CN107404819B

CN107404819B - Substrate assembly and electronic device

Info

Publication number: CN107404819B
Application number: CN201710696290.1A
Authority: CN
Inventors: 范艳辉
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-08-14
Filing date: 2017-08-14
Publication date: 2023-05-16
Anticipated expiration: 2037-08-14
Also published as: CN107404819A

Abstract

The invention discloses a substrate assembly and electronic equipment, wherein the substrate assembly comprises a substrate, a middle frame and a buckle, the buckle is arranged on the middle frame, the substrate is fixed on the middle frame through the buckle, and the buckle elastically deforms to clamp the substrate between the buckle and the middle frame. The buckle provided by the invention has the advantages that the buckle can be elastically deformed to clamp the substrate between the buckle and the middle frame, the buckle can be directly clamped on the surface of the substrate, the clamping of the substrate can be realized without perforating on the substrate, the limiting and fixing of the substrate are realized, the damage to devices, wires and the like of the substrate can be avoided, and the damage to the substrate in the fixing process is reduced.

Description

Substrate assembly and electronic device

Technical Field

The invention relates to the technical field of electronic equipment, in particular to a substrate assembly and electronic equipment.

Background

With the development of network technology and the improvement of the intelligent degree of electronic devices, users can realize more and more functions through the electronic devices, such as voice call, video call and the like by utilizing instant messaging programs.

The printed circuit board of the electronic equipment is screwed onto the shell of the electronic equipment through screws, screw holes are needed to be drilled manually in the actual production process, and the printed circuit board and the shell of the electronic equipment are both needed to be provided with the screw holes, and the printed circuit board is fixed onto the shell through the screws. However, since the number of devices on the printed circuit board is too large, the screw holes are easily biased in the manual screw hole punching process, and the printed circuit board is easily damaged, broken and the like, so that the printed circuit board is poor.

Disclosure of Invention

The embodiment of the invention provides a substrate assembly and electronic equipment, which can reduce the damage of a substrate.

In a first aspect, an embodiment of the present invention provides a substrate assembly, for use in an electronic device, where the substrate assembly includes a substrate, a middle frame, and a buckle, where the buckle is disposed on the middle frame, the substrate is fixed on the middle frame by the buckle, and the buckle elastically deforms to clamp the substrate between the buckle and the middle frame.

In a second aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes a housing and a substrate assembly disposed in the housing, and the substrate assembly is a substrate assembly as described above.

According to the substrate assembly provided by the embodiment of the invention, the buckle is elastically deformed, so that the substrate can be clamped between the buckle and the middle frame, the buckle can be directly clamped on the surface of the substrate, the clamping of the substrate can be realized without perforating on the substrate, the limiting and fixing of the substrate are realized, the damage to devices, wires and the like of the substrate can be avoided, and the damage to the substrate in the fixing process is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Fig. 2 is a schematic front view of the electronic device shown in fig. 1.

Fig. 3 is a schematic structural diagram of a housing according to an embodiment of the present invention.

Fig. 4 is another schematic structural view of a housing according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of another structure of an electronic device according to an embodiment of the present invention.

Fig. 6 is a schematic front view of the electronic device shown in fig. 5.

Fig. 7 is a schematic structural diagram of a substrate assembly according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a buckle set according to an embodiment of the present invention.

Fig. 9 is another schematic structural diagram of a buckle set according to an embodiment of the present invention.

Fig. 10 is a schematic diagram of another structure of a substrate assembly according to an embodiment of the invention.

Fig. 11 is a schematic view of another structure of a substrate assembly according to an embodiment of the invention.

Fig. 12 is another schematic structural diagram of a buckle according to an embodiment of the present invention.

Fig. 13 is another schematic structural view of a buckle according to an embodiment of the present invention.

Fig. 14 is a schematic view of another structure of a substrate assembly according to an embodiment of the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The embodiment of the invention provides a substrate assembly and electronic equipment. Each of which will be described in detail below.

