CN107507695A - Coil device and its manufacture method - Google Patents
Coil device and its manufacture method Download PDFInfo
- Publication number
- CN107507695A CN107507695A CN201710447177.XA CN201710447177A CN107507695A CN 107507695 A CN107507695 A CN 107507695A CN 201710447177 A CN201710447177 A CN 201710447177A CN 107507695 A CN107507695 A CN 107507695A
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- China
- Prior art keywords
- coil
- basalis
- communication
- coil device
- pattern
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
According to one embodiment of present invention, a kind of coil device and its manufacture method are disclosed.Coil device according to an embodiment of the invention includes：First basalis, including epoxy resin, the epoxy resin include aromatic compound and rubber compound；And the first metal layer, with first basalis while directly contact, and formed with receiving electric coil for receiving wirelessly send the first of electric power.
Description
Technical field
The present invention relates to a kind of in coil device and its manufacture method of the printed circuit board (PCB) formed with coil.
Background technology
Portable terminal etc. is included in coil device of the printed circuit board (PCB) formed with coil, for from outside with wireless parties
Formula receives electric power, either receives or data or information are sent into outside the data or information that are sent from outside.
Recently, with the slimming of the equipment such as portable terminal, it is desirable to which the thickness of the coil device is also thinning.Also,
For holding equipment more flexible design the purpose of, the coil device possess the necessity of good bending property also by
It is cumulative to add.
[prior art literature]
[patent document]
(patent document 1) Korean Patent Laid the 2014-111799th
The content of the invention
According to one embodiment of present invention, there is provided a kind of in coil device of the printed circuit board (PCB) formed with coil.
According to one embodiment of present invention, there is provided a kind of method for manufacturing coil device.
Coil device according to an embodiment of the invention includes：First basalis, including epoxy resin, the epoxy
Resin includes aromatic compound and rubber compound；And the first metal layer, with first basalis while it is straight
Contact, and receive electric coil formed with first for receiving the electric power wirelessly sent.
The method of manufacture coil device according to an embodiment of the invention, comprises the following steps：Preparation includes epoxy
First basalis of resin, the epoxy resin include aromatic compound and rubber compound；So that the one of the first metal layer
The mode that face turns into dull surface is surface-treated；With the first metal layer with first basalis while it is straight
The mode of contact arranges, and first basalis is Nian Jie with the first metal layer；And in the first metal layer
Form coil.
Coil device according to an embodiment of the invention includes：Magnetosphere, including at least one magnetic；First base
Bottom, with it is described magnetospheric while directly contact, and include aromatic compound including epoxy resin, the epoxy resin
Thing and rubber compound；The first metal layer, simultaneously the another side with first basalis directly contacts, and leads to formed with first
Believe pattern；Second basalis, simultaneously directly contacted with the magnetospheric another side, and including epoxy resin, the asphalt mixtures modified by epoxy resin
Fat includes aromatic compound and rubber compound；Second metal layer, simultaneously the another side with second basalis directly connect
Touch, and formed with the second communication pattern；And multiple through holes, by one end of the described first communication pattern and the other end and described the
One end of two communication patterns and the other end are electrically connected, so that the first communication pattern is connected with the described second communication pattern
Connect and form the communication coil of solenoid form.
Therefore, according to coil device according to an embodiment of the invention and its manufacture method, it is possible to provide following line
Coil apparatus：With the property being easily bent, at the same time thinner must can realize, and peel strength is stronger, and insulating properties is also outstanding.
Also, manufacturing process can be simplified, and material cost can be saved, so as to which production efficiency and economy can also be improved.
Brief description of the drawings
Fig. 1 and Fig. 2 respectively roughly represents the equipment for including coil device according to an embodiment of the invention
The figure of one embodiment.
Fig. 3 is the figure for the plan for roughly representing coil device according to an embodiment of the invention.
Fig. 4 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.
Fig. 5 is the figure of the experimental result for the peel strength for representing coil device according to an embodiment of the invention.
Fig. 6 a to Fig. 6 d are to represent that the printed circuit board (PCB) according to an embodiment of the invention in coil device is formed
The figure of the form of the embodiment of conductor patterns and the form of comparative example.
Fig. 7 a and Fig. 7 b are point for the partial cross section for roughly representing coil device according to an embodiment of the invention
Solve the figure of figure.
Fig. 8 and Fig. 9 respectively roughly represents cutting for wireless power reception device according to an embodiment of the invention
The figure in face.
Figure 10 is the reality for the plan for roughly representing wireless power reception device according to an embodiment of the invention
Apply the figure of example.
Figure 11 to Figure 13 respectively roughly represents wireless power reception device according to an embodiment of the invention
The figure in section.
Figure 14 is the reality for the plan for roughly representing wireless power reception device according to an embodiment of the invention
Apply the figure of example.
Figure 15 is the figure in the section for roughly representing wireless power reception device according to an embodiment of the invention.
Figure 16 a to Figure 16 c are the system for roughly representing wireless power reception device according to an embodiment of the invention
Make the figure of method.
Symbol description
1-1、1-2：Equipment 100,100-1,100-2：Printed circuit board (PCB)
10、11、12、13、14-1、14-2、15-1、15-2、16-1、16-2、17-1、17-2、18-1、18-2：Basalis
20-1、20-2、21-1、21-2、22-1、22-2、23-1、23-2、24-1、24-2、25-1、25-2、26-1、26-
2、27-1、27-2、28-1、28-2：Metal pattern
Embodiment
Hereinafter, the present invention is described with reference to the drawings is preferable to carry out form.However, the embodiment of the present invention can be deformed into
Various other forms, the scope of the present invention are not limited to embodiment described below.And, there is provided implementation shape of the invention
The purpose of state is, the present invention is described more fully to the personnel for possessing average knowledge in relevant art field.
