CN107379277A - Diamond saw blade - Google Patents
Diamond saw blade Download PDFInfo
- Publication number
- CN107379277A CN107379277A CN201710711152.6A CN201710711152A CN107379277A CN 107379277 A CN107379277 A CN 107379277A CN 201710711152 A CN201710711152 A CN 201710711152A CN 107379277 A CN107379277 A CN 107379277A
- Authority
- CN
- China
- Prior art keywords
- diamond
- saw blade
- blade according
- diamond saw
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/048—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with a plurality of saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention relates to a kind of diamond saw blade, belong to the technical field of diamond machining tool.The diamond saw blade of the present invention, including circular base, disc matrix includes the side circumferential surface positioned at matrix border, and multiple diamond segments are distributed with the circumferential surface of side, and each in multiple diamond segments forms by abrasive hardcoat portion and Diamond Cutting portion.The diamond saw blade of the present invention can not only reduce the dosage of diamond abrasive, save material cost, and for the materials such as marble, granite, concrete, ceramics high-speed cutting performance more preferably, cutting performance is more stable.
Description
Technical field
The present invention relates to the technical field of diamond machining tool, it is more particularly related to a kind of diamond saw
Piece.
Background technology
Diamond is the most hard material that finds and industrially can largely use in the world, and diamond cutting tool
Have become and process the indispensable material of various stiff materials.Diamond cutting tool is by metal dust and diamond
Particle mixes, and repressed and sintering forms.And as society continues to develop, basisization construction scale constantly expands, also given
Diamond tool provides more wide application market.And in diamond cutting tool, the use range of diamond saw blade is most
Extensively, diamond saw blade is widely used to marble, granite, concrete, pitch, ceramics, glass, jewels and jade, semiconductor
Deng material cutting processing.With the continuous development of technology, requirement to cutting efficiency and rate of cutting also more and more higher.In order to carry
The cutting performance of high diamond saw blade, designer examine generally from two angles of structure design or used solder of saw blade
Consider.For solder, the effect of its one side is that high-abrasive material is connected into grid frame to hold diamond；Second aspect
Effect is worn away with the abrasion of diamond, diamond is normally gone out sword.Solder is except with certain hardness, toughness and resistance to
Beyond mill property, if having certain wellability to diamond, the great height of protrusion for improving diamond grinds so as to improve
Cut performance.Although the pre-alloyed powder generally used in the prior art can improve diamond and metallic bond hold and
Wellability, but its self-sharpening under the conditions of high-speed cutting is poor, so as to cause cutting efficiency bad.
The content of the invention
In order to solve above-mentioned technical problem of the prior art, it is an object of the invention to provide a kind of diamond saw blade.
A kind of diamond saw blade, including disc matrix, the disc matrix include the side circumference positioned at matrix border
Surface, and multiple diamond segments are distributed with the side circumferential surface；It is characterized in that：In the multiple diamond segment
Each formed by abrasive hardcoat portion and Diamond Cutting portion.
Wherein, the abrasive hardcoat portion is identical with the height and thickness in the Diamond Cutting portion, and along the disk
The length ratio of the cylindrical circumferential direction of shape matrix is 1: 8~1: 20.
Wherein, the abrasive hardcoat portion and Diamond Cutting portion are integrally formed by sintering process.
Wherein, it is provided between adjacent diamond segment from the side circumferential surface inwards along the disc matrix center of circle
The chip area of direction extension.
Wherein, the chip area is made up of a trapeze cut and a U-lag.
Wherein, the multiple diamond segment is evenly distributed on the side circumferential surface.
Wherein, the diamond segment is arranged on the side circumferential surface by soldering processes.
Wherein, the abrasive hardcoat portion is formed by not pre-alloyed hard solder by cold pressing and sintering, and wherein
Without diamond abrasive grain.
Wherein, by being cold-pressed and sintering after the Diamond Cutting portion is mixed by pre-alloyed solder and diamond abrasive grain
Form.
Wherein, it is added with pore-foaming agent in the not pre-alloyed hard solder.
