CN107403748A - 一种集成电路载片装置 - Google Patents

一种集成电路载片装置 Download PDF

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CN107403748A
CN107403748A CN201710489204.XA CN201710489204A CN107403748A CN 107403748 A CN107403748 A CN 107403748A CN 201710489204 A CN201710489204 A CN 201710489204A CN 107403748 A CN107403748 A CN 107403748A
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CN107403748B (zh
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侯育增
李波
夏俊生
臧子昂
魏刚剑
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Anhui North Microelectronics Research Institute Group Co ltd
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North Electronic Research Institute Anhui Co., Ltd.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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Abstract

本发明涉及一种集成电路载片装置，包括底座（1），在底座上设有一组平行设置的凸条（2），在每个凸条上均设有一组气孔（3），在每个凸条下侧的底座（1）均设有第一气道（4）和第二气道（5），第一气道与其对应凸条上的所有气孔（3）连通，第二气道与所有第一气道连通；在底座的两侧分别设有立板（6）和固定挡板（7），在立板上通过推杆（11）连接移动挡板（9）。本发明的优点：本装置结构简单，实现了真空吸附与弹性夹紧的合理组合，适用的集成电路载片装置，以较低的加工成本，简捷的加工方法有效提高载片台的通用性，提高混合集成电路的键合加工能力，具有电路卸取简洁易行、适用广泛的显著效果。

Description

一种集成电路载片装置
技术领域
本发明涉及微电子产品制造技术领域，特别涉及一种集成电路载片装置。
背景技术
引线键合工艺是指借助于键合机的超声能作用，依照产品组装图，用高纯度的微细金属丝准确而可靠地对集成电路中的键合区进行引线互连，使整个电路能够完成规定的电学功能的一种操作工序。集成电路键合工艺，按键合位置不同可分为基板上内引线键合、外壳上外引线键合。当前，基板上内引线键合、外壳上外引线键合因夹持方式不同采用了不同的载片装置。
基板上内引线键合普遍采用的是平板式的载片台，平板式的载片台固定电路的方式是采用真空吸附式，这种方式适合于底面平整的陶瓷基板。
外壳上外引线键合时，由于基板粘接在金属外壳内表面，因带有管腿的金属外壳地面不平整，采用真空吸附式存在吸附不牢的问题。因此采用了弹性夹紧装置，可确保各类外壳的稳定夹持。而通用弹性夹紧装置普遍采用了内埋式的结构，即弹簧杆内埋在夹具中心，也造成了该夹具无法叠加内部真空通道，因此不能实现表面真空吸附。
而对于基板上内引线键合、外壳上外引线键合均需要时，就需要通过频繁更换夹具来实现两种需求，这给键合操作带来麻烦，并且频繁更换夹具也容易导致夹具的损坏。
发明内容
本发明的目的是为了解决现阶段背景技术中所存在的缺点，而提出的一种集成电路载片装置。
为了实现上述目的，本发明采用了如下技术方案：
一种集成电路载片装置，其特征在于：包括底座，在底座上设有一组平行设置的凸条，在每个凸条上均设有一组气孔，在每个凸条下侧的底座均设有第一气道，第一气道与其对应凸条上的所有气孔连通，在底座还设有第二气道，第二气道与所有第一气道连通；
在凸条两侧的底座上分别设有立板和固定挡板，在立板上通过推杆连接移动挡板，移动挡板设置在立板和固定挡板之间。
在上述技术方案的基础上，可以有以下进一步的技术方案：
在所述立板外侧的所述推杆上还通过固定轴连接偏心轮，偏心轮与立板对应配合。
在所述偏心轮上设有把手。
在所述固定挡板相邻所述凸条一侧的侧面设有第一斜面，在移动挡板相邻凸条一侧的侧面设有第二斜面，第一斜面和第二斜面组成梯形结构。
本发明的优点在于：本装置结构简单，实现了真空吸附与弹性夹紧的合理组合，适用的集成电路载片装置，以较低的加工成本，简捷的加工方法有效提高载片台的通用性，提高混合集成电路的键合加工能力，具有电路卸取简洁易行、适用广泛的显著效果。
附图说明
图1是本发明的基本结构示意图。
具体实施方式
为了使本发明更加清楚明白，以下结合附图对本装置详细说明，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
如图1所示，本发明提供的一种集成电路载片装置，其特征在于：包括底座1，在底座1上设有一组平行设置的凸条2，相邻两个凸条2之间形成卡槽，在每个凸条2上均设有一组气孔3，在每个凸条2下侧的底座1均设有第一气道4，第一气道4与其对应凸条2上的所有气孔3连通，在底座1还设有第二气道5，第二气道5与所有第一气道4连通；
在凸条2两侧的底座1上分别设有立板6和固定挡板7，在立板6上通过推杆11连接移动挡板9，在实际生产中，根据需要设置移动挡板9的个数，移动挡板9设置在立板6和固定挡板7之间。在立板6外侧的所述推杆11上还通过固定轴12连接偏心轮13，在偏心轮13上设有把手14，偏心轮13与立板6对应配合。
在所述固定挡板7相邻所述凸条2一侧的侧面设有第一斜面8，在移动挡板9相邻凸条2一侧的侧面设有第二斜面10，第一斜面8和第二斜面10的下侧均向内倾斜设置，两者配合形成梯形结构，确保将金属外壳两端向下用力固定于真空吸附平台表面。
在使用过程中，平板电路可直接放在真空吸附平台进行固定，带金属外壳的电路可通过移动挡板9和固定挡板7进行固定。

