CN107390837A - A kind of external heat dissipation equipment of notebook computer - Google Patents
A kind of external heat dissipation equipment of notebook computer Download PDFInfo
- Publication number
- CN107390837A CN107390837A CN201710615233.6A CN201710615233A CN107390837A CN 107390837 A CN107390837 A CN 107390837A CN 201710615233 A CN201710615233 A CN 201710615233A CN 107390837 A CN107390837 A CN 107390837A
- Authority
- CN
- China
- Prior art keywords
- ceramic wafer
- notebook computer
- base
- heat dissipation
- external heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/04—Preventing deposition of fouling or of dust by using removable coverings
Abstract
The present invention relates to a kind of external heat dissipation equipment of notebook computer,Including base,The base side connects dust cap by movable rotation-shaft,The dust cap side is provided with handle,The dust cap inwall side is provided with some adhesive bands,The adhesive band side is pasted with sponge block,The base is provided with ceramic wafer,The ceramic wafer is provided with some heat emission holes,The ceramic wafer bottom is provided with thermally conductive sheet,The thermally conductive sheet bottom is provided with fin,The heat on notebook is transmitted on fin by thermally conductive sheet in use,Radiated with fin and blower fan,Reject heat to surrounding,There is the function of moisture-proof antistatic using ceramic wafer,Falling into for dust can be reduced,By setting dust cap,Not only can be with dust-proof,And by can be directly by overall carrying,Sponge block has the function that pressing,Prevent that computer is shaken in transport,Pass through adhesive band,It is convenient that sponge block dismounting is cleaned or changed.
Description
Technical field
The present invention relates to a kind of external heat dissipation equipment of notebook computer, belong to laptop radiating field.
Background technology
For notebook computer, in performance and portable sex resistance, radiating is as the factor of most critical, laptop heat-dissipation
Bottleneck always in notebook core technology, sometimes notebook computer can baffled marvellous deadlock, be typically exactly system temperature
Too high to cause, in order to solve this problem, people devise notebook PC radiator, and good radiator can extend notebook
Computer service life, makes heat caused by notebook be diffused into as soon as possible outside computer, does not influence the use function of notebook, no
The circuit of computer can be made corrosion phenomenon occur, ensure the normal work of notebook computer, the material that Vehicles Collected from Market major product uses
Material is mainly metal, plastics or wooden, and the thermal conductivity of metal is good, and antiskid glue cushion is arranged at the bottom of most of notebook,
Bottom friction power can be increased, but the heat conductivility of metal can not be brought into play completely, and also heat dissipation equipment is frequently necessary to and electricity
Brain separately carries, comparatively laborious, therefore, it is necessary to further improves.
The content of the invention
The technical problem to be solved in the present invention overcomes the defects of existing, there is provided a kind of external radiating of notebook computer is set
It is standby, the heat on notebook is transmitted on fin by thermally conductive sheet in use, radiated with fin and blower fan,
Surrounding is rejected heat to, the function using ceramic wafer with moisture-proof antistatic, falling into for dust can be reduced, it is anti-by setting
Dirt lid, not only can with dust-proof, and by can directly by overall carrying, sponge block have the function that pressing, prevent transport when
Computer is shaken, convenient that sponge block dismounting is cleaned or changed by adhesive band, can effectively solve asking in background technology
Topic.
In order to solve the above-mentioned technical problem, the invention provides following technical scheme：
A kind of external heat dissipation equipment of notebook computer, including base, the base side connect dust cap by movable rotation-shaft,
The dust cap side is provided with handle, and the dust cap inwall side is provided with some adhesive bands, and the adhesive band side is pasted
There is sponge block, the base is provided with ceramic wafer, and the ceramic wafer is provided with some heat emission holes, and the ceramic wafer bottom is provided with and led
Backing, the thermally conductive sheet bottom are provided with fin, four pillar support projections, the base intracavity are provided with the top of the ceramic wafer
Blower fan is embedded with, and blower fan is located between pillar support projection, the pillar support convex top is provided with rubber layer, the blower fan
Side is additionally provided with wire, and the base bottom is provided with anti-skid bulge.
Furthermore, the wire side is provided with USB interface, and the USB interface is electrically connected with notebook computer.
Furthermore, the base side also is provided with handle, and is equipped with slip-resistant texture on handle outer wall.
Furthermore, the number of the anti-skid bulge is at least provided with four.
Furthermore, wire wrapping post is additionally provided with the top of the ceramic wafer, the wire wrapping post is provided with spiral winding
Wire casing.
Beneficial effect of the present invention：The heat on notebook is transmitted on fin by thermally conductive sheet in use, by fin
Cooperation with blower fan is radiated, and rejects heat to surrounding, has the function of moisture-proof antistatic using ceramic wafer, can be reduced
Dust is fallen into, not only can be with dust-proof by setting dust cap, and by can be directly by overall carrying, sponge block, which has, to be pressed
The effect of pressure, prevent that computer is shaken in transport, it is convenient that sponge block dismounting is cleaned or changed by adhesive band.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.
Fig. 1 is a kind of external heat dissipation equipment structure chart of notebook computer of the present invention.
Fig. 2 is base sectional view of the present invention.
