CN107424977A - A kind of smart card band pressing plate and there is its chip package system - Google Patents
A kind of smart card band pressing plate and there is its chip package system Download PDFInfo
- Publication number
- CN107424977A CN107424977A CN201710730980.4A CN201710730980A CN107424977A CN 107424977 A CN107424977 A CN 107424977A CN 201710730980 A CN201710730980 A CN 201710730980A CN 107424977 A CN107424977 A CN 107424977A
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- China
- Prior art keywords
- pressing plate
- chip
- band
- smart card
- plate matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
Abstract
The invention discloses a kind of smart card band pressing plate and there is its chip package system, be related to intelligent card chip encapsulation technology field.The smart card band pressing plate includes：Pressing plate matrix (1), the pressing plate matrix (1) are provided with multiple chip holes (11) along its length；The pressing plate matrix (1) and the side of ribbon contacts are only provided with raised press strip (12) along the length direction of band, and the raised press strip (12) is used to press band.The chip package system includes smart card band pressing plate as described above.The advantage of the invention is that：The smart card band pressing plate of the present invention is pressed band using raised press strip, length direction of the raised press strip along pressing plate matrix is set, it is consistent with the moving direction of band, chip hole does not have press strip in the width of pressing plate matrix, band is in moving process, be not in the phenomenon for scratching chip gold thread, ensure that the quality of chip package, be advantageous to improve the stability and service life of chip.
Description
Technical field
The present invention relates to intelligent card chip encapsulation technology field, and in particular to a kind of smart card band pressing plate and with its
Chip package system.
Background technology
In smart card industry, before finished product smart card is produced, intelligent card chip supplier is general to smart card manufacturer
The chip for being packaged into striped patterns, the important component as smart card components are provided with developer.So-called band, it is a kind of
Outward appearance is similar to the circuit board of the specific glass fibrous material of celluloid tape.Length is generally tens of rice to rice up to a hundred, general wide
Degree only has 3.5 cms.Multiple rows of up to ten thousand intelligent card chips can be encapsulated on a band.This band is equivalent to
Up to ten thousand small circuit boards are serially connected.This outward appearance and structure are well suited for the full-automatic assembly line next life of smart card production line
Production, therefore intelligent card chip supplier is essentially all that intelligent card chip is packaged into striped patterns to be supplied to smart card to manufacture
Business and developer.The manufacturing process that the intelligent card chip of intelligent card chip supplier is packaged into striped patterns is:By intelligent the core of the card
The wafer of piece turns into the crystal grain of aligned orderly by being thinned, these smart cards after fab manufactures with dicing operation
Then the die package of chip operates after bar takes to every crystal grain, it is necessary to right in operating process is carried out to crystal grain
Band is fixed.
It is general in the prior art that pressing fixation is carried out to band using pressing plate, and reserve chip hole on pressing plate and chip is entered
The various operations of row.As shown in figure 1, the position that existing pressing plate takes corresponding chip placement according to bar is provided with multiple chip holes,
One side periphery of each chip hole and ribbon contacts is provided with lug, and the lug and band plane contact, bar take every
Individual chip position all corresponds to a chip hole on pressing plate.Lug on this pressing plate is easily produced and scratched in bar Tape movement
The phenomenon of gold thread, and the phenomenon is relatively hidden, and is not easy to be found after scratching, easily causes the product quality of batch, influences to produce
Moral character energy and service life.
The content of the invention
It is an object of the invention to provide a kind of smart card band pressing plate, in the presence of solving or at least mitigate background technology
At least one at the problem of.
The technical solution adopted by the present invention is：A kind of smart card band pressing plate is provided, comprising：
Pressing plate matrix, the pressing plate matrix are provided with multiple chip holes along its length；The pressing plate matrix connects with band
Tactile side is only provided with raised press strip along the length direction of band, and the raised press strip is used to press band.
