CN107507789A - 一种旋转夹持台 - Google Patents

一种旋转夹持台 Download PDF

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CN107507789A
CN107507789A CN201710655117.7A CN201710655117A CN107507789A CN 107507789 A CN107507789 A CN 107507789A CN 201710655117 A CN201710655117 A CN 201710655117A CN 107507789 A CN107507789 A CN 107507789A
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main shaft
motor
clamping table
pedestal
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陈文�
牛伟光
尚美杰
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Ningbo Advance Automation Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Computer Hardware Design (AREA)
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Abstract

本发明提供了一种旋转夹持台,其包括:座体;主轴,铰接在座体上,所述主轴中部具有用于固定待封装激光器芯片的平面;电机,设置在座体外侧并与主轴直接连接,所述电机直接驱动主轴进行旋转动作。本旋转夹持台具有结构简单、动态响应快、定位精度高、可靠性好的优点。

Description

一种旋转夹持台
技术领域
本发明属于机械技术领域,涉及一种旋转夹持台。
背景技术
全自动引线键合机是利用超声波能量、热和压力,将金属丝一端键合在半导体芯片上,另一端键合在管脚上,从而达到电气连接的一种设备。TO56是激光发射器封装形式的一种,旋转夹持台主要为了解决半导体芯片分布在不同角度平面上时带来的键合挑战。
目前出现的旋转夹持台驱动模式都是用步进电机或伺服电机加上齿轮结构或同步带组成的传统驱动***。虽然这种解决办法可以实现大扭矩的运行,但由于加入了齿轮减速机构或同步带,增加了误差累积,降低了***的精度和刚度;并且由于长时间的运动所造成的机械磨损无法避免,会进一步加剧误差累积的扩大和动态特性的恶化。
综上所述,需要设计一种结构简单、可靠性高的旋转夹持台。
发明内容
本发明的目的是针对现有的技术存在上述问题,提出了一种结构简单、动态响应快、定位精度高、可靠性好的旋转夹持台。
本发明的目的可通过下列技术方案来实现:一种旋转夹持台,包括:
座体;
主轴,铰接在座体上,所述主轴中部具有用于固定待封装激光器芯片的平面;
电机,设置在座体外侧并与主轴直接连接,所述电机直接驱动主轴进行旋转动作。
作为本发明的进一步改进,所述电机设置为扇形直驱电机,改变扇形直驱电机的电流方向和大小能控制激光器芯片的旋转方向和速度。
作为本发明的更进一步改进,所述扇形直驱电机可设置为三相电机或音圈电机。
作为本发明的进一步改进,在座体上还设有与主轴相接并与电机控制***电气连接的旋转编码器,所述旋转编码器用于实时监测并反馈旋转夹持台角度。
作为本发明的更进一步改进,所述电机与主轴一端相连,所述旋转编码器可与电机同侧设置并安装于主轴对应位置,或安装于主轴远离电机的一端。
作为本发明的又一种改进,所述旋转编码器包括套设在主轴上的光栅尺以及安装在座体上并与光栅尺适配的读数头。
基于上述技术方案,本发明实施例至少可以产生如下技术效果:整体旋转夹持台结构简单且各部件之间紧密配合,电机直接驱动相较于传统驱动方式来讲,可以去除中间部分的机械结构,例如移除了从电机到主轴(旋转轴)之间的传动链,使电机与主轴直接连接,减少了由于机械传动结构带来的误差,本旋转夹持台总体结构更加简单,重量更轻,刚度更高,消除了中间误差,在旋转精度上更优秀,动态响应快,可靠性也得到了提高,降低了驱动时产生的噪声。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明,其中:
图1是本发明一较佳实施例的结构示意图。
图2是图1另一视角的结构示意图。
图3是本发明一较佳实施例的局部结构示意图。
图4是本发明中旋转编码器另一较佳实施例的结构示意图。
图中,10、座体;20、主轴;30、电机;40、旋转编码器;41、光栅尺;42、读数头;50、芯片;60、管座。
具体实施方式
以下是本发明的具体实施例并结合附图,对本发明的技术方案作进一步的描述,但本发明并不限于这些实施例。
下面结合图1至图4对本发明提供的技术方案进行更为详细的阐述。
如图1至图3所示,本旋转夹持台包括:
座体10,为旋转夹持台的主要载体;
主轴20,即为旋转夹持台的旋转轴,其铰接在座体10上,所述主轴20中部具有用于固定待封装激光器芯片的平面;本案还可进一步优选主轴20中部下沉使主轴整体呈平摆的“[”型结构,上述平面为主轴中部朝上的平整端面;
电机30,设置在座体10外侧并与主轴20直接连接,所述电机30直接驱动主轴20进行旋转动作。
本发明保护一种旋转夹持台,特别是一种全自动引线键合机上的旋转夹持台,本旋转夹持台主要攻克的是TO56型红外半导体激光器芯片分布在不同角度平面上时带来的键合挑战,适用于TO56芯片封装。
鉴于传统电动驱动***误差较大以及结构较为复杂这一现状,本发明重点改进是提供了一种直接驱动旋转夹持台的驱动方式;本旋转夹持台整体结构简单且各部件之间紧密配合,电机30直接驱动相较于传统驱动方式来讲,可以去除中间部分的机械结构,例如移除了从电机30到旋转轴(主轴20)之间的传动链,使电机30与旋转轴直接连接,减少了由于机械传动结构带来的误差(例如位置误差),本旋转夹持台总体结构更加简单,重量更轻(即本旋转夹持台更加轻便简单),刚度更高,消除了中间误差,在旋转精度上更优秀,可靠性也得到了提高,降低了驱动时产生的噪声。
在本发明总体结构中,待封装的TO56激光器芯片固定于旋转夹持台的主轴20的平面上,由电机30直接与主轴20连接,实现对TO56激光器芯片的直接旋转驱动。
具体的,参见图1和图3所示,待封装的TO56激光器芯片50安装于管座60上,管座60固定于旋转夹持台的主轴20的平面上,电机30安装在座体10外侧,电机30置于主轴20外侧并与主轴20直接连接,其作为动力带动主轴20进行旋转,实现TO56激光器芯片50以Y轴为中心轴的旋转。
结合图3所示,两个芯片50之间形成有90°的夹角,在不拆卸TO56管座60的情况下,实现了对两个芯片50的同步焊接,即完成在相互垂直的平面上的焊点的焊接。
进一步的,本案中的电机30优选设置为扇形直驱电机,改变扇形直驱电机的电流方向和大小能控制激光器芯片的旋转方向和速度,进而实现夹持台能在多角度进行固定;即改变扇形直驱电机的电流方向和大小能控制TO56芯片的旋转方向和速度,实现TO56芯片以Y轴为中心轴的旋转。
更进一步的,上述扇形直驱电机可设置为三相电机或音圈电机。本发明中的直接驱动电机30为扇形直驱电机,具有结构简单、高加速、响应快等特性。扇形直驱电机的原理是通电线圈在磁场中运动,其产生的安培力与磁场强弱和电流大小成正比,故在磁场不变的情况下可以通过改变电流方向实现运动方向的变化,也可以通过改变电流大小来改变安培力的大小,以此实现对于主轴20旋转加速度的控制。
再进一步的,为保证旋转夹持台的精确旋转,本旋转夹持台在直驱电机30基础上还配合加设了可实现闭环控制的旋转编码器40,即在座体10上还设有与主轴20相接并与电机30控制***电气连接的旋转编码器40,所述旋转编码器40用于实时监测并反馈旋转夹持台角度。
本发明的旋转夹持台上监测和反馈旋转夹持台角度的设备为旋转编码器40,通过对于旋转夹持台实时角度的监测,并将数据反馈入扇形直驱电机控制***,达到闭环控制,极大地提高了扇形直驱电机角度的定位精度,进而实现待封装的TO56激光器芯片在不同角度平面上的键合。
在本案中,电机30与主轴20一端相连,所述旋转编码器40可与电机30同侧设置并安装于主轴20对应位置,或安装于主轴20远离电机30的一端;即本案中的旋转编码器40的安装位置具有多种实施例,其中一种如图1所示,旋转编码器40安装在主轴20远离电机30的一端(如果定义电机30在座体10一侧,则旋转编码器40置于座体10另一侧)。
结合图4所示,还公开了另一种实施例如下:旋转编码器40与电机30同侧设置并安装于主轴20对应位置,优选旋转编码器40和电机30分列在座体10的内、外侧。
进一步的,为保证旋转夹持台的旋转精度,优选旋转编码器40包括套设在主轴20上的光栅尺41以及安装在座体10上并与光栅尺41适配的读数头42。
旋转夹持台也即TO56激光器芯片的角度数据经旋转编码器40的光栅尺41和读数头42进行实时监测并反馈,以达到闭环控制,实现对待封装的TO56激光器芯片的旋转角度的高精度控制,提高旋转精度和速度,提高封装的工作效率,降低时间成本。
本发明中扇形直驱电机配合旋转编码器40的反馈,达到闭环控制,可以进一步提高旋转精度,更适用于高精度的TO56激光器的芯片封装,能有效地提高封装的效率和可靠性,大幅度降低了后期的维护成本,提高了使用寿命。
综上所述,本发明通过扇形直驱电机直接驱动旋转夹持台,并通过旋转编码器40实现实时角度反馈,提高夹持台的旋转精度和速度;由于采用扇形直驱电机作为动力直接驱动旋转夹持台主轴20,移除了中间传动机构,并且用旋转编码器40直接读取旋转角度,在精度和刚度上都得到提高,动态特性也大大改善;由于空间的限制,扇形电机比圆形电机更有优势,它使得电机定子和动子部分不用高过旋转中心轴,或只高出一小部分,方便操作工进行各种操作;另外由于取消了齿轮机构,***的精度寿命以及可靠性都大为改善,后期维护成本及维护时间成本大为降低。
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。