Diamond saw blade of the present invention has the advantages that：
The diamond saw blade of the present invention can not only reduce the dosage of diamond abrasive, save material cost, and for big
More preferably, cutting performance is more stable, service life is longer for the high-speed cutting performance of the materials such as reason stone, granite, concrete, ceramics.
Brief description of the drawings
Fig. 1 is the structural representation of diamond saw blade of the present invention.
Fig. 2 is the structural representation of the diamond segment in the diamond saw blade of the present invention.
Embodiment
Diamond saw blade of the present invention is further elaborated below with reference to specific embodiment, to help ability
The technical staff in domain has more complete, accurate and deep understanding to inventive concept of the invention, technical scheme.
As shown in accompanying drawing 1-2, diamond saw blade of the invention, including disc matrix 10, disc matrix 10 include position
Multiple gold connected by soldering processes are evenly distributed with the side circumferential surface of matrix border, and on the side circumferential surface
Diamond tool bit 20.It is provided between adjacent diamond segment 20 from the side circumferential surface inwards along the disc matrix center of circle
The chip area 30 of direction extension, and the chip area is made up of a trapeze cut and a U-lag.The multiple diamond
Each in cutter head 20 forms by abrasive hardcoat portion 21 and Diamond Cutting portion 22, the abrasive hardcoat portion and the Buddha's warrior attendant
The height of stone cutting portion is identical with thickness, and along the cylindrical circumferential direction of disc matrix length ratio be 1: 8~1: 20, institute
Abrasive hardcoat portion and Diamond Cutting portion is stated to be integrally formed by sintering process.Using the diamond saw blade of the present invention to Dali
When the hard materials such as stone, granite, concrete, ceramics are cut, described abrasive hardcoat portion can produce along cutting direction
The abrasive grains of hard, so as to contribute to diamond abrasive grain that Diamond Cutting portion exposes from sharpening, so as to improve gold
Cutting ability of the diamond tool bit under the conditions of high-speed cutting.
Diamond saw blade manufacturing process of the present invention is as follows：
1. matrix is processed
According to drawing requirement, disc 65Mn steel matrix is cut by laser, is then polished flat.
2. prepared by diamond segment
Not pre-alloyed hard solder (including atoleine pore-foaming agent) is weighed according to proportioning respectively to be well mixed, and by
Pre-alloyed solder and diamond abrasive grain (compression strength 25Kg, granularity 35/40) are well mixed；Then by them by first
(length ratio is 1: 8~1: 20) is sequentially respectively put into diamond segment mould afterwards to be cold-pressed into diamond compact and then pass through hot pressing
Sinter molding, hot pressed sintering temperature are 810~850 DEG C, 320~350kg/cm of pressure2, soaking time 180 seconds.
3. laser welding
Diamond segment is placed on by drawing in corresponding matrix location together with matrix, by the light of laser-beam welding machine
Point is adjusted to cutter head and the suitable position of matrix, starts laser-beam welding machine welding, makes cutter head and matrix in the moment of laser penetration
Weld together, then with 600N/mm2Strength criterion carries out weld strength detection to each diamond segment.
4. polishing, spray painting, examine
Then the working face of grinder buffing diamond segment is used, and diamond is exposed, by diamond saw after welding
Piece is bright with sanding machine polishing matrix surface, then carries out surface lacquer, dries, to prevent surface oxidisation, finally with 600N/
mm2Strength criterion carries out weld strength detection, qualified rear printing packaging storage to each diamond segment.