Preferably, the chip hole on each pressing plate matrix corresponds to the chip position that bar takes, the chip hole
The position that corresponding bar takes chip is provided with multiple rows of.
Preferably, the raised press strip is arranged to a plurality of, chip hole described in each row in pressing plate matrix width direction two
Side is each provided with a raised press strip.
Preferably, length of the raised press strip on pressing plate matrix is more than or equal to the overall length of chip hole described in each row,
The overall length of the chip hole is length of each row's chip hole on pressing plate matrix.
Preferably, the side of the pressing plate matrix and ribbon contacts is provided with multiple rows of groove, the groove in the width direction
Extend along the length direction of the pressing plate matrix, each row's groove corresponds to row's chip placement locations that bar takes.
Preferably, the groove often arranges groove in the width side of pressing plate matrix towards the inner recess of the pressing plate matrix
To both sides form rib, the raised press strip is arranged on the rib.
Preferably, in each row's chip hole on pressing plate matrix, two neighboring chip hole by separating every rib, it is described every
Rib is less than the surface of the pressing plate matrix in the side away from strip direction.
Present invention also offers a kind of chip package system, the chip package system includes the as above intelligence described in any one
Can card article band pressing plate.
In said chip package system, it is preferred that the chip package system further includes vacuum absorption device；Bar
Be provided with multiple through holes on the support baseboard on support baseboard by platen presses in band course of conveying, the through hole with
The vacuum absorption device connection, for adsorbing the band.
The beneficial effects of the present invention are：
The smart card band pressing plate of the present invention carries out pressing fixation to band using raised press strip, and raised press strip is along pressing plate base
The length direction of body is set, and consistent with the moving direction of band, chip hole does not have press strip, band in the width of pressing plate matrix
Be not in the phenomenon for scratching chip and gold thread in moving process, ensure that the quality of chip package, be advantageous to improve chip
Stability and service life.
Brief description of the drawings
Fig. 1 is the structural representation of smart card band pressing plate of the prior art.
Fig. 2 is the structural representation of the smart card band pressing plate of the present invention.
Wherein, 1- pressing plates matrix, 11- chip holes, 12- projection press strips, 13- grooves, 14- ribs, 15- is every rib.
Embodiment
To make the purpose, technical scheme and advantage that the present invention is implemented clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from beginning to end or class
As label represent same or similar element or the element with same or like function.Described embodiment is the present invention
Part of the embodiment, rather than whole embodiments.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to uses
It is of the invention in explaining, and be not considered as limiting the invention.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.Under
Embodiments of the invention are described in detail with reference to accompanying drawing for face.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " is based on accompanying drawing institutes
The orientation or position relationship shown, it is for only for ease of the description present invention and simplifies description, rather than instruction or the dress for implying meaning
Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that the present invention is protected
The limitation of scope.
As shown in Fig. 2 a kind of smart card band pressing plate, comprising pressing plate matrix 1, pressing plate matrix 1 is provided with along its length
Multiple chip holes 11, the size and position correspondence bar of chip hole 11 take the die size and set location of placement；Further, core
The row of film perforation 11 is identical with the row that bar takes chip placement.
The side of pressing plate matrix 1 and ribbon contacts is only provided with raised press strip 12, raised press strip along the length direction of band
12 are used to press band.It the advantage is that, raised press strip 12 is only set in the length direction of pressing plate matrix 1, and width does not have
Press strip, band will not occur the phenomenon that raised press strip scratches chip spun gold in moving process, improve the matter of chip package
Amount, be advantageous to improve the stability and service life of chip.
In the present embodiment, chip hole 11 is provided with three rows, and often row is provided with 4, the chip hole on each pressing plate matrix 1
The chip position that 11 corresponding bars take.It is understood that the quantity of chip hole 11 can be set according to actual use situation
It is fixed, for example, in an alternative embodiment, chip hole 11 is provided with 2 rows on pressing plate matrix 1；In another alternative embodiment,
Chip hole 11 is provided with 4 rows on pressing plate matrix 1；The position that the corresponding bar of chip hole 11 takes chip can be provided with multiple rows of.
