CN107415369A - LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction - Google Patents
LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction Download PDFInfo
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- CN107415369A CN107415369A CN201710429601.8A CN201710429601A CN107415369A CN 107415369 A CN107415369 A CN 107415369A CN 201710429601 A CN201710429601 A CN 201710429601A CN 107415369 A CN107415369 A CN 107415369A
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- Prior art keywords
- copper foil
- heat
- aluminium sheet
- pressure resistant
- heat conduction
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 101
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 101
- 239000004411 aluminium Substances 0.000 title claims abstract description 95
- 239000010949 copper Substances 0.000 title claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 54
- 239000003292 glue Substances 0.000 claims abstract description 48
- 239000012528 membrane Substances 0.000 claims abstract description 39
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004744 fabric Substances 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 10
- 238000010422 painting Methods 0.000 claims abstract description 10
- 229910052582 BN Inorganic materials 0.000 claims abstract description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 5
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000003647 oxidation Effects 0.000 claims description 15
- 238000007254 oxidation reaction Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 14
- 238000013461 design Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 230000007812 deficiency Effects 0.000 description 5
- 239000004831 Hot glue Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Laminated Bodies (AREA)
Abstract
It is field of circuit boards that LED television backlight of the present invention covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction.With high pressure resistant and high heat conduction technology, the aluminum oxide film film thickness of surface of aluminum plate, the CuO film thickness of copper foil surface is 5 10um, by boron nitride, magnesium hydroxide, epoxy resin, dicyandiamide is mixed and made into high-heat-conductivity glue, high-heat-conductivity glue is applied above aluminium sheet, glass cloth two sides applies 165 DEG C of bakings of high-heat-conductivity glue and cured sheets is made in 30 minutes, the coated on bottom side high-heat-conductivity glue of copper foil, the copper foil bottom surface composition aluminium sheet that painting high-heat-conductivity glue is put above cured sheets and cured sheets is put after high-heat-conductivity glue is applied above aluminium sheet, A glued membranes, cured sheets, B glued membranes, copper foil is sequentially placed, through 160 DEG C, with 175 DEG C after 30 minutes, it is pressed into LED television backlight within 180 minutes and covers copper aluminium base with high pressure resistant high heat conduction.For circuit board making.Design science is rationally, simple and ingenious structure, effect stability are reliable, easily make and cost is low, easy to utilize.
Description
Technical field
LED television backlight of the present invention covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction, is related to circuit board technology neck
Domain；More particularly to LED television backlight copper aluminium base board manufacturing method technical field is covered with high pressure resistant high heat conduction.
Background technology
At present, the aluminum base circuit board of used as television LED backlight, due to its reasons in structure, there is high pressure resistant or high
Heat conduction, without can high pressure resistant deficiency, defect and the drawback having both simultaneously with high heat conduction, so as to cause quality defect and unstable
Problem.Professional knowledge based on inventor is with abundant working experience and to the excelsior unremitting pursuit of cause, conscientious
With abundant investigation, understand, analysis, summarize, on the basis of the existing known technology of research and present situation, it is creative take " it is high pressure resistant and
High heat conduction " key technology, the present invention succeeded in developing, produced that " LED television backlight covers copper aluminium base with high pressure resistant high heat conduction
Plate " new product and the new method of " LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction ", it is effective to solve
Deficiency, defect and drawback existing for existing known technology and present situation, effectively raise the technical merit of the industry.