Fig. 1 and Fig. 2 respectively roughly represents the equipment for including coil device according to an embodiment of the invention
Figure.
Reference picture 1, equipment 1-1 according to an embodiment of the invention can be the intelligence for including coil device 100-1
Mobile phone, reference picture 2, equipment 1-2 according to an embodiment of the invention can also be the intelligent hand including coil device 100-2
Table.
In fig. 1 and 2, the exemplified smart mobile phone of difference and intelligent watch, but the equipment of the present invention can be more
The mobile device or electronic equipment of sample.
Can be the printing formed with least one coil in coil device 100-1,100-2 that Fig. 1 and Fig. 2 are shown respectively
Circuit board.The coil both can be for receiving the receipts electric coil of electric power that wirelessly sends or for sending out
Send or receive the communication coil of a variety of data or information.The data or information can be with wireless near field communication (NFC:
Near Field Communication) mode or magnetic security transmission (MST:Magnetic Secure Transmission)
Mode is transmitted or received.Moreover, can be according to WPC (Wireless Power Consortium), A4WP (Alliance for
Wireless Power), PMA (Power Metters Allinace), other various standards and send or receive electric power.
Fig. 3 is the figure for the plan for roughly representing coil device according to an embodiment of the invention.
Coil device 100 according to an embodiment of the invention can be the printing for including basalis 10 and metal level 20
Circuit board.Can be formed with first coil 110, the second coil 120 and tertiary coil 130 in metal level 20.Also, coil device
100 may include：Portion of terminal 150, including electrically connect respectively with first coil 110, the second coil 120 and tertiary coil 130 more
Individual terminal；Connecting portion 140, formed with connecting pattern, the connecting pattern is used to make multiple terminals and first coil 110, the second line
Circle 120 and tertiary coil 130 are electrically connected.The multiple terminal and connecting pattern can be formed at metal level 20.
First coil 110 can be the receipts electric coil for receiving the electric power wirelessly sent, and the second coil 120 can
Be used for wireless near field communication (NFC:Near Field Communication) mode by data or information send and/
Or the communication coil received, tertiary coil 130 can be used to transmit (MST with magnetic security:Magnetic Secure
Transmission) the communication coil that data or information are sent and/or received by mode.
Fig. 4 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention, according to this
The wireless power reception device 100 of one embodiment of invention includes basalis 10 and metal level 20-1,20-2.
Basalis 10 includes epoxy resin, and it can be the epoxies film with the property that can be bent.Now, epoxy
Resin can include aromatic compound and rubber compound.As the example of aromatic compound, the public affairs such as bisphenol-A, Bisphenol F can be enumerated
The bisphenol compound known, but it is not limited to this.As rubber compound, natural rubber, styrene-butadiene rubber can be enumerated
Glue, poly-chloroprene rubber, nitrile rubber, butyl rubber, butadiene rubber, isoprene rubber, ethylene-propylene rubber, more sulphur
The synthetic rubber such as compound system rubber, silicon rubber, fluorubber, polyurethane rubber, ACM, but it is not limited to this.
By the aromatic compound of epoxy resin, basalis 10 can have outstanding machinery, chemical property, but also can pass through ring
The rubber compound of oxygen tree fat and there is flexible characteristic.
According to one embodiment of present invention, basalis 10 can be semi-solid preparation epoxy film.If use semi-solid preparation epoxy
Film, then with the solidification of semi-solid preparation epoxy film, can possess bonding force, therefore without single adhesive linkage.Accordingly, gold can be achieved
Belong to the slimming of plywood 100, and the clinging force between basalis 10 and metal level 20-1,20-2 can be improved.
According to one embodiment of present invention, basalis 10 can also include inorganic filler.Inorganic filler can be oxidation
Aluminium, such as can be aloxite (AI2O3) (Fused Al2O3) etc., but it is not limited to this.It is molten when being used as inorganic filler
Melt aluminum oxide (Fused Al2O3) etc. when, by the combination between the epoxy resin of above-mentioned material, can further improve substrate
The machinery of layer 10, chemical property.
In addition, with order to reduce thermal coefficient of expansion (CTE：Coefficient of Thermal Expansion) and carry
High glass-transition temperature (Tg:Glass Transition Temperature) and increase the content of inorganic filler, basalis
The relative amount of 10 epoxy resin is reduced, so as to so that the clinging force between basalis 10 and metal level 20-1,20-2 subtracts
It is small.
According to one embodiment of present invention, basalis 10 can also include adhesion promoters (adhesion
promoter).As adhesion promoters, as long as it can be used together with the epoxy resin of above-mentioned material, curing agent etc. and right
Basalis 10 assigns the material of cementability, so that it may is not added with using specifically limitedly.When using adhesion promoters, can further it carry
Clinging force between high basalis 10 and metal level 20-1,20-2, the relative amount so as to solve due to epoxy resin subtract
The problem of clinging force deficiency occurred less.
According to one embodiment of present invention, basalis 10 may also include curing agent.As curing agent, can be used with it is above-mentioned
Reactive outstanding acid amides system curing agent between the epoxy resin of material etc., but it is not limited to this.
According to one embodiment of present invention, basalis 10 does not include glass cloth (Glass Cloth).If include glass
Cloth (Glass Cloth), then because of glass cloth (Glass Cloth) rigidity characteristics, had difficulties when realizing flexible characteristic, and
It may be had difficulties because of the thickness of glass cloth in terms of slimming.Therefore, according to one embodiment of present invention, can be from substrate
Layer 10 excludes glass cloth (Glass Cloth), so as to so that wireless power reception device 100 has thinner thickness, with this
There is the property being easily bent simultaneously.
