CN107426955A - A kind of radiator structure for speed regulation module of fan - Google Patents
A kind of radiator structure for speed regulation module of fan Download PDFInfo
- Publication number
- CN107426955A CN107426955A CN201710847839.2A CN201710847839A CN107426955A CN 107426955 A CN107426955 A CN 107426955A CN 201710847839 A CN201710847839 A CN 201710847839A CN 107426955 A CN107426955 A CN 107426955A
- Authority
- CN
- China
- Prior art keywords
- radiator
- thermal source
- copper plate
- speed regulation
- conducting copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000033228 biological regulation Effects 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- 230000000694 effects Effects 0.000 claims abstract description 4
- 206010041662 Splinter Diseases 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000001413 cellular effect Effects 0.000 claims description 4
- 238000010622 cold drawing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of radiator structure for speed regulation module of fan, including radiator, conducting copper plate and thermal source chip, described radiator to be welded in the radiator mounting groove of conducting copper plate one side, and described thermal source chip is close to the another side of conducting copper plate；Heat is transmitted to radiator by described thermal source chip through conducting copper plate, and under the air-cooled effect of blower fan, heat is scattered away.Compared with prior art, the present invention has the advantages that Stability Analysis of Structures, small volume, light weight, efficiency are high.
Description
Technical field
The present invention relates to speed regulation module of fan radiator structure, more particularly, to a kind of radiating knot for speed regulation module of fan
Structure, can effectively solve the problems, such as Automobile Fan high-power speed-adjusting module heat dissipating.
Background technology
The traditional heat-dissipating structure that speed regulation module of fan uses is evenly distributed for fin.Because more remote apart from thermal source, heat passes
Lead that efficiency is lower, fin conductive of the heat along radiator is in decline trend, so the actual utilization of evenly distributed fin
Rate is limited；And the wind surface of fin only has two sides, actual wind area is small, and the heat scattered away is not high, and radiating rate is slow.
By retrieval, China Patent Publication No. is that CN205911300U discloses a kind of speed adjusting module metal-oxide-semiconductor radiator structure
And speed adjusting module, it is described heat sink to be arranged on below metal-oxide-semiconductor and be connected with metal-oxide-semiconductor, the tabletting pressure including including tabletting and heat sink
In metal-oxide-semiconductor upper surface, the end of tabletting and heat sink connection, the metal-oxide-semiconductor and it is heat sink between be provided with heat conductor, the metal-oxide-semiconductor
With heat conductor, tabletting contact surface between be provided with hot boundary layer.This speed adjusting module metal-oxide-semiconductor radiator structure that the invention provides
Simply, effectively heat caused by metal-oxide-semiconductor is conducted by thermal conductivity physical efficiency, so as to reduce metal-oxide-semiconductor temperature, extends speed adjusting module
Service life, protective tube fusing is avoided to influence the normal use of air conditioning for automobiles.But the invention be directed to reduce metal-oxide-semiconductor temperature and
It is not speed regulation module of fan, and does not optimize improvement for radiator.
The content of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of Stability Analysis of Structures, volume
The high radiator structure of small, light weight, efficiency.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of radiator structure for speed regulation module of fan, it is characterised in that：Including radiator, conducting copper plate and thermal source core
Piece, described radiator are welded in the radiator mounting groove of conducting copper plate one side, and described thermal source chip is close to conducting copper plate
Another side；
Heat is transmitted to radiator by described thermal source chip through conducting copper plate, and under the air-cooled effect of blower fan, heat is dissipated
Walk.
Preferably, described radiator is the radiator using cellular hollow out packed structures, and it is excellent to combine copper metal
Moment heat transfer performance, pyrotoxin heat transfer is taken away to greatest extent, makes speed adjusting module in high-power, superelevation temperature-heat-source
Under the conditions of can keep the work of long-term efficient stable.
Preferably, each junior unit of described radiator is the air holes of regular hexagon.
Preferably, the junior unit of described radiator is in corresponding stacked according to the heat transfer temperature peak curve of thermal source
Layout.
Preferably, described radiator is using 1070 material aluminium, and the radiating that use cold-drawing technology processing and fabricating forms
Device, thermal conductivity factor is high, Stability Analysis of Structures.
Preferably, the structure also includes copper splinter and screw, and described copper splinter compresses thermal source chip, described screw according to
It is secondary to pass through copper splinter and the screwed hole of conducting copper plate, described thermal source chip is locked in conducting copper plate.
Compared with prior art, the present invention has advantages below：
1. due to using thermal source thermal contact conductance copper coin, copper coin connects cellular, hollow out stacked radiator, effectively improved
Heat transfer speed, heat dispersion is improved, and reduce the volume and weight of radiator, improve radiator effective utilization, dropped
Low cost.
2. radiator uses 1070 aluminium section bar materials, using cold-drawing technology, thermal conductivity factor is excellent, its Stability Analysis of Structures, price
It is cheap, save cost.
Brief description of the drawings
Fig. 1 is the exploded sketch of the present invention；
Fig. 2 is the outside drawing and scheme of installation of the present invention；
Fig. 3 is the structural representation using conventional radiator structure；
Fig. 4 is the radiating front schematic view of the present invention；
Fig. 5 is the radiating side schematic view of the present invention
Fig. 6 is that the layout of radiator of the present invention illustrates schematic diagram.