In the present embodiment, raised press strip 12 is arranged to 6, each row's chip hole 11 in pressing plate matrix width direction two
Side is each provided with a raised press strip 12.It the advantage is that, band pressing is more firm, will not during being operated to chip
There is the phenomenon of bar Tape movement, be advantageous to improve the package quality of chip.It is understood that according to actual needs, it is convex
Play press strip 12 and could be arranged to a plurality of, for example, in an alternative embodiment, two adjacent row's chip holes share a raised pressure
Bar, simplify structure, it should be noted that using this kind of structure, due to increasing the pressing area of raised press strip 12, it should be noted that
Ensure the flatness of shared raised press strip 12；In another alternative embodiment, it is wide to be provided only on pressing plate matrix 1 for raised press strip 12
Spend the both sides in direction.
In the present embodiment, length of the raised press strip 12 on pressing plate matrix 1 is more than or equal to the total of each row's chip hole 11
Long, the overall length of chip hole 11 is length of each row's chip hole 11 on pressing plate matrix 1, i.e., from first chip hole 11 to the end
The length of one chip hole 11.
It is understood that raised press strip 12 can be with subsection setup, each section of correspondence in the length direction of pressing plate matrix 1
The length of one chip hole 11.
In the present embodiment, the side of pressing plate matrix 1 and ribbon contacts is provided with multiple rows of groove 13, groove in the width direction
13 extend along the length direction of pressing plate matrix 1, and are taken through the whole length of pressing plate matrix 1, the corresponding bar of each row's groove 13
Row's chip placement location.It the advantage is that, certain activity space is reserved in the movement for being arranged to band of groove 13, is prevented
Only band scratches in moving process with pressing plate matrix 1, avoids damage to the gold thread on chip.
In the present embodiment, groove 13 is towards the inner recess of pressing plate matrix 1, width of each groove 13 in pressing plate matrix 1
The both sides for spending direction form rib 14, and raised press strip 12 is arranged on rib 14.It the advantage is that, alleviate pressing plate matrix 1
Weight, while the intensity of pressing plate matrix can be ensured using rib 14.
In the present embodiment, in each row's chip hole 11 on pressing plate matrix 1, two neighboring chip hole 11 is by every rib
15 separate, and are less than the surface of pressing plate matrix 1 in the side away from strip direction every rib 15.It the advantage is that, carried out to chip
In operating process, the conversion time from a chip hole 11 to another chip hole 11 is advantageously reduced, is advantageous to improve work effect
Rate.
In the present embodiment, it is formed in one every rib 15 and pressing plate matrix 1；It is understood that can also be with every rib 15
Removably is connected with pressing plate matrix 1, the advantage is that, according to different chips, can change the length of chip hole 11, have
Beneficial to the versatility for improving pressing plate.
Present invention also offers a kind of chip package system, the chip package system includes intelligent card article as described above
Band pressing plate.Chip is encapsulated using the smart card band pressing plate, band is not in scratch showing for chip gold thread in moving process
As ensure that the quality of chip package, being advantageous to improve the stability and service life of chip.
In the present embodiment, the chip package system further includes vacuum absorption device；Lead in band course of conveying
Cross pressing plate to be pressed against on support baseboard, multiple through holes are provided with the support baseboard, the through hole fills with the vacuum suction
Connection is put, for adsorbing the band.It the advantage is that, pressing plate fixed strip band can be aided in using vacuum absorption device, it is ensured that
In the various operations to chip, band will not be moved, and be advantageous to improve the package quality of chip.
It is last it is to be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations.To the greatest extent
The present invention is described in detail with reference to the foregoing embodiments for pipe, it will be understood by those within the art that：It is still
Technical scheme described in foregoing embodiments can be modified, or which part technical characteristic is equally replaced
Change；And these modifications or replacement, the essence of appropriate technical solution is departed from the essence of various embodiments of the present invention technical scheme
God and scope.