, can be formed with scheming in metal level 20-1,20-2 of coil device 100 according to an embodiment of the invention
First coil 110, the second coil 120, tertiary coil 130, the connecting pattern of connecting portion 140 and the portion of terminal 150 illustrated in 3
Terminal.
According to one embodiment of present invention, metal level 20-1,20-2 can include metallics, such as aluminium (Al), silver
(Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or their alloy etc..Metal level 20-1,20-2 can be
Copper foil, in this case, it is possible to by the way that coil pattern is formed at into epoxy flexible copper clad plywood (Flexible CCL:
Flexible Copper Clad Laminate), so as to realize wireless power reception device 100.
According to one embodiment of present invention, metal level 20-1,20-2 can be contacted directly with basalis 10 respectively, i.e. can
In the case of not single adhesive linkage, metal level 20-1,20-2 is set to be attached at basalis 10.
According to one embodiment of present invention, in order to improve the clinging force between basalis 10 and metal level 20-1,20-2,
The sudden strain of a muscle for forming low roughness can be performed in the face that the basalis 10 with metal level 20-1,20-2 connects and loses (flash
Etching) or it is surface-treated.For example, wireless power reception device 100 according to an embodiment of the invention can be by as follows
The step of formed：Metal level 20-1,20-2 at least one side are surface-treated；In a face of basalis 10 or two faces
Laminated metal layer 20-1,20-2；And form coil pattern in metal level 20-1,20-2.If in this way, improve basalis 10 with
Clinging force between metal level 20-1,20-2, then without single adhesive linkage, therefore wireless power reception device 100 can be realized
Slimming.
Flatness, close property, cooperation as the plane for ensuring to connect with metal level 20-1,20-2 basalis 10
Property etc. metal level 20-1,20-2 surface treatment, gloss can be performed by carrying out zinc (Zn), chromium (Cr) processing etc.
(Shiny) surface treatment in face, can be unglazed to perform by carrying out zinc (Zn), chromium (Cr) processing or nozzle (nozzle) processing etc.
(Matte) surface treatment in face.
Metal level 20-1,20-2 stacking can perform as follows：In a face of basalis 10 or two faces, lead to
V- compactings (V-Press), roll pressing (Roll-Press) etc. and preparation property laminated metal layer 20-1,20-2 are crossed, then applies heat
Amount and pressure, and cool down at normal temperatures.Now, in the step of preparation property is laminated, without single adhesive linkage, can then realize
The simplification of technique.
, as needed, can also be by metal level 20-1,20-2 in metal level 20-1,20-2 preparation property Stacking steps
Multiple layers are laminated respectively.Also, basalis 10 can also be laminated multiple layers.
, as needed, can be in each metal level 20-1,20-2 in metal level 20-1,20-2 preparation property Stacking steps
On, either between basalis 10 and metal level 20-1,20-2 or between multiple basalises 10, or in multiple metals
Abnormity or foreign material are laminated again between each layer in layer 20-1,20-2.Abnormity or foreign material can be known cover layer,
Magnetic film, epoxy rigid film, polyimides system flexible membrane etc., but it is not limited to this.
By being processed to the metal level lamination of stacked substrates layer 10 and metal level 20-1,20-2, can be formed according to this
The coil device 100 of one embodiment of invention.Therefore, at least a portion in the section of coil device 100, such as arrangement are conductive
The part of body pattern, can be identical with the section shown in Fig. 4.
In fig. 4 it is shown that following situation：A part of profit of coil device 100 according to an embodiment of the invention
Metal level 20-1,20-2 metal level lamination are laminated with used in two surface layers of basalis 10 and are formed.However, according to the present invention's
A part for the coil device of one embodiment can also utilize the one side in basalis to be laminated with the metal level lamination of metal level
And formed.
Fig. 5 is the figure for the peel strength experimental result for representing coil device according to an embodiment of the invention, and it is
Based on IPC-TM-650 method of testings to coil device according to an embodiment of the invention and the coil device of comparative example
The result tested of peel strength.In Figure 5, (a) represents the experimental result of the coil device of the present invention, and (b) represents to make
With the experimental result of the coil device of the normal flexible printed circuit board (PCB) (Flexible PCB) of polyimides material, (c) table
Show the experimental result for the coil device for having used printed circuit board (Rigid PCB).
As shown in figure 5, the coil device of the present invention has stronger peel strength for comparing comparative example.
As described previously for the present invention coil device for, even if can between basalis and metal level non-binding
Layer mode realize, also compared with used common flexible printed circuit board or printed circuit board coil device have more
Strong peel strength.However, although how much flexible for situation that may be than having used common printed circuit board decrease, so
And the equipment such as portable terminal are arranged at, and the electric power wirelessly sent is received, or in order to send or receive data
Or information and the coil device that uses does not require high flexibility, therefore these will not turn into problem.On the contrary, can be real by thickness more unfertile land
It is existing, and production cost can be saved, therefore the coil device of the present invention has the line than having used normal flexible printed circuit board (PCB)
The advantages of coil apparatus is very more.
Fig. 6 a to Fig. 6 d are the embodiment for the conductor patterns for representing coil device according to an embodiment of the invention
Form (Fig. 6 a, Fig. 6 b, Fig. 6 c) and comparative example (Fig. 6 d) form figure.
For the conductor patterns that the metal level according to an embodiment of the invention in coil device is formed, such as
Shown in Fig. 6 a, there can be wave feature, but also there can be multiple (such as 4 or 12) lines as shown in Fig. 6 b and Fig. 6 c
The form being connected in parallel.
