CN107452900B - 用于阴极环修补的掩膜装置及其使用方法 - Google Patents
用于阴极环修补的掩膜装置及其使用方法 Download PDFInfo
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- CN107452900B CN107452900B CN201710365174.1A CN201710365174A CN107452900B CN 107452900 B CN107452900 B CN 107452900B CN 201710365174 A CN201710365174 A CN 201710365174A CN 107452900 B CN107452900 B CN 107452900B
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 25
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000001259 photo etching Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims 1
- 238000009740 moulding (composite fabrication) Methods 0.000 claims 1
- 238000001039 wet etching Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 6
- 238000005240 physical vapour deposition Methods 0.000 abstract description 6
- 238000001704 evaporation Methods 0.000 abstract description 5
- 230000008020 evaporation Effects 0.000 abstract description 5
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 150000004706 metal oxides Chemical class 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 206010027146 Melanoderma Diseases 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000010549 co-Evaporation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
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CN201710365174.1A CN107452900B (zh) | 2017-05-22 | 2017-05-22 | 用于阴极环修补的掩膜装置及其使用方法 |
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CN201710365174.1A CN107452900B (zh) | 2017-05-22 | 2017-05-22 | 用于阴极环修补的掩膜装置及其使用方法 |
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CN107452900A CN107452900A (zh) | 2017-12-08 |
CN107452900B true CN107452900B (zh) | 2020-05-05 |
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Families Citing this family (1)
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CN113233412A (zh) * | 2021-05-10 | 2021-08-10 | 南京惠斯通智能科技有限责任公司 | 一种用于复杂微机械封装的硬掩膜板结构及其焊料键合方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752401A (zh) * | 2008-12-11 | 2010-06-23 | 奇晶光电股份有限公司 | 双面显示装置及其制造方法 |
CN104659063A (zh) * | 2014-12-30 | 2015-05-27 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示面板和掩膜板 |
CN104701338A (zh) * | 2013-12-09 | 2015-06-10 | 昆山国显光电有限公司 | 一种有机发光显示器件及其掩膜板 |
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- 2017-05-22 CN CN201710365174.1A patent/CN107452900B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752401A (zh) * | 2008-12-11 | 2010-06-23 | 奇晶光电股份有限公司 | 双面显示装置及其制造方法 |
CN104701338A (zh) * | 2013-12-09 | 2015-06-10 | 昆山国显光电有限公司 | 一种有机发光显示器件及其掩膜板 |
CN104659063A (zh) * | 2014-12-30 | 2015-05-27 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示面板和掩膜板 |
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Effective date of registration: 20210825 Address after: 518000 Room 302, building 2, chunhaian Yaju, No. 4, Gaoxin South Ring Road, Nanshan District, Shenzhen, Guangdong Patentee after: Bu Dan Address before: 518000 floor 44, Xinhao e Du, 7018 CaiTian Road, Futian District, Shenzhen, Guangdong Patentee before: Sheng Sheng Effective date of registration: 20210825 Address after: 518000 706, block w2-a, Gaoxin industrial storage, No. 025, Gaoxin South Fourth Road, Gaoxin community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Shouda Hengxin technology partnership (L.P.) Address before: 518000 Room 302, building 2, chunhaian Yaju, No. 4, Gaoxin South Ring Road, Nanshan District, Shenzhen, Guangdong Patentee before: Bu Dan |
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Effective date of registration: 20210922 Address after: 210000 room 603, building C, Xingzhi science and Technology Park, No. 6, Xingzhi Road, Nanjing Economic and Technological Development Zone, Jiangsu Province Patentee after: Nanjing Ruixian Electronic Technology Co.,Ltd. Address before: 518000 706, block w2-a, Gaoxin industrial storage, No. 025, Gaoxin South Fourth Road, Gaoxin community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen Shouda Hengxin technology partnership (L.P.) |