Embodiment 1
The present embodiment use by 31 (weight) % copper powder, 5.2 (weight) % nickel powder, 4.2 (weight) % cobalt powder,
3.6 (weight) % glass putty, 1.0 (weight) % chromium powder, 3.0 (weight) % tungsten carbide powder, 1.0wt% atoleine and
The hard solder that the iron powder mechanical mixture of surplus forms is as the raw material for preparing abrasive hardcoat portion.Using the copper by 31 (weight) %
Powder, 5.2 (weight) % nickel powder, 4.2 (weight) % cobalt powder, 3.6 (weight) % glass putty, 1.0 (weight) % chromium powder,
1.5 (weight) % cerium copper alloy powder, and a diameter of less than 10 μm of the gas that 53.5 (weight) % iron powder is prepared for raw material
Atomized powder adds diamond particles (concentration 100%) conduct that granularity is 35/40 and prepares diamond as prealloy powder
The raw material of cutting portion.They are sequentially respectively put into diamond segment mould (dispensing cause abrasive hardcoat portion with gold
Hard rock cutting portion length ratio is 1: 10) is cold-pressed into diamond compact and then by Thermocompressed sintering and forming, hot pressed sintering temperature is 850
DEG C, pressure 320kg/cm2, soaking time 180 seconds.Then use emery wheel belt sanding diamond segment, by diamond segment with
Matrix is placed on by drawing in corresponding matrix location together, and it is suitable with matrix that the luminous point of laser-beam welding machine is adjusted into cutter head
Position, start laser-beam welding machine welding, cutter head and matrix is welded together in the moment of laser penetration, then with 600N/
mm2Strength criterion carries out weld strength detection to each diamond segment, by the sanding machine polishing base of diamond saw blade after welding
Body surface-brightening, then with the working face of grinder buffing diamond segment, and diamond is exposed, then carries out surface spray
Paint, drying, to prevent surface oxidisation, finally with 600N/mm2Strength criterion carries out weld strength inspection to each diamond segment
Survey, qualified rear printing packaging storage.
Embodiment 2
The present embodiment use by 15 (weight) % copper powder, 11.2 (weight) % nickel powder, 1.2 (weight) % cobalt powder,
The hard solder conduct that 3.0 (weight) % tungsten carbide powder, 1.0wt% atoleine and the iron powder mechanical mixture of surplus forms
Prepare the raw material in abrasive hardcoat portion.Using the copper powder by 15 (weight) %, 11.2 (weight) % nickel powder, 1.2 (weight) %
Cobalt powder and the iron powder of surplus be a diameter of less than 5 μm of electrolytic powder prepared by raw material as prealloy powder, and add granularity
For 35/40 diamond particles (concentration 100%) as the raw material for preparing Diamond Cutting portion.They are sequentially divided
(dispensing is so that abrasive hardcoat portion and Diamond Cutting minister degree ratio are 1: 15) is not put into diamond segment mould is cold-pressed into gold
Hard rock base substrate is then by Thermocompressed sintering and forming, and hot pressed sintering temperature is 850 DEG C, pressure 320kg/cm2, soaking time 180 seconds.
Then emery wheel belt sanding diamond segment is used, diamond segment is placed on to corresponding matrix by drawing together with matrix
On position, the luminous point of laser-beam welding machine is adjusted to cutter head and the suitable position of matrix, starts laser-beam welding machine welding, makes cutter head
Weld together with moment of the matrix in laser penetration, then with 600N/mm2Strength criterion welds to each diamond segment
Intensity detection is connect, diamond saw blade after welding is bright with sanding machine polishing matrix surface, then with grinder buffing diamond tool
The working face of head, and is exposed diamond, then carries out surface lacquer, dries, to prevent surface oxidisation, finally with
600N/mm2Strength criterion carries out weld strength detection, qualified rear printing packaging storage to each diamond segment.
