CN107413612A - Piezoelectric supersonic generator of multi-frequency and preparation method thereof - Google Patents
Piezoelectric supersonic generator of multi-frequency and preparation method thereof Download PDFInfo
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- CN107413612A CN107413612A CN201710468686.0A CN201710468686A CN107413612A CN 107413612 A CN107413612 A CN 107413612A CN 201710468686 A CN201710468686 A CN 201710468686A CN 107413612 A CN107413612 A CN 107413612A
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- mems cantilever
- supersonic generator
- piezoelectric
- mems
- frequency
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000003491 array Methods 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007667 floating Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
- B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses piezoelectric supersonic generator of a kind of multi-frequency and preparation method thereof, is a kind of small volume, in light weight, simple to operate, frequency-adjustable, and be easy to novel ultrasonic generator integrated with other devices and preparation method thereof.The piezoelectric supersonic generator of the multi-frequency is using High Resistivity Si as substrate, MEMS cantilever beam pull-down electrodes are provided with substrate, MEMS cantilever beam bridge piers are provided with MEMS cantilever beam pull-down electrodes, MEMS cantilever beams are provided with MEMS cantilever beam bridge piers, piezoelectric ZnO is provided between MEMS cantilever beams and MEMS cantilever beam pull-down electrodes.The present invention is due to having different length in MEMS cantilever arrays, characteristic frequency is different, so as to realize the ultrasonic wave of multi-frequency.
Description
Technical field
The present invention relates to piezoelectric supersonic generator of a kind of multi-frequency and preparation method thereof, belongs to ultrasound, microelectron-mechanical
Systems technology field.
Background technology
Ultrasonic wave is the sound wave that a kind of frequency is higher than 20000 hertz, and ultrasonic wave is approximately equal to listening for people because of its lower-frequency limit
Feel the upper limit and gain the name.Ultrasonic wave has the characteristics such as pack, orientation and reflection, transmission, thus produces, propagates and connect by ultrasonic wave
The process of receipts is so as to completing a kind of ultrasonic technique.
Over nearly more than 20 years, with the rapid development of MEMS technology, in-depth study is carried out to MEMS cantilever beam structures so that
MEMS technology is possibly realized applied to ultrasonic generator.Ultrasonic technique has extensively in the fields such as biomedicine, collection of energy
Application.
The content of the invention
The technical problems to be solved by the invention are to provide piezoelectric supersonic generator of a kind of multi-frequency and preparation method thereof,
The MEMS cantilever beams of different length by using MEMS cantilever beam Technology designs, so as to realize that the frequency of ultrasonic generator is selected
Select.The ultrasonic generator has miniaturized structure, simple to operate, it is easy of integration the features such as.
The present invention uses following technical scheme to solve above-mentioned technical problem：
On the one hand, the present invention provides a kind of piezoelectric supersonic generator of multi-frequency, the piezoelectric supersonic generator using silicon as substrate,
Silicon substrate is provided with MEMS cantilever beams pull-down electrode and MEMS cantilever beam bridge piers；The MEMS cantilever beams bridge pier hangs provided with MEMS
Arm beam array, one end of each MEMS cantilever beams in the MEMS cantilever arrays are fixed on MEMS cantilever beam bridge piers, separately
One end is free end；Each MEMS cantilever beams are respectively arranged below a MEMS cantilever beam pull-down electrode, each MEMS cantilever beams
Piezoelectric material layer is provided with pull-down electrode.
As the further technical scheme of the present invention, each MEMS cantilever beams length in MEMS cantilever arrays not phase
Together.
As the further technical scheme of the present invention, the MEMS cantilever beams number in MEMS cantilever arrays is 5.
As the further technical scheme of the present invention, the silicon substrate is High Resistivity Si SOI substrate.
As the further technical scheme of the present invention, piezoelectric ZnO.