The test result that table 1 below is shown below：In coil device according to an embodiment of the invention and various
Form printed circuit board (PCB), form the conductor patterns with the form being shown respectively in Fig. 6 a to Fig. 6 d, surveyed so as to be formed
Test agent, then " two-fold test (DoubleFold Test) " method tests resistance to bend(ing) as specified in ISO5626.
[table 1]
As known from Table 1, according to one embodiment of present invention and manufacture test sample all there is outstanding resistance to bend(ing).
That is, by bending (bending) region of the bending with coil device according to an embodiment of the invention, such as figure is made
The connecting pattern of 3 connecting portion 140 is formed as that, with the form being shown respectively in Fig. 6 a to Fig. 6 c, coil can be substantially reduced
The fraction defective of device.
Fig. 7 a and Fig. 7 b are point for the partial cross section for roughly representing coil device according to an embodiment of the invention
Solve the figure of figure.
Basalis 11,12 can have to be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.
According to one embodiment of present invention, as shown in Figure 7a, metal foil 21-1,21-2 for being laminated in basalis 11 can be
There is gloss (Shiny) face and unglazed (Matte) face in production process.Or as shown in Figure 7b, it is laminated in the gold of basalis 12
Category paper tinsel 22-1,22-2 can only have unglazed (Matte) face in process of production.Metal foil 21-1,21-2,22-1,22-2 and base
Bottom 11,12 is bonded, so as to form the metal level of metal foil diaphragm plate.
That is, basalis is formed by the content according to Fig. 4, and zinc (Zn), chromium (Cr) is performed on the surface of metal foil
Processing or nozzle (nozzle) processing etc., so as to so that the face or two faces of metal foil turn into dull surface.Then, it is laminated
Basalis and metal foil and form metal foil diaphragm plate, and metal foil diaphragm plate metal level formed coil pattern, so as to make
Make the coil device of the present invention.
I.e., according to one embodiment of present invention, by make metal foil 21-1,21-2,22-1,22-2 dull surface with
The mode that basalis 11,12 contacts is laminated and forms metal foil diaphragm plate, and in metallic film plate shape into pattern, so as to realize
Coil device.Making metal foil 21-1,21-2,22-1,22-2 dull surface layer in a manner of being contacted with basalis 11,12
It is folded, so as to strengthen the bonding force between the conductor patterns such as the coil of coil device and basalis (or insulating barrier).
Although not illustrating, but for Fig. 7 b situation, can in metal foil 22-1 upper surface and/or metal foil
22-2 lower surface is additionally arranged with the insulating barrier with the identical material of basalis 12.
Fig. 8 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.
Coil device according to an embodiment of the invention may include：Basalis 13；First metal pattern 23-1 and
Two metal pattern 23-2, directly attached in a manner of adhesive-free in two faces of basalis；Magnetosphere 43, it is arranged in the first gold medal
Metal patterns 23-1 top；Coating 33, it is arranged in the second metal pattern 23-2 bottoms.Basalis 13 can have with Fig. 4
Basalis (the 10 of Fig. 4) identical of explanation is formed.
By performing etching work procedure in the metal level that illustrates in Fig. 4 and Fig. 7 a, Fig. 7 b or other are used to form pattern
Process etc., the first metal pattern 23-1 and the second metal pattern 23-2 can be formed.
The first insulating barrier 53-1 and the second insulating barrier 53-2 can be arranged in two faces of magnetosphere 43.First insulating barrier 53-1
Can have and the identical material of basalis 13 with the second insulating barrier 53-2.That is, the first insulating barrier 53-1 and the second insulating barrier 53-2
Can have and be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.
Fig. 9 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.
As shown in figure 9, coil device according to an embodiment of the invention can be by by 2 basalises 14-1,14-
2 are laminated and are formed.The first metal pattern 24-1 can be arranged in basalis 14-1 upper surface, can in basalis 14-2 lower surface
Arrange the second metal pattern 24-2.Basalis 14-1 upper surface and the first metal pattern 24-1 are direct in a manner of non-binding layer
Contact, basalis 14-2 lower surface is directly contacted with the second metal pattern 24-2 in a manner of non-binding layer.Basalis 14-1
Can have with basalis 14-2 and be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.By in Fig. 4 and Fig. 7 a, Fig. 7 b
The metal level of middle explanation performs etching work procedure or other processes for being used to forming pattern etc., can form the first metal pattern 24-1
With the second metal pattern 24-2.
That is, for coil device according to an embodiment of the invention, 2 epoxy film layers are folded and form substrate
Layer, and can utilize and manufacture coil device in the metal level lamination that the folded metal level of two surface layers of basalis is formed.Such as
With it is illustrated in fig. 4 like that, for coil device according to an embodiment of the invention, following gold can also be utilized
Belong to plywood and manufacture, in the metal level that a face laminated metal layer of the basalis for being laminated 2 epoxy mesenterys and being formed is formed
Lamination.
Also, as shown in figure 9, for coil device according to an embodiment of the invention, in the first metal figure
Case 24-1 top can arrange the first coating 34-1, and the second coating 34- can be arranged in the second metal pattern 24-2 bottom
2。
Also, it can be arranged on the first coating 34-1 top including at least magnetic 44 and insulator 64-1,64-2
Magnetosphere.Magnetic 44 may be arranged at the part of coil formed in the first metal pattern 24-1 and the second metal pattern 24-2
Corresponding region.Insulator 64-1,64-2 can be disposed in the first metal pattern 24-1 and the second metal pattern 24-2 except
Other parts outside part formed with coil.By make insulator 64-1,64-2 be arranged in the identical layer of magnetic 44,
Insulator 64-1,64-2 can be made to play a part of securing plate.
