CN107479151B - Heat pipe semiconductor temperature control module for all-in-one optical module - Google Patents
Heat pipe semiconductor temperature control module for all-in-one optical module Download PDFInfo
- Publication number
- CN107479151B CN107479151B CN201710868420.5A CN201710868420A CN107479151B CN 107479151 B CN107479151 B CN 107479151B CN 201710868420 A CN201710868420 A CN 201710868420A CN 107479151 B CN107479151 B CN 107479151B
- Authority
- CN
- China
- Prior art keywords
- optical module
- hot end
- cold
- substrate
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 95
- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000002955 isolation Methods 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 238000004512 die casting Methods 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses a heat pipe semiconductor temperature control module for an all-in-one optical module, which comprises an optical module hot end substrate, an optical module heat conduction pad, a phase-change heat pipe, a cold end substrate, a heat conduction pad, a semiconductor refrigerating sheet, a cold and hot end spacing column, a hot end radiator, a heat insulation bushing, an inner and outer fastening screw, a spacing column and a single plate, wherein the optical module heat end substrate is provided with a heat pipe; the optical module hot end substrate is arranged at the upper part of the optical module mouse cage, the optical module heat conduction pad is clamped in the middle of the optical module hot end substrate, and the phase change heat pipe is arranged between the optical module hot end substrate and the optical module cold end substrate; a semiconductor refrigerating sheet is arranged below the cold end substrate, the cold end and the hot end of the semiconductor refrigerating sheet are respectively attached with a heat conducting pad, and a fixing hole is formed in a hot end radiator; the inner fastening screw fixes the hot end radiator and the cold end substrate; the module is fixed on the isolation column and then fixed on the veneer by the external fastening screw. The application solves the temperature control problem that the all-in-one optical module is insufficient in longitudinal height and has large heating value and needs to be controlled to be below the ambient temperature, and realizes the efficient temperature control of the all-in-one optical module.
Description
Technical Field
The application relates to the technical field of refrigeration equipment, in particular to a heat pipe semiconductor temperature control module for an all-in-one optical module.
Background
With the rapid development of the communication industry, the integration degree and the assembly density of the communication equipment are continuously improved, and the power consumption and the heating value of the equipment are rapidly increased while powerful use functions are provided. In all components, the temperature specification of the optical module is relatively low, the shell temperature is usually required to be limited within 65 ℃ by the industrial-grade optical module, the actual environment temperature is up to 70 ℃, the space tightening and pluggable requirements and the low-temperature specification bring challenges to the heat dissipation of the optical module, and even become the bottleneck of the development of the whole product.
The traditional mode adopts natural convection heat dissipation, namely a section bar radiator is arranged on the upper part of the optical module mouse cage, the top of the optical module mouse cage is windowed, a boss at the bottom of the radiator is in direct contact with the optical module, and heat is dissipated through radiation and natural convection. However, the development requirements of the communication industry are not met more and more, the integration level of the optical module is higher and more and the heating value is higher and the temperature control requirement is lower and less, the traditional natural convection can not reduce the temperature of the optical module to be lower than the ambient temperature, and the pushing of 4G and 5G provides higher requirements for heat dissipation of the optical module.
The pushing-out of the multi-in-one optical module heat pipe semiconductor temperature control module solves the problems of space and heat productivity, the temperature of the optical module can be reduced to be lower than the ambient temperature by adopting a semiconductor active refrigeration technology, the problem of insufficient longitudinal space is solved by introducing the heat pipe technology, and the temperature of the optical module can be timely conducted to a transverse surface for concentrated heat dissipation by adopting a phase-change heat pipe technology.