On the other hand, the present invention also provides a kind of preparation method of the piezoelectric supersonic generator of multi-frequency, the preparation method
Including step in detail below：
（1）Prepare silicon substrate；
（2）Remove the photoresist at MEMS cantilever beams pull-down electrode, MEMS cantilever beam bridge piers；
（3）Sputtering gold, forms MEMS cantilever beams pull-down electrode and MEMS cantilever beam bridge piers；
（4）With plasma enhanced CVD method technique piezoelectric material layer is grown in MEMS cantilever beam pull-down electrodes；
（5）Coating polyimide sacrifice layer on a silicon substrate, photoetching polyimide sacrificial layer, only retain the sacrifice under cantilever beam
Layer；
（6）Plating gold, forms MEMS cantilever arrays；
（7）The polyimide sacrificial layer below each MEMS cantilever beams is discharged with developer solution, and is dehydrated with absolute ethyl alcohol, is formed outstanding
Floating MEMS cantilever arrays.
As the further technical scheme of the present invention, step（1）Middle silicon substrate is High Resistivity Si SOI substrate.
As the further technical scheme of the present invention, step（3）The thickness of middle sputtering gold is 0.5 μm, step（4）Middle piezoelectricity
The thickness of material layer is 1 μm, step（5）The thickness of middle polyimide sacrificial layer is 1 μm, step（6）The thickness of middle plating gold is 1
μm。
As the further technical scheme of the present invention, step（6）Each MEMS cantilever beams in middle MEMS cantilever arrays
Length differs.
As the further technical scheme of the present invention, step（4）Middle piezoelectric is ZnO.
The present invention compared with prior art, has following technique effect using above technical scheme：
1st, the piezoelectric supersonic generator has the MEMS cantilever array structures of different length, therefore can produce different frequency
Ultrasonic signal, can be the ultrasonic signal or the continuous ultrasonic signal of frequency of a series of frequency-distributeds；
2nd, the piezoelectric supersonic generator has the MEMS cantilever array structures of different length, therefore can improve the ultrasound of system
Caused efficiency, and the fault-tolerant error of system frequency can be improved；
3rd, the piezoelectric supersonic generator is using MEMS cantilever beam structures, therefore the structure has small volume, in light weight, is easy to
Other devices integrate, such as implantating biological chip.
Brief description of the drawings
Fig. 1 is the top view of the piezoelectric supersonic generator of different length MEMS cantilever array structures.
Fig. 2 is the sectional view of unifrequent piezoelectric supersonic generator.
In figure：1 is silicon substrate, and 2 be MEMS cantilever beam pull-down electrodes, and 3 be MEMS cantilever beams, and 4 be MEMS cantilever beam bridge piers,
5 be piezoelectric ZnO layer, and 6 be MEMS cantilever beam fixing ends, and 7 be MEMS cantilever beams free end.
Fig. 3 is the sectional view that unifrequent piezoelectric supersonic generator after voltage drive is added between upper bottom crown.
Embodiment
Technical scheme is described in further detail below in conjunction with the accompanying drawings：
The present invention provides a kind of piezoelectric supersonic generator of multi-frequency, and using High Resistivity Si as substrate 1, on substrate being designed with MEMS hangs
Arm beam pull-down electrode 2, the array of MEMS cantilever beams 3 of different length, piezoelectric ZnO layer 5.As shown in figure 1, by different length
MEMS cantilever arrays and two parallel conductive plates of the MEMS cantilever beams pull-down electrode as capacitor, there are certain intervals centre.
MEMS cantilever beams one end of different length is fixed on bridge pier 4 as fixing end, and the other end can move up and down as free end.
If applying voltage between MEMS cantilever beams pull-down electrode 2 and MEMS cantilever beams 3, because MEMS cantilever beams are fixed
Hold that 6 is irremovable and MEMS cantilever beams free end 7 can move up and down, MEMS cantilever beams 3 are in electrostatic force after voltage is applied
Under can bend.When bending sufficiently large, MEMS cantilever beams free end 7 can be touched on piezoelectric ZnO 5, now MEMS cantilevers
Electrical potential difference between beam pull-down electrode 2 and MEMS cantilever beams 3 reduces, and electrostatic force reduces, in the elastic-restoring force of MEMS cantilever beams 3
Under effect, MEMS cantilever beams 3 return to initial position.Then, electrostatic force once more pulls downward on MEMS cantilever beams, repeatedly this
Process.Because MEMS cantilever beams 3 have different length, characteristic frequency is also different, so as to which this structure can produce multi-frequency
Ultrasonic wave.