The first insulating barrier 54-1 and the second insulating barrier 54-2 can be disposed with magnetospheric two faces.First insulating barrier
54-1 and the second insulating barrier 54-2 can have and basalis 14-1,14-2 identical material.That is, the first insulating barrier 54-1 and second
Insulating barrier 54-2 can have to be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.
Figure 10 is the embodiment for the metal pattern for roughly representing coil device according to an embodiment of the invention
Figure.
As described above, coil device according to an embodiment of the invention can wirelessly send electric power and information
Or receive.In the case, as shown in Figure 10, coil device of the invention may include to receive electric coil 210 and communication coil 220-
1、220-2.Now, it can be spiral (spiral) coil to receive electric coil 210, and communication coil 220-1,220-2 can be helicals
Manage (solenoid) coil.
2 metal levels can be formed at by receiving electric coil 210 and communication coil 220-1,220-2.In the case, electric coil is received
210 can have the form for being connected in parallel to 2 coils for being formed as solenoid form respectively in 2 metal levels.Moreover, order wire
Circle 220-1,220-2 can be formed by being formed at metal pattern and the multiple through holes 80 of 2 metal levels.More specifically,
The both ends of each metal pattern can be connected with each other by each through hole 80, so that being formed at the metal pattern of 2 metal levels turns into spiral shell
Communication coil 220-1,220-2 of spool form.As shown in Figure 10, communication coil 220-1 and communication coil 220-2 can phase each other
Every.Although also, do not illustrate, coil device can also include electrically connect communication coil 220-1 and communication coil 220-2
Connecting pattern.
Figure 11 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.Figure 11 can
Be Figure 10 I-I' opening positions section.
As shown in figure 11, coil device according to an embodiment of the invention may include：First magnetosphere, includes magnetic
Body 45-2,45-3 and insulator 65-3,65-4,65-5；First basalis 15-1 and the second basalis 15-2, is arranged in the first magnetic
Two faces of property layer；First metal pattern 25-1, it is arranged in the first basalis 15-1 upper surface；Second metal pattern 25-2,
It is arranged in the second basalis 15-2 lower surface.
Basalis 15-1 upper surface is directly contacted with the first metal pattern 25-1 in a manner of non-binding layer, basalis
15-2 lower surface is directly contacted with the second metal pattern 25-2 in a manner of non-binding layer.Basalis 15-1 and basalis 15-2
Can have and be formed with basalis (the 10 of Fig. 4) identical shown in Fig. 4.Pass through the metal level illustrated in Fig. 4 and Fig. 7 a, Fig. 7 b
Perform etching work procedure or other are used for the process etc. that forms pattern, the first metal pattern 25-1 and the second metal figure can be formed
Case 25-2.
That is, coil device according to an embodiment of the invention can be formed as follows：Including magnetic and absolutely
Magnetospheric two faces of edge body stack gradually epoxy mesentery and metal level.With the situation described in Fig. 4 similarly, according to this hair
The metal pattern of the coil device of bright one embodiment can only be arranged in magnetospheric one side.
Moreover, as shown in figure 11, can be in the first metal for coil device according to an embodiment of the invention
The first coating 35-1 is arranged on pattern 25-1 top, and in the second metal pattern 25-2 the second coating of lower disposed 35-
2。
Also, it can be arranged including at least magnetic 45-1 and insulator 65-1,65-2 on the first coating 35-1 top
The second magnetosphere.
The first insulating barrier 55-1 and the second insulating barrier 55-2 can be arranged in described second magnetospheric two faces.First insulation
Layer 55-1 and the second insulating barrier 55-2 can have and basalis 15-1,15-2 identical material.That is, the first insulating barrier 55-1 and
Two insulating barrier 55-2 can have to be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.
Coil device according to an embodiment of the invention not only receives the electric power wirelessly sent, but also can
So that data and/or information are wirelessly transmitted or received.In the case, the first metal pattern 25-1 and the second gold medal
Metal patterns 25-2 may include：Electric coil is received, for receiving the electric power wirelessly sent；Communication coil, for receiving and sending messages.
Insulator 65-5 and magnetic 45-1 can be disposed with forming the region corresponding to the part for receiving electric coil, described in formation
Region corresponding to the part of communication coil can be disposed with magnetic 45-2,45-3 and insulator 65-1,65-2.
I.e., it is assumed that Figure 11 is the section of the I-I' opening positions of Figure 10 coil device, then the first metal pattern 25-1 and the
The pattern in the region corresponding to insulator 65-6 region is arranged in two metal pattern 25-2 can form receipts electric coil.In this situation
Under, spiral can be had by receiving electric coil, be contained in the first metal pattern 25-1 receipts electric coil and be contained in the second gold medal
Metal patterns 25-2 receipts electric coil can be connected in parallel with each other and form receipts electric coil.As shown in Figure 10, coil device can also wrap
The connecting pattern for electrically connecting communication coil is included, also, the connecting pattern can be arranged in and the first metal pattern 25-1 phases
Layer together is arranged in and the second metal pattern 25-2 identical layers.Moreover, the first metal pattern 25-1 and the second metal pattern
The pattern that the region corresponding to each magnetic 45-2,45-3 region is arranged in 25-2 can be communication coil.Communication coil
There can be the solenoid form for surrounding each magnetic 45-2,45-3.
Show that the first magnetosphere includes magnetic 45-2,45-3 and insulator 65-3,65-4,65-5 situation in Figure 11,
But the first magnetosphere of coil device according to an embodiment of the invention only can also be made up of magnetic.
Figure 12 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.Figure 12 can
Be Figure 10 II-II' opening positions section.
As shown in figure 12, coil device according to an embodiment of the invention may include：Magnetosphere, include the first magnetic
Body 76, there is the second magnetic 46-1 and 46-2 and insulator 66-1 and 66- with the different qualities of the first magnetic 76
2；First basalis 16-1 and the second basalis 16-2, it is arranged in magnetospheric two faces；First metal pattern 26-1, is arranged in
First basalis 16-1 upper surface；Second metal pattern 26-2, it is arranged in the second basalis 16-2 lower surface.
Basalis 16-1 upper surface is directly contacted with the first metal pattern 26-1 in a manner of non-binding layer, basalis
16-2 lower surface is directly contacted with the second metal pattern 26-2 in a manner of non-binding layer.Basalis 16-1 and basalis 16-2
Can have and be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.The metal level that can illustrate in Fig. 4 and Fig. 7 a, Fig. 7 b
Perform etching work procedure or other are used for the process etc. that forms pattern, so as to form the first metal pattern 26-1 and the second gold medal
Metal patterns 26-2.
That is, coil device according to an embodiment of the invention can manufacture by using following metal level lamination,
Magnetospheric two faces including mutually different magnetic of more than two kinds and insulator by epoxy mesentery and metal level successively
The metal level lamination for being laminated and being formed.With situation illustrated in fig. 3 similarly, radio according to an embodiment of the invention
The metal pattern of power reception device can only be arranged in magnetospheric one side.
Also, can be with as shown in figure 12, for wireless power reception device according to an embodiment of the invention
The first coating 36-1 is arranged on the first metal pattern 26-1 top, and in the second metal pattern 26-2 lower disposed second
Coating 36-2.
As shown in figure 11, wireless power reception device according to an embodiment of the invention can be received wirelessly
Electric power is received and sent messages.In the case, the first metal pattern 26-1 and the second metal pattern 26-2 may include be used for receive with
The receipts electric coil and the communication coil for receiving and sending messages for the electric power that wireless mode is sent.Forming the part for receiving electric coil
Corresponding region can be disposed with the first magnetic 65, and the can be arranged forming the region corresponding to the part of the communication coil
Two magnetic 46-1,46-2.
I.e., it is assumed that Figure 12 be Figure 10 coil device II-II' opening positions section, then the first metal pattern 26-1 and
The pattern in the region corresponding to the region of magnetic 76 is arranged in second metal pattern 26-2 can form receipts electric coil.In this situation
Under, spiral can be had by receiving electric coil, and is contained in the first metal pattern 26-1 receipts electric coil and is contained in second
Metal pattern 26-2 receipts electric coil can be connected in parallel with each other and form receipts electric coil.Moreover, the first metal pattern 26-1 and
The pattern that the region corresponding to each magnetic 46-2,46-3 region is arranged in two metal pattern 26-2 can be order wire
Circle.Communication coil can have the solenoid form for surrounding each magnetic 46-2,46-3.
Figure 13 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.Figure 13 can
Be Figure 10 II-II' opening positions section.
As shown in figure 13, coil device according to an embodiment of the invention may include magnetosphere, the first metal pattern
27-1, the second metal pattern 27-2, the first basalis 17-1 and the second basalis 17-2, the magnetosphere may include the first magnetic
Body 47 and insulator 67-1,67-2.Moreover, coil device according to an embodiment of the invention can also include the first covering
Layer 37-1 and the second coating 37-2.
First magnetic 47 can be and magnetic 45-2 or 45-3 illustrated in fig. 11 or magnetic illustrated in fig. 12
Body 46-1,46-2 identical are formed.
Insulator 67-1,67-2 can be with it is exhausted described in insulator 65-3 or 65-4 or Figure 12 illustrated in fig. 11
Edge body 66-1,66-2 identical inscape.
First basalis 17-1 and the second basalis 17-2 can be respectively and the first basalis 15-1 illustrated in fig. 11
And second basalis 15-2 or the first basalis 16-1 illustrated in fig. 12 and the second basalis 16-2 identicals form.
First coating 37-1 and the second coating 37-2 can be respectively and the first coating 35-1 illustrated in fig. 11
And second coating 35-2 or the first coating 36-1 illustrated in fig. 12 and the second coating 36-2 identicals form.
Each through hole 87-1,87-2 can be to penetrate insulator 67-1,67-2 and the first basalis 17-1 and the second substrate
Layer 17-2 form is formed, and can electrically connect the first metal pattern 27-1 and the second metal pattern 27-2.According to circumstances, respectively
Individual through hole 87-1,87-2 can also be to penetrate insulator 67-1,67-2, the first basalis 17-1, the second basalis 17-2, first
Metal pattern 21-1 and the second metal pattern 27-2 form are formed.
The communication coil 220-1 shown in Figure 10 can be formed as follows：It is contained in the first metal pattern 27-1
Each first communication coil pattern and be contained in the second metal pattern 27-2 each second communication coil pattern both ends
It is connected with each other by through hole 87-1,87-2.The communication coil 220-2 shown in Figure 10 can also be with same method shape
Into.
Figure 14 is the embodiment for the metal pattern for roughly representing coil device according to an embodiment of the invention
Figure.
As shown in figure 14, coil device according to an embodiment of the invention may include communication coil 221-1,221-2.
Each communication coil 221-1,221-2 can be solenoid forms.Communication coil 221-1,221-2 can be with Figure 10 order wires
It is identical to enclose 220-1,220-2.That is, communication coil 221-1,221-2 can be following coil：It is being arranged in two of magnetic
The metal pattern that each metal level in face is formed respectively is connected with each other both ends by through hole 81, so as to real in the form of solenoid
It is existing.
The section of Figure 14 IV-IV' opening positions can be identical with Figure 13.
Figure 15 is the figure for the partial cross section for roughly representing coil device according to an embodiment of the invention.Figure 15 can
Be Figure 14 III-III' opening positions section.
