CN107359134B - Method and device for realizing BGA chip repair by using laser - Google Patents
Method and device for realizing BGA chip repair by using laser Download PDFInfo
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- CN107359134B CN107359134B CN201710631883.XA CN201710631883A CN107359134B CN 107359134 B CN107359134 B CN 107359134B CN 201710631883 A CN201710631883 A CN 201710631883A CN 107359134 B CN107359134 B CN 107359134B
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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Abstract
The invention discloses a method and a device for realizing BGA chip repair by using laser, belonging to the field of printed circuit board manufacture, comprising a laser scanning heating system, a coaxial imaging system, a bottom hot air nozzle, a preheating plate, a PCB plate clamp and the like. The method and the device applying the principle not only effectively reduce the influence on other surrounding components in the repairing process of the BGA chip, but also greatly shorten the alignment time of the BGA chip in the repairing process, greatly improve the repairing efficiency of the BGA chip and reduce the application cost of the BGA chip.
Description
Technical Field
The invention belongs to the field of printed circuit board manufacturing, and particularly relates to a method and a device for realizing BGA chip repair by using laser.
Background
With the continuous development of electronic technology, electronic products tend to be more miniaturized, portable and intelligent, the traditional circuit connection form is also changed greatly, the application of printed circuit boards (also called printed circuit boards, PCB for short) is more and more extensive, correspondingly, various chips arranged corresponding to the PCB are also rapidly developed, and the printed circuit boards are widely applied to various electronic products.
With the increasing integration of chips, the number of I/O leads is also increasing, and on the basis of ensuring the miniaturization of chips, the pin pitch of the chips is becoming smaller and smaller, which is particularly evident in BGA chips (Ball Grid Array, Ball Grid Array Package) and CSP chips (Chip Scale Package), and the development and development of BGA chips and CSP chips greatly promote the miniaturization and intellectualization of electronic products.
In the existing BGA chip repair field, an infrared heating based BGA repair table is generally adopted, for example, a BGA intelligent repair table disclosed in patent document CN 201520222667.6, which includes an operation table, an infrared heating device, a control device and a display device, the infrared heating device is connected to the operation table, the control device is connected to the display device through a diode circuit, in the scheme, the infrared heating device is used to heat and unsolder the BGA chip, although the BGA chip can be repaired and positioned more accurately; however, the BGA chip rework stations of the above type also have significant limitations, such as: 1. the thermal influence range of the infrared heating device is large, so that the thermal influence range is easy to influence components around the BGA chip, and the cold soldering or the desoldering of the components around the BGA chip can be caused in serious cases; 2. present heating device based on infrared ray is longer with the counterpoint time of BGA chip, and the counterpoint precision is relatively poor, the efficiency of reprocessing of BGA chip has greatly been reduced, though it has set up CCD image system to realize optics counterpoint with promotion heating device and BGA chip to adjust the precision well on the BGA reprocesses the bench, but after the PCB board change size, the optics counterpoint that needs artifical position of adjusting the PCB board many times to realize BGA chip and image system, the efficiency of reprocessing of BGA chip has greatly been reduced. Therefore, the existence of the defects greatly affects the repair accuracy and efficiency of the conventional BGA chip, which causes great adverse effects on the application and development of the BGA chip, indirectly affects the miniaturization and intelligent development of electronic products, and improves the application and maintenance cost of the BGA chip.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a method and a device for realizing the repair of a BGA chip by using laser, wherein the BGA chip to be repaired in a limited area is heated by using the laser, so that the repair efficiency of the BGA chip is greatly improved, other electronic components arranged beside the BGA chip are prevented from being adversely affected as far as possible, and the progress of the repair process of the BGA chip is greatly promoted.
In order to achieve the above object, in one aspect of the present invention, there is provided a method for repairing a BGA chip by using a laser, the method heating the BGA chip to separate the BGA chip from a PCB by using the laser generated by a laser scanning heating system, the method comprising the steps of:
s1: a coaxial image system for imaging the PCB is arranged corresponding to the laser scanning heating system, and the field range shot by the coaxial image system corresponds to the area scanned and heated by the laser scanning heating system;
s2: selecting a bottom hot air nozzle with a corresponding size according to the size of the BGA chip to be repaired on the PCB, arranging the bottom hot air nozzle at the bottom of the area to align the BGA chip, and clamping and fastening the PCB to be repaired by a PCB clamp;
s3: opening a coaxial imaging system to image a PCB within a field of view, and accurately adjusting the position of a BGA chip to be repaired according to the imaging, so that the BGA chip is accurately aligned with the bottom hot air nozzle and a laser scanning heating head in the laser scanning heating system respectively;
s4: opening a preheating plate to uniformly preheat the bottom surface of the PCB to be repaired;
s5: and closing the preheating plate, then opening the laser scanning heating system and the bottom hot air nozzle, wherein the laser scanning heating system generates laser to uniformly scan and heat the upper surface of the BGA chip, and meanwhile, introducing hot air into the bottom hot air nozzle to uniformly heat the lower surface of the BGA chip, so that the BGA chip to be repaired can be separated from the PCB to be repaired.