In the present embodiment, description will be made from the perspective of a substrate assembly, which may be provided in an electronic device such as a mobile phone, a tablet computer, a palm computer (PDA, personal Digital Assistant), or the like.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention, and fig. 2 is a schematic front structural diagram of an electronic device according to an embodiment of the present invention. The electronic device 1 comprises a housing 10, a printed circuit board 14, a display screen 15. It should be noted that, although not shown in fig. 1 and 2, the electronic device 1 includes a battery.

Wherein the battery is mounted in the housing 10 in electrical connection with the printed circuit board 14 for providing power to the electronic device 1.

The printed circuit board 14 is mounted in the housing 10, the printed circuit board 14 may be a motherboard of the electronic device 1, and functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, and a processor may be integrated on the printed circuit board 14.

Wherein the display screen 15 is mounted in the housing 10, while the display screen 15 is electrically connected to the printed circuit board 14 to form a display surface of the electronic device 1.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a housing according to an embodiment of the invention. The case 10 may include a cover plate 11, a middle frame 12, and a rear cover 13, the cover plate 11, the middle frame 12, and the rear cover 13 being combined with each other to form the case 10, the case 10 having a closed space formed by the cover plate 11, the middle frame 12, and the rear cover 13 to accommodate a printed circuit board 14, a display 15, a battery, and the like. In some embodiments, the cover 11 is covered on the middle frame 12, the rear cover 13 is covered on the middle frame 12, the cover 11 and the rear cover 13 are located on opposite sides of the middle frame 12, the cover 11 and the rear cover 13 are oppositely arranged, and the closed space of the housing 10 is located between the cover 11 and the rear cover 13.

It should be noted that, the structure of the housing according to the embodiment of the invention is not limited thereto, and referring to fig. 4, fig. 4 is another schematic structural diagram of the housing according to the embodiment of the invention. The difference between this fig. 4 and fig. 3 is that: the rear cover and the center are integrally formed to form a center 12 structure. The casing 10 shown in fig. 4 includes a cover plate 11 and a middle frame 12, and the cover plate 11 and the middle frame 12 are fixed to each other to form a closed space for accommodating devices such as a printed circuit board 14, a display screen 15, a battery, and the like.

Wherein the cover plate 11 is mounted to the display screen 15 to cover the display screen 15. The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire. The cover plate 11 includes a display area 111 and a non-display area 112. The display area 111 may be used to display a screen of the electronic device 1 or for a user to perform touch manipulation or the like. The top area of the non-display area 112 is provided with openings for conducting sound and light, and the bottom of the non-display area 112 can be provided with functional components such as a fingerprint module, a touch key and the like.

It should be noted that, the structure of the display screen is not limited thereto, please refer to fig. 5 and fig. 6 together, fig. 5 is another schematic structural diagram of the electronic device provided by the embodiment of the present invention, and fig. 6 is another schematic front structural diagram of the electronic device provided by the embodiment of the present invention. The electronic device 2 comprises a housing 20, a printed circuit board 24, a display screen 25. The display screen 25 includes a display area and a non-display area. The non-display area is directly formed on the display screen 25, for example, the non-display area of the display screen 25 is set to be transparent, so that the optical signal passes through, or an opening for light transmission is directly formed in the non-display area of the display screen 25, so that the front camera, the photoelectric sensor and the like can be arranged at the position of the non-display area, so that the front camera can take a picture and the photoelectric sensor can detect the light.

Wherein the housing 20 includes a cover 21, a middle frame 22 and a rear cover 23. It should be noted that the mutual matching relationship among the cover plate 21, the middle frame 22 and the rear cover 23 can refer to the cover plate 11, the middle frame 12 and the rear cover 13, and will not be described herein. The cover 21 includes a display area 211 and a non-display area 212, the non-display area 212 corresponds to a non-display area of the display screen 25, and the display area 211 corresponds to a display area of the display screen 25.

The printed circuit board 24 may refer to the printed circuit board 14 above, and will not be described herein.