Claims (6)

1.一种旋转夹持台,其特征在于:包括:
座体;
主轴,铰接在座体上,所述主轴中部具有用于固定待封装激光器芯片的平面;
电机,设置在座体外侧并与主轴直接连接,所述电机直接驱动主轴进行旋转动作。
2.根据权利要求1所述的一种旋转夹持台,其特征在于:所述电机设置为扇形直驱电机,改变扇形直驱电机的电流方向和大小能控制激光器芯片的旋转方向和速度。
3.根据权利要求2所述的一种旋转夹持台,其特征在于:所述扇形直驱电机可设置为三相电机或音圈电机。
4.根据权利要求1所述的一种旋转夹持台,其特征在于:在座体上还设有与主轴相接并与电机控制***电气连接的旋转编码器,所述旋转编码器用于实时监测并反馈旋转夹持台角度。
5.根据权利要求4所述的一种旋转夹持台,其特征在于:所述电机与主轴一端相连,所述旋转编码器可与电机同侧设置并安装于主轴对应位置,或安装于主轴远离电机的一端。
6.根据权利要求4或5所述的一种旋转夹持台,其特征在于:所述旋转编码器包括套设在主轴上的光栅尺以及安装在座体上并与光栅尺适配的读数头。
CN201710655117.7A 2017-08-03 2017-08-03 一种旋转夹持台 Pending CN107507789A (zh)

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