CN107452862B - A kind of high heat radiation energy-saving lamp and its manufacturing method - Google Patents

A kind of high heat radiation energy-saving lamp and its manufacturing method Download PDF

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Publication number
CN107452862B
CN107452862B CN201710616043.6A CN201710616043A CN107452862B CN 107452862 B CN107452862 B CN 107452862B CN 201710616043 A CN201710616043 A CN 201710616043A CN 107452862 B CN107452862 B CN 107452862B
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heat
welded
heat radiating
plate
conducting layer
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CN107452862A (en
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瞿王城
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention provides a kind of high heat radiation energy-saving lamp, including：Terrace edge shape lampshade；The LED illumination unit and cooling unit being arranged in the lampshade；Wherein, the lampshade is made of cooling material material；The LED illumination unit includes fluorescent glass, the transparency conducting layer being arranged on the fluorescent glass, the LED chip being arranged on the transparency conducting layer, the fluid sealant of the sealing LED chip, the heat-conducting plate being arranged on the fluid sealant successively；The cooling unit includes welded plate, the heat radiating metal pattern being arranged on welded plate, the cover board being arranged on the heat radiating metal pattern；The welded plate is closely welded with the heat-conducting plate.

Description

A kind of high heat radiation energy-saving lamp and its manufacturing method
Technical field
The present invention relates to life appliance fields, and in particular to a kind of high heat radiation energy-saving lamp and its manufacturing method.
Background technology
Now, LED light is at low cost since it is high with brightness, it is small, power consumption is less the advantages of and widely made With, no matter street lamp, desk lamp, shot-light, car light, usage time is longer, LED accumulated heats it is faster, the increase of heat directly results in The temperature rise of lamps and lanterns, the conductive photoelectric conversion efficiency of rise meeting of this temperature are lower, and power consumption increases, while can also accelerate old Change, shorten the service life of LED light.How quickly to radiate is this field urgent problem to be solved.
The content of the invention
Based on solving the above problems, the present invention provides a kind of high heat radiation energy-saving lamp, including：Terrace edge shape lampshade；If The LED illumination unit and cooling unit being placed in the lampshade；Wherein,
The lampshade is made of cooling material material；
The LED illumination unit includes fluorescent glass, the transparency conducting layer being arranged on the fluorescent glass, sets successively In on the transparency conducting layer multiple LED chips, the fluid sealant of the sealing LED chip, be arranged on the fluid sealant Heat-conducting plate；
The cooling unit includes welded plate, the heat radiating metal pattern being arranged on welded plate, is arranged at the heat dissipation gold Cover board on metal patterns；
The welded plate is closely welded with the heat-conducting plate.
According to an embodiment of the invention, the heat radiating metal pattern includes the multiple metal concentric rings uniformly disconnected, with institute State multiple dowels that multiple metal concentric rings intersect.
According to an embodiment of the invention, the heat radiating metal pattern is centrosymmetric or axially symmetric structure.
According to an embodiment of the invention, the multiple LED chip is located at the multiple dowel and the multiple gold respectively Belong to the top of the intersection point of concentric ring.
According to an embodiment of the invention, projection of the dowel on the heat sink and the transparency conducting layer are in institute The projection stated on heat sink overlaps.
The present invention also provides a kind of method for manufacturing high heat radiation energy-saving lamp, including：
（1）One fluorescent glass for being cut to suitable size is provided；
（2）On the fluorescent glass electrically conducting transparent is formed using patterning method, method for printing screen or electro-plating method Layer；
（3）Multiple LED are welded in the transparency conducting layer, form cascaded structure；
（4）The LED chip is sealed using sealing material, polishing is then ground and forms flat surfaces；
（5）The corresponding heat sink of size is adhered to above the sealing material；