Wherein 1 be the present invention radiator, 2 be conducting copper plate, 3 be thermal source chip, 4 be copper splinter, 5 be screw, 6 be heat
Source, 7 be conventional diffusers, 8 be conventional heat direction of transfer, 9 be it is air-cooled, 10 be conventional wind surface, 11 be the present invention heat
Direction of transfer, 12 be the present invention wind surface, 13 be thermal source heat transfer temperature peak curve.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is the part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained on the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
As depicted in figs. 1 and 2, a kind of radiator structure for speed regulation module of fan, including radiator 1, conducting copper plate 2,
Thermal source chip 3, copper splinter 4 and screw 5, described radiator 1 are welded in the mounting groove of the radiator 1 of the one side of conducting copper plate 2,
Described thermal source chip 3 is close to the another side of conducting copper plate 2, and described copper splinter 4 compresses thermal source chip 3, described screw 5 according to
It is secondary to pass through copper splinter 4 and the screwed hole of conducting copper plate 2, described thermal source chip 3 is locked in conducting copper plate 2.
Heat is transmitted to radiator 1 by described thermal source chip 3 through conducting copper plate 2, under air-cooled 9 effect of blower fan, heat
Scattered away.Described radiator 1 is the radiator using cellular hollow out packed structures.Each of described radiator 1 is small
Unit is the air holes of regular hexagon.The junior unit of described radiator 1 is in phase according to the heat transfer temperature peak curve 13 of thermal source
The stacked layout answered.Described radiator 1 is using 1070 material aluminium, and the radiating that use cold-drawing technology processing and fabricating forms
Device.
It is as shown in figure 3, evenly distributed using the fin of the radiator 7 of conventional radiator structure.Because got over apart from thermal source 6
Far, heat transfer efficiency is lower, and fin conductive of the heat along radiator 7 is in decline trend, so evenly distributed fin
Practical efficiency is limited；And the wind surface 10 of fin only has two sides, actual wind area is small, and the heat scattered away is not high,
Radiating rate is slow.
As shown in Figure 4, Figure 5 and Figure 6, using the radiator structure of the present invention, the heat of thermal source 6 is along the radiating groove hole wall of radiator 1
Transmit, can also can be along shortest path transmission, the wind-engaging for the hole wall that radiates along side direction transmission, the heat of thermal source 6 in addition to vertical direction
Face 12 has also had more horizontal plane, actual wind area increase in addition to two sides, and the heat scattered away increases, and radiating rate is fast.Dissipate
Hot device 1 uses 1070 aluminium section bars as material, and thermal conductivity factor is high, and heat radiating slot design reduces the extension height of radiator 1, layout
The heat transfer temperature peak curve 13 of identical thermal source, stacked layout alleviate weight and volume.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, various equivalent modifications can be readily occurred in or replaced
Change, these modifications or substitutions should be all included within the scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection domain be defined.
Claims (6)
- A kind of 1. radiator structure for speed regulation module of fan, it is characterised in that：Including radiator, conducting copper plate and thermal source core Piece, described radiator are welded in the radiator mounting groove of conducting copper plate one side, and described thermal source chip is close to conducting copper plate Another side；Heat is transmitted to radiator by described thermal source chip through conducting copper plate, and under the air-cooled effect of blower fan, heat is scattered away.
- A kind of 2. radiator structure for speed regulation module of fan according to claim 1, it is characterised in that：Described radiating Device is the radiator using cellular hollow out packed structures.
- A kind of 3. radiator structure for speed regulation module of fan according to claim 1, it is characterised in that：Described radiating Each junior unit of device is the air holes of regular hexagon.
- A kind of 4. radiator structure for speed regulation module of fan according to claim 3, it is characterised in that：Described radiating The junior unit of device is laid out according to the heat transfer temperature peak curve of thermal source in corresponding stacked.
- A kind of 5. radiator structure for speed regulation module of fan according to claim 4, it is characterised in that：Described radiating Device is using 1070 material aluminium, and the radiator that use cold-drawing technology processing and fabricating forms.
- A kind of 6. radiator structure for speed regulation module of fan according to claim 1, it is characterised in that：The structure is also wrapped Include copper splinter and screw, described copper splinter compresses thermal source chip, and described screw sequentially passes through copper splinter and conducting copper plate Screwed hole, described thermal source chip is locked in conducting copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710847839.2A CN107426955A (en) | 2017-09-19 | 2017-09-19 | A kind of radiator structure for speed regulation module of fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710847839.2A CN107426955A (en) | 2017-09-19 | 2017-09-19 | A kind of radiator structure for speed regulation module of fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107426955A true CN107426955A (en) | 2017-12-01 |
Family
ID=60433650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710847839.2A Pending CN107426955A (en) | 2017-09-19 | 2017-09-19 | A kind of radiator structure for speed regulation module of fan |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107426955A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201267083Y (en) * | 2008-08-27 | 2009-07-01 | 国格金属科技股份有限公司 | Radiating module |
| CN106163222A (en) * | 2015-04-27 | 2016-11-23 | 天津程朗科技发展有限公司 | A kind of radiator |
-
2017
- 2017-09-19 CN CN201710847839.2A patent/CN107426955A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201267083Y (en) * | 2008-08-27 | 2009-07-01 | 国格金属科技股份有限公司 | Radiating module |
| CN106163222A (en) * | 2015-04-27 | 2016-11-23 | 天津程朗科技发展有限公司 | A kind of radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171201 |
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| RJ01 | Rejection of invention patent application after publication |