addition, the present invention provides a specific embodiment, second of conducting resinl for dispensing glue and first time dispensing
Conductive gemel connection.Specifically, second of dispensing can be reduced equivalent to the reverse side dispensing in same position, dispensing twice one
Dispensing space required for one side, particularly with the techniques such as follow-up encapsulation, dispensing amount excessively makes encapsulation difficult, or even seals
The conducting resinl for filling latter two electrode position is connected due to extruding, causes short circuit；Two can make vibration in itself to increase dispensing position
Effect is restricted, and makes the equivalent resistance of quartz wafer larger, it is therefore desirable to ensure that the amount of conducting resinl is more few better, will be second
Conducting resinl for dispensing glue is bonding with that can be greatly reinforced after conductive gemel connection for dispensing glue for the first time in the case of less conducting resinl
Fastness, solves the short circuit problem that equivalent resistance is big and is subsequently likely to occur.
Obviously, the above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not pair
The restriction of embodiments of the present invention, for those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms, all embodiments can not be exhaustive here, it is every to belong to this hair
Row of the obvious changes or variations that bright technical scheme is extended out still in protection scope of the present invention.
Claims (4)
1. a kind of adhering method for quartz wafer, it is characterised in that this method comprises the following steps：
S1, prepare bonding agent：The material of bonding agent is conducting resinl, and the composition of the conducting resinl includes silver powder and resin；
S2, cleaning object to be bonded：The pedestal of electroded quartz wafer and fixed quartz wafer is immersed into acid cleaning fluid simultaneously
1-2 minutes are cleaned using ultrasonic wave, then natural cooling；Cleaning fluid is poured out after cooling and is neutralized using sodium hydroxide solution；
Then quartz wafer and pedestal are rinsed well with the distilled water or deionized water of boiling, with being dried after absolute ethyl alcohol dewater treatment
It is dry；
S3, bonding:Electroded quartz wafer is placed on fixed position, by spot gluing equipment to 2 in base interior region
Electrode position and the predeterminated position in 2 non-electrode regions carry out first time dispensing, and the predeterminated position meets that the support of chip will
Ask.Quartz wafer is drawn by spot gluing equipment pick device, and quartz wafer is pressed on the conducting resinl of the base interior, so
The position for corresponding to former conducting resinl on quartz wafer afterwards carries out second of dispensing, together with pedestal after the completion of the quartz wafer dispensing
Together it is put into baking oven and carries out baking-curing.
2. it is used for the adhering method of quartz wafer according to claim 1, it is characterised in that the predeterminated position is corresponding institute
State the marginal position of quartz wafer.
3. it is used for the adhering method of quartz wafer according to claim 2, it is characterised in that the predeterminated position is corresponding remote
From two corner locations of the quartz wafer of the electrode position.
4. it is used for the adhering method of quartz wafer according to claim 2, it is characterised in that
Second of conducting resinl for dispensing glue and conductive gemel connection for dispensing glue for the first time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710778642.8A CN107508570A (en) | 2017-09-01 | 2017-09-01 | A kind of adhering method for quartz wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710778642.8A CN107508570A (en) | 2017-09-01 | 2017-09-01 | A kind of adhering method for quartz wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107508570A true CN107508570A (en) | 2017-12-22 |
Family
ID=60694831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710778642.8A Pending CN107508570A (en) | 2017-09-01 | 2017-09-01 | A kind of adhering method for quartz wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107508570A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
| CN103078601A (en) * | 2012-12-28 | 2013-05-01 | 北京无线电计量测试研究所 | Metal bonding method for quartz wafer |
| CN103138710A (en) * | 2011-11-23 | 2013-06-05 | 北京晨晶电子有限公司 | Connecting method of wafer and base and obtained crystal resonator |
| CN204559526U (en) * | 2015-03-24 | 2015-08-12 | 珠海东精大电子科技有限公司 | A kind of quartz-crystal resonator with novel spot gluing structure |
| CN106849900A (en) * | 2016-12-15 | 2017-06-13 | 北京无线电计量测试研究所 | A kind of pedestal for installing quartz wafer |
-
2017
- 2017-09-01 CN CN201710778642.8A patent/CN107508570A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
| CN103138710A (en) * | 2011-11-23 | 2013-06-05 | 北京晨晶电子有限公司 | Connecting method of wafer and base and obtained crystal resonator |
| CN103078601A (en) * | 2012-12-28 | 2013-05-01 | 北京无线电计量测试研究所 | Metal bonding method for quartz wafer |
| CN204559526U (en) * | 2015-03-24 | 2015-08-12 | 珠海东精大电子科技有限公司 | A kind of quartz-crystal resonator with novel spot gluing structure |
| CN106849900A (en) * | 2016-12-15 | 2017-06-13 | 北京无线电计量测试研究所 | A kind of pedestal for installing quartz wafer |
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Application publication date: 20171222 |