Disclosure of Invention
The application provides a scheme for controlling temperature of an all-in-one optical module by using a heat pipe and a semiconductor refrigeration technology, which solves the defects that the temperature of the optical module cannot be controlled below the ambient temperature and the longitudinal height is insufficient and cannot be cooled by using passive heat dissipation in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
the application comprises the following steps: a heat pipe semiconductor temperature control module for an all-in-one optical module comprises an optical module hot end substrate, an optical module heat conduction pad, a phase change heat pipe, a cold end substrate, a heat conduction pad, a semiconductor refrigerating sheet, a cold and hot end spacing column, a hot end radiator, a heat insulation bushing, an inner fastening screw, an outer fastening screw, a spacing column and a single plate; the optical module hot end substrate is arranged on the upper part of the optical module mouse cage, the optical module heat conduction pad is arranged between the optical module hot end substrate and the optical module mouse cage, and the phase-change heat pipe is arranged between the optical module hot end substrate and the cold end substrate;
the cold end substrate is positioned at one side of the optical module mouse cage, a plurality of semiconductor refrigerating sheets are arranged below the cold end substrate, each semiconductor refrigerating sheet is connected with one terminal, the upper and lower parts of the semiconductor refrigerating sheets are respectively provided with a cold end and a hot end, the cold end and the hot end are respectively attached with a heat conducting pad and are respectively in close contact with the cold end substrate and the hot end radiator up and down, and the hot end radiator is provided with a fixing hole;
the cold-hot end spacer is arranged between the cold-end substrate and the hot-end radiator, the heat insulation bush is arranged in the fixing hole, and the inner fastening screw is sleeved with the heat insulation bush, penetrates through the fixing hole and fixes the hot-end radiator and the cold-end substrate;
the single board is positioned at the lower side of the hot end radiator, the isolation column is arranged between the hot end radiator and the single board, the external fastening screw is used for fixing the heat pipe semiconductor temperature control module on the isolation column, and the isolation column is fixed on the single board.
Preferably, the phase-change heat pipe is flat, grooves are formed in the upper surfaces of the hot end substrate and the cold end substrate of the optical module, the phase-change heat pipe is buried in the grooves in a soldering or gluing mode and is arranged between the hot end substrate and the cold end substrate of the optical module, the hot end substrate and the cold end substrate of the optical module are formed by adopting ADC12 die casting or AL6063-T5 machining, and chemical nickel plating treatment is adopted on the surfaces of the hot end substrate and the cold end substrate of the optical module. The phase-change heat pipe rapidly conducts heat of the hot end substrate to the cold end substrate through the phase-change principle, so that heat transmission generated by the optical module is rapidly conducted, the temperature of the optical module is reduced, and the processing method limits and ensures the heat transmission effect of the optical module.
Further, the diameter of the phase-change heat pipe is 3mm, the thickness is 0.8mm, and the width is 4.3mm. The size limitation of the phase-change heat pipe ensures the heat transfer effect thereof.
Preferably, the semiconductor refrigerating sheet has two sheets, the external dimension is 37x19.2mm, the thickness is 2+/-0.03 mm, and the pair of crystal grains 71 are contained. The size and the number of the semiconductor refrigerating sheets ensure the refrigerating power to realize the refrigerating effect at a proper time.
Further, the thickness of the heat conducting pad is 0.5mm, the total number of the heat conducting pads is 4, two heat conducting pads are arranged between the semiconductor refrigerating pad and the cold end substrate, and the other two heat conducting pads are arranged between the semiconductor refrigerating pad and the hot end radiator. The heat conducting pad is used for reducing the contact thermal resistance between the semiconductor refrigerating sheet and the hot end radiator as well as between the semiconductor refrigerating sheet and the cold end substrate, and improving the heat conducting efficiency.
Further, the cold and hot end spacing columns and the heat insulation bushing are made of nylon, the total number of the cold and hot end spacing columns is 6, and the height of the cold and hot end spacing columns is 2.6+/-0.05 mm; the number of the inner fastening screws is 6. The nylon material of the cold and hot end space column and the heat insulation bushing has good heat insulation performance, and because the nylon material is connected in the interior in a penetrating way, the heat insulation is needed, the cold and hot end space column, the heat insulation bushing and the inner fastening screw 6 are correspondingly arranged, the fixing penetrates through the whole end part and the middle, and the fixing compactness is high.