Unifrequent piezoelectric supersonic generator between upper bottom crown as shown in Fig. 2 add voltage drive, when voltage reaches
During certain value, MEMS cantilever beams free end can start to bend under electrostatic force.The size of the electrostatic force depends on being added in two
The length of the voltage swing at end, parallel electrode plate spacing and MEMS cantilever beams.When bending to a certain degree, MEMS cantilevers
Beam free end can touch piezoelectric ZnO as shown in figure 3, being at this moment equivalent to connect capacitor positive/negative plate, capacitor
Electric discharge, electrostatic force disappear.In the presence of elastic-restoring force, MEMS cantilever beams can return to initial position.Then, electrostatic force is again
MEMS cantilever beams are pulled downward on again, repeatedly this process, so as to produce with MEMS cantilever beam characteristic frequency identical ultrasonic waves,
MEMS cantilever beams length is different, and characteristic frequency is different.In repetitive process, because MEMS cantilever beams length is different, eigenfrequency
Difference, therefore the piezoelectric ultrasonic of multi-frequency can be produced, ultrasonic frequency can realize from 20kHz to 800kHz scope.
The piezoelectric supersonic generator of multi-frequency of the present invention is using the MEMS cantilever arrays of five different lengths, each MEMS
A MEMS cantilever beams pull-down electrode and a piezoelectric ZnO are respectively arranged below cantilever beam.By under MEMS cantilever beams
Apply voltage between pulling electrode and MEMS cantilever beams, due to electrostatic force, the MEMS cantilever beams of such different length just have difference
The bending of degree.When bending to a certain degree, MEMS cantilever beams will touch piezoelectric ZnO, and at this moment electrostatic force subtracts
Small or even disappearance, MEMS cantilever beams return to initial position, when MEMS cantilever beams leave piezoelectric ZnO, electrostatic force
Gradually recover, again pull down MEMS cantilever beams, so repeatedly.It is special due to having different length in MEMS cantilever arrays
It is different to levy frequency, so as to realize the ultrasonic wave of multi-frequency.
Its preparation method of the piezoelectric supersonic generator of multi-frequency is：
（1）Prepare silicon substrate：What is selected is High Resistivity Si SOI substrate；
（2）Photoetching：Remove the photoresist in MEMS cantilever beam pull-down electrodes, MEMS cantilever beam bridge piers；
（3）Sputtering gold：MEMS cantilever beams pull-down electrode and MEMS cantilever beam bridge piers are formed, thickness is 0.5 μm；
（4）Deposit piezoelectric ZnO layer：With plasma enhanced CVD method technique in MEMS cantilever beam pull-down electrodes
The piezoelectric ZnO layer of 1 μ m thick of upper growth；
（5）Deposit simultaneously photoetching polyimide sacrificial layer：Coat the polyimide sacrificial layer of 1 μ m-thick, it is desirable to fill up pit, polyamides is sub-
The thickness of amine sacrifice layer determines the height between different length MEMS cantilever beams and MEMS cantilever beam pull-down electrodes, photoetching polyamides
Imines sacrifice layer, only retain the sacrifice layer under cantilever beam；
（6）Plating gold；Different length MEMS cantilever beams are electroplated, golden thickness is 1 μm；
（7）Releasing sacrificial layer；With the polyimide sacrificial layer below developer solution release different length MEMS cantilever beam structures, it is used in combination
Absolute ethyl alcohol is dehydrated, and forms the different length MEMS cantilever beam structures of suspension.
Distinguish whether be the structure standard it is as follows：
The ultrasonic generator structure is using the different MEMS cantilever array structures of five length.Operation principle is：By to not
Apply DC voltage with length MEMS cantilever arrays and MEMS cantilever beams pull-down electrode, it is different long so under electrostatic force
Degree MEMS cantilever beams just have different degrees of bending.When bending to a certain degree, will be contacted with piezoelectric ZnO,
Electrostatic force, which reduces, even to disappear, and elastic force causes MEMS cantilever beams to return to initial position.Then electrostatic force gradually recovers, and repeats
Said process, the MEMS cantilever beams of different length produce vibration, produce ultrasonic wave.Due to having difference in MEMS cantilever arrays
Length, characteristic frequency is different, so as to realize the ultrasonic wave of multi-frequency.