In some embodiments, the printed circuit board 14 is disposed within the housing 10, and in particular, is disposed on the middle frame 12, and the printed circuit board 14 is disposed on the middle frame 12 to form a substrate assembly. Referring to fig. 7, fig. 7 is a schematic structural diagram of a substrate assembly according to an embodiment of the invention. The base plate assembly 16 includes a center 12, a base plate 14, and a clasp 120. The base plate 14 is fixed to the middle frame 12 by a buckle 120. Specifically, the base plate 14 is snap-fitted between the buckle 120 and the center 12 by elastic deformation of the buckle 120. The buckle 120 can be directly clamped to the surface of the substrate 14, the clamping of the substrate 14 can be realized without forming holes in the substrate 14, the limiting and fixing of the substrate 14 can be realized, the damage to devices, wires and the like of the substrate 14 can be avoided, and the damage to the substrate 14 in the fixing process is reduced.

The middle frame may be the middle frame 12 in the electronic device 1, or may be a middle frame on another device, and the embodiment of the present invention is described by taking the middle frame 12 of the electronic device 1 as an example, and it should be noted that the middle frame of the embodiment of the present invention is not limited to the electronic device 1.

The substrate may be the printed circuit board 14 in the electronic device 1, or may be another circuit board, and the embodiment of the invention is described by taking the printed circuit board 14 of the electronic device 1 as an example, and it should be noted that the substrate of the embodiment of the invention is not limited to the electronic device 1. The substrate 14 is disposed on the middle frame 12.

Wherein, the number of the buckles 120 is at least two, and the buckles 120 are disposed on the inner sidewall of the middle frame 12. The clasp 120 may be integrally formed with the middle frame 12 to form a unitary structure, such as: the middle frame 12 and the buckle 120 are made of metal or plastic. It should be noted that, in the embodiment of the present invention, the connection relationship between the frame 12 and the buckle 120 is not limited to this, for example: the buckle 120 and the middle frame 12 are made of metal, and the buckle 120 is fixed on the inner side wall of the middle frame 12 in a welding mode. For another example: the middle frame 12 is provided with a through hole or a groove, and the root of the buckle is inserted into the through hole or the groove to realize fixed connection.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a buckle according to an embodiment of the present invention. In some embodiments, the clasp 120 includes a carrier 123 and at least two snap-fit portions 121.

At least two of the engaging portions 121 are disposed on the carrying portion 123 at intervals, and in the embodiment of the invention, three engaging portions 121 are uniformly distributed on the carrying portion 123. It should be noted that the number of the engaging portions 121 in the embodiment of the invention is not limited to three, such as 2, 4, etc., please refer to fig. 9, and fig. 9 is another schematic structure of the buckle according to the embodiment of the invention. The clasp shown in fig. 9 includes only two snap-fit portions 121. In some embodiments, the sizes of the clamping portions 121 are set to be the same, so that the clamping portions 121 are uniformly stressed during the clamping process with the substrate 14, and damage to the substrate 14 caused by uneven stress of the clamping portions 121 is prevented. It should be noted that the size of each engaging portion in the embodiment of the present invention is not limited to this, and the size of each engaging portion may be set differently. In some embodiments, the thickness of each engaging portion 121 gradually increases from the top to the root thereof to form an inclined surface 124, and providing the inclined surface 124 on the engaging portion 121 not only facilitates the elastic deformation of the engaging portion 121, but also ensures the strength of the engaging portion 121 to prevent damage due to small force.

In some embodiments, the structure of the snap-fit portion 121 is a three-sided structure.

In some embodiments, an opening 122 is formed between two adjacent snap-fit portions 121, and three snap-fit portions 121 form two openings 122, and the two snaps 122 are the same size and shape. Further, in the same direction, the width of the opening 122 is larger than the width of the mating portion 121, and the width of the opening 122 is the width of two adjacent mating portions, i.e. the distance between one mating portion 121 and its adjacent mating portion 121. In the embodiment of the present invention, the opposite surfaces of two adjacent engaging portions 121 are parallel to each other, and the distance between the two engaging portions 121 or the width between the two engaging portions 121 is the minimum distance between the two engaging portions 121, which is the width of the opening 122. The width of the opening 122 is not limited to this, and the width of the opening 122 may be the same as the width of the engaging portion 121, or the width of the opening 122 may be smaller than the width of the engaging portion 121. In the embodiment of the invention, the width of the opening 122 is larger than that of the clamping portion 121, so that the clamping portion 121 is elastically deformed, and meanwhile, the influence of the excessive width of the clamping portion 121 on devices on the substrate 14 is prevented.

In some embodiments, the inclined surface 124 of the snap fit portion 121 extends to the position of the opening 122. It should be noted that, in the embodiment of the present invention, the inclined surface 124 may also extend to the position of the bearing portion 123 through the opening 122; alternatively, the inclined surface 124 may be disposed in front of the position of the opening 122.

In some embodiments, the snap-fit portion 121 is disposed on one side of the carrier portion 123.

The carrying portion 123 is fixed on an inner side surface of the middle frame 12, specifically, the other side surface of the carrying portion 123 is fixed on the middle frame 12, and the middle frame 12 and the engaging portion 120 are respectively located on two opposite surfaces of the carrying portion 123. In some embodiments, the other side of the carrier 123 is integrally formed with the middle frame 12 to form a unitary structure. It should be noted that, the connection relationship between the bearing portion 123 and the middle frame 12 in the embodiment of the present invention is not limited to this, for example, the bearing portion 123 and the middle frame 12 are made of metal materials, and the bearing portion 123 may be welded to the inner side wall of the middle frame 12.

In some embodiments, the thickness of the bearing portion 123 gradually increases along one side thereof toward the other side thereof, and the bearing portion 123 extends to the middle frame 12, when the buckle 120 receives a large force, the bearing portion 123 can also elastically deform, and the structure of the bearing portion 123 is not only convenient for elastically deforming, but also ensures the strength of the root portion thereof, increases the force bearing capability, and prevents damage.

In some embodiments, the snaps 120 are disposed on three adjacent inner side walls of the center 12, and the interaction achieves a spacing, securing of the base plate 14. Although only one of the inner side walls of the middle frame 12 is shown in fig. 7, this is not a limitation of the embodiment of the present invention. It should be noted that, the manner in which the buckle is disposed on the middle frame 12 according to the embodiment of the present invention is not limited to this, for example: the snaps 120 may be disposed only on two opposing inner side walls of the center 12.

The above is a description of a specific structure of the buckle according to the embodiment of the present invention, and a specific process of the buckle to be engaged with the substrate is described below. In the process of actually clamping the substrate 14 through the buckle 120 fixed on the inner side surface of the middle frame 12, firstly, a user can place the edge of the substrate 14 on the inclined surface 124 of the clamping portion 121, the user can lightly press the substrate 14 by hand, the substrate 14 receives a pressing force, and the pressing force acts on the inclined surface 124 of the clamping portion 121, so that the clamping portion 121 is elastically deformed, and the edge of the substrate 14 moves gradually along the inclined surface 124 until being clamped into the clamping portion 121. Thus, the engaging portion 121 limits and fixes the substrate 14, and prevents the substrate 14 from shaking. In the actual clamping process, the clamping portion 121 of the buckle 120 can be directly clamped to the surface of the substrate 14, the clamping of the substrate 14 can be realized without forming holes in the substrate 14, the limiting and fixing of the substrate 14 are realized, the damage to devices, wires and the like of the substrate 14 can be avoided, and the damage to the substrate 14 in the fixing process is reduced.

The above is a description of a specific structure of the buckle according to the embodiment of the present invention, and a specific description of the buckle matching substrate. It should be noted that the structure of the buckle according to the embodiment of the present invention is not limited thereto, and refer to the following.

Referring to fig. 10, fig. 10 is a schematic diagram of another structure of a substrate assembly according to an embodiment of the invention. The base plate assembly 16a includes a center 12a, a base plate 14a, and a catch 120a.

The substrate 14a may be applied to electronic devices such as a mobile phone and a pad, and may also be applied to other electronic devices. The substrate 14a may be a flat plate structure and the substrate 14a may include four edges.

The middle frame 12a may be applied to electronic devices such as a mobile phone and a pad, and may also be applied to other electronic devices. The middle frame 12a can be referred to as the middle frame 12, and will not be described herein.

The buckle 120a is disposed on the middle frame 12a, and the connection relationship between the buckle 120a and the middle frame 12a can be referred to above, which is not described herein. In some embodiments, the plurality of buckles 120a are uniformly distributed on the middle frame 12 a.

Specifically, the number of the clips 120a is four, and each clip 120a is snapped onto one edge of the substrate 14 a. Further, each of the snaps 120a is snapped onto the middle of the edge of the base plate 14 a. Thus, the four buckles 120a are respectively engaged with the four edges of the substrate 14a, so that the engagement effect on the substrate 14a is better. It should be noted that the number of the buckles in the embodiment of the present invention is not limited to this, and may be other numbers, such as 6, 8, 10, etc. Referring to fig. 11, fig. 11 is a schematic structural diagram of a substrate assembly according to an embodiment of the invention. Fig. 11 is a modification of fig. 10, and fig. 11 and fig. 10 are the same reference numerals, and the difference between fig. 11 and fig. 10 is that: the number of snaps 120a in fig. 11 is 8, one snap set 17a is formed for every two adjacent snaps 120a, four snap sets 17a are formed for the 8 snaps 120a in fig. 11, and the four snap sets 17a are respectively snapped onto the four edges of the substrate 14. According to the embodiment of the invention, two adjacent buckles form the buckle group to limit the substrate, so that the limit effect is better. It should be noted that one buckle group according to the embodiment of the present invention may also include three or even more adjacent buckles.

Referring to fig. 12, fig. 12 is another schematic structural diagram of a buckle according to an embodiment of the present invention. The buckle 120a includes a fixing portion 123a, a connecting portion 122a, and a locking portion 121a, and the connecting portion 122a is connected between the fixing portion 123a and the locking portion 121 a.

Wherein the fixing portion 123a is fixed on the middle frame 12a, in some embodiments, the buckle 120a is made of a metal material, and the buckle 120a is fixed on the middle frame 12a by welding the fixing portion 123a and the middle frame 12 a. It should be noted that, the buckle 120a of the embodiment of the present invention may be fixed on the middle frame 12a in other manners, and the detailed description is omitted herein.

The engaging portion 121a is used for engaging the substrate 14a, and is not described herein.

Wherein, the width of the connecting portion 122a gradually increases from the engaging portion 121a to the fixing portion 123a, and the thickness of the connecting portion 122a gradually increases from the engaging portion 121a to the fixing portion 123a, that is, the width of the connecting portion 122a gradually increases along the engaging portion 121a toward the fixing portion 123a, and the thickness of the connecting portion 122a gradually increases along the engaging portion 121a toward the fixing portion 123 a. In some embodiments, the connecting portion 122a and the fixing portion 123a form a first included angle 124a, and the first included angle 124a is greater than ninety degrees, and the size of the first included angle 124a is preferably 100 degrees to 150 degrees. In some embodiments, the connection portion and the snap-fit portion form a second included angle 125a therebetween, the second included angle 125a being greater than ninety degrees. The second included angle 125a in the embodiment of the present invention is preferably 100 degrees to 150 degrees. In some embodiments, the first included angle 124a and the second included angle 125a are set to be the same, and in embodiments of the present invention, the first included angle 124a is set to be 120 degrees, and in embodiments of the present invention, the second included angle 125a is set to be 120 degrees. In some embodiments, the snap-fit portion 121a and the fixing portion 123a are disposed in parallel.

It should be noted that, the arrangement of the first included angle and the second included angle is not limited to this, for example, the first included angle is smaller than ninety degrees, and the second included angle is smaller than ninety degrees; or the first included angle is equal to ninety degrees and the second included angle is equal to ninety degrees; or the first included angle is greater than ninety degrees and the second included angle is less than ninety degrees.

The above is a description of another specific structure of the buckle according to the embodiment of the present invention, and a specific process of the buckle to be engaged with the substrate is described below. In the process of actually clamping the substrate 14a by the buckle 120a fixed on the middle frame 12a, firstly, a user can place the edge of the substrate 14a on the clamping portion 121a, the user can lightly press the substrate 14a by hand, the substrate 14a receives a pressing force, and the pressing force acts on the clamping portion 121a, so that the clamping portion 121a and the connecting portion 122a generate elastic deformation, and the edge of the substrate 14a is clamped between the clamping portion 121a and the connecting portion 122 a. Thus, the engaging portion 121a and the connecting portion 122a limit and fix the substrate 14a, and prevent the substrate 14a from shaking. In the actual clamping process, the clamping portion 121a of the clamp 120a can be directly clamped on the surface of the substrate 14a, the clamping of the substrate 14a can be realized without forming holes in the substrate 14a, the limiting and fixing of the substrate 14a are realized, the damage to devices, wires and the like of the substrate 14a can be avoided, and the damage to the substrate 14a in the fixing process is reduced.

The above is a description of another specific structure of the buckle according to the embodiment of the present invention, and a specific description of the buckle matching substrate. It should be noted that the structure of the buckle according to the embodiment of the present invention is not limited thereto, and refer to the following.

Referring to fig. 13, fig. 13 is another schematic structural diagram of a buckle according to an embodiment of the present invention. The buckle 121b includes a clamping portion 121b and a carrying portion 122b, the clamping portion 121b and the carrying portion 122b are integrally formed, and the carrying portion 122b is disposed on the middle frame. It should be noted that, the specific structure of the buckle 120b and the matching relationship with the middle frame and the substrate shown in fig. 13 can be referred to above, and will not be described herein.

The above is a description of still another specific structure of the buckle according to the embodiment of the present invention, and a specific description of the buckle matching substrate. It should be noted that the structure of the substrate assembly according to the embodiment of the invention is not limited thereto, and the following is specifically referred to.

Referring to fig. 14, fig. 14 is a schematic view of another structure of a substrate assembly according to an embodiment of the invention. The substrate assembly 16c includes a center frame 12c, a printed circuit board 14c, a catch 120c, and a bezel 130c.

The printed circuit board 14c is described by taking a printed circuit board in an electronic device as an example, and it should be noted that the printed circuit board 14c is not limited thereto, and specifically, the printed circuit board 14c may refer to the above substrate 14 and will not be described herein.

The middle frame 12c is illustrated by taking a middle frame in an electronic device as an example, and it should be noted that the middle frame 12c is not limited thereto, and specifically, the middle frame 12c may refer to the above middle frame 12, which is not described herein.

The buckle 120c may be directly integrally formed with the middle frame 12c, or may be fixed on the inner wall of the middle frame 12c by welding, etc., which is described in detail herein. In some embodiments, the clip 120c may be multiple, snap-fit onto the surface of the printed circuit board 120 c. Specifically, the number of the buckles 120c is 6, two buckles 120c are located on one inner wall of the middle frame 12c, 6 buckles 120c are respectively located on three inner walls of the middle frame 12c, and 6 buckles 120c are respectively snapped onto three edges of the printed circuit board 14 c. The specific structure of the buckle 120c can be referred to the above engaging portion 121, and will not be described herein. It should be noted that the structure of the buckle 120, the structure of the buckle 120a, the structure of the buckle 120b, or other structures may be adopted in the buckle 120c according to the embodiment of the present invention.

The printed circuit board 14c has four edges, and three edges are engaged and limited by the buckle 120 c. The other edge of the printed circuit board 14c that is not engaged by the catch 120c is restrained by the flap 130c. Specifically, the baffle 130c may be directly fixed to the middle frame 12c, and the baffle 130c may be fixed to the middle frame 12c by screwing, may be fixed to the middle frame 12c by glue, may be fixed to the middle frame 12c by welding, or may be integrally formed with the middle frame 12c directly. Therefore, after the printed circuit board 14c is mounted and fixed on the middle frame 12c, the edges of the four sides are respectively clamped and limited by the 6 buckles 120c and the baffle 130c, so that the clamping and limiting effects on the printed circuit board 14c are better, and the movement of the printed circuit board 14c is prevented.

It should be noted that, in the embodiment of the present invention, a buckle may be provided on the baffle 130c, or a groove may be provided on the baffle 130c for accommodating the edge of the printed circuit board 14c, so that the limit and fixation of the printed circuit board 14c may be further realized.

