CN107492592A - A kind of package structure for LED - Google Patents
A kind of package structure for LED Download PDFInfo
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- CN107492592A CN107492592A CN201710496660.7A CN201710496660A CN107492592A CN 107492592 A CN107492592 A CN 107492592A CN 201710496660 A CN201710496660 A CN 201710496660A CN 107492592 A CN107492592 A CN 107492592A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 99
- 239000002105 nanoparticle Substances 0.000 claims description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 239000003963 antioxidant agent Substances 0.000 claims description 20
- 230000003078 antioxidant effect Effects 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 19
- -1 polytrifluorochloroethylene Polymers 0.000 claims description 18
- 239000002250 absorbent Substances 0.000 claims description 16
- 230000002745 absorbent Effects 0.000 claims description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 12
- 239000000741 silica gel Substances 0.000 claims description 12
- 229910002027 silica gel Inorganic materials 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- 150000003568 thioethers Chemical class 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims description 3
- 229920001038 ethylene copolymer Polymers 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 3
- YAGBAUUBKBTRNY-UHFFFAOYSA-N CO[SiH](OC)OC.C(C=C)(=O)OCCC[SiH2]OCC Chemical compound CO[SiH](OC)OC.C(C=C)(=O)OCCC[SiH2]OCC YAGBAUUBKBTRNY-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 21
- 235000013339 cereals Nutrition 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical class CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- MASNVFNHVJIXLL-UHFFFAOYSA-N ethenyl(ethoxy)silicon Chemical compound CCO[Si]C=C MASNVFNHVJIXLL-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical class CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of package structure for LED, belong to technical field of semiconductor encapsulation, the package structure for LED includes circuit base plate, the light emitting diode being arranged on the circuit base plate, cover the first encapsulation glue-line of the light emitting diode, cover the second encapsulation glue-line of the first encapsulation glue-line, cover the 3rd encapsulation glue-line of the second encapsulation glue-line, cover the 4th encapsulation glue-line of the 3rd encapsulation glue-line, and the 5th encapsulation glue-line of covering the 4th encapsulation glue-line.The present invention is packaged using the encapsulation glue-line of laminated construction to light emitting diode, is improved the steadiness of package structure for LED, is extended its service life, and improves the luminous flux of light source.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, and in particular to a kind of package structure for LED.
Background technology
Existing package structure for LED is only to set the resin bed containing fluorescent material on the led chips,
Package structure for LED in normal work, light-emitting diode chip for backlight unit will persistent fever, caused heat will be passed to
Resin bed containing fluorescent material causes the temperature of fluorescent material to raise, and then causes the quantum efficiency of fluorescent material constantly to decay, and works as hair
During optical diode package structure long-term work, its luminous efficiency can be reduced gradually, while existing therefore LED package
Structure has the shortcomings that easily flavescence, easy to aging, service life is short, how to design a kind of encapsulating structure of excellent combination property, is
Industry urgent problem to be solved.
The content of the invention
The purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of package structure for LED.
To achieve the above object, a kind of package structure for LED proposed by the present invention, the LED package
Structure includes circuit base plate, the light emitting diode being arranged on the circuit base plate, covers the first envelope of the light emitting diode
Glue-line is filled, the second of covering the first encapsulation glue-line encapsulates glue-line, covers the 3rd encapsulation glue-line of the second encapsulation glue-line,
Cover the 4th encapsulation glue-line of the 3rd encapsulation glue-line, and the 5th encapsulation glue-line of covering the 4th encapsulation glue-line；
Described first, the three, the 5th encapsulation glue-lines are by composed of the following components in percentage by weight：Epoxy resin 100
Part；Fluororesin 30-50 parts；Organic silica gel 20-40 parts；Heat conducting nano particle 10-20 parts；Graphene 5-15 parts；Inorganic UV
Absorbent 0.5-3 parts；Antioxidant 3-5 parts；Tackifier 1-2 parts；Silane coupler 2-5 parts；
Described second, the 4th encapsulation glue-line is by composed of the following components in percentage by weight：100 parts of epoxy resin；Fluorine
Resin 30-50 parts；Organic silica gel 20-40 parts；Fluorescent powder grain 5-10 parts；Heat conducting nano particle 10-20 parts；Graphene 5-15
Part；Inorganic ultraviolet absorbent 0.5-3 parts；Antioxidant 3-5 parts；Tackifier 1-2 parts；Silane coupler 2-5 parts.
Preferably, the described first, second, third, fourth, the 5th encapsulation glue-line is hemispherical.
Preferably, the fluororesin is polytetrafluoroethylene (PTFE), polytrifluorochloroethylene, Kynoar, ethylene-tetrafluoroethylene
One or more in copolymer, ethylene-chlorotrifluoro-ethylene copolymer and polyvinyl fluoride.
Preferably, the heat conducting nano particle is aluminum oxide, magnesia, aluminium nitride, boron nitride, silicon nitride, carborundum
In one or more, the particle diameter of the heat conducting nano particle is 200-800 nanometers.
Preferably, the thickness of the graphene is 5-10 nanometers, a diameter of 10-20 microns.
Preferably, the inorganic ultraviolet absorbent is titania nanoparticles, Zinc oxide nanoparticle, zinc sulphide
One kind in nano particle.
Preferably, the antioxidant is 2,6- three-level butyl -4- methylphenols, double（3,5- three-level butyl -4- hydroxy benzenes
Base）One or more in thioether, four (β-(3,5- three-level butyl -4- hydroxy phenyls) propionic acid) pentaerythritol esters.
Preferably, described tackifier are vinylethoxysilane, vinyltriacetoxy silane, N- (amino
Ethyl)-gamma-amino propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, the second of γ-aminopropyl three
One or more in TMOS.
Beneficial effects of the present invention are as follows：
The present invention's is packaged using the encapsulation glue-line of laminated construction to light emitting diode, improves LED package knot
The steadiness of structure, its service life is extended, and improve the luminous flux of light source.
The encapsulation glue-line of the present invention uses new composite resin material, and it has excellent combination property, by multiple
Resin material is added with heat conducting nano particle and graphene, and encapsulation glue-line can be effectively improved by the mating reaction of the two
Heat dissipation characteristics, by adding inorganic ultraviolet absorbent and antioxidant, the uvioresistant of the encapsulation glue-line of encapsulation glue-line can be improved
And ageing resistace.
The encapsulation glue-line of the laminated construction of the present invention, the first encapsulation glue-line close to light emitting diode do not contain fluorescent material,
To reduce the influence that light emitting diode generates heat to fluorescent material, simultaneously because the first encapsulation glue-line does not contain fluorescent material so that first
Encapsulation glue-line has excellent sealing property, and fluorescent material and the are not contained by using the first, the 3rd, the 5th encapsulation glue-line
2nd, the 4th encapsulation glue-line contains the structure of fluorescent material, while can causing uniform in light emission, does not contain the encapsulation glue-line of fluorescent material
The encapsulation glue-line containing fluorescent material can effectively be protected.
Brief description of the drawings
Fig. 1 is the structural representation of the package structure for LED of the present invention.
Embodiment
Referring to Fig. 1, a kind of package structure for LED, the package structure for LED includes circuit base plate 1, if
The light emitting diode 2 on the circuit base plate 1 is put, the first encapsulation glue-line 3 of the light emitting diode 2 is covered, described in covering
Second encapsulation glue-line 4 of the first encapsulation glue-line 3, the 3rd encapsulation glue-line 5 of covering the second encapsulation glue-line 4, covering described the
4th encapsulation glue-line 6 of three encapsulation glue-lines 5, and the 5th encapsulation glue-line 7 of covering the 4th encapsulation glue-line 6；Described first,
Three, the 5th encapsulation glue-lines are by composed of the following components in percentage by weight：100 parts of epoxy resin；Fluororesin 30-50
Part；Organic silica gel 20-40 parts；Heat conducting nano particle 10-20 parts；Graphene 5-15 parts；Inorganic ultraviolet absorbent 0.5-3 parts；
Antioxidant 3-5 parts；Tackifier 1-2 parts；Silane coupler 2-5 parts；Described second, the 4th encapsulation glue-line is by according to percentage by weight
Calculate composed of the following components：100 parts of epoxy resin；Fluororesin 30-50 parts；Organic silica gel 20-40 parts；Fluorescent powder grain 5-10
Part；Heat conducting nano particle 10-20 parts；Graphene 5-15 parts；Inorganic ultraviolet absorbent 0.5-3 parts；Antioxidant 3-5 parts；Thickening
Agent 1-2 parts；Silane coupler 2-5 parts.