Preferably, the isolation column is provided with internal and external double-ended threads, one end of the isolation column is provided with an external threaded stud, the isolation column is fixed on the single plate through the external threaded stud, the other end of the isolation column is provided with an internal threaded hole, the number of external fastening screws is 4, and the heat pipe semiconductor temperature control module is fixed on the isolation column through the internal threaded hole. The isolating column is used for realizing the installation and fixation of the whole module, and the mode of respectively arranging and connecting the internal thread and the external thread saves space, is convenient to fix and ensures the tightness of fixation.
Furthermore, the thickness of the cold end substrate is 2mm, 6 round or square bosses with phi 4mm are arranged at the bottom, the height is 1.5mm, and screw holes are tapped in the middle of the bosses. The thickness of the cold end substrate, the opened boss and the tapped screw hole enable the cold end substrate to be fixedly connected with the hot end radiator conveniently and tightly, so that heat and cold quantity conduction of two sides of the semiconductor refrigeration piece is ensured.
Preferably, the hot end radiator is formed by forging or machining AL6063-T5, square or round radiating teeth are arranged, the specification of fins is 1.5x1x5mm, the thickness of a substrate is 2mm, and the surface of the hot end radiator is subjected to black anode or natural anode oxidation treatment. The hot end radiator is used for radiating the heat absorbed by the semiconductor refrigerating sheet and the heat generated by the self power consumption to the surrounding atmosphere.
Preferably, the upper end of the cold-hot end spacer column is buckled with the boss of the cold-end substrate, and the inner fastening screw is sleeved with the heat insulation bushing and penetrates through the fixing hole to be connected with the screw hole in the middle of the boss in a penetrating way, so that the hot-end radiator and the cold-end substrate are fixed. The boss and the screw hole are arranged to facilitate the internal fastening screw to fix the hot end radiator and the cold end substrate, thereby ensuring the semiconductor refrigeration piece to be in close contact with the hot end radiator and the cold end substrate.
Compared with the prior art, the application has the beneficial effects that: the heat pipe semiconductor temperature control module for the all-in-one optical module has clear structural hierarchy and excellent heat transfer effect. The size and the number of the semiconductor refrigerating sheets ensure the refrigerating power so as to realize the refrigerating effect in proper time; the phase-change heat pipe rapidly conducts heat of the hot end substrate of the optical module to the cold end substrate through the phase-change principle, so that heat transmission generated by the optical module is rapidly conducted, and the temperature of the optical module is reduced; the cold and hot end space columns, the heat insulation bushings and the inner fastening screws 6 are correspondingly arranged, and the ends and the middle of the whole body are fixedly penetrated, so that the fixing compactness is high, and the heat and cold quantity conduction of the two sides of the semiconductor refrigerating sheet is ensured; the external fastening screw and the external fixation of the isolation column are convenient to fasten. The application solves the temperature control problem that the multi-in-one optical module is insufficient in longitudinal height and large in heating value and needs to be controlled below the ambient temperature, the heat is firstly and rapidly conducted to the transverse end through the phase-change heat pipe, and then the multi-in-one optical module is actively cooled through the semiconductor refrigeration technology, so that the temperature control of the multi-in-one optical module is realized. The service life of the optical module is prevented from being influenced by high temperature, the reliability of the optical module is improved, and the failure rate is reduced.
Drawings
Fig. 1 is a schematic view of a disassembly detail structure of an embodiment of the present application, and fig. 2 is a schematic view of an assembled structure of an embodiment of the present application.