In particular, in the process of clamping the printed circuit board 14c to the middle frame 12c, firstly, a user can press one edge of the printed circuit board 14c to the position of the baffle 130c, and simultaneously place three edges of the printed circuit board onto the inclined surface (the inclined surface can refer to the inclined surface 124 above) of the buckle 120c, the user can lightly press the printed circuit board 14c by hand, the printed circuit board 14c is subjected to a pressing force, and the pressing force is applied to the inclined surface of the buckle 120c, so that the buckle 120c generates elastic deformation, and the other three edges of the printed circuit board 14c gradually move along the inclined surface of the buckle 120c until the other three edges are clamped into the buckle 120 c. Thus, the buckle 120c and the baffle 130c limit and fix the printed circuit board 14c, and prevent the printed circuit board 14c from shaking. In the actual clamping process, the buckle 120 can be directly clamped on the surface of the printed circuit board 14c, the printed circuit board 14c can be clamped without opening holes in the printed circuit board 14c, the limit and the fixation of the printed circuit board 14c are realized, the damage to devices, wires and the like of the printed circuit board 14c can be avoided, and the damage to the printed circuit board 14c in the fixing process is reduced.

As can be seen from the foregoing, the substrate assembly provided by the embodiment of the invention has the advantages that the buckle can be elastically deformed to clamp the substrate between the buckle and the middle frame, the buckle can be directly clamped on the surface of the substrate, the clamping of the substrate can be realized without perforating on the substrate, the limiting and fixing of the substrate are realized, the damage to devices, wires and the like of the substrate can be avoided, and the damage to the substrate in the fixing process is reduced.

It will be appreciated by those skilled in the art that the structure of the electronic device 1 shown in fig. 1 and 2 does not constitute a limitation of the electronic device 1. The electronic device 1 may comprise more or fewer components than shown, or may combine certain components, or may have a different arrangement of components. The electronic device 1 may further include a processor, a memory, a bluetooth module, a camera, etc., which are not described herein.

The substrate assembly and the electronic device provided by the embodiments of the present invention have been described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present invention, and the above examples are only for aiding in understanding the present invention. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.

Claims

1. The utility model provides a base plate subassembly for in the electronic equipment, its characterized in that, base plate subassembly includes base plate, center and buckle, the buckle takes place elastic deformation with the base plate card is joined in marriage between the buckle with the center, the buckle includes carrier part and at least two card joining in marriage the portion, carrier part set up in on the inside wall of center, card joining in marriage the portion is used for the card to join in marriage the base plate, at least two card joining in marriage the portion mutual interval set up in on the carrier part, at least two card joining in marriage the portion set up in one side of carrier part, the opposite side of carrier part sets up on the center, the center with the card joining in marriage respectively is located the opposite face of carrier part, the carrier part increases gradually along the direction thickness of one side towards the opposite side, and extends to the inside wall department of center.

2. The substrate assembly of claim 1, wherein the snap-fit portion gradually increases in thickness from its top to its root, forming an inclined surface.

3. The substrate assembly of claim 1, wherein an opening is formed between two adjacent ones of the snap-fit portions, the opening having a width in the same direction that is greater than a width of the snap-fit portions, the width of the opening being a distance between two adjacent snap-fit portions.

4. The substrate assembly of claim 3, wherein the snap-fit portion gradually increases in thickness from its top to its root, forming an inclined surface extending to the opening.

5. The substrate assembly of any one of claims 1-4, wherein two adjacent snaps form a snap set, the substrate being secured to the center by at least two of the snap sets.

6. The substrate assembly of any one of claims 1-4, wherein the substrate comprises four edges and the snaps comprise four, each of the snaps snap-fit onto one edge of the substrate.

7. The substrate assembly of any one of claims 1-4, further comprising a baffle adjacent one of the edges of the substrate to limit the substrate.

8. The substrate assembly of claim 7, wherein the substrate includes four edges, the other three edges of the substrate being snap-fit by the snaps.

9. The substrate assembly of any one of claims 1-4, wherein the clasp and the middle frame are integrally formed.

10. The substrate assembly of any one of claims 1-4, wherein the clasp is made of a metallic material.

11. The substrate assembly of claim 10, wherein the snap-fit is welded to the center frame.

12. An electronic device comprising a housing and a substrate assembly disposed within the housing, the substrate assembly being as claimed in any one of claims 1 to 11.