Wherein, the described first, second, third, fourth, the 5th encapsulation glue-line is hemispherical, and the fluororesin is polytetrafluoro
Ethene, polytrifluorochloroethylene, Kynoar, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoro-ethylene copolymer and poly-
One or more in PVF, the heat conducting nano particle are aluminum oxide, magnesia, aluminium nitride, boron nitride, silicon nitride, carbon
One or more in SiClx, the particle diameter of the heat conducting nano particle is 200-800 nanometers, and the thickness of the graphene is 5-10
Nanometer, a diameter of 10-20 microns, the inorganic ultraviolet absorbent are titania nanoparticles, Zinc oxide nanoparticle, sulphur
Change one kind in zinc nanoparticles, the antioxidant is 2,6- three-level butyl -4- methylphenols, double（3,5- three-level butyl -4- hydroxyls
Base phenyl）One or more in thioether, four (β-(3,5- three-level butyl -4- hydroxy phenyls) propionic acid) pentaerythritol esters, it is described
Tackifier for vinylethoxysilane, vinyltriacetoxy silane, N- (amino-ethyl)-gamma-amino propyl group front three
TMOS, γ-methacryloxypropyl trimethoxy silane, one kind in gamma-aminopropyl-triethoxy-silane or several
Kind.
Embodiment 1
Referring to Fig. 1, a kind of package structure for LED, the package structure for LED includes circuit base plate 1, is arranged on
Light emitting diode 2 on the circuit base plate 1, cover the first encapsulation glue-line 3 of the light emitting diode 2, covering described first
The second encapsulation glue-line 4 of glue-line 3 is encapsulated, the 3rd encapsulation glue-line 5 of covering the second encapsulation glue-line 4, covers the 3rd envelope
Fill the 4th encapsulation glue-line 6 of glue-line 5, and the 5th encapsulation glue-line 7 of covering the 4th encapsulation glue-line 6；Described first,
3rd, the 5th encapsulation glue-line is by composed of the following components in percentage by weight：100 parts of epoxy resin；30 parts of fluororesin；Have
20 parts of machine silica gel；10 parts of heat conducting nano particle；5 parts of graphene；0.5 part of inorganic ultraviolet absorbent；3 parts of antioxidant；Tackifier 1
Part；2 parts of silane coupler；Described second, the 4th encapsulation glue-line is by composed of the following components in percentage by weight：Epoxy
100 parts of resin；Fluororesin 40 part；30 parts of organic silica gel；5 parts of fluorescent powder grain；15 parts of heat conducting nano particle；10 parts of graphene；
1 part of inorganic ultraviolet absorbent；4 parts of antioxidant；1 part of tackifier；2 parts of silane coupler.Wherein, described first, second,
3rd, the four, the 5th encapsulation glue-lines are hemispherical, and the fluororesin is polytetrafluoroethylene (PTFE), and the heat conducting nano particle is aluminum oxide,
The particle diameter of the heat conducting nano particle is 500 nanometers, and the thickness of the graphene is 5 nanometers, a diameter of 15 microns, described inorganic
Ultra-violet absorber is titania nanoparticles, and the antioxidant is 2,6- three-level butyl -4- methylphenols, described thickening
Agent is vinylethoxysilane.