Comparative example 1
It is that diamond segment is made up of Diamond Cutting portion with the difference of embodiment 1, and using by 31 (weights
Amount) % copper powder, 5.2 (weight) % nickel powder, 4.2 (weight) % cobalt powder, 3.6 (weight) % glass putty, 1.0 (weight) %
Chromium powder, 1.5 (weight) % cerium copper alloy powder, and 53.5 (weight) % iron powder for raw material prepare a diameter of 10 μm with
Under gas-atomised powders as prealloy powder, and add granularity be 35/40 diamond particles (concentration 100%) as prepare
The raw material in the Diamond Cutting portion.Raw material is put into diamond segment mould and is cold-pressed into diamond compact and then passes through hot pressing
Sinter molding, hot pressed sintering temperature are 850 DEG C, pressure 320kg/cm2, soaking time 180 seconds.Then emery wheel belt sanding is used
Diamond segment, diamond segment is placed on by drawing in corresponding matrix location together with matrix, by laser-beam welding machine
Luminous point be adjusted to cutter head and the suitable position of matrix, start laser-beam welding machine welding, make cutter head and matrix in laser penetration
Moment welds together, then with 600N/mm2Strength criterion carries out weld strength detection to each diamond segment, will weld
Diamond saw blade is bright with sanding machine matrix surface of polishing afterwards, then with the working face of grinder buffing diamond segment, and makes gold
Hard rock is exposed, and then carries out surface lacquer, drying, to prevent surface oxidisation, finally with 600N/mm2Strength criterion is to every
Individual diamond segment carries out weld strength detection, qualified rear printing packaging storage.
Comparative example 2
It is that diamond segment is made up of Diamond Cutting portion with the difference of embodiment 2, and using by 15 (weights
Amount) % copper powder, 11.2 (weight) % nickel powder, the iron powder of 1.2 (weight) % cobalt powder and surplus prepared for raw material it is straight
Footpath be less than 5 μm of electrolytic powder as prealloy powder, and add granularity as 35/40 diamond particles (concentration 100%)
As the raw material for preparing the Diamond Cutting portion.Raw material is put into diamond segment mould and is cold-pressed into diamond compact then
By Thermocompressed sintering and forming, hot pressed sintering temperature is 850 DEG C, pressure 320kg/cm2, soaking time 180 seconds.Then emery wheel is used
Belt sanding diamond segment, diamond segment is placed on by drawing in corresponding matrix location together with matrix, will swashed
The luminous point of photocoagulator is adjusted to cutter head and the suitable position of matrix, starts laser-beam welding machine welding, is swashing cutter head and matrix
The moment that light penetrates welds together, then with 600N/mm2Strength criterion carries out weld strength inspection to each diamond segment
Survey, diamond saw blade after welding is bright with sanding machine polishing matrix surface, then with the work of grinder buffing diamond segment
Face, and diamond is exposed, surface lacquer is then carried out, is dried, to prevent surface oxidisation, finally with 600N/mm2Intensity
Standard carries out weld strength detection, qualified rear printing packaging storage to each diamond segment.
The diamond saw blade for a diameter of 250mm that embodiment 1~2 and comparative example 1~2 are prepared is in air cooling condition
Under cutting experiment is carried out to medium-hard granite plates, it is when cutting speed is respectively 4.5m/min, 5.0m/min
Cutting life is as shown in table 1.
The diamond saw blade for a diameter of 250mm that embodiment 1~2 and comparative example 1~2 are prepared is in air cooling condition
Under cutting experiment is carried out to medium-hard cement concrete, it is when cutting speed is respectively 5.0m/min, 7.0m/min
Cutting life is as shown in table 2.
Table 1
| Cutting speed | Embodiment 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 |
| 4.5m/min | 612 | 593 | 619 | 603 |
| 5.0m/min | 589 | 573 | 566 | 543 |
Table 2
| Cutting speed | Embodiment 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 |
| 5.0m/min | 1862 | 1795 | 1883 | 1782 |
| 7.0m/min | 1813 | 1722 | 1603 | 1556 |
Test and show under the conditions of high-speed cutting, the gold of the present invention with abrasive hardcoat portion and Diamond Cutting portion
Diamond tool bit saw blade can show more preferable service life.
For the ordinary skill in the art, simply the present invention is exemplarily described for specific embodiment,
Obviously present invention specific implementation is not subject to the restrictions described above, and is entered as long as employing the inventive concept and technical scheme of the present invention
The improvement of capable various unsubstantialities, or it is not improved by the present invention design and technical scheme directly apply to other occasions
, within protection scope of the present invention.