In the figure: 1-a hot end substrate of an optical module, 15-a groove, 2-a phase-change heat pipe, 3-a heat conduction pad of the optical module, 4-a mouse cage of the optical module, 5-a cold end substrate, 51-a heat conduction pad, 52-a semiconductor refrigerating sheet, 53-cold end space columns, 54-terminals, 55-heat insulation bushings, 56-inner fastening screws, 57-bosses, 6-hot end heat radiators, 61-fixing holes, 7-outer fastening screws, 8-isolation columns and 9-veneers.
Detailed Description
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the embodiments will be briefly described below.
As shown in fig. 1-2, a heat pipe semiconductor temperature control module for an all-in-one optical module comprises an optical module hot end substrate 1, an optical module heat conduction pad 3, a phase change heat pipe 2, a cold end substrate 5, a heat conduction pad 51, a semiconductor refrigeration sheet 52, a cold and hot end spacing column 53, a hot end radiator 6, a heat insulation bushing 55, an inner fastening screw 56, an outer fastening screw 7, a spacing column 8 and a single plate 9; the optical module hot end substrate 1 is arranged on the optical moduleThe upper part of the module mouse cage 4, the optical module heat conduction pad 3 is attached between the optical module hot end substrate 1 and the optical module mouse cage 4 to reduce the contact thermal resistance between the optical module mouse cage 4 and the optical module hot end substrate 1, the phase-change heat pipe 2 is flat, the diameter of the phase-change heat pipe 2 is 3mm, the thickness is 0.8mm, the width is 4.3mm, and the Q is the same as the diameter of the phase-change heat pipe 2 max 7.5W, Q max The maximum power consumption of the phase-change heat pipe 2 is achieved, grooves 15 are formed in the upper surfaces of a hot end substrate and a cold end substrate of the optical module, the phase-change heat pipe 2 is buried in the grooves 15 in a soldering or gluing mode and is arranged between the hot end substrate 1 and the cold end substrate 5 of the optical module, the hot end substrate 1 and the cold end substrate 5 of the optical module are formed by adopting ADC12 die casting or AL6063-T5 machining, and chemical nickel plating treatment is adopted on the surfaces of the hot end substrate and the cold end substrate;
the cold junction base plate 5 is located one side of the optical module mouse cage 4, two semiconductor refrigerating sheets 52 are arranged below the cold junction base plate 5, and parameters of the semiconductor refrigerating sheets 52 are as follows:
the external dimension is 37x19.2mm, the thickness is 2+/-0.03 mm, the pair of crystal grains 71 are contained, and the heat end T is provided h When=25 ℃, V max 9.6V, I max 6.8A, Q max 34W, T h Is the temperature of the hot junction of the hot end, V max Is the maximum voltage at that temperature, I max Is maximum current, Q max Is the maximum refrigeration power;
each semiconductor refrigerating sheet 52 is connected with a terminal 54, the terminal 54 is 4pin, the terminal 54 is connected with a power supply and supplies direct current to the semiconductor refrigerating sheets 52, the semiconductor refrigerating sheets 52 are respectively provided with a cold end and a hot end, the cold end and the hot end are attached with a heat conducting pad 51, the thickness of the heat conducting pad 51 is 0.5mm, the total number is 4, two of the heat conducting pads are arranged between the semiconductor refrigerating sheets 52 and the cold end substrate 5, and the other two of the heat conducting pads are arranged between the semiconductor refrigerating sheets 52 and the hot end radiator 6, so that the contact thermal resistance between the cold end substrate 5 and the hot end radiator 6 is reduced;
the cold and hot end spacing columns 53 and the heat insulation bushings 55 are made of nylon, the total number of the cold and hot end spacing columns 53 is 6, and the height of the cold and hot end spacing columns 53 is 2.6+/-0.05 mm; the inner fastening screws 56 are M2X8 cross pan head screws with the specification of 6, the thickness of the cold end base plate 5 is 2mm, 6 round or square bosses 57 with phi 4mm are arranged at the bottom, the height is 1.5mm, and screw holes (not shown in the figure) are tapped in the middle of each boss 57;