Meet that the structure of conditions above is considered as the piezoelectric supersonic generator of the multi-frequency of the present invention.
It is described above, it is only the embodiment in the present invention, but protection scope of the present invention is not limited thereto, and is appointed
What be familiar with the people of the technology disclosed herein technical scope in, it will be appreciated that the conversion or replacement expected, should all cover
Within the scope of the present invention, therefore, protection scope of the present invention should be defined by the protection domain of claims.
Claims (10)
1. the piezoelectric supersonic generator of multi-frequency, it is characterised in that the piezoelectric supersonic generator is using silicon as substrate, on a silicon substrate
Provided with MEMS cantilever beams pull-down electrode and MEMS cantilever beam bridge piers；The MEMS cantilever beams bridge pier is provided with MEMS cantilever beam battle arrays
Arrange, one end of each MEMS cantilever beams in the MEMS cantilever arrays is fixed on MEMS cantilever beam bridge piers, and the other end is
Free end；Each MEMS cantilever beams are respectively arranged below a MEMS cantilever beam pull-down electrode, each MEMS cantilever beams drop-down electricity
Piezoelectric material layer is provided with extremely.
2. the piezoelectric supersonic generator of multi-frequency according to claim 1, it is characterised in that in MEMS cantilever arrays
Each MEMS cantilever beam length differs.
3. the piezoelectric supersonic generator of multi-frequency according to claim 1, it is characterised in that in MEMS cantilever arrays
MEMS cantilever beams number is 5.
4. the piezoelectric supersonic generator of multi-frequency according to claim 1, it is characterised in that the silicon substrate is High Resistivity Si
SOI substrate.
5. the piezoelectric supersonic generator of multi-frequency according to claim 1, it is characterised in that piezoelectric ZnO.
6. the preparation method of the piezoelectric supersonic generator of multi-frequency, it is characterised in that the preparation method includes step in detail below：
（1）Prepare silicon substrate；
（2）Remove the photoresist at MEMS cantilever beams pull-down electrode, MEMS cantilever beam bridge piers；
（3）Sputtering gold, forms MEMS cantilever beams pull-down electrode and MEMS cantilever beam bridge piers；
（4）With plasma enhanced CVD method technique piezoelectric material layer is grown in MEMS cantilever beam pull-down electrodes；
（5）Coating polyimide sacrifice layer on a silicon substrate, photoetching polyimide sacrificial layer, only retain the sacrifice under cantilever beam
Layer；
（6）Plating gold, forms MEMS cantilever arrays；
（7）The polyimide sacrificial layer below each MEMS cantilever beams is discharged with developer solution, and is dehydrated with absolute ethyl alcohol, is formed outstanding
Floating MEMS cantilever arrays.
7. the preparation method of the piezoelectric supersonic generator of multi-frequency according to claim 6, it is characterised in that step（1）
Middle silicon substrate is High Resistivity Si SOI substrate.
8. the preparation method of the piezoelectric supersonic generator of multi-frequency according to claim 6, it is characterised in that step（3）
The thickness of middle sputtering gold is 0.5 μm, step（4）The thickness of middle piezoelectric material layer is 1 μm, step（5）Middle polyimide sacrificial layer
Thickness be 1 μm, step（6）The thickness of middle plating gold is 1 μm.
9. the preparation method of the piezoelectric supersonic generator of multi-frequency according to claim 6, it is characterised in that step（6）
Each MEMS cantilever beams length in middle MEMS cantilever arrays differs.
10. the preparation method of the piezoelectric supersonic generator of multi-frequency according to claim 6, it is characterised in that step（4）
Middle piezoelectric is ZnO.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710468686.0A CN107413612A (en) | 2017-06-20 | 2017-06-20 | Piezoelectric supersonic generator of multi-frequency and preparation method thereof |
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| CN201710468686.0A CN107413612A (en) | 2017-06-20 | 2017-06-20 | Piezoelectric supersonic generator of multi-frequency and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112870562A (en) * | 2021-01-06 | 2021-06-01 | 上海交通大学 | Implanted piezoelectric MEMS ultrasonic transducer and preparation method thereof |
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Application publication date: 20171201 |
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