Claims (4)

1.一种集成电路载片装置，其特征在于：包括底座（1），在底座（1）上设有一组平行设置的凸条（2），在每个凸条（2）上均设有一组气孔（3），在每个凸条（2）下侧的底座（1）均设有第一气道（4），第一气道（4）与其对应凸条（2）上的所有气孔（3）连通，在底座（1）还设有第二气道（5），第二气道（5）与所有第一气道（4）连通；
在凸条（2）两侧的底座（1）上分别设有立板（6）和固定挡板（7），在立板（6）上通过推杆（11）连接移动挡板（9），移动挡板（9）设置在立板（6）和固定挡板（7）之间。
2.根据权利要求1所述的一种集成电路载片装置，其特征在于：在所述立板（6）外侧的所述推杆（11）上还通过固定轴（12）连接偏心轮（13），偏心轮（13）与立板（6）对应配合。
3.根据权利要求2所述的一种集成电路载片装置，其特征在于：在所述偏心轮（13）上设有把手（14）。
4.根据权利要求1所述的一种集成电路载片装置，其特征在于：在所述固定挡板（7）相邻所述凸条（2）一侧的侧面设有第一斜面（8），在移动挡板（9）相邻凸条（2）一侧的侧面设有第二斜面（10），第一斜面（8）和第二斜面（10）组成梯形结构。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102507923A (zh) * 2011-10-31 2012-06-20 上海裕隆生物科技有限公司 全自动反应***
CN103344794A (zh) * 2013-06-24 2013-10-09 上海华力微电子有限公司 一种多功能半导体样品夹具
CN203767107U (zh) * 2014-04-04 2014-08-13 上海中艺自动化***有限公司 偏心轮开合器
CN206100620U (zh) * 2016-08-03 2017-04-12 苏州工业园区精泰达自动化有限公司 一种真空吸载板模组
CN206186643U (zh) * 2016-11-21 2017-05-24 东莞市小智人机器人有限公司 一种手机玻璃的定位治具
CN206272967U (zh) * 2016-11-01 2017-06-20 深圳市大乾自动化技术有限公司 一种贴合头装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102507923A (zh) * 2011-10-31 2012-06-20 上海裕隆生物科技有限公司 全自动反应***
CN103344794A (zh) * 2013-06-24 2013-10-09 上海华力微电子有限公司 一种多功能半导体样品夹具
CN203767107U (zh) * 2014-04-04 2014-08-13 上海中艺自动化***有限公司 偏心轮开合器
CN206100620U (zh) * 2016-08-03 2017-04-12 苏州工业园区精泰达自动化有限公司 一种真空吸载板模组
CN206272967U (zh) * 2016-11-01 2017-06-20 深圳市大乾自动化技术有限公司 一种贴合头装置
CN206186643U (zh) * 2016-11-21 2017-05-24 东莞市小智人机器人有限公司 一种手机玻璃的定位治具

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