Embodiment 2
Referring to Fig. 1, a kind of package structure for LED, the package structure for LED includes circuit base plate 1, is arranged on
Light emitting diode 2 on the circuit base plate 1, cover the first encapsulation glue-line 3 of the light emitting diode 2, covering described first
The second encapsulation glue-line 4 of glue-line 3 is encapsulated, the 3rd encapsulation glue-line 5 of covering the second encapsulation glue-line 4, covers the 3rd envelope
Fill the 4th encapsulation glue-line 6 of glue-line 5, and the 5th encapsulation glue-line 7 of covering the 4th encapsulation glue-line 6；Described first,
3rd, the 5th encapsulation glue-line is by composed of the following components in percentage by weight：100 parts of epoxy resin；Fluororesin 40 part；Have
30 parts of machine silica gel；15 parts of heat conducting nano particle；10 parts of graphene；2 parts of inorganic ultraviolet absorbent；4 parts of antioxidant；Tackifier
1.5 part；4 parts of silane coupler；Described second, the 4th encapsulation glue-line is by composed of the following components in percentage by weight：
100 parts of epoxy resin；50 parts of fluororesin；35 parts of organic silica gel；8 parts of fluorescent powder grain；18 parts of heat conducting nano particle；Graphene 12
Part；3 parts of inorganic ultraviolet absorbent；3 parts of antioxidant；2 parts of tackifier；4 parts of silane coupler.Wherein, described first, second,
Three, the four, the 5th encapsulation glue-lines are hemispherical, and the fluororesin is ethylene-tetrafluoroethylene copolymer, the heat conducting nano
Grain is boron nitride, and the particle diameter of the heat conducting nano particle is 800 nanometers, and the thickness of the graphene is 8 nanometers, and a diameter of 15 is micro-
Rice, the inorganic ultraviolet absorbent is Zinc oxide nanoparticle, and the antioxidant is double（3,5- three-level butyl -4- hydroxy benzenes
Base）Thioether, described tackifier are N- (amino-ethyl)-gamma-amino propyl trimethoxy silicane.
Embodiment 3
Referring to Fig. 1, a kind of package structure for LED, the package structure for LED includes circuit base plate 1, is arranged on
Light emitting diode 2 on the circuit base plate 1, cover the first encapsulation glue-line 3 of the light emitting diode 2, covering described first
The second encapsulation glue-line 4 of glue-line 3 is encapsulated, the 3rd encapsulation glue-line 5 of covering the second encapsulation glue-line 4, covers the 3rd envelope
Fill the 4th encapsulation glue-line 6 of glue-line 5, and the 5th encapsulation glue-line 7 of covering the 4th encapsulation glue-line 6；Described first,
3rd, the 5th encapsulation glue-line is by composed of the following components in percentage by weight：100 parts of epoxy resin；50 parts of fluororesin；Have
40 parts of machine silica gel；20 parts of heat conducting nano particle；15 parts of graphene；3 parts of inorganic ultraviolet absorbent；5 parts of antioxidant；Tackifier 2
Part；5 parts of silane coupler；Described second, the 4th encapsulation glue-line is by composed of the following components in percentage by weight：Epoxy
100 parts of resin；30 parts of fluororesin；20 parts of organic silica gel；5 parts of fluorescent powder grain；10 parts of heat conducting nano particle；5 parts of graphene；Nothing
0.5 part of machine ultra-violet absorber；3 parts of antioxidant；2 parts of tackifier；5 parts of silane coupler.Wherein, described first, second,
3rd, the four, the 5th encapsulation glue-lines are hemispherical, and the fluororesin is Kynoar, and the heat conducting nano particle is carborundum,
The particle diameter of the heat conducting nano particle is 300 nanometers, and the thickness of the graphene is 7 nanometers, a diameter of 20 microns, described inorganic
Ultra-violet absorber is Zinc oxide nanoparticle, and the antioxidant is four (β-(3,5- three-level butyl -4- hydroxy phenyls) propionic acid)
Pentaerythritol ester, described tackifier are gamma-aminopropyl-triethoxy-silane.
The present invention's is packaged using the encapsulation glue-line of laminated construction to light emitting diode, improves light emitting diode envelope
The steadiness of assembling structure, its service life is extended, and improve the luminous flux of light source.The encapsulation glue-line of the present invention is using new
Composite resin material, it has excellent combination property, by being added with heat conducting nano particle and stone in composite resin material
Black alkene, the heat dissipation characteristics of encapsulation glue-line can be effectively improved by the mating reaction of the two, by adding inorganic UV line absorption
Agent and antioxidant, the uvioresistant and ageing resistace of the encapsulation glue-line of encapsulation glue-line can be improved.The laminated construction of the present invention
Glue-line is encapsulated, the first encapsulation glue-line close to light emitting diode does not contain fluorescent material, to reduce light emitting diode heating to fluorescence
The influence of powder, simultaneously because the first encapsulation glue-line does not contain fluorescent material so that the first encapsulation glue-line has excellent sealing property,
The knot that fluorescent material and the second, the 4th encapsulation glue-line contain fluorescent material is not contained by using first, the three, the 5th encapsulation glue-lines
Structure, while can causing uniform in light emission, the encapsulation containing fluorescent material can effectively be protected by not containing the encapsulation glue-line of fluorescent material
Glue-line.
