CN107484339A - A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties - Google Patents
A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties Download PDFInfo
- Publication number
- CN107484339A CN107484339A CN201710621881.2A CN201710621881A CN107484339A CN 107484339 A CN107484339 A CN 107484339A CN 201710621881 A CN201710621881 A CN 201710621881A CN 107484339 A CN107484339 A CN 107484339A
- Authority
- CN
- China
- Prior art keywords
- ground level
- printed board
- signal
- microwave
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
Abstract
The present invention relates to it is a kind of improve microwave multi-layer boards matching properties earthed circuit implementation method, including：Confirmed by simulation software to carrying out rational distribution perpendicular to the metal throuth hole of orientation substrate, the signal return flow path shown simultaneously by simulation software, radio frequency ground level is connected by printed board interconnection on signal path by the way of printed board edge is covered with gold leaf with the big ground level at the multilager base plate back side, substrate back ground level is welded to as on the carrier of the public ground level of microwave signal again, to reduce the impedance of micro-strip ground level and microwave signal publicly interplanar, so as to superiorization radio frequency path performance.
Description
Technical field
The invention belongs to frequency microwave technical field.
Background technology
Generally use multi-chip module (MCM) technology reduces in the design and manufacture of Connectors for Active Phased Array Radar T/R components
Volume, component integrated level is improved, the printed board as multi-chip and chip interconnection routing carrier is increasingly tended to use LTCC
Or the laminated multi-layer microwave interconnection circuit substrate of complex media is to improve the interconnection wiring density of component and integrated level.Due to LTCC
Difficulty of processing and cost are higher, and the selection of printed board is more likely to use laminated multi-layer interconnection circuit substrate at present.And compound Jie
The laminated multi-layer microwave interconnection circuit substrate of matter causes it because the ground level and signal ground level of microstrip transmission line are non-coplanar
Microwave signal generates a certain size impedance in publicly planar transmission, has not been preferable micro-strip ground level, transmission line
Transmission mode is also just changed, and frequency is higher, and the higher mode that it is excited is more serious, and this causes microwave transmission line at port
Reflection is serious so that assembly radio-frequency path performance is remarkably decreased, serious to be also possible to cause radio-frequency devices to burn.Therefore,
There is an urgent need to seek a kind of effective ways that can improve multiplayer microwave interconnection circuit board transport line microwave property.
The present invention first passes through simulation software and the metal throuth hole perpendicular to orientation substrate is reasonably distributed, and passes through simultaneously
The signal return flow path that simulation software is shown, will by the way of printed board edge is covered with gold leaf to printed board interconnection on signal path
Radio frequency ground level is connected with the big ground level at the multilager base plate back side, then substrate back ground level is welded to as microwave signal
On the carrier of public ground level, to reduce the impedance of micro-strip ground level and microwave signal publicly interplanar, so as to which superiorization is penetrated
The purpose of frequency path performance.
The content of the invention
Ground plane is undesirable in multiplayer microwave interconnection circuit board transport line in order to solve by the present invention, signal return flow path
Discontinuously influence the problem of microwave transmission performance.The implementation method of this method is：Obtained for design printed board by emulation
Fixing hole away from the metal hole post perpendicular to orientation substrate, microstrip line ground level is connected with the ground level of substrate back, then
Substrate back ground level is welded on one piece of metal shell as the public ground level of microwave signal, while by printing edges of boards
Along gold technology technology, the low resistance ground plane interface channel of a microwave signal is established, ensure that and passed positioned at different interlayers
The continuity of the ground level of defeated line, with this come realize to radio frequency path optimization purpose.
The technical solution for realizing the object of the invention is：For design printed board in multiplayer microwave interconnection circuit substrate
In design process, metallization VIA near transmission line port is emulated, acknowledged pore radius, pad radius cross pitch of holes and
Number of vias, find out aperture and distance values.The metallic vias of setting makes the microstrip line ground level copper clad layers and base in substrate intermediate layer
Back is covered copper face and is connected, the signal return flow path then shown by simulation software, mutual to printed board on signal path
Printed board edges of boards are surrounded with metal using edge printed board edge processing mode covered with gold leaf at connection, so that microwave signal
Radio frequency ground level is connected with the big ground level at the multilager base plate back side.