The content of the invention
The present invention takes " high pressure resistant and high heat conduction " key technology, provides " the high pressure resistant high heat conduction of LED television backlight
Cover copper aluminium base " new method of new product and " LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction ", this
The aluminum oxide film film thickness of invention surface of aluminum plate, the CuO film thickness of copper foil surface are 5-10um, by boron nitride, hydrogen-oxygen
Change magnesium, epoxy resin, dicyandiamide and be mixed and made into high-heat-conductivity glue, high-heat-conductivity glue is applied above aluminium sheet, glass cloth two sides applies high-heat-conductivity glue
Cured sheets, the coated on bottom side high-heat-conductivity glue of copper foil is made for 30 minutes in 165 DEG C of bakings, puts cured sheets after high-heat-conductivity glue is applied above aluminium sheet and consolidates
Copper foil bottom surface composition aluminium sheet, A glued membranes, cured sheets, B glued membranes, the copper foil that painting high-heat-conductivity glue is put above change piece are sequentially placed, through 160
DEG C, be pressed into LED television backlight with 175 DEG C, 180 minutes after 30 minutes and cover copper aluminium base with high pressure resistant high heat conduction.
It is by the purpose of the invention reached：1., take " high pressure resistant and high heat conduction " key technology, provide " LED television
Backlight covers copper aluminium base with high pressure resistant high heat conduction " new product and " LED television backlight covers copper aluminium base with high pressure resistant high heat conduction
The new method of preparation method ".2., the aluminium sheet of the present invention and copper foil be provided with the oxide film and aluminium sheet, A glue of 5-10 μ m-thicks
Film, cured sheets, B glued membranes, copper foil are sequentially placed and are connected in a manner of hot pressing, thus the present invention just possess it is high voltage withstanding and
The beneficial effect of high heat conduction function.3., the present invention solve the deficiency, defect and drawback of existing known technology.4., the present invention
Design science is rationally, simple and ingenious structure, easy to produce and use, effect stability is reliable, is advantageous to wide popularization and application.⑤、
The present invention effectively raises the technical merit of the industry.
To achieve the above object, technical scheme provided by the invention is：
A kind of LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, by aluminium sheet, A glued membranes, cured sheets, B glued membranes,
Copper foil is formed；
The LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, its aluminium sheet, A glued membranes, cured sheets, B glued membranes,
Copper foil is sequentially placed and is connected in a manner of hot pressing.
Described LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, and the aluminium sheet is platy structure, the A
Glued membrane, B glued membranes are the membrane structure of heat-conducting glue membranous type, and the cured sheets are the laminated structure of sized glass cloth semi-solid preparation, institute
It is foil-like structure to state copper foil.
Described LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, and the surface of the aluminium sheet is provided with oxidation
Aluminium film, the surface of the copper foil are provided with CuO film, and the thickness of the aluminum oxide film, the thickness of CuO film are equal
For 5-10um.
A kind of LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction：
1., high-heat-conductivity glue prepare：By parts by weight of the boron nitride 10, parts by weight of magnesium hydroxide 60, the parts by weight of epoxy resin 28, double
The parts by weight of cyanamide 2 are well mixed, and to be prepared into high-heat-conductivity glue stand-by；
2., aluminium sheet prepare：It is oxidation-treated to aluminium sheet material clean reach anodic oxidation after form aluminium sheet material surface
It is stand-by to be prepared into aluminium sheet to increase its proof voltage for the aluminum oxide film of 5-10 μ m-thicks；
3., copper foil prepare：To copper foil material cleaning it is oxidation-treated reach anodic oxidation after form copper foil material surface
It is stand-by to be prepared into copper foil to increase its proof voltage for the CuO film of 5-10 μ m-thicks；
4., apply high-heat-conductivity glue bake：It is stand-by that high-heat-conductivity glue is applied above aluminium sheet, 165 DEG C of high-heat-conductivity glue of glass cloth two sides painting
Bake and be prepared within 30 minutes that cured sheets are stand-by, the coated on bottom side high-heat-conductivity glue of copper foil is stand-by；
5., cover copper aluminium base preparation：Cured sheets are placed after painting high-heat-conductivity glue, cured sheets are placed above painting height and led above aluminium sheet
The copper foil bottom surface of hot glue, constitute described aluminium sheet, A glued membranes, cured sheets, B glued membranes, copper foil and be sequentially placed, through 160 DEG C, 30 points
Clock covers copper aluminium base in vacuum press after baking to be prepared into after 175 DEG C, pressing in 180 minutes, that is, is prepared into LED television backlight
Copper aluminium base panel products are covered with high pressure resistant high heat conduction in source.
The present invention operation principle and the course of work be：The present invention takes " high pressure resistant and high heat conduction " key technology, there is provided
" LED television backlight covers copper aluminium base with high pressure resistant high heat conduction " new product and " the high pressure resistant high heat conduction of LED television backlight
Cover copper aluminium base board manufacturing method " new method.After the present invention carries out pre-treatment, including surface clean to aluminium sheet material first, enter
Row oxidation processes, after anodic oxidation, the aluminum oxide film of 5-10 μ m-thicks is formed, to increase the proof voltage of product (for copper foil
Processing be also such).Then aluminium sheet after oxidation, which is first carried on the back, applies one layer of heat-conducting glue (i.e. glued membrane), and a high heat conduction is put after drying
PP (sized glass cloth prepreg ----i.e. cured sheets), then the copper foil that a back of the body applies high-heat-conductivity glue (i.e. glued membrane) is put, in vacuum
Under state, through 175 DEG C, the hot pressing of 4 hours, pressure 3Mpa, high voltage withstanding, the special backlights of high heat conduction LED are made with covering copper
Aluminium base.Exactly because the aluminium sheet and copper foil of the present invention are provided with the oxide film of 5-10 μ m-thicks and aluminium sheet, A glued membranes, solidification
Piece, B glued membranes, copper foil are sequentially placed and are connected in a manner of hot pressing, so the present invention just possesses high voltage withstanding and high heat conduction
Function.So as to solve the deficiency of existing known technology, defect and drawback.
As a result of technical scheme provided by the present invention；Because the present invention takes " high pressure resistant and high heat conduction " crucial skill
Art；Due to described in the operation principle and the course of work of the present invention；Due to aluminum oxide film film thickness, the copper foil of surface of aluminum plate of the present invention
The CuO film thickness on surface is 5-10um, and boron nitride, magnesium hydroxide, epoxy resin, dicyandiamide are mixed and made into height and led
Hot glue, high-heat-conductivity glue is applied above aluminium sheet, glass cloth two sides applies 165 DEG C of high-heat-conductivity glue and dried 30 minutes and cured sheets, the bottom of copper foil is made
Face applies high-heat-conductivity glue, and the copper foil bottom surface structure put above cured sheets and cured sheets and apply high-heat-conductivity glue is put after high-heat-conductivity glue is applied above aluminium sheet
It is sequentially placed into aluminium sheet, A glued membranes, cured sheets, B glued membranes, copper foil, is pressed into after 160 DEG C, 30 minutes with 175 DEG C, 180 minutes
LED television backlight covers copper aluminium base with high pressure resistant high heat conduction.So that it is of the invention compared with existing known technology and present situation, obtain
Beneficial effect be：
1st, this invention takes " high pressure resistant and high heat conduction " key technology, there is provided " the high pressure resistant height of LED television backlight
The new method of heat conduction aluminum substrate " new product and " the high pressure resistant high thermal conductivity aluminum matrix board manufacturing method of LED television backlight ".
2nd, aluminium sheet and copper foil of the invention are provided with the oxide film and aluminium sheet, A glued membranes, cured sheets, B glue of 5-10 μ m-thicks
Film, copper foil are sequentially placed and are connected in a manner of hot pressing, thus the present invention just possess it is high voltage withstanding and high heat conduction function
Beneficial effect.
3rd, the present invention solves the deficiency, defect and drawback of existing known technology.
4th, design science of the invention is rationally, simple and ingenious structure, easy to produce and use, effect stability is reliable, favorably
In wide popularization and application.
5th, the present invention effectively raises the technical merit of the industry.
Brief description of the drawings
Fig. 1 is the section that LED television backlight covers copper aluminium base with high pressure resistant high heat conduction in the specific embodiment of the invention
Schematic diagram.
Label in figure：1st, aluminium sheet, 2, A glued membranes, 3, cured sheets, 4, B glued membranes, 5, copper foil.
Embodiment
With reference to Figure of description, the present invention is described in detail.As shown in Figure of description 1：
A kind of LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, by aluminium sheet 1, A glued membranes 2, cured sheets 3, B glue
Film 4, copper foil 5 are formed；
The LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, its aluminium sheet 1, A glued membranes 2, cured sheets 3, B glue
Film 4, copper foil 5 are sequentially placed and are connected in a manner of hot pressing.
Described LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, and the aluminium sheet 1 is platy structure, the A
Glued membrane 2, B glued membranes 4 are the membrane structure of heat-conducting glue membranous type, and the cured sheets 3 are the laminated structure of sized glass cloth semi-solid preparation,
The copper foil 5 is foil-like structure.
Described LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, and the surface of the aluminium sheet 1 is provided with oxidation
Aluminium film, the surface of the copper foil 5 are provided with CuO film, the thickness of the aluminum oxide film, the thickness of CuO film
It is 5-10um.
A kind of LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction：
1., high-heat-conductivity glue prepare：By parts by weight of the boron nitride 10, parts by weight of magnesium hydroxide 60, the parts by weight of epoxy resin 28, double
The parts by weight of cyanamide 2 are well mixed, and to be prepared into high-heat-conductivity glue stand-by；
2., aluminium sheet prepare：It is oxidation-treated to aluminium sheet material clean reach anodic oxidation after form aluminium sheet material surface
It is stand-by to be prepared into aluminium sheet to increase its proof voltage for the aluminum oxide film of 5-10 μ m-thicks；
3., copper foil prepare：To copper foil material cleaning it is oxidation-treated reach anodic oxidation after form copper foil material surface
It is stand-by to be prepared into copper foil to increase its proof voltage for the CuO film of 5-10 μ m-thicks；
4., apply high-heat-conductivity glue bake：It is stand-by that high-heat-conductivity glue is applied above aluminium sheet, 165 DEG C of high-heat-conductivity glue of glass cloth two sides painting
Bake and be prepared within 30 minutes that cured sheets are stand-by, the coated on bottom side high-heat-conductivity glue of copper foil is stand-by；
5., cover copper aluminium base preparation：Cured sheets are placed after painting high-heat-conductivity glue, cured sheets are placed above painting height and led above aluminium sheet
The copper foil bottom surface of hot glue, constitute described aluminium sheet 1, A glued membranes 2, cured sheets 3, B glued membranes 4, copper foil 5 and be sequentially placed, through 160 DEG C,
Copper aluminium base is covered to be prepared into after 175 DEG C, pressing in 180 minutes in vacuum press after baking within 30 minutes, that is, is prepared into LED television
Backlight covers copper aluminium base panel products with high pressure resistant high heat conduction.
In above-mentioned specific implementation process：The thickness of thickness, CuO film to the aluminum oxide film is respectively
It is carried out with 5,6,7,8,9,10um；Obtain expected good result.
Presently preferred embodiments of the present invention is these are only, any formal limitation not is made to the present invention；All industry skills
Art personnel smooth can implement；But modification and the equivalent variations developed are made not departing from technical solution of the present invention, is this hair
Bright technical scheme.
Claims (4)
1. a kind of LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, it is characterised in that：By aluminium sheet (1), A glued membranes
(2), cured sheets (3), B glued membranes (4), copper foil (5) are formed；
The LED television backlight covers copper aluminium base with high pressure resistant high heat conduction, its aluminium sheet (1), A glued membranes (2), cured sheets (3), B
Glued membrane (4), copper foil (5) are sequentially placed and are connected in a manner of hot pressing.
2. LED television backlight according to claim 1 covers copper aluminium base with high pressure resistant high heat conduction, it is characterised in that：Institute
It is platy structure to state aluminium sheet (1), and the A glued membranes (2), B glued membranes (4) are the membrane structure of heat-conducting glue membranous type, the cured sheets
(3) it is the laminated structure of sized glass cloth semi-solid preparation, the copper foil (5) is foil-like structure.
3. LED television backlight according to claim 1 covers copper aluminium base with high pressure resistant high heat conduction, it is characterised in that：Institute
The surface for stating aluminium sheet (1) is provided with aluminum oxide film, and the surface of the copper foil (5) is provided with CuO film, the aluminum oxide
The thickness of film, the thickness of CuO film are 5-10um.
4. a kind of LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction, it is characterised in that：
1., high-heat-conductivity glue prepare：By the parts by weight of boron nitride 10, the parts by weight of magnesium hydroxide 60, the parts by weight of epoxy resin 28, dicyandiamide
2 parts by weight are well mixed, and to be prepared into high-heat-conductivity glue stand-by；
2., aluminium sheet prepare：It is oxidation-treated to aluminium sheet material clean reach aluminium sheet material surface is formed 5-10 μ
It is stand-by to be prepared into aluminium sheet to increase its proof voltage for aluminum oxide film thick m；
3., copper foil prepare：It is oxidation-treated to copper foil material cleaning reach copper foil material surface is formed 5-10 μ
It is stand-by to be prepared into copper foil to increase its proof voltage for CuO film thick m；
4., apply high-heat-conductivity glue bake：It is stand-by that high-heat-conductivity glue is applied above aluminium sheet, glass cloth two sides applies 165 DEG C of bakings of high-heat-conductivity glue
It is prepared within 30 minutes that cured sheets are stand-by, the coated on bottom side high-heat-conductivity glue of copper foil is stand-by；
5., cover copper aluminium base preparation：Cured sheets are placed after painting high-heat-conductivity glue, painting high-heat-conductivity glue is placed above in cured sheets above aluminium sheet
Copper foil bottom surface, constitute aluminium sheet (1) described in claim 1, A glued membranes (2), cured sheets (3), B glued membranes (4), copper foil (5) according to
Secondary placement, copper aluminium base is covered to be prepared into after 175 DEG C, pressing in 180 minutes in vacuum press after 160 DEG C, 30 minutes are baked,
It is prepared into LED television backlight and covers copper aluminium base panel products with high pressure resistant high heat conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429601.8A CN107415369A (en) | 2017-06-09 | 2017-06-09 | LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429601.8A CN107415369A (en) | 2017-06-09 | 2017-06-09 | LED television backlight covers copper aluminium base board manufacturing method with high pressure resistant high heat conduction |
Publications (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419460A (en) * | 2012-05-24 | 2013-12-04 | 甄伟浪 | Processing method of high-heat-conduction aluminum base copper clad board |
| CN106626700A (en) * | 2016-12-27 | 2017-05-10 | 江西省航宇新材料股份有限公司 | Manufacturing technique for aluminum metal base copper foil coating laminated board |
| CN207274040U (en) * | 2017-06-09 | 2018-04-27 | 陕西长石电子材料股份有限公司 | LED television backlight covers copper aluminum substrate with high pressure resistant high heat conduction |
-
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419460A (en) * | 2012-05-24 | 2013-12-04 | 甄伟浪 | Processing method of high-heat-conduction aluminum base copper clad board |
| CN106626700A (en) * | 2016-12-27 | 2017-05-10 | 江西省航宇新材料股份有限公司 | Manufacturing technique for aluminum metal base copper foil coating laminated board |
| CN207274040U (en) * | 2017-06-09 | 2018-04-27 | 陕西长石电子材料股份有限公司 | LED television backlight covers copper aluminum substrate with high pressure resistant high heat conduction |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
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