Claims (10)
1. a kind of diamond saw blade, including disc matrix, the disc matrix includes the side circumference table positioned at matrix border
Face, and multiple diamond segments are distributed with the side circumferential surface；It is characterized in that：In the multiple diamond segment
Each is formed by abrasive hardcoat portion and Diamond Cutting portion.
2. diamond saw blade according to claim 1, it is characterised in that：The abrasive hardcoat portion and the Diamond Cutting
The height in portion is identical with thickness, and along the cylindrical circumferential direction of disc matrix length ratio be 1: 8~1: 20.
3. diamond saw blade according to claim 1, it is characterised in that：The abrasive hardcoat portion and Diamond Cutting portion lead to
Oversintering technique is integrally formed.
4. diamond saw blade according to claim 1, it is characterised in that：The multiple diamond segment is evenly distributed on institute
State on the circumferential surface of side.
5. diamond saw blade according to claim 1, it is characterised in that：It is provided between adjacent diamond segment from institute
State the chip area that side circumferential surface extends inwards along disc matrix center of circle direction.
6. diamond saw blade according to claim 5, it is characterised in that：The chip area is by a trapeze cut and one
U-lag forms.
7. diamond saw blade according to claim 1, it is characterised in that：The diamond segment is set by soldering processes
On the side circumferential surface.
8. diamond saw blade according to claim 3, it is characterised in that：The abrasive hardcoat portion is by not pre-alloyed hard
Matter solder forms by cold pressing and sintering, and is wherein free of diamond abrasive grain.
9. diamond saw blade according to claim 3, it is characterised in that：The Diamond Cutting portion is by pre-alloyed pricker
Formed after material and diamond abrasive grain mixing by being cold-pressed and sintering.
10. diamond saw blade according to claim 8, it is characterised in that：Add in the not pre-alloyed hard solder
Added with pore-foaming agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711152.6A CN107379277B (en) | 2017-08-17 | 2017-08-17 | Diamond saw blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711152.6A CN107379277B (en) | 2017-08-17 | 2017-08-17 | Diamond saw blade |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107379277A true CN107379277A (en) | 2017-11-24 |
| CN107379277B CN107379277B (en) | 2023-07-14 |
Family
ID=60352964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710711152.6A Active CN107379277B (en) | 2017-08-17 | 2017-08-17 | Diamond saw blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107379277B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582502A (en) * | 2018-05-07 | 2018-09-28 | 江苏锋泰工具有限公司 | Diamond saw blade and preparation method thereof |
| CN113976891A (en) * | 2021-09-08 | 2022-01-28 | 江苏华昌工具制造有限公司 | Diamond circular saw blade and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277331A (en) * | 1998-03-26 | 1999-10-12 | Kanefusa Corp | Diamond tip saw |
| US20020115399A1 (en) * | 2001-02-19 | 2002-08-22 | Chang Hyun Lee | Diamond saw blade equipped with undercut preventing tip |
| ES1059314U (en) * | 2005-01-19 | 2005-04-01 | Herramientas Preziss, S.L. | Disc for circular saw (Machine-translation by Google Translate, not legally binding) |
| JP2006527663A (en) * | 2004-04-21 | 2006-12-07 | エーワ ダイアモンド インダストリアル カンパニイリミテッド | CUTTING TIP, CUTTING TIP MANUFACTURING METHOD, AND CUTTING TOOL |
| CN104875287A (en) * | 2015-06-19 | 2015-09-02 | 江苏锋泰工具有限公司 | Dry and wet dual-purpose laser welding diamond saw blade |
| CN204955134U (en) * | 2015-09-11 | 2016-01-13 | 江苏友和工具有限公司 | Base member strenghthened type diamond circular saw piece |
| CN105922456A (en) * | 2016-06-23 | 2016-09-07 | 江苏锋泰工具有限公司 | Noise reducing diamond saw blade |