Finally it should be noted that：Obviously, above-described embodiment is only intended to clearly illustrate example of the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the field, can also do on the basis of the above description
Go out other various forms of changes or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
Among the obvious changes or variations that Shen goes out is still in protection scope of the present invention.
Claims (8)
- A kind of 1. package structure for LED, it is characterised in that：The package structure for LED includes circuit base plate, if The light emitting diode on the circuit base plate is put, covers the first encapsulation glue-line of the light emitting diode, covering described first The second encapsulation glue-line of glue-line is encapsulated, the 3rd encapsulation glue-line of covering the second encapsulation glue-line, covers the 3rd packaging plastic 4th encapsulation glue-line of layer, and the 5th encapsulation glue-line of covering the 4th encapsulation glue-line；Described first, the three, the 5th encapsulation glue-lines are by composed of the following components in percentage by weight：Epoxy resin 100 Part；Fluororesin 30-50 parts；Organic silica gel 20-40 parts；Heat conducting nano particle 10-20 parts；Graphene 5-15 parts；Inorganic UV Absorbent 0.5-3 parts；Antioxidant 3-5 parts；Tackifier 1-2 parts；Silane coupler 2-5 parts；Described second, the 4th encapsulation glue-line is by composed of the following components in percentage by weight：100 parts of epoxy resin；Fluorine Resin 30-50 parts；Organic silica gel 20-40 parts；Fluorescent powder grain 5-10 parts；Heat conducting nano particle 10-20 parts；Graphene 5-15 Part；Inorganic ultraviolet absorbent 0.5-3 parts；Antioxidant 3-5 parts；Tackifier 1-2 parts；Silane coupler 2-5 parts.
- 2. package structure for LED according to claim 1, it is characterised in that：Described first, second, third, 4th, the 5th encapsulation glue-line is hemispherical.
- 3. package structure for LED according to claim 1, it is characterised in that：The fluororesin is polytetrafluoroethyl-ne Alkene, polytrifluorochloroethylene, Kynoar, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoro-ethylene copolymer and poly- fluorine One or more in ethene.
- 4. package structure for LED according to claim 1, it is characterised in that：The heat conducting nano particle is oxidation One or more in aluminium, magnesia, aluminium nitride, boron nitride, silicon nitride, carborundum, the particle diameter of the heat conducting nano particle are 200-800 nanometers.
- 5. package structure for LED according to claim 1, it is characterised in that：The thickness of the graphene is 5-10 Nanometer, a diameter of 10-20 microns.
- 6. package structure for LED according to claim 1, it is characterised in that：The inorganic ultraviolet absorbent is One kind in titania nanoparticles, Zinc oxide nanoparticle, zine sulfide nano particles.
- 7. package structure for LED according to claim 1, it is characterised in that：The antioxidant is 2,6- three-level fourths It is base -4- methylphenols, double（3,5- three-level butyl -4- hydroxy phenyls）Thioether, four (β-(3,5- three-level butyl -4- hydroxy phenyls) Propionic acid) one or more in pentaerythritol ester.
- 8. package structure for LED according to claim 1, it is characterised in that described tackifier are vinyl second TMOS, vinyltriacetoxy silane, N- (amino-ethyl)-gamma-amino propyl trimethoxy silicane, γ-methyl-prop One or more in alkene acryloxypropylethoxysilane trimethoxy silane, gamma-aminopropyl-triethoxy-silane.
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| CN201710496660.7A CN107492592A (en) | 2017-06-26 | 2017-06-26 | A kind of package structure for LED |
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| CN201710496660.7A CN107492592A (en) | 2017-06-26 | 2017-06-26 | A kind of package structure for LED |
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| CN108336229A (en) * | 2018-01-24 | 2018-07-27 | 南通壹选工业设计有限公司 | A kind of solar cell module |
| CN113659059A (en) * | 2021-07-09 | 2021-11-16 | 深圳市佑明光电有限公司 | LED lamp bead, illuminating lamp and manufacturing method of LED lamp bead |
| CN114087547A (en) * | 2021-11-24 | 2022-02-25 | 盐城东山精密制造有限公司 | Process for realizing high-efficiency wide angle of lamp bead |
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Application publication date: 20171219 |