Claims (9)
1. a kind of smart card band pressing plate, it is characterised in that include：
Pressing plate matrix (1), the pressing plate matrix (1) are provided with multiple chip holes (11) along its length；The pressing plate matrix (1)
The length direction of band is only provided with raised press strip (12) with the side of ribbon contacts, the raised press strip (12) is used to press
Band.
2. smart card band pressing plate as claimed in claim 1, it is characterised in that：Chip on each pressing plate matrix (1)
The chip position that the corresponding bar in hole (11) takes, the position that the corresponding bar of the chip hole (11) takes chip are provided with multiple rows of.
3. smart card band pressing plate as claimed in claim 2, it is characterised in that：The raised press strip (12) is arranged to a plurality of,
Chip hole (11) is each provided with a raised press strip in the both sides in pressing plate matrix width direction described in each row.
4. smart card band pressing plate as claimed in claim 3, it is characterised in that：The raised press strip (12) is in pressing plate matrix
(1) length on is more than or equal to the overall length of chip hole (11) described in each row, and the overall length of the chip hole (11) is each row's core
Length of the film perforation (11) on pressing plate matrix (1).
5. smart card band pressing plate as claimed in claim 4, it is characterised in that：The pressing plate matrix (1) and ribbon contacts
Side is provided with multiple rows of groove (13) in the width direction, and length direction of the groove (13) along the pressing plate matrix (1) extends,
Row's chip placement locations that the corresponding bar of each row's groove (13) takes.
6. smart card band pressing plate as claimed in claim 5, it is characterised in that：The groove (13) is towards the pressing plate matrix
(1) inner recess, often arrange groove (13) and form rib (14), the projection in the both sides of the width of pressing plate matrix (1)
Press strip (12) is arranged on the rib (14).
7. smart card band pressing plate as claimed in claim 6, it is characterised in that：Each row's chip on pressing plate matrix (1)
In hole (11), two neighboring chip hole (11) by every rib (15) separate, it is described every rib (15) away from strip direction side
Less than the surface of the pressing plate matrix (1).
8. a kind of chip package system, it is characterised in that the chip package system is included such as any one of claim 1 to 7 institute
The smart card band pressing plate stated.
9. chip package system as claimed in claim 8, it is characterised in that：The chip package system further includes vacuum
Adsorbent equipment；In band course of conveying by platen presses on support baseboard, multiple through holes are provided with the support baseboard,
The through hole is connected with the vacuum absorption device, for adsorbing the band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710730980.4A CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710730980.4A CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107424977A true CN107424977A (en) | 2017-12-01 |
| CN107424977B CN107424977B (en) | 2023-09-29 |
Family
ID=60433799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710730980.4A Active CN107424977B (en) | 2017-08-23 | 2017-08-23 | Smart card strip clamp plate and have its chip packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107424977B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108213733A (en) * | 2017-12-30 | 2018-06-29 | 深圳市牧激科技有限公司 | Automatic laser cutting machine |
| CN111681972A (en) * | 2020-06-19 | 2020-09-18 | 中国航空无线电电子研究所 | Tool for assisting gold removal of chip with pins and gold removing and tin coating method |
| CN112366252A (en) * | 2020-11-25 | 2021-02-12 | 深圳市中科创想科技有限责任公司 | Polycrystalline silicon wafer texturing clamping strip assembling, detecting and packaging process |
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| CN1723099A (en) * | 2002-08-02 | 2006-01-18 | 赛宝技术公司 | Method and apparatus for high volume assembly of radio frequency identification tags |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108213733A (en) * | 2017-12-30 | 2018-06-29 | 深圳市牧激科技有限公司 | Automatic laser cutting machine |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107424977B (en) | 2023-09-29 |
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