（6）Cooling unit is processed using mechanical system, the heat radiating metal pattern includes the multiple metals uniformly disconnected Concentric ring, the multiple dowels intersected with the multiple metal concentric ring, and the heat radiating metal pattern is centrosymmetric or axis Symmetrical structure；
（7）The welded plate and the heat-conducting plate are closely welded so that the multiple LED chip is located at described more respectively The top of a dowel and the intersection point of the multiple metal concentric ring.
Advantages of the present invention is as follows：
（1）Rate of heat dispation is improved using LED chip is with the intersection point of heat radiating metal pattern corresponding；
（2）Accelerate heat dissipation using special cooling unit structure；
（3）The use in outer layer of fluorescent glass, can cause transparency conducting layer to be formed on it, prevent from aoxidizing, It can realize the fluorescent effect of light.
Description of the drawings
Fig. 1 is the sectional view of the high heat radiation energy-saving lamp of the present invention；
Fig. 2-8 is the flow diagram of present invention manufacture lamps and lanterns；
Fig. 9 is the schematic diagram of the heat radiating metal pattern of the present invention.
Specific embodiment
Referring to Fig. 1, high heat radiation energy-saving lamp of the invention, including：Terrace edge shape lampshade 1；It is arranged in the lampshade LED illumination unit and cooling unit；Wherein,
The lampshade 1 is made of cooling material material；
The LED illumination unit successively include fluorescent glass 5, be arranged on the fluorescent glass 5 transparency conducting layer 21, Multiple LED chips 3 on the transparency conducting layer 21, the fluid sealant 4 of the sealing LED chip 3 are arranged at, is arranged at described close Heat-conducting plate 2 in sealing 4；
The cooling unit includes welded plate（Lower plywood）, be arranged on welded plate heat radiating metal pattern 6, be arranged at institute State the cover board on heat radiating metal pattern 6（Top plate）；
The welded plate is closely welded with the heat-conducting plate 2.
Referring to Fig. 9, an illustrative heat radiating metal pattern 61 includes the multiple metal concentric rings 62 uniformly disconnected, with institute The intersecting multiple dowels 63 of multiple metal concentric rings 62 are stated, becket 62 is separated by disconnecting unit 64, forms discontinuous dissipate Heat structure.The heat radiating metal pattern 6 is centrosymmetric or axially symmetric structure.The multiple LED chip 3 is located at described more respectively The top of a dowel and the intersection point of the multiple metal concentric ring.Projection of the dowel 63 on the heat sink 2 with Projection of the transparency conducting layer 21 on the heat sink 2 overlaps.
The present invention also provides a kind of method for manufacturing high heat radiation energy-saving lamp, including：
（1）Referring to Fig. 2, the fluorescent glass for being cut to suitable size is provided；
（2）Referring to Fig. 3, formed on the fluorescent glass using patterning method, method for printing screen or electro-plating method Transparency conducting layer；
（3）Referring to Fig. 4, multiple LED are welded in the transparency conducting layer, form cascaded structure；
（4）Referring to Fig. 5, the LED chip is sealed using sealing material, polishing is then ground and forms flat surfaces；
（5）Referring to Fig. 6, the corresponding heat sink of size is adhered to above the sealing material；
（6）Referring to Fig. 7, cooling unit is processed using mechanical system, the heat radiating metal pattern includes what is uniformly disconnected Multiple metal concentric rings, the multiple dowels intersected with the multiple metal concentric ring, and the heat radiating metal pattern are in center Symmetrical or axially symmetric structure；
（7）Referring to Fig. 8, the welded plate and the heat-conducting plate are closely welded so that the multiple LED chip distinguishes position In the top of the multiple dowel and the intersection point of the multiple metal concentric ring；
（8）Lampshade and the LED illumination unit and cooling unit are assembled and to form the lamps and lanterns.
Finally it should be noted that：Obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously The non-restriction to embodiment.For those of ordinary skill in the art, can also do on the basis of the above description Go out other various forms of variations or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn The obvious changes or variations that Shen goes out is still in the protection scope of this invention.