the hot end radiator 6 is provided with a fixing hole 61, the cold end spacing column 53 is arranged between the cold end substrate 5 and the hot end radiator 6, the heat insulation bushing 55 is arranged in the fixing hole 61, the upper end of the cold end spacing column 53 is buckled with the boss 57 of the cold end substrate 5, the inner fastening screw 56 is sleeved with the heat insulation bushing 55 and penetrates through the fixing hole 61 to be connected with a screw hole in the middle of the boss 57 in a penetrating way, so that the hot end radiator 6 and the cold end substrate 5 are fixed;
the single plate 9 is located at the lower side of the hot end radiator 6, the isolation column 8 is arranged between the hot end radiator 6 and the single plate 9, the isolation column 8 is provided with internal and external double-ended threads, one end of the isolation column 8 is provided with an external threaded stud, the isolation column 8 is fixed on the single plate 9 by the external threaded stud, the other end of the isolation column is provided with internal threaded holes, the external fastening screws are M3X5 cross-shaped pan head screws, the number of the external fastening screws is 4, the external fastening screws 7 are connected with the internal threaded holes through the fixing holes 61, and the heat pipe semiconductor temperature control module is fixed on the isolation column 8.
The hot-end radiator 6 has the following specifications: the aluminum alloy heat dissipation plate is formed by forging or machining AL6063-T5, square or round heat dissipation teeth are arranged, the specification of fins is 1.5x1x5mm, the thickness of a substrate is 2mm, and the surface is subjected to black anode or natural anode oxidation treatment.
The cooling principle is as follows: the bottom of the cold end substrate 5 is tightly contacted with the cold end of the semiconductor refrigerating sheet 52, after the semiconductor refrigerating sheet 52 is electrified, one side is refrigerated, the other side heats, and the heat conducted by the phase-change heat pipe 2 is rapidly absorbed by the cold end of the semiconductor refrigerating sheet 52, so that gaseous medium in the phase-change heat pipe 2 is cooled and condensed into liquid state, and the liquid state flows to the hot end substrate 1 side of the optical module under capillary force to continuously absorb the heat of the optical module. The hot end of the semiconductor refrigerating sheet 52 is closely contacted with the hot end radiator 6, heat absorbed by the cold end is conducted to the hot end ceramic sheet through the P/N section, and the internal fan of the system sucks ambient air to blow the ambient air to the hot end radiator 6, so that the heat is diffused to the surrounding environment, and finally, the heat of the optical module parameters is diffused to the surrounding air, so that the optical module is cooled.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Claims (6)
1. The heat pipe semiconductor temperature control module for the all-in-one optical module is characterized by comprising an optical module hot end substrate (1), an optical module heat conduction pad (3), a phase-change heat pipe (2), a cold end substrate (5), a heat conduction pad (51), a semiconductor refrigerating sheet (52), a cold and hot end spacing column (53), a hot end radiator (6), a heat insulation bushing (55), an inner fastening screw (56), an outer fastening screw (7), a spacing column (8) and a single plate (9); the optical module hot end substrate (1) is arranged at the upper part of the optical module mouse cage (4), the optical module heat conduction pad (3) is arranged between the optical module hot end substrate (1) and the optical module mouse cage (4), and the phase-change heat pipe (2) is arranged between the optical module hot end substrate (1) and the cold end substrate (5);