As a further improvement of the present invention, the coaxial imaging system comprises a visible light reflector for reflecting the position of the BGA chip in the field of view, a zoom lens for imaging the field of view image reflected by the visible light reflector, and a display screen for displaying the imaging image of the zoom lens and adjusting the optical alignment of the BGA chip;
the axis of the zoom lens is intersected and vertical to the axis of the laser beam emitted from the laser scanning heating head, the visible light reflector and the axis of the laser beam emitted from the laser scanning heating head to the BGA chip are arranged at an angle so that the laser beam can transmit through the visible light reflector to realize the scanning and heating of the BGA chip by the laser, and the visible light reflector and the axis of the zoom lens are also arranged at the same angle so that the visible light reflector can reflect the BGA chip in a view field below the visible light reflector to the zoom lens to realize the imaging display of the BGA chip by the zoom lens.
As a further improvement of the present invention, the position of the BGA chip to be repaired is adjusted so that it is at the center of the field of view of the coaxial imaging system.
As a further development of the invention, the angle is 45 °.
As a further improvement of the present invention, in step S5, the infrared temperature measurement module may be further used to monitor the surface temperature of the BGA chip in real time during the heating process.
As a further improvement of the present invention, the method for implementing BGA chip rework by laser further includes:
s6: the BGA chip which is taken down is maintained and judged, if the BGA chip can not be repaired, a new BGA chip is replaced, and if the BGA chip can be repaired, maintenance work such as ball mounting of the BGA chip is carried out;
s7: after the new BGA chip or the repaired BGA chip is cleaned and aligned with the corresponding position on the PCB, the BGA chip is welded on the PCB, and the repair of the BGA chip is completed;
s8: and taking down the repaired PCB from the PCB clamp, closing the corresponding device, and completing the whole maintenance process.
In another aspect of the present invention, there is provided an apparatus for repairing a BGA chip using a laser, including a frame,
the machine frame is provided with a laser scanning heating system, a coaxial imaging system, a bottom hot air nozzle, a preheating plate and a PCB clamp;
the laser scanning heating system comprises a laser generator for generating laser, a laser light path for transmitting the laser and a laser scanning heating head for deflecting a laser beam to be aligned with the BGA chip so as to realize scanning and heating of the BGA chip by the laser, and is positioned at the top of the rack, and the laser beam emitted by the laser scanning heating head is aligned with the bottom hot air nozzle;
the coaxial imaging system comprises a visible light reflector for reflecting the position of the BGA chip in a visual field, a zoom lens for imaging a visual field picture reflected by the visible light reflector, and a display screen for displaying an imaging picture of the zoom lens and adjusting the optical alignment of the BGA chip, wherein the axis of the zoom lens is intersected and vertical to the axis of the laser beam emitted from the laser scanning heating head, the visible light reflector and the laser beam axis of the laser scanning heating head which shoots to the BGA chip are arranged in an angle for the laser beam to transmit the visible light reflector so as to realize the scanning heating of the BGA chip by the laser, the visible light reflector and the axis of the zoom lens are arranged at the same angle so as to be used for reflecting the BGA chip in the field of view below the visible light reflector to the zoom lens to realize the imaging display of the zoom lens on the BGA chip;
the bottom hot air nozzle is arranged on the rack and aligned with the laser beam emitted from the laser scanning heating head so as to heat the bottom surface of the BGA chip to be repaired after adjustment and alignment;
the PCB clamp is used for fixing a PCB to be repaired, is arranged at two sides of the bottom hot air nozzle and can move in the horizontal direction relative to the bottom hot air nozzle so as to align the BGA chip with the laser scanning heating head;
the preheating plate is arranged below the PCB clamp and used for preheating the PCB fixed on the PCB clamp.
As a further improvement of the invention, the angle between the visible light reflector and the axis of the laser beam emitted to the BGA chip by the laser scanning heating head is 45 degrees.
As a further improvement of the invention, the device for realizing the repair of the BGA chip by using the laser further comprises an infrared temperature measurement module for monitoring the surface temperature of the BGA chip in real time.
As a further improvement of the invention, the device for realizing the BGA chip repair by using the laser further comprises an X-Y axis adjusting mechanism matched with the PCB clamp for adjusting the horizontal position of the BGA chip.
