CN107415067B - 一种利用金刚线对单晶硅圆棒切割开方的方法 - Google Patents
一种利用金刚线对单晶硅圆棒切割开方的方法 Download PDFInfo
- Publication number
- CN107415067B CN107415067B CN201710609341.2A CN201710609341A CN107415067B CN 107415067 B CN107415067 B CN 107415067B CN 201710609341 A CN201710609341 A CN 201710609341A CN 107415067 B CN107415067 B CN 107415067B
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- CN
- China
- Prior art keywords
- cutting
- monocrystalline silicon
- round rod
- silicon round
- diamond
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
切割面垂直度(°) | 表面粗糙度(um) | 所需时间(min) | |
实施例一 | 90±0.1 | 0.69 | 660 |
实施例二 | 90±0.1 | 0.62 | 590 |
实施例三 | 90±0.1 | 0.58 | 600 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710609341.2A CN107415067B (zh) | 2017-07-24 | 2017-07-24 | 一种利用金刚线对单晶硅圆棒切割开方的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710609341.2A CN107415067B (zh) | 2017-07-24 | 2017-07-24 | 一种利用金刚线对单晶硅圆棒切割开方的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107415067A CN107415067A (zh) | 2017-12-01 |
CN107415067B true CN107415067B (zh) | 2019-03-22 |
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CN201710609341.2A Active CN107415067B (zh) | 2017-07-24 | 2017-07-24 | 一种利用金刚线对单晶硅圆棒切割开方的方法 |
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CN (1) | CN107415067B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI786740B (zh) * | 2020-07-27 | 2022-12-11 | 環球晶圓股份有限公司 | 晶碇切割裝置及晶碇切割方法 |
CN114030093B (zh) * | 2021-12-01 | 2023-02-28 | 长飞光纤光缆股份有限公司 | 一种晶体冷加工方法 |
CN116277560B (zh) * | 2023-05-17 | 2023-08-11 | 浙江求是半导体设备有限公司 | 晶棒切割***及金刚线寿命检测方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0887137A2 (en) * | 1997-06-24 | 1998-12-30 | Nippei Toyama Corporation | Tension adjusting mechanism for wire saw |
CN102285010A (zh) * | 2011-08-08 | 2011-12-21 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的太阳能级硅晶薄片及其切割方法 |
CN102294757A (zh) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的单晶短棒拼接方法 |
CN102490280A (zh) * | 2011-12-12 | 2012-06-13 | 内蒙古中环光伏材料有限公司 | 一种金刚石线应用于砂浆切方设备的方法 |
CN103302754A (zh) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | 金刚石线锯切割方法及切割设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008018478A (ja) * | 2006-07-11 | 2008-01-31 | Osaka Titanium Technologies Co Ltd | 棒状材の切断方法およびそれを用いた切断装置 |
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2017
- 2017-07-24 CN CN201710609341.2A patent/CN107415067B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0887137A2 (en) * | 1997-06-24 | 1998-12-30 | Nippei Toyama Corporation | Tension adjusting mechanism for wire saw |
CN102285010A (zh) * | 2011-08-08 | 2011-12-21 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的太阳能级硅晶薄片及其切割方法 |
CN102294757A (zh) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的单晶短棒拼接方法 |
CN102490280A (zh) * | 2011-12-12 | 2012-06-13 | 内蒙古中环光伏材料有限公司 | 一种金刚石线应用于砂浆切方设备的方法 |
CN103302754A (zh) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | 金刚石线锯切割方法及切割设备 |
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CN107415067A (zh) | 2017-12-01 |
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Effective date of registration: 20230805 Address after: Room 1203, No. 2 Houkenanli, Haicang District, Xiamen City, Fujian Province, 361000 Patentee after: Xiamen Luan Chuang Technology Co.,Ltd. Address before: 226600 Huanghai Avenue, Hai'an Development Zone, Nantong City, Jiangsu Province Patentee before: COMTEC SOLAR (JIANGSU) Co.,Ltd. |
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Effective date of registration: 20230911 Address after: Room 705-2, 7th floor, Building A, Zhongyuan Science and Technology Innovation Park, No. 6596 Dongfanghong East Road, Yuanqiao Town, Economic and Technological Development Zone, Dezhou City, Shandong Province, 253000 (production address: Workshop 1 of Yifang Steel Structure Co., Ltd. in Chongde, Yuanqiao Town) Patentee after: Dezhou Beili Tool Co.,Ltd. Address before: Room 1203, No. 2 Houkenanli, Haicang District, Xiamen City, Fujian Province, 361000 Patentee before: Xiamen Luan Chuang Technology Co.,Ltd. |