Claims (3)

1. a kind of high heat radiation energy-saving lamp, including：Terrace edge shape lampshade；The LED illumination unit that is arranged in the lampshade and cold But unit；Wherein,
The lampshade is made of cooling material material；
The LED illumination unit includes fluorescent glass, the transparency conducting layer being arranged on the fluorescent glass, is arranged at institute successively State multiple LED chips on transparency conducting layer, the fluid sealant for sealing the LED chip, the heat conduction being arranged on the fluid sealant Plate；
The cooling unit includes welded plate, the heat radiating metal pattern being arranged on welded plate, is arranged at the heat radiating metal figure Cover board in case；
The welded plate is closely welded with the heat-conducting plate；
The heat radiating metal pattern includes the multiple metal concentric rings uniformly disconnected, intersects with the multiple metal concentric ring more A dowel；The heat radiating metal pattern is centrosymmetric or axially symmetric structure；The multiple LED chip is located at described more respectively The top of a dowel and the intersection point of the multiple metal concentric ring.
2. high heat radiation energy-saving lamp according to claim 1, it is characterised in that：The dowel is on the heat sink The projection with the transparency conducting layer on the heat sink is projected to overlap.
3. a kind of method for manufacturing high heat radiation energy-saving lamp as claimed in claim 1 or 2, including：
（1）One fluorescent glass for being cut to suitable size is provided；
（2）On the fluorescent glass transparency conducting layer is formed using patterning method, method for printing screen or electro-plating method；
（3）Multiple LED are welded in the transparency conducting layer, form cascaded structure；
（4）The LED chip is sealed using sealing material, polishing is then ground and forms flat surfaces；
（5）The corresponding heat sink of size is adhered to above the sealing material；
（6）Cooling unit is processed using mechanical system, it is concentric that the heat radiating metal pattern includes the multiple metals uniformly disconnected Ring, the multiple dowels intersected with the multiple metal concentric ring, and the heat radiating metal pattern is centrosymmetric or axial symmetry Structure；
（7）The welded plate and the heat-conducting plate are closely welded so that the multiple LED chip is located at the multiple company respectively Connect the top of muscle and the intersection point of the multiple metal concentric ring.
CN201710616043.6A 2017-07-26 2017-07-26 A kind of high heat radiation energy-saving lamp and its manufacturing method Active CN107452862B (en)

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CN107452862B true CN107452862B (en) 2018-05-18

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200982607Y (en) * 2006-11-02 2007-11-28 王建州 Heat irradiation structure of LED lamp
CN201555119U (en) * 2009-10-15 2010-08-18 苏州中泽光电科技有限公司 Combined type LED ceiling lamp
CN102709445A (en) * 2012-06-02 2012-10-03 王双喜 Light-emitting diode (LED) packaging structure with fluorescent glass layer
CN102723423A (en) * 2012-05-24 2012-10-10 上海泉新光电技术有限公司 Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device
CN103500787A (en) * 2013-10-16 2014-01-08 北京大学东莞光电研究院 Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink
CN105702845A (en) * 2016-03-02 2016-06-22 深圳市西德利集团有限公司 LED illuminating device and light fixture

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8530990B2 (en) * 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
CN203445158U (en) * 2013-01-31 2014-02-19 光明半导体（天津）有限公司 Light-emitting diode module using metal substrate printed circuit board having heat radiation pattern

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200982607Y (en) * 2006-11-02 2007-11-28 王建州 Heat irradiation structure of LED lamp
CN201555119U (en) * 2009-10-15 2010-08-18 苏州中泽光电科技有限公司 Combined type LED ceiling lamp
CN102723423A (en) * 2012-05-24 2012-10-10 上海泉新光电技术有限公司 Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device
CN102709445A (en) * 2012-06-02 2012-10-03 王双喜 Light-emitting diode (LED) packaging structure with fluorescent glass layer
CN103500787A (en) * 2013-10-16 2014-01-08 北京大学东莞光电研究院 Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink
CN105702845A (en) * 2016-03-02 2016-06-22 深圳市西德利集团有限公司 LED illuminating device and light fixture

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