Compared with prior art, its remarkable advantage is the present invention：It can significantly reduce and reflect between microstrip transmission line port, so as to
Improve the performance of assembly radio-frequency path.Simple, significant effect is realized in this method processing, is had highly application value.
Brief description of the drawings
Fig. 1 multilayer board schematic layout patterns.
Fig. 2 via simulation parameters figures.
Fig. 3 does not do process signal return flow path figure covered with gold leaf.
Fig. 4 does process signal return flow path figure covered with gold leaf.
Fig. 5 test result figures.
Embodiment
The present invention embodiment be：
1st, the structure determination of the realization for telecommunication function and mounting means progress multiplayer microwave interconnection circuit substrate is folded
Layout layer and design.
2nd, to the cablings such as substrate microstrip line, ground plane, control line, power line the distribution of interlayer carry out unified planning and
Layout designs are shown in Fig. 1.Establish model and 3 D electromagnetic emulation is carried out to substrate port.Substrate metal via substrate joining will have been set
Layout file importing 3 D electromagnetic emulation is soft to be really modeled, emulates, because multilayered printed partitioned signal passes through metallic vias to ground
There is maximum at resonant frequency in the input impedance of plane return path, efficiency of transmission when causing the high-frequency signal to pass through via
It is very low, and the degree of coupling between via is reached maximum, it is therefore desirable to via diameter and spacing parameter are optimized and set
Meter is shown in Fig. 2, draws optimal aperture and distance values.
3rd, multigroup metallization VIA is set in the near ports of multiplayer microwave interconnection circuit substrate.
Multigroup metallization VIA is artificially set the microstrip line ground level in substrate intermediate layer is covered copper near transmission line port
Layer with substrate back cover copper face be connected interview Fig. 3.
4th, Fig. 4 is shown according to emulation, confirms current reflux path, and printed board is needed to carry out at gold filled according to return flow path
Technological design.
5th, the multiplayer microwave interconnection circuit substrate made is welded on metal shell.
The via parameters and gold technology established by emulation make multiplayer microwave interconnection circuit substrate, the base that will be completed
The back metal copper clad layers of plate are welded on metal shell, public with microwave signal so as to artificially reduce the micro-strip ground level in intermediate layer
Impedance between ground level altogether.
6th, assembly and test.
The multiplayer microwave interconnection circuit substrate for completing welding is assembled into appropriate radio frequency connector with metal shell, ensured just
Radio frequency path energization test is really carried out after contraposition, the object test assembled is as shown in Figure 5.
Claims (1)
1. a kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties, it is characterized in that：
(1) by being emulated to pore radius excessively, pad radius, pitch of holes and number of vias excessively, aperture and distance values are found out；If
The metallic vias put makes the microstrip line ground level copper clad layers in substrate intermediate layer cover copper face with substrate back to be connected；
(2) the signal return flow path shown by simulation software, to using edge covered with gold leaf on signal path at printed board interconnection
Printed board edge processing mode printed board edges of boards are surrounded with metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710621881.2A CN107484339A (en) | 2017-07-27 | 2017-07-27 | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710621881.2A CN107484339A (en) | 2017-07-27 | 2017-07-27 | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107484339A true CN107484339A (en) | 2017-12-15 |
Family
ID=60597233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710621881.2A Pending CN107484339A (en) | 2017-07-27 | 2017-07-27 | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484339A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362175A (en) * | 2018-11-30 | 2019-02-19 | 神思电子技术股份有限公司 | A kind of design method for the via hole reducing power supply ripple |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093270A (en) * | 2014-07-08 | 2014-10-08 | 西安电子工程研究所 | Interlayer signal transmission structure of microwave mixed printed circuit board |
| CN205336647U (en) * | 2015-12-11 | 2016-06-22 | 安徽四创电子股份有限公司 | Microwave digital device |
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
-
2017
- 2017-07-27 CN CN201710621881.2A patent/CN107484339A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093270A (en) * | 2014-07-08 | 2014-10-08 | 西安电子工程研究所 | Interlayer signal transmission structure of microwave mixed printed circuit board |
| CN205336647U (en) * | 2015-12-11 | 2016-06-22 | 安徽四创电子股份有限公司 | Microwave digital device |
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362175A (en) * | 2018-11-30 | 2019-02-19 | 神思电子技术股份有限公司 | A kind of design method for the via hole reducing power supply ripple |
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Application publication date: 20171215 |
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