Label in figure：1st, base；2nd, dust cap；3rd, adhesive band；4th, sponge block；5th, ceramic wafer；6th, heat emission hole；7th, heat conduction
Piece；8th, fin；9th, pillar support is raised；10th, blower fan；11st, wire；12nd, anti-skid bulge；13rd, USB interface；14th, wire coiling
Post；15th, handle.
Embodiment
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
As Figure 1-Figure 2, the external heat dissipation equipment of a kind of notebook computer, including base 1, the side of base 1 lead to
Turn of making a living axis connection dust cap 2, the side of dust cap 2 are provided with handle 15, and the inwall side of dust cap 2 is provided with some viscous
Adhesive tape 3, the side of adhesive band 3 are pasted with sponge block 4, and the base 1 is provided with ceramic wafer 5, and the ceramic wafer 5 is provided with
Some heat emission holes 6, the bottom of ceramic wafer 5 are provided with thermally conductive sheet 7, and the bottom of thermally conductive sheet 7 is provided with fin 8, the ceramic wafer 5
Top is provided with four pillar support projections 9, and the inner chamber of base 1 is embedded with blower fan 10, and blower fan 10 is located at pillar support projection 9
Between, the top of pillar support projection 9 is provided with rubber layer, and the side of blower fan 10 is additionally provided with wire 11, the bottom of base 1
Provided with anti-skid bulge 12.
The side of wire 11 is provided with usb 13, and the usb 13 is electrically connected with notebook computer, passes through notes
This computer fan 10 is powered, and the side of base 1 also is provided with handle 15, conveniently lifts, and is equipped with the outer wall of handle 15 anti-
Sliding texture, prevents rubber sleeve, the number of the anti-skid bulge 12 plays a part of support at least provided with four, and the ceramic wafer 5 pushes up
Portion is additionally provided with wire wrapping post 14, and the wire wrapping post 14 is provided with spiral winding wire casing, convenient that wire 11 is wound, and prevents from beating
Knot.
It is above the preferable embodiment of the present invention, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and changed.Therefore, the invention is not limited in above-mentioned embodiment, every those skilled in the art exist
Any conspicuously improved, replacement or modification made on the basis of the present invention belong to protection scope of the present invention.
Claims (5)
1. a kind of external heat dissipation equipment of notebook computer, including base（1）, it is characterised in that the base（1）Side passes through
Movable rotation-shaft connects dust cap（2）, the dust cap（2）Side is provided with handle（15）, the dust cap（2）Inwall side is provided with
Some adhesive bands（3）, the adhesive band（3）Side is pasted with sponge block（4）, the base（1）It is provided with ceramic wafer（5）,
The ceramic wafer（5）It is provided with some heat emission holes（6）, the ceramic wafer（5）Bottom is provided with thermally conductive sheet（7）, the thermally conductive sheet（7）
Bottom is provided with fin（8）, the ceramic wafer（5）Top is provided with four pillar support projections（9）, the base（1）Inner chamber is embedding
Provided with blower fan（10）, and blower fan（10）It is raised located at pillar support（9）Between, the pillar support is raised（9）Top is provided with rubber
Glue-line, the blower fan（10）Side is additionally provided with wire（11）, the base（1）Bottom is provided with anti-skid bulge（12）.
A kind of 2. external heat dissipation equipment of notebook computer according to claim 1, it is characterised in that：The wire（11）One
Side is provided with USB interface（13）, the USB interface（13）It is electrically connected with notebook computer.
A kind of 3. external heat dissipation equipment of notebook computer according to claim 1, it is characterised in that：The base（1）One
Side also is provided with handle（15）, and handle（15）Slip-resistant texture is equipped with outer wall.
A kind of 4. external heat dissipation equipment of notebook computer according to claim 1, it is characterised in that：The anti-skid bulge
（12）Number at least provided with four.
A kind of 5. external heat dissipation equipment of notebook computer according to claim 1, it is characterised in that：The ceramic wafer（5）
Top is additionally provided with wire wrapping post（14）, the wire wrapping post（14）It is provided with spiral winding wire casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710615233.6A CN107390837A (en) | 2017-07-26 | 2017-07-26 | A kind of external heat dissipation equipment of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710615233.6A CN107390837A (en) | 2017-07-26 | 2017-07-26 | A kind of external heat dissipation equipment of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107390837A true CN107390837A (en) | 2017-11-24 |
Family
ID=60341003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710615233.6A Pending CN107390837A (en) | 2017-07-26 | 2017-07-26 | A kind of external heat dissipation equipment of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107390837A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2628771Y (en) * | 2003-05-29 | 2004-07-28 | 協禧电机股份有限公司 | Heat radiator |
| US9289059B2 (en) * | 2010-12-22 | 2016-03-22 | Digital Innovations Llc | Shielded heat-dissipating lap cushion |
| CN205546377U (en) * | 2016-03-03 | 2016-08-31 | 闫云昊 | Novel heat dissipation circuit board base |
-
2017
- 2017-07-26 CN CN201710615233.6A patent/CN107390837A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2628771Y (en) * | 2003-05-29 | 2004-07-28 | 協禧电机股份有限公司 | Heat radiator |
| US9289059B2 (en) * | 2010-12-22 | 2016-03-22 | Digital Innovations Llc | Shielded heat-dissipating lap cushion |
| CN205546377U (en) * | 2016-03-03 | 2016-08-31 | 闫云昊 | Novel heat dissipation circuit board base |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171124 |
|
| RJ01 | Rejection of invention patent application after publication |