As shown in figure 15, coil device according to an embodiment of the invention may include：Magnetosphere, include magnetic
45-2,45-3 and insulator 68-1,68-2,68-3；First basalis 18-1 and the second basalis 18-2, is arranged in the first magnetic
Two faces of layer；First metal pattern 28-1, it is arranged in the first basalis 18-1 upper surface；Second metal pattern 28-2, cloth
It is placed in the second basalis 18-2 lower surface.
Basalis 18-1 upper surface is directly contacted with the first metal pattern 28-1 in a manner of non-binding layer, basalis
18-2 lower surface is directly contacted with the second metal pattern 28-2 in a manner of non-binding layer.Basalis 18-1 and basalis 18-2
Can have and be formed with basalis illustrated in fig. 4 (the 10 of Fig. 4) identical.Pass through the metal illustrated in Fig. 4 and Fig. 7 a, Fig. 7 b
Layer performs etching work procedure or other are used for the process etc. that forms pattern, can form the first metal pattern 28-1 and the second metal figure
Case 28-2.
Also, as shown in figure 15, can be in the first gold medal for coil device according to an embodiment of the invention
The first coating 38-1 is arranged on metal patterns 28-1 top, and in the second metal pattern 28-2 coating of lower disposed second
38-2。
Coil device according to an embodiment of the invention can also wirelessly be sent out data and/or information
Send or receive.Now, the data and/or information can transmit (MST with magnetic security:Magnetic Secure
Transmission) mode is transmitted.Each magnetosphere 48-1,48-2 can be disposed at the area to be formed corresponding to the part of communication coil
Domain.
I.e., it is assumed that Figure 15 is the section of the III-III' opening positions of Figure 14 coil device, then the first metal pattern 28-1
With arrange that the region corresponding to each magnetic 48-1,48-2 region can form communication coil in the second metal pattern 28-2.
Communication coil can have the solenoid form for surrounding each magnetic 48-1,48-2.In fig.15, magnetic is included with magnetosphere
It is illustrated exemplified by 48-1,48-2 and insulator 68-1,68-2,68-3 situation, but insulator 68-1,68-2,68-3
In all or part can be omitted.If illustrated using Figure 14 situation as example, communicated being formed
Coil 221-1,221-2 region can arrange magnetic 48-1,48-2, and what region in addition can not arranged with.
In this case, insulator 68-1,68-2 or 68-3 top can also what do not arrange.I.e., in fig.15, can only exist
The first basalis 18-1, the first metal pattern 28-1 and the first coating 38-1 are arranged in magnetic 48-1,48-2 top, and
Insulator 68-1,68-2,68-3 and its first basalis 18-1, the first metal pattern 28-1 and the first coating of top stacking
38-1 can be by except.
Figure 16 a to Figure 16 c are the system for roughly representing wireless power reception device according to an embodiment of the invention
Make the figure of method.
Can be formed with Figure 13 identicals with Figure 13 identicals reference numeral in Figure 16 a to Figure 16 c.
First, shape processing, and profit are carried out using roll squeezer (Roll Press) and to insulator 67-1 (such as epoxy)
The basalis 17-2 of magnetic 47 and second is entered with roll squeezer (Roll Press) and/or trigger squeeze (Sheet Press) etc.
Row shape processes (reference picture 16a).Roll squeezer (Roll Press) and/or trigger squeeze (Sheet are utilized at this time it is also possible to perform
) etc. Press the first basalis 17-1 shape processing, and can also be by the first metal pattern 27-1 to be formed and the second gold medal
Metal patterns 27-2 metal foil cutting.
Then, by magnetic 47, insulator 67-1 and the second basalis 17-2 tack weldings (reference picture 16b).Using heat
(Hot Press) is pressed to perform tack welding process.Specifically, for magnetic 47, insulator 67-1 and the second basalis 17-2,
At relatively low temperatures with the relatively short time, be processed using hot pressing (Hot Press), so as to executable tack welding
Process.
Then, by the magnetic 47 being tack welded, insulator 67-1 and the second basalis 17-2, with the first basalis 17-1
And the first metal pattern 27-1's to be formed and the second metal pattern 27-2 is metal foil laminated, then utilizes hot pressing (Hot
Press) it is processed, so as to manufacture metal foil diaphragm plate (reference picture 16c).
Then, by etch etc. process and metal level formed pattern, so as to formed the first metal pattern 27-1 and
Second metal pattern 27-2, and through hole can be additionally formed.
More than, embodiments of the invention are described in detail, but the interest field of the present invention does not limit
In this, in the range of the technological thought of the invention described in claims is not departed from, various modification and change can be achieved
Shape, this is obvious for possessing the personnel of ABC in this area.
Claims (18)
1. a kind of coil device, including：
First basalis, including epoxy resin, the epoxy resin include aromatic compound and rubber compound；
The first metal layer, with first basalis while directly contact, and formed with for receive wirelessly
The first of the electric power of transmission receives electric coil.
2. coil device as claimed in claim 1, wherein, in addition to：
Multiple receipts electric terminals, are formed at the first metal layer；And
Multiple connecting patterns, be formed at the first metal layer, for by the multiple receipts electric terminal respectively with each described the
One receives the both ends electrical connection of electric coil, and each connecting pattern has wave-like.
3. coil device as claimed in claim 1, wherein, in addition to：
Multiple receipts electric terminals, are formed at the first metal layer；And
Multiple connecting patterns, be formed at the first metal layer, for by the multiple receipts electric terminal respectively with each described the
One receives the both ends electrical connection of electric coil, and each connecting pattern has the shape that multiple conductor patterns are connected in parallel.
4. coil device as claimed in claim 1, wherein, the institute of the first metal layer contacted with first basalis
It is dull surface to state one side.
5. coil device as claimed in claim 1, wherein, first basalis also includes adhesion promoters.
6. coil device as claimed in claim 1, wherein, in addition to：
Second metal layer, simultaneously the another side with first basalis directly contact, and formed with described first receive electric wire
Circle is connected in parallel and receives the second receipts electric coil of the electric power wirelessly sent；
Second basalis, simultaneously directly contacted with the another side of the second metal layer, and including epoxy resin, the asphalt mixtures modified by epoxy resin
Fat includes aromatic compound and rubber compound；And
Magnetic layer, another surface side of second basalis is arranged in, and including magnetic.
7. coil device as claimed in claim 6, wherein,
The magnetic layer also includes insulator,
The magnetic is arranged in the area corresponding to the region with receiving electric coil formed with described first in the magnetic layer
Domain, the insulator are arranged in the area corresponding to the region with not forming the first receipts electric coil in the magnetic layer
Domain.
8. coil device as claimed in claim 1, wherein, first basalis is by multiple rings for including the epoxy resin
Oxygen mesentery is laminated and formed.
9. coil device as claimed in claim 1, wherein, in addition to：
Communication coil, for data or information to be sent or received.
10. coil device as claimed in claim 9, wherein, the first receipts electric coil has spiral, the order wire
Circle has solenoid form.
11. coil device as claimed in claim 10, wherein, the communication coil includes：
First communication coil, it is arranged in described first and receives the side of electric coil, and there is solenoid form；And
Second communication coil, it is arranged in described first and receives the opposite side of electric coil, and is electrically connected with first communication coil, and
With solenoid form.
12. coil device as claimed in claim 10, wherein, in addition to：
Magnetic layer, simultaneously the another side with first basalis directly contact, and including the first magnetic；
Second basalis, simultaneously directly contacted with the another side of the magnetic layer, and including epoxy resin, the epoxy resin
Include aromatic compound and rubber compound；
Second metal layer, simultaneously the another side with second basalis directly contact, and including with described first receive electric coil
Second be connected in parallel receives electric coil；And
Multiple through holes,
Wherein, multiple first communication patterns for forming the communication coil are additionally formed with the first metal layer,
Multiple second communication patterns for forming the communication coil, first magnetic are additionally formed with the second metal layer
Property body be arranged in the first communication pattern and communicate with described second between pattern, the multiple through hole connection described first communicates
Pattern communicates pattern with described second, so as to be formed as helical tubular for the first communication pattern and the second communication pattern
State.
13. coil device as claimed in claim 12, wherein, in addition to：
Second magnetic, be arranged in and be disposed with it is described first receive electric coil region corresponding to region, and with it is described
The different property of first magnetic.
14. a kind of manufacture method of coil device, comprises the following steps：
Preparing includes the first basalis of epoxy resin, and the epoxy resin includes aromatic compound and rubber compound；
It is surface-treated in a manner of the one side for making the first metal layer turns into dull surface；
By the first metal layer with first basalis while directly contact in a manner of be arranged, and by institute
It is Nian Jie with the first metal layer to state the first basalis；And
The first receipts electric coil for receiving the electric power wirelessly sent is formed in the first metal layer.
15. the manufacture method of coil device as claimed in claim 14, wherein, also comprise the following steps：
Preparing includes the second basalis of epoxy resin, and the epoxy resin includes aromatic compound and rubber compound；
Magnetic and insulator positioning are welded in the one side of second basalis；
It is arranged in a manner of the another side for making first basalis directly contacts with the magnetic and the insulator；
It is arranged in a manner of the one side for making second metal layer directly contacts with the another side of second basalis；And
The another side of first basalis is Nian Jie with the magnetic and the insulator, and by the second metal layer
One side it is Nian Jie with the another side of second basalis.
16. the manufacture method of coil device as claimed in claim 15, wherein, also comprise the following steps：
It is surface-treated in a manner of the one side for making the second metal layer turns into dull surface.
17. a kind of coil device, including：
Magnetosphere, including at least one magnetic；
First basalis, with it is described magnetospheric while directly contact, and included including epoxy resin, the epoxy resin
Aromatic compound and rubber compound；
The first metal layer, simultaneously the another side with first basalis directly contact, and formed with first communication pattern；
Second basalis, simultaneously directly contacted with the magnetospheric another side, and including epoxy resin, the epoxy resin bag
Containing aromatic compound and rubber compound；
Second metal layer, simultaneously the another side with second basalis directly contact, and formed with second communication pattern；And
Multiple through holes, by described first communication pattern one end and the other end with described second communicate pattern one end and the other end
It is electrically connected, so that the first communication pattern is connected with the described second communication pattern and forms the communication of solenoid form
Coil.
18. coil device as claimed in claim 17, wherein, the communication coil includes：
First communication coil, including it is described first communication pattern in a part, it is described second communication pattern in a part with
And the part in the multiple through hole；And
Second communication coil, it is separated by with first communication coil, and including the remainder in the described first communication pattern, institute
The remainder in the second communication pattern and the remainder in the multiple through hole are stated,
The coil device also includes the connecting pattern for electrically connecting first communication coil and second communication coil.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20160074080 | 2016-06-14 | ||
| KR10-2016-0074080 | 2016-06-14 | ||
| KR10-2016-0169559 | 2016-12-13 | ||
| KR1020160169559A KR101912283B1 (en) | 2016-06-14 | 2016-12-13 | Coil device and manufacturing method of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107507695A true CN107507695A (en) | 2017-12-22 |
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ID=60679008
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710447177.XA Pending CN107507695A (en) | 2016-06-14 | 2017-06-14 | Coil device and its manufacture method |
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