| CN207088211U (en) * | 2017-08-17 | 2018-03-13 | 江苏华昌工具制造有限公司 | Diamond saw blade |
-
2017
- 2017-08-17 CN CN201710711152.6A patent/CN107379277B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277331A (en) * | 1998-03-26 | 1999-10-12 | Kanefusa Corp | Diamond tip saw |
| US20020115399A1 (en) * | 2001-02-19 | 2002-08-22 | Chang Hyun Lee | Diamond saw blade equipped with undercut preventing tip |
| JP2006527663A (en) * | 2004-04-21 | 2006-12-07 | エーワ ダイアモンド インダストリアル カンパニイリミテッド | CUTTING TIP, CUTTING TIP MANUFACTURING METHOD, AND CUTTING TOOL |
| ES1059314U (en) * | 2005-01-19 | 2005-04-01 | Herramientas Preziss, S.L. | Disc for circular saw (Machine-translation by Google Translate, not legally binding) |
| CN104875287A (en) * | 2015-06-19 | 2015-09-02 | 江苏锋泰工具有限公司 | Dry and wet dual-purpose laser welding diamond saw blade |
| CN204955134U (en) * | 2015-09-11 | 2016-01-13 | 江苏友和工具有限公司 | Base member strenghthened type diamond circular saw piece |
| CN105922456A (en) * | 2016-06-23 | 2016-09-07 | 江苏锋泰工具有限公司 | Noise reducing diamond saw blade |
| CN207088211U (en) * | 2017-08-17 | 2018-03-13 | 江苏华昌工具制造有限公司 | Diamond saw blade |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582502A (en) * | 2018-05-07 | 2018-09-28 | 江苏锋泰工具有限公司 | Diamond saw blade and preparation method thereof |
| CN113976891A (en) * | 2021-09-08 | 2022-01-28 | 江苏华昌工具制造有限公司 | Diamond circular saw blade and preparation method thereof |
| CN113976891B (en) * | 2021-09-08 | 2024-05-10 | 江苏华昌工具制造有限公司 | Diamond circular saw blade and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107379277B (en) | 2023-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10377017B2 (en) | Bonded abrasive article and method of forming | |
| CN104875287B (en) | Dry and wet dual-purpose laser welding diamond saw blade | |
| CN101434827B (en) | Grinding medium containing ceramic particle, preparation and use thereof | |
| JPH05208312A (en) | Duplex coating diamond particle pellet and saw blade segment manufactured by using it | |
| JP5636144B2 (en) | Vitrified super abrasive wheel | |
| CN104874863B (en) | Manufacture method for dry and wet dual-purpose diamond saw blade | |
| CN1953843A (en) | Brazed diamond dressing tool | |
| US20120066982A1 (en) | Bonded abrasive articles, method of forming such articles, and grinding performance of such articles | |
| CN104907942A (en) | Saw-tooth double-faced concave U sharp type concrete laser welding cutting disk preparation method | |
| CN110125820B (en) | Diamond grinding disc and preparation method thereof | |
| CN105798782A (en) | Diamond resin grinding wheel and preparation method thereof | |
| CN112677061B (en) | Brazing diamond grinding disc for steel grinding and preparation method thereof | |
| CN106392908A (en) | Diamond grinding wheel with ceramic binders and production method thereof | |
| US9278431B2 (en) | Bonded abrasive article and method of grinding | |
| CN105538174A (en) | Grinding wheel block, preparation method thereof and polishing grinding wheel | |
| US10377016B2 (en) | Bonded abrasive article and method of grinding | |
| CN101066585A (en) | Brazed multilayer abrasive tool and its making process | |
| CN107379277A (en) | Diamond saw blade | |
| CN104015132A (en) | Manufacturing technology of dry diamond-impregnated wheel | |
| CN207088211U (en) | Diamond saw blade | |
| CN106493635A (en) | A kind of surface has the diadust grinding block of trench structure and processing method | |
| CN108161778B (en) | Diamond grinding head and preparation process thereof | |
| CN111136591B (en) | Grinding wheel for ceramic tile processing | |
| CN108582504A (en) | Energy-efficient diamond saw blade and preparation method thereof | |
| JP2012200847A (en) | Vitrified superabrasive grain grinding wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |