CN107406674A - Peel ply formation composition - Google Patents
Peel ply formation composition Download PDFInfo
- Publication number
- CN107406674A CN107406674A CN201680017216.6A CN201680017216A CN107406674A CN 107406674 A CN107406674 A CN 107406674A CN 201680017216 A CN201680017216 A CN 201680017216A CN 107406674 A CN107406674 A CN 107406674A
- Authority
- CN
- China
- Prior art keywords
- peel ply
- acid
- formation composition
- resin substrate
- polyamic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 29
- 239000000945 filler Substances 0.000 claims abstract description 19
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 54
- 229920005989 resin Polymers 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 19
- -1 aromatic tetracarboxylic acid Chemical class 0.000 claims description 18
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 17
- 150000004984 aromatic diamines Chemical class 0.000 claims description 10
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 239000000376 reactant Substances 0.000 claims 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 44
- 239000011159 matrix material Substances 0.000 description 28
- 238000002360 preparation method Methods 0.000 description 19
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 230000006978 adaptation Effects 0.000 description 16
- 239000011521 glass Substances 0.000 description 16
- 239000000243 solution Substances 0.000 description 14
- 239000007788 liquid Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 8
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 150000001555 benzenes Chemical class 0.000 description 6
- 239000003575 carbonaceous material Substances 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical class NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229940018564 m-phenylenediamine Drugs 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 238000002525 ultrasonication Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 235000019241 carbon black Nutrition 0.000 description 4
- 239000003205 fragrance Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 3
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000002079 double walled nanotube Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000002048 multi walled nanotube Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000002109 single walled nanotube Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical class NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical class CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical class C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000002134 carbon nanofiber Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- YZBBUYKPTHDZHF-KNVGNIICSA-N (3R)-7,2'-dihydroxy-4'-methoxyisoflavanol Chemical compound OC1=CC(OC)=CC=C1[C@H]1C(O)C2=CC=C(O)C=C2OC1 YZBBUYKPTHDZHF-KNVGNIICSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- 150000000183 1,3-benzoxazoles Chemical class 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical class COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 150000005001 2,5-diaminotoluenes Chemical class 0.000 description 1
- BWAPJIHJXDYDPW-UHFFFAOYSA-N 2,5-dimethyl-p-phenylenediamine Chemical compound CC1=CC(N)=C(C)C=C1N BWAPJIHJXDYDPW-UHFFFAOYSA-N 0.000 description 1
- 150000005000 2,6-diaminotoluenes Chemical class 0.000 description 1
- MJAVQHPPPBDYAN-UHFFFAOYSA-N 2,6-dimethylbenzene-1,4-diamine Chemical compound CC1=CC(N)=CC(C)=C1N MJAVQHPPPBDYAN-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ZMLHBBXPXZXTSP-UHFFFAOYSA-N 2-fluoropropane Chemical compound C[C](C)F ZMLHBBXPXZXTSP-UHFFFAOYSA-N 0.000 description 1
- PPPFYBPQAPISCT-UHFFFAOYSA-N 2-hydroxypropyl acetate Chemical compound CC(O)COC(C)=O PPPFYBPQAPISCT-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical compound C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- PQFRTJPVZSPBFI-UHFFFAOYSA-N 3-(trifluoromethyl)benzene-1,2-diamine Chemical class NC1=CC=CC(C(F)(F)F)=C1N PQFRTJPVZSPBFI-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- GMNVMGZRYCFBBV-UHFFFAOYSA-N 3-butan-2-yloxy-n,n-dimethylpropanamide Chemical compound CCC(C)OCCC(=O)N(C)C GMNVMGZRYCFBBV-UHFFFAOYSA-N 0.000 description 1
- LVYXPOCADCXMLP-UHFFFAOYSA-N 3-butoxy-n,n-dimethylpropanamide Chemical compound CCCCOCCC(=O)N(C)C LVYXPOCADCXMLP-UHFFFAOYSA-N 0.000 description 1
- CRORGGSWAKIXSA-UHFFFAOYSA-N 3-methylbutyl 2-hydroxypropanoate Chemical compound CC(C)CCOC(=O)C(C)O CRORGGSWAKIXSA-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- FHDAHNBPYOFJMC-UHFFFAOYSA-N 4-(4-amino-3,5-difluorophenyl)-2,6-difluoroaniline Chemical class C1=C(F)C(N)=C(F)C=C1C1=CC(F)=C(N)C(F)=C1 FHDAHNBPYOFJMC-UHFFFAOYSA-N 0.000 description 1
- MITHMOYLTXMLRB-UHFFFAOYSA-N 4-(4-aminophenyl)sulfinylaniline Chemical compound C1=CC(N)=CC=C1S(=O)C1=CC=C(N)C=C1 MITHMOYLTXMLRB-UHFFFAOYSA-N 0.000 description 1
- PJWQLRKRVISYPL-UHFFFAOYSA-N 4-[4-amino-3-(trifluoromethyl)phenyl]-2-(trifluoromethyl)aniline Chemical class C1=C(C(F)(F)F)C(N)=CC=C1C1=CC=C(N)C(C(F)(F)F)=C1 PJWQLRKRVISYPL-UHFFFAOYSA-N 0.000 description 1
- KZSXRDLXTFEHJM-UHFFFAOYSA-N 5-(trifluoromethyl)benzene-1,3-diamine Chemical class NC1=CC(N)=CC(C(F)(F)F)=C1 KZSXRDLXTFEHJM-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- SKNOITCLAVCCPT-UHFFFAOYSA-N C1(=CC=CC=C1)C1=CC=C(C=C1)C1=CC=CC=C1.NNC(NN)=O Chemical group C1(=CC=CC=C1)C1=CC=C(C=C1)C1=CC=CC=C1.NNC(NN)=O SKNOITCLAVCCPT-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical group CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- NWHVETQKRUAVNP-UHFFFAOYSA-N anthracene-1,2,7,8-tetracarboxylic acid Chemical class C1=CC(C(O)=O)=C(C(O)=O)C2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 NWHVETQKRUAVNP-UHFFFAOYSA-N 0.000 description 1
- 238000001241 arc-discharge method Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical class C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 210000000481 breast Anatomy 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- MGHPNCMVUAKAIE-UHFFFAOYSA-N diphenylmethanamine Chemical compound C=1C=CC=CC=1C(N)C1=CC=CC=C1 MGHPNCMVUAKAIE-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940035423 ethyl ether Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- VQAXAEVAHOSPMQ-UHFFFAOYSA-N n,n-dimethyl-3-[(2-methylpropan-2-yl)oxy]propanamide Chemical class CN(C)C(=O)CCOC(C)(C)C VQAXAEVAHOSPMQ-UHFFFAOYSA-N 0.000 description 1
- 229940017144 n-butyl lactate Drugs 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
Abstract
The present invention provides the peel ply formation composition for including polyamic acid, carbon system filler and organic solvent.
Description
Technical field
The present invention relates to peel ply formation composition, in detail, is related to for forming the stripping set on matrix
The peel ply formation composition of layer.
Background technology
In recent years, for electronic device need imparting bent as function, it is necessary to be thinned with lighting so
Performance.Based on this, require to substitute conventional weight, fragility, unyielding glass substrate and use the flexiplast of lightweight
Substrate.In addition, for display of new generation, it is desirable to which exploitation is flexible plastic substrates, active panchromatic using lightweight
(active full-color) TFT display panel.Therefore, begin one's study the various electronic devices using resin film as substrate
Manufacture method, for display of new generation, studying and manufactured with the technique for the existing TFT equipment that can convert.
Patent document 1,2 and 3 discloses following method：Amorphous si film layer is formed on the glass substrate, it is thin at this
After foring plastic base in film layer, laser is irradiated from glass surface side, it is caused using accompanying with the crystallization of amorphous silicon
Hydrogen peels off plastic base from glass substrate.In addition, patent document 4 discloses that following method：Use patent document 1~3
Disclosed technology will be stripped layer (being described in patent document 4 " being transferred layer ") and be pasted on plastic foil, complete liquid crystal display dress
Put.
But method, particularly method disclosed in patent document 4 disclosed in patent document 1~4 must use translucency high
Substrate, give the energy for being enough to be passed to substrate and then releasing hydrogen contained in non-crystalline silicon, it is therefore desirable to stronger
The irradiation of laser, is present to being stripped the problem of layer brings damage.In addition, laser treatment needs for a long time, will have large area
Be stripped layer peel off it is difficult, therefore the problem of there is also being difficult to improve the productivity ratio of element manufacturing.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 10-125929 publications
Patent document 2：Japanese Unexamined Patent Publication 10-125931 publications
Patent document 3：International Publication No. 2005/050754
Patent document 4：Japanese Unexamined Patent Publication 10-125930 publications
The content of the invention
The invention problem to be solved
The present invention in view of above-mentioned actual conditions and complete, and it is an object of the present invention to provide can not be to the resin base of flexible electronic device
The peel ply formation composition that strip to damage is peeled off.
Means for solving the problems
The present inventor furthers investigate repeatedly in order to solve above-mentioned problem, as a result finds by comprising polyamic acid, carbon system filler
Can be formed with the composition of organic solvent has the excellent adaptation with matrix and the tree with being used in flexible electronic device
The peel ply of the appropriate adaptation of aliphatic radical plate and the fissility of appropriateness, completes the present invention.
That is, the present invention provides：
1. peel ply formation composition, it includes polyamic acid, carbon system filler and organic solvent,
2. 1 peel ply formation composition, wherein, above-mentioned polyamic acid is to make aromatic diamine and aromatic series tetracarboxylic acid
Polyamic acid obtained from acid dianhydride reaction,
3. 2 peel ply formation composition, it is characterised in that above-mentioned aromatic diamine is containing 1~5 benzene nucleus
Aromatic diamine,
4. 2 or 3 peel ply formation composition, it is characterised in that above-mentioned aromatic tetracarboxylic acid's dianhydride is to contain 1~5
Aromatic tetracarboxylic acid's dianhydride of individual benzene nucleus,
5. the peel ply formation composition of 1~4 any one, wherein, above-mentioned carbon system filler is CNT or graphite
Alkene,
6. the peel ply formed using the peel ply formation of 1~5 any one with composition,
7. the manufacture method of the flexible electronic device with resin substrate, it is characterised in that using 6 peel ply,
8. 7 manufacture method, it is characterised in that above-mentioned resin substrate is the substrate made of polyimides.
The effect of invention
By using the present invention peel ply formation composition, can repeatability obtain well have it is excellent with matrix
The film of the fissility of different adaptation and the appropriate adaptation with resin substrate and appropriateness.By using such composition,
In the manufacturing process of flexible electronic device, not to the resin substrate formed on matrix and then the electricity set thereon
Road etc. will can separate in the case of bringing damage together with the resin substrate and the circuit etc. from the matrix.Therefore, it is of the invention
Peel ply formation can help to easy, its finished product of the manufacturing process of the flexible electronic device with resin substrate with composition
Rate raising etc..
Embodiment
The present invention is described in more detail below.
The peel ply formation of the present invention includes polyamic acid, carbon system filler and organic solvent with composition.Wherein, it is of the invention
In peel ply be in order at as defined in purpose be close to glass basis top set layer, as its typical case, can enumerate
Go out in the manufacturing process of flexible electronic device for the flexible electronic device made of matrix and the resin as polyimides
Between the resin substrate of part by the resin substrate in defined technique it is fixed and set and formd on the resin substrate
Electronic circuit etc. it is rear in order that obtain the resin substrate can be from the peel ply that the matrix is easily peeled off and set.
The polyamic acid used in the present invention is not particularly limited, diamines can be made to react and obtain with tetracarboxylic dianhydride
Arrive, but from the viewpoint of the feature as peel ply for improving obtained film, preferably make aromatic diamine and aromatic series four
Polyamic acid obtained from carboxylic acid dianhydride reaction.
As aromatic diamine, as long as being then not particularly limited with 2 amino and with aromatic rings in intramolecular,
Preferably comprise the aromatic diamine of 1~5 benzene nucleus.
As its concrete example, can include Isosorbide-5-Nitrae-diaminobenzene (p-phenylenediamine), 1,3- diaminobenzenes (m-phenylene diamine (MPD)),
1,2- diaminobenzenes (o-phenylenediamine), 2,4 di amino toluene, 2,5- diaminotoluenes, 2,6- diaminotoluenes, 4,6- diformazans
Base-m- phenylenediamine, 2,5- dimethyl-p-phenylenediamine, 2,6- dimethyl-p-phenylenediamine, 2,4,6- trimethyl -1,3- benzene two
Amine, 2,3,5,6- TMPDs, m-xylene diamine, p dimethylamine, 5- trifluoromethylbenzene -1,3- diamines, 5- tri-
The diamines that the benzene nucleus such as double (trifluoromethyl) benzene -1,2- diamines of methyl fluoride benzene -1,2- diamines, 3,5- are 1；1,2- naphthylenediamines, 1,
3- naphthylenediamines, 1,4- naphthylenediamines, 1,5- naphthylenediamines, 1,6- naphthylenediamines, 1,7- naphthylenediamines, 1,8- naphthylenediamines, 2,3- naphthylenediamines, 2,
6- naphthylenediamines, 4,4 '-benzidine, 2,2 '-bis- (trifluoromethyls) -4,4 '-benzidines, 3,3 '-dimethyl -4,4 '-two
Aminodiphenylmethane, 3,3 '-dicarboxyl -4,4 '-diaminodiphenyl-methane, 3,3 ', 5,5 '-tetramethyl -4,4 '-diaminourea
Diphenyl methane, 4,4 '-diaminobenzene anilid, 3,3 '-dichloro-benzidine, 3,3 '-dimethylbenzidine, 2,2 '-diformazan
Base benzidine, 3,3 '-diaminodiphenyl-methane, 3,4 '-diaminodiphenyl-methane, 4,4 '-diaminodiphenyl-methane, 2,
Double (3- aminophenyls) propane of 2-, double (4- aminophenyls) propane of 2,2-, double (3- the aminophenyls) -1,1,1,3,3,3- six of 2,2-
Fluoro-propane, 2,2- double (4- aminophenyls) -1,1,1,3,3,3- HFC-236fas, 3,3 '-diaminodiphenyl sulfoxide, 3,4 '-two
Aminodiphenyl base sulfoxide, 4,4 '-diaminodiphenyl sulfoxide, 3,3 '-bis- (trifluoromethyl) biphenyl -4,4 '-diamines, 3,3 ', 5,
5 '-tetrafluoro biphenyl -4,4 '-diamines, 4,4 '-diaminourea octafluorobiphenyl, 2- (3- aminophenyls) -5- aminobenzimidazoles, 2- (4-
Aminophenyl) benzene nucleus such as -5- An base benzoxazoles be 2 diamines；1,5- diaminoanthraquinone-s, 2,6- diaminoanthraquinone-s, 9,10- diaminos
Base anthracene, 1,8- diaminourea are luxuriant and rich with fragrance, 2,7- diaminourea is luxuriant and rich with fragrance, 3,6- diaminourea is luxuriant and rich with fragrance, 9,10- diaminourea is luxuriant and rich with fragrance, 1,3- is double (3- aminophenyls)
Double (4- aminophenyls) benzene of benzene, 1,3-, double (3- aminophenyls) benzene of 1,4-, double (4- aminophenyls) benzene of 1,4-, double (the 3- ammonia of 1,3-
Base aralkyl sulfid) benzene, double (4- aminophenyl-thioethers) benzene of 1,3-, double (4- aminophenyl-thioethers) benzene of 1,4-, double (the 3- amino of 1,3-
Phenylsulfone) benzene, double (the 4- aminophenyls sulfone) benzene of 1,3-, double (the 4- aminophenyls sulfone) benzene of 1,4-, the double [2- (4- aminophenyls) of 1,3-
Isopropyl] benzene, double [2- (3- aminophenyls) isopropyl] benzene of 1,4-, double [2- (4- aminophenyls) isopropyl] benzene of 1,4-, 4,4 "-
The benzene nucleus such as diaminourea-p- terphenyl, 4,4 "-diaminourea-m- terphenyl is 3 diamines etc., but is not limited to these.This
It can be used alone, two or more can be also applied in combination a bit.
Wherein, from the viewpoint of the obtained feature as peel ply of film is improved, preferably only by aromatic rings and
The aromatic diamine that aromatic ring and heteroaromatic ring without substituents such as methyl on the heterocycle condensed with it are formed.Specifically
Ground, preferably p-phenylenediamine, m-phenylene diamine (MPD), 2- (3- aminophenyls) -5- aminobenzimidazoles, 2- (4- aminophenyls) -5- amino
Benzoxazole, 4,4 "-diaminourea-p- terphenyl etc..
In the present invention, for the usage amount of aromatic diamine, in whole diamines, preferably 70 moles of more than %, more
Preferably 80 moles of more than %, more preferably 90 moles of more than %, it is still more preferably 95 moles of more than %, most preferably
For 100 moles of %.By using such usage amount, can repeatability obtain well with the excellent adaptation with matrix
With the appropriate adaptation with resin substrate and the film of the fissility of appropriateness.
As aromatic tetracarboxylic acid's dianhydride, as long as in intramolecular with 2 dicarboxylic anhydride positions and with aromatic rings, then
It is not particularly limited, preferably comprises aromatic tetracarboxylic acid's dianhydride of 1~5 benzene nucleus.
As its concrete example, pyromellitic acid anhydride, benzene -1,2 can be included, 3,4- tetracarboxylic dianhydrides, naphthalene -1,2,3,
4- tetracarboxylic dianhydrides, naphthalene -1,2,5,6- tetracarboxylic dianhydrides, naphthalene -1,2,6,7- tetracarboxylic dianhydrides, naphthalene -1,2,7,8- tetrabasic carboxylic acids two
Acid anhydride, naphthalene -2,3,5,6- tetracarboxylic dianhydrides, naphthalene -2,3,6,7- tetracarboxylic dianhydrides, naphthalene-1,4,5,8-tetracarboxylic acid dianhydride, biphenyl -2,
2 ', 3,3 '-tetracarboxylic dianhydride, biphenyl -2,3,3 ', 4 '-tetracarboxylic dianhydride, biphenyl -3,3 ', 4,4 '-tetracarboxylic dianhydride, anthracene -1,
2,3,4- tetracarboxylic dianhydrides, anthracene -1,2,5,6- tetracarboxylic dianhydrides, anthracene -1,2,6,7- tetracarboxylic dianhydrides, anthracene -1,2,7,8- tetracarboxylic acids
Acid dianhydride, anthracene -2,3,6,7- tetracarboxylic dianhydrides, phenanthrene -1,2,3,4- tetracarboxylic dianhydrides, phenanthrene -1,2,5,6- tetracarboxylic dianhydrides, phenanthrene -
1,2,6,7- tetracarboxylic dianhydrides, phenanthrene -1,2,7,8- tetracarboxylic dianhydrides, phenanthrene -1,2,9,10- tetracarboxylic dianhydrides, phenanthrene -2,3,5,6- four
Carboxylic acid dianhydride, phenanthrene -2,3,6,7- tetracarboxylic dianhydrides, phenanthrene -2,3,9,10- tetracarboxylic dianhydrides, phenanthrene -3,4,5,6- tetracarboxylic dianhydrides,
Phenanthrene -3,4,9,10- tetracarboxylic dianhydrides etc., but and it is defined in these.These can be used alone, and can also combine two or more
Use.
Wherein, from the viewpoint of the feature as peel ply for improving obtained film, preferably benzene nucleus is 1 or 2
Aromatic carboxylic acid dianhydride.And specifically, it is preferable to aromatic tetracarboxylic acid's dianhydride of any one expression by formula (C1)~(C12), more
It is preferred that the aromatic tetracarboxylic acid's dianhydride represented by any one of formula (C1)~(C7) and (C9)~(C11).
[changing 1]
In the present invention, for the usage amount of aromatic tetracarboxylic acid's dianhydride, in whole tetracarboxylic dianhydrides, preferably 70 rub
You are more than %, more preferably more preferably 80 moles of more than %, 90 moles of more than %, is still more preferably 95 moles of %
More than, most preferably 100 moles of %.By using such usage amount, can repeatability obtain having well and matrix
The film of the fissility of excellent adaptation and the appropriate adaptation with resin substrate and appropriateness.
By reacting diamines described above and tetracarboxylic dianhydride, use is formed so as to obtain the peel ply of the present invention
Polyamic acid contained by composition.
The weight average molecular weight of above-mentioned polyamic acid preferably 5,000~1,000,000, more preferably 10,000~500,000, from
From the viewpoint of treatability, further preferred 15,000~200,000.It should illustrate, in the present invention, weight average molecular weight is to pass through
Polystyrene standard based on gel permeation chromatography (GPC) analysis converts obtained mean molecule quantity.
As long as the organic solvent used in such reaction does not produce harmful effect to reaction, then it is not particularly limited,
As its concrete example, metacresol, 2-Pyrrolidone, METHYLPYRROLIDONE, N- ethyl-2-pyrrolidones, N- can be included
Vinyl-2-pyrrolidone, DMAC N,N' dimethyl acetamide, N,N-dimethylformamide, 3- methoxyl groups-N, N- dimethyl propionyl
Amine, 3- ethyoxyls-N, N- dimethylpropionamide, 3- propoxyl group-N, N- dimethylpropionamide, 3- isopropoxies-N, N- dimethyl
Propionamide, 3- butoxy-N, N- dimethylpropionamide, 3- sec- butoxy-N, N- dimethylpropionamide, 3- t-butoxy-N,
N- dimethylpropionamides, gamma-butyrolacton etc..Further, organic solvent can a kind be used alone or two or more be applied in combination.
Reaction temperature can suitably be set in the range of molten point to the boiling point of the solvent used, usually 0~100 DEG C of left side
The right side, in order to prevent the imidizate in the solution of obtained polyamic acid, the high content of polyamic acid unit is maintained, is preferably
0~70 DEG C or so, more preferably 0~60 DEG C or so, more preferably 0~50 DEG C or so.
Reaction time cannot treat different things as the same due to dependent on reaction temperature, the reactivity of raw material, but be usually
1~100 hour or so.
As long as the carbon system filler used in the present invention forms using carbon atom as principal component, then it is not particularly limited, preferably
Fibrous carbon material, stratiform carbon material, particle shape carbon material.Further, these carbon system fillers can each be used alone or
Two or more is applied in combination.
As the concrete example of fibrous carbon material, CNT (CNT), carbon nano-fiber (CNF) etc. can be included, from point
From the viewpoint of dissipating property, acquired etc., preferably CNT.CNT typically using arc discharge method, chemical gas phase growth methods (CVD),
Laser ablation method etc. is made, and the CNT used in the present invention can be obtained using any method.In addition, have 1 in CNT
Carbon film (graphene sheet) is rolled into the individual layer CNT (being also abbreviated as SWCNT below) of cylindrical shape, rolls up 2 graphene sheets
Concentrically 2 layers of CNT (being also abbreviated as DWCNT below) of round shape and multiple graphene sheets are rolled into the multilayers of concentric circles
CNT (MWCNT), in the present invention, SWCNT, DWCNT, MWCNT can be each used alone or make multiple combinations
With.
Further, when adopting making SWCNT, DWCNT or MWCNT with the aforedescribed process, the catalyst such as nickel, iron, cobalt, yttrium is golden sometimes
Category is also remaining, therefore refined for the impurity to be removed sometimes for carrying out.Removing for impurity, with using nitric acid, sulphur
It is effective that the acid treatment of acid etc. carries out ultrasonication together.But if using nitric acid, sulfuric acid etc. acid treatment, have
The pi-conjugated system for forming CNT may be destroyed, characteristic original infringement CNT, is made it is desirable to be refined under suitable condition
With.
As the concrete example of stratiform carbon material, graphite, graphene etc. can be included.For graphite, there is no particular restriction, energy
Enough use commercially available various graphite.Graphene is the sheet material of the sp2 bonding carbon atoms of the thickness of 1 atom, is had by carbon atom
And its cellular hexagonal minor structure bonded together to form, its thickness are stated to be 0.38nm or so.In addition, except commercially available oxygen
Beyond graphite alkene, it is possible to use graphene oxide obtained from being handled using Hummers methods graphite.
As the concrete example of particle shape carbon material, furnace black, channel black, acetylene black, pyrolytic carbon black etc. can be included
Carbon black etc..For carbon black, there is no particular restriction, can use commercially available various carbon blacks, its particle diameter preferably 5~500nm.
The peel ply formation of the present invention represents with the ratio between the polyamic acid in composition and carbon system filler with mass ratio, relatively
In polyamic acid 1, carbon system filler is 0.001~0.1 or so, preferably 0.005~0.05 or so, more preferably 0.01~0.02
Left and right.
The peel ply formation of the present invention includes organic solvent with composition.As the organic solvent, can include with it is above-mentioned
The same organic solvent of the concrete example of the reaction dissolvent of reaction.Wherein, from polyamic acid is fully dissolved, easily prepares homogeneity
From the viewpoint of high composition, preferably DMF, DMA, METHYLPYRROLIDONE,
DMI, N- ethyl-2-pyrrolidones, more preferably gamma-butyrolacton, METHYLPYRROLIDONE.
Even further, individually in the case of do not make polyamic acid dissolve solvent, as long as what polyamic acid did not separated out
Scope, it also can be used in the preparation of composition.Especially, it can moderately make ethyl cellosolve, butyl cellosolve, ethyl card must
Alcohol, butyl carbitol, ethylcarbitol acetate, ethylene glycol, 1- methoxy-2-propanols, 1- ethyoxyl -2- propyl alcohol, 1- fourth oxygen
Base -2- propyl alcohol, 1- phenoxy group -2- propyl alcohol, Propylene glycol monoacetate, propylene-glycol diacetate, propane diols -1- monomethyl ethers -2-
Acetic acid esters, propane diols -1- list ethylether -2- acetic acid esters, DPG, 2- (2- ethoxy-cs epoxide) propyl alcohol, methyl lactate, breast
The solvent that acetoacetic ester, lactic acid n-propyl ester, n-butyl lactate, isoamyl lactate etc. have low surface tension mixes.It is known by
This film homogeneity in the coating on substrate improves, and also preferably uses in the present invention.
The peel ply formation of the present invention is arbitrary with the preparation method of composition.Preferable one as preparation method
Example, can enumerate following method：The reaction solution mistake for the polyamic acid comprising target that method using described above is obtained
Filter, carbon system filler is added in obtained filtrate, implements decentralized processing.Now, for the purpose of concentration regulation etc., if it is desired,
Filtrate can be diluted or be concentrated.By using such method, the composition system that can turn into by obtaining can not only be reduced
The impurity for the reason for adaptation of the peel ply made, fissility etc. are deteriorated is mixed into, and can efficiently obtain peel ply
Formation composition.
As decentralized processing, wet type as mechanical treatment, using ball mill, ball mill, jet mill etc. can be included
Processing, use bath type, the ultrasonication of the sonicator of sonde-type.The time of decentralized processing be it is arbitrary, preferably 1 point
Clock was to 10 hours or so, more preferably 5 minutes to 5 hours or so.Further, during decentralized processing, can implement to heat as needed.
In addition, as the solvent for diluting, it is not particularly limited, as its concrete example, can includes molten with the reaction of above-mentioned reaction
The same solvent of the concrete example of agent.For dilution solvent can a kind be used alone or two or more be applied in combination.
For the concentration of the polyamic acid in the peel ply formation composition of the present invention, the peel ply of making is considered
Thickness, the viscosity etc. of composition are suitably set, usually 1~30 mass % or so, preferably 1~20 mass % or so.It is logical
Cross and become such concentration, obtain the peel ply of 0.05~5 μm or so of thickness well so as to repeatability.It is just poly-
For the concentration of amic acid, the diamines of the raw material of polyamic acid and the usage amount of tetracarboxylic dianhydride can be used as by adjustment, is made
Its amount etc. is adjusted when the polyamic acid of isolation dissolves in a solvent to be adjusted.
In addition, for the viscosity of the peel ply formation composition of the present invention, thickness of peel ply of making etc. is considered
Suitably set, for the purpose of the film for the thickness for particularly obtaining 0.05~5 μm or so well by repeatability in the case of, lead to
Often, it is 10~10,000mPas or so, preferably 20~5,000mPas or so at 25 DEG C.Wherein, viscosity can use city
The viscosimetric analysis viscosimeter for the liquid sold, the step of referring for example to described in JIS K7117-2, in 25 DEG C of the temperature of composition
Under conditions of be measured.Preferably as viscosimeter, cone-plate type (cone-plate type) rotation viscometer is used, it is preferable that
1 ° of 34 ' × R24 is used to enter as standard cone rotor under conditions of 25 DEG C of the temperature of composition in the viscosimeter of homotype
Row measure.As such rotation viscometer, such as Toki Sangyo Co., Ltd. TVE-25L can be included.
Further, the peel ply formation composition of the present invention is in addition to polyamic acid and organic solvent, such as in order to carry
High film-strength, crosslinking agent etc. can be included.
Matrix is coated on by the way that the peel ply of present invention mentioned above is formed into composition, by the heating of obtained film
Hot-imide is carried out to polyamic acid, it is suitable with the excellent adaptation with matrix and with resin substrate so as to obtain
The adaptation of degree and peel ply fissility, being made up of polyimide film of appropriateness.
In the case of peel ply of the invention as being formed on matrix, peel ply can be formed at the part table of matrix
Face, it can also be formed at all surfaces.As the form of the part surface formation peel ply in matrix, have only in matrix surface
Defined scope is formed the form of peel ply, is formed and shelled with pattern-likes such as dot pattern, line and space patterns in whole matrix surface
Form of absciss layer etc..Further, in the present invention, matrix mean its surface coating present invention peel ply formation composition,
Component for the manufacture of flexible electronic device etc..
As matrix (base material), such as glass, plastics (makrolon, polymethacrylates, polyphenyl second can be included
Alkene, polyester, polyolefin, epoxy, melamine, triacetyl cellulose, ABS, AS, norbornene resin etc.), metal (silicon wafer
Deng), timber, paper, slabstone etc., especially, there is the angle for its sufficient adaptation from the peel ply of the present invention,
It is preferred that glass.Further, matrix surface can be made up of single material, can be also made up of material of more than two kinds.As by 2 kinds
More than material form matrix surface form, there is certain scope in matrix surface to be made up of certain material, remaining surface by
The form that other materials is formed；Certain material is present in pattern-likes such as dot pattern, line and space patterns in matrix surface entirety
Form in other materials etc..
The method being coated is not particularly limited, such as cast coating method, spin-coating method, scraper for coating can be included
Method, dip coating, rolling method, stick coating method, molding rubbing method, ink-jet method, print process (relief printing plate, intaglio plate, lithographic plate, silk-screen printing etc.)
Deng.
Heating-up temperature for carrying out imidizate generally suitably determines in the range of 50~550 DEG C, is preferably big
In 150 DEG C and less than 510 DEG C.By making heating-up temperature turn into such temperature, the obtained fragilityization of film can be prevented, simultaneously
It is sufficiently carried out imidization reaction.Heat time is different because of heating-up temperature, therefore can not entirely provide, usually 5 points
Clock~5 hour.As long as in addition, scope of the acid imide rate for 50~100%.
As preferable one of the mode of heating in the present invention, following gimmick can be enumerated：It heated at 50~150 DEG C
After 5 minutes~2 hours, periodically heating-up temperature is set to increase like this, finally in more than 150 DEG C and less than 510 DEG C heating 30
Minute~4 hours.Particularly preferably：After 5 minutes~2 hours are heated at 50~150 DEG C, more than 150 DEG C and less than 350 DEG C
Heating 5 minutes~2 hours, next heated 30 minutes~4 hours more than 350 DEG C and less than 450 DEG C, finally more than 450
DEG C and less than 510 DEG C heat 30 minutes~4 hours.
For the utensil for heating, such as hot plate, baking oven etc. can be included.Heating atmosphere can be air under,
Can be under non-active gas, furthermore it is possible to under normal pressure, or under decompression.
The thickness of peel ply is usually 0.01~50 μm or so, from the viewpoint of productivity ratio, preferably 0.05~20 μm
Left and right.Further, desired thickness is realized by adjusting the thickness of the film before heating.
Peel ply described above has excellent adaptation and and the resin substrate with matrix, the particularly matrix of glass
Appropriate adaptation and appropriateness fissility.Therefore, peel ply of the present invention can be suitable for：In flexible electronic device
Damage will not be brought in the manufacturing process of part to the resin substrate of the device by the resin substrate and the shape on the resin substrate
Into circuit etc. together from matrix stripping.
One of manufacture method of the flexible electronic device for the peel ply for having used the present invention is illustrated below.
Using the peel ply formation composition of the present invention, adopt and form peel ply on glass basis with the aforedescribed process.
By being coated with the resin solution for forming resin substrate on the peel ply, the film is heated, so as to be formed via this hair
Bright peel ply is fixed on the resin substrate of glass basis.Now, in a manner of peel ply all to be covered, with than peel ply
The big area of area forms substrate.As above-mentioned resin substrate, the resin substrate representative as flexible electronic device can be included
Property the resin substrate made of polyimides, as the resin solution for forming it, polyimide solution, poly- can be included
Acid amides acid solution.The forming method of the resin substrate is conventionally.
Next, desired circuit is formed on the resin substrate that the peel ply via the present invention is fixed on matrix, so
Afterwards, such as along peel ply by resin substrate cut, peel off resin substrate from peel ply together with the circuit, by resin substrate
Separated with matrix.Now, a part for matrix can be cut together with peel ply.
Embodiment
It is exemplified below embodiment the present invention is described in more detail, but the present invention is not limited to these embodiments.
[1] abbreviation of compound
p-PDA：P-phenylenediamine (Tokyo chemical conversion industry (strain) manufacture)
DATP：4,4 "-diaminourea-p- terphenyl (Tokyo chemical conversion industry (strain) manufacture)
ABO：2- (4- aminophenyls) -5- An bases benzoxazole (Changzhou Sunlight Pharmaceutical
Co., Ltd. is manufactured)
PMDA：Pyromellitic acid anhydride (Tokyo chemical conversion industry (strain) manufacture)
CNT：CNT, product name NC7000 (manufacture of Nanocyl companies)
GRA：Graphene, product name iGurafen- α (manufacture of (strain) ア イ テ ッ Network)
NMP：METHYLPYRROLIDONE
The measure ＞ of ＜ weight average molecular weight and molecular weight distribution
The weight average molecular weight (Mw) of polymer and the measure of molecular weight distribution (Mw/Mn) use Japan light splitting (strain) GPC processed
Device (post：Showa electrician (strain) OHpak SB803-HQ processed and OHpak SB804-HQ；Eluent：Dimethylformamide/
LiBr·H2O(29.6mM)/H3PO4(29.6mM)/THF (0.1 mass %)；Flow：1.0mL/ minute；Column temperature：40℃；Mw：
Polystyrene standard scaled value) carry out (same in following embodiment and comparative example).
[2] preparation example of resin substrate composition
The synthesis ＞ of ＜ preparation example 1-1 polyamic acids
P-PDA 20.3g (188 mMs) and DATP 12.2g (47 mMs) is set to be dissolved in NMP 617.4g.It will obtain
Solution be cooled to 15 DEG C, thereto add PMDA 50.1g (230 mMs), be warming up to 50 DEG C under nitrogen atmosphere, make its anti-
Answer 48 hours.The Mw of obtained polymer is 82,100, molecular weight distribution 2.7.Further, will not from obtained reaction solution
Polyamic acid is separated, and the reaction solution has been directly used as into resin substrate formation composition.
[3] preparation of filler dispersion liquid
＜ preparation example 2-1 ＞
P-PDA 2.49g (23.0 mMs) are made to be dissolved in NMP 63g.Then, PMDA 4.51g (20.7 mmoles are added
You), stir under nitrogen atmosphere, at room temperature 24 hours.Then, CNT 0.07g are added in obtained solution, are entered at room temperature
After one step has stirred 30 minutes, ultrasonic generator (UIP1000hd is used when stirring obtained mixture
10 minutes 500w ultrasonication (Transducer manufactures), similarly hereinafter) is carried out, has obtained filler dispersion liquid.
＜ preparation example 2-2 ＞
P-PDA 1.72g (15.9 mMs) and DATP1.03g (3.97 mMs) is set to be dissolved in NMP 63g.Then,
PMDA 4.25g (19.5 mMs) are added, have been stirred under nitrogen atmosphere, at room temperature 24 hours.
Then, CNT 0.07g are added in obtained solution, after being further stirred at room temperature 30 minutes, side stirring
Obtained mixture side carries out 10 minutes 500w ultrasonication with ultrasonic generator, has obtained filler dispersion liquid.
＜ preparation example 2-3 ＞
ABO 3.59g (15.9 mMs) are made to be dissolved in NMP 63g.Then, PMDA 3.40g (15.6 mMs) are added,
Under nitrogen atmosphere, stirred at room temperature 24 hours.Then, CNT 0.07g are added in obtained solution, at room temperature further
After having stirred 30 minutes, at the ultrasonic wave that carries out 10 minutes 500w with ultrasonic generator when stirring obtained mixture
Reason, has obtained filler dispersion liquid.
＜ preparation example 2-4 ＞
ABO 3.59g (15.9 mMs) are made to be dissolved in NMP 63g.PMDA 3.40g are added in obtained solution
(15.6 mMs), stir under nitrogen atmosphere, at room temperature 24 hours.Then, GRA 0.07g are added in obtained solution,
After being further stirred at room temperature 30 minutes, ultrasonic generator is used to carry out when stirring obtained mixture 10 minutes
500w ultrasonication, obtained filler dispersion liquid.
[4] preparation of peel ply formation composition
＜ preparation example 3-1 ＞
The filler dispersion liquid 10g and NMP that are obtained in preparation example 2-1 are mixed, obtained the mass %'s of solid component concentration 5
Peel ply formation composition.It should illustrate, solid constituent herein means both polyamic acid and filler.
＜ preparation example 3-2~3-4 ＞
Use what is obtained in preparation example 2-2~2-4 to disperse respectively except the dispersion liquid for replacing obtaining in preparation example 2-1
Beyond liquid, the peel ply that the mass % of solid component concentration 5 has been obtained using the method same with embodiment 3-1 is formed with combining
Thing.
[5] formation of peel ply
＜ embodiment 1-1 ＞
Use spinner (condition：Rotating speed 3000rpm × 30 second) the peel ply formation obtained in preparation example 3-1 is combined
Thing is coated with 100mm × 100mm alkali-free glass substrate, and obtained film heated into 10 points at 80 DEG C using hot plate
Clock.
Then, by obtained film be put into Gas Replacement Vacuum Furnaces (KDF-900GL (DENKEN-HIGHDENTAL Co.,
Ltd. manufacture)) in, carry out nitrogen displacement after being depressurized 60 minutes in stove at room temperature.
Then, from room temperature to 300 DEG C, heat 30 minutes at 300 DEG C, heated 60 minutes at 400 DEG C successively,
Heated 10 minutes at 500 DEG C, made the peel ply of about 0.1 μm of thickness on the glass substrate.
Further, room temperature~300 DEG C, 300~400 DEG C, 400~500 DEG C of programming rate be set to 10 DEG C/min.
＜ embodiment 1-2~1-4 ＞
In addition to having used the peel ply formation composition obtained in preparation example 3-1, using same with embodiment 1-1
Method form peel ply.
[6] evaluation of peel ply
For the peel ply of making, the function as peel ply is evaluated using following gimmick.
The adaptation of ＜ glass substrates and peel ply evaluates ＞
The cross-cut (in length and breadth 1mm intervals, similarly hereinafter) of the peel ply formed on glass substrate, 100 grids
Cutting.That is, by the cross-cut, the cubic grids of 100 1mm are formd.
Then, in 100 mesh segmentation bonding partially adhesive tapes, the adhesive tape is peeled off, based on following standard (5B~
0B, B, A, AA) degree of stripping is evaluated.
5B：0% peels off (no to peel off)
4B：Stripping less than 5%
3B：5~stripping less than 15%
2B：15~stripping less than 35%
1B：35~stripping less than 65%
0B：65~stripping less than 80%
B：80~stripping less than 95%
A：95~stripping less than 100%
AA：100% peels off and (all peels off)
The adaptation of ＜ peel plies and resin substrate evaluates ＞
Use rod coaters (gap：250 μm), it is coated with the peel ply obtained in embodiment 1-1 in preparation example 1-1
To resin substrate formation composition.Then, obtained film heated 30 minutes at 80 DEG C using hot plate.
Then, by obtained film be put into Gas Replacement Vacuum Furnaces (KDF-900GL (DENKEN-HIGHDENTAL Co.,
Ltd. manufacture)) in, after being depressurized 60 minutes in stove at room temperature, carry out nitrogen displacement.
Then, from room temperature to 300 DEG C, heat 30 minutes at 300 DEG C, heated 30 minutes at 400 DEG C successively,
Heated 60 minutes at 500 DEG C, form the resin substrate of about 10 μm of thickness on the glass substrate.
Further, room temperature~300 DEG C, 300~400 DEG C, 400~500 DEG C of programming rate be set to 10 DEG C/min.Similarly,
Resin substrate has been made on the peel ply obtained in embodiment 1-2~1-4.
Then, the cross-cut (in length and breadth 1mm intervals, similarly hereinafter) cut by carrying out the cross of resin substrate peel ply,
The cutting of 100 grids is carried out, in 100 mesh segmentation bonding partially adhesive tapes, the adhesive tape is peeled off, based on above-mentioned standard
(5B~0B, B, A, AA) is evaluated the degree of stripping.
The result that fissility is evaluated is shown in Table 1.As shown in table 1 like that, it is known that peel ply and glass of the invention
The excellent adhesion of substrate, and it is excellent with the fissility of resin substrate.
[table 1]
Claims (8)
1. peel ply formation composition, it includes polyamic acid, carbon system filler and organic solvent.
2. peel ply formation composition according to claim 1, wherein, above-mentioned polyamic acid for make aromatic diamine with
Polyamic acid obtained from the anhydride reactant of aromatic tetracarboxylic acid two.
3. peel ply formation composition according to claim 2, it is characterised in that above-mentioned aromatic diamine is to contain 1
The aromatic diamine of~5 benzene nucleus.
4. the peel ply formation composition according to Claims 2 or 3, it is characterised in that above-mentioned aromatic tetracarboxylic acid two
Acid anhydride is aromatic tetracarboxylic acid's dianhydride containing 1~5 benzene nucleus.
5. the peel ply formation composition according to any one of Claims 1 to 4, wherein, above-mentioned carbon system filler is carbon
Nanotube or graphene.
6. the peel ply that the peel ply formation described in any one of usage right requirement 1~5 is formed with composition.
7. the manufacture method of the flexible electronic device with resin substrate, it is characterised in that the stripping described in usage right requirement 6
Layer.
8. manufacture method according to claim 7, it is characterised in that above-mentioned resin substrate is the base made of polyimides
Plate.
Applications Claiming Priority (3)
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| JP2015042875 | 2015-03-04 | ||
| JP2015-042875 | 2015-03-04 | ||
| PCT/JP2016/056347 WO2016140238A1 (en) | 2015-03-04 | 2016-03-02 | Peeling layer forming composition |
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| CN107406674A true CN107406674A (en) | 2017-11-28 |
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| JP (1) | JP6620805B2 (en) |
| KR (1) | KR102483075B1 (en) |
| CN (1) | CN107406674A (en) |
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| CN109836858A (en) * | 2017-11-29 | 2019-06-04 | 上海和辉光电有限公司 | A kind of release film, flexible device preparation method, release film and flexible device |
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| CN110099974B (en) * | 2016-12-27 | 2022-02-25 | 日产化学株式会社 | Composition for forming protective layer on substrate |
| WO2018181496A1 (en) * | 2017-03-30 | 2018-10-04 | 日産化学株式会社 | Composition for forming releasing layers, and releasing layer |
| US11927904B2 (en) * | 2021-06-16 | 2024-03-12 | Canon Kabushiki Kaisha | Electrophotographic belt having a substrate containing a polyimide resin and carbon nanotubes, electrophotographic image forming apparatus, fixing device, and varnish |
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| TW201702287A (en) | 2017-01-16 |
| KR20170125362A (en) | 2017-11-14 |
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| JPWO2016140238A1 (en) | 2017-12-14 |
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| KR102483075B1 (en) | 2022-12-30 |
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Application publication date: 20171128 |