the cold end substrate (5) is positioned at one side of the optical module mouse cage (4), a plurality of semiconductor refrigerating sheets (52) are arranged below the cold end substrate (5), each semiconductor refrigerating sheet (52) is provided with a connecting terminal, the upper and lower parts of the semiconductor refrigerating sheets (52) are respectively provided with a cold end and a hot end, the cold end and the hot end are respectively attached with a heat conducting pad (51), the upper and lower parts of the heat conducting pad are respectively in close contact with the cold end substrate and the hot end radiator (6), and the hot end radiator (6) is provided with a fixing hole (61);
the cold-hot end space between the cold-end base plate (5) and the hot-end radiator (6) is provided with a heat insulation bushing (55) which is arranged in the fixing hole (61), and the inner fastening screw (56) is sleeved with the heat insulation bushing (55), penetrates through the fixing hole (61) and fixes the hot-end radiator (6) and the cold-end base plate (5);
the heat pipe semiconductor temperature control module is characterized in that the single plate (9) is positioned at the lower side of the hot end radiator (6), the isolation column (8) is arranged between the hot end radiator (6) and the single plate (9), the external fastening screw (7) is used for fixing the heat pipe semiconductor temperature control module on the isolation column (8), and the isolation column (8) is fixed on the single plate (9);
the semiconductor refrigerating sheet (52) is provided with two sheets, the external dimension is 37x19.2mm, the thickness is 2+/-0.03 mm, and the pair of crystal grains 71 are contained;
the thickness of the heat conducting pad (51) is 0.5mm, the total number of the heat conducting pads is 4, two heat conducting pads are arranged between the semiconductor refrigerating piece (52) and the cold end substrate (5), and the other two heat conducting pads are arranged between the semiconductor refrigerating piece (52) and the hot end radiator (6);
the cold and hot end spacing columns (53) and the heat insulation bushings (55) are made of nylon, the total number of the cold and hot end spacing columns is 6, and the height of the cold and hot end spacing columns (53) is 2.6+/-0.05 mm; the number of the inner fastening screws (56) is 6;
the thickness of the cold end substrate (5) is 2mm, 6 round or square bosses with phi 4mm are arranged at the bottom, the height is 1.5mm, and screw holes are tapped in the middle of the bosses.
2. The heat pipe semiconductor temperature control module for the all-in-one optical module according to claim 1, wherein the phase-change heat pipe (2) is flat, grooves (15) are formed in the upper surfaces of the optical module hot end substrate (1) and the cold end substrate (5), the phase-change heat pipe (2) is embedded in the grooves (15) in a soldering or gluing mode and is arranged between the optical module hot end substrate (1) and the cold end substrate (5), the optical module hot end substrate (1) and the cold end substrate (5) are formed by adopting ADC12 die casting or AL6063-T5 machining, and the surfaces of the optical module hot end substrate and the cold end substrate are subjected to chemical nickel plating treatment.
3. The heat pipe semiconductor temperature control module for the all-in-one optical module according to claim 2, wherein the diameter of the phase change heat pipe (2) is 3mm, the thickness is 0.8mm, and the width is 4.3mm.
4. The heat pipe semiconductor temperature control module for the all-in-one optical module according to claim 1, wherein the isolation column (8) is provided with internal and external double-ended threads, one end is an external threaded stud, the isolation column (8) is fixed on the single plate (9) through the external threaded stud, the other end is an internal threaded hole, the number of external fastening screws (7) is 4, and the heat pipe semiconductor temperature control module is fixed on the isolation column (8) through the internal threaded hole.
5. The heat pipe semiconductor temperature control module for the all-in-one optical module according to claim 1, wherein the hot end radiator (6) is formed by forging or machining AL6063-T5, square or round radiating teeth are arranged, the fin specification is 1.5x1x5mm, the thickness of the substrate is 2mm, and the surface is subjected to black anode or natural anode oxidation treatment.
6. The heat pipe semiconductor temperature control module for the all-in-one optical module according to claim 1, wherein the upper end of the cold end and the hot end are buckled with the boss of the cold end substrate (5), and the inner fastening screw (56) is sleeved with the heat insulation bushing (55) and penetrates through the fixing hole (61) to be connected with the screw hole in the middle of the boss in a penetrating way, so that the hot end radiator (6) is fixed with the cold end substrate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868420.5A CN107479151B (en) | 2017-09-22 | 2017-09-22 | Heat pipe semiconductor temperature control module for all-in-one optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868420.5A CN107479151B (en) | 2017-09-22 | 2017-09-22 | Heat pipe semiconductor temperature control module for all-in-one optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107479151A CN107479151A (en) | 2017-12-15 |
| CN107479151B true CN107479151B (en) | 2023-10-31 |
Family
ID=60586836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710868420.5A Active CN107479151B (en) | 2017-09-22 | 2017-09-22 | Heat pipe semiconductor temperature control module for all-in-one optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107479151B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108679804A (en) * | 2018-04-02 | 2018-10-19 | 珠海银河温控技术有限公司 | A kind of Portable temperature-controlling device |
| CN110161638A (en) * | 2019-06-26 | 2019-08-23 | 苏州格曼斯温控科技有限公司 | Optical module cooling system and board |
| CN110494018B (en) * | 2019-08-21 | 2021-01-08 | 武汉光迅科技股份有限公司 | Optical module |
| CN111681999A (en) * | 2020-05-18 | 2020-09-18 | 广东工业大学 | Vacuum heat conduction cavity soaking plate and air-cooled heat dissipation device |
| CN113759480A (en) * | 2021-09-27 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Optical module heat abstractor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105955435A (en) * | 2016-07-04 | 2016-09-21 | 山东超越数控电子有限公司 | Heat dissipation method for ruggedized computer |
| CN207318800U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of high heat load All-in-One optical module semiconductor temperature module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050257532A1 (en) * | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
| US9730365B2 (en) * | 2012-12-30 | 2017-08-08 | General Electric Company | Heat sink apparatus and method for power semiconductor device module |
-
2017
- 2017-09-22 CN CN201710868420.5A patent/CN107479151B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105955435A (en) * | 2016-07-04 | 2016-09-21 | 山东超越数控电子有限公司 | Heat dissipation method for ruggedized computer |
| CN207318800U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of high heat load All-in-One optical module semiconductor temperature module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107479151A (en) | 2017-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107479151B (en) | Heat pipe semiconductor temperature control module for all-in-one optical module | |
| US8004842B2 (en) | Heat dissipation device for communication chassis | |
| CN207612462U (en) | A kind of high heat conduction type printed wiring board | |
| TW200936024A (en) | Heat dissipation module and supporting element thereof | |
| US20100218512A1 (en) | Heat exchanger for thermoelectric applications | |
| TWM597382U (en) | Phase change heat dissipation device | |
| WO2020011045A1 (en) | Heat dissipation device | |
| CN207488926U (en) | Computer radiator structure | |
| CN207318800U (en) | A kind of high heat load All-in-One optical module semiconductor temperature module | |
| CN113115510A (en) | Printed circuit board heat dissipation system using high-thermal-conductivity substrate | |
| CN209729888U (en) | High reliablity heat radiation module | |
| JP4391351B2 (en) | Cooling system | |
| CN213718300U (en) | PCB with heat dissipation device | |
| CN212936472U (en) | Novel chip heat dissipation device | |
| CN210110475U (en) | Transformer heat abstractor and transformer | |
| JP2001053342A (en) | Thermoelectric heater and cooler | |
| CN217160294U (en) | Metal substrate electronic component with radiator | |
| TWI812430B (en) | Two-phase immersion-cooling heat-dissipation structure having different thermal conductivities of fin | |
| CN212257380U (en) | Chip insulation heat radiation structure | |
| CN217406795U (en) | Copper clad foil for supporting printed circuit board | |
| CN208063546U (en) | It is a kind of it is novel can assembled automatically controlled circuit board cooling fin | |
| CN218851204U (en) | Heat dissipation module and refrigerating device | |
| CN215222808U (en) | Semiconductor electronic component | |
| CN219017636U (en) | Radiating fin of semiconductor radiator | |
| CN219698307U (en) | Pre-buried heat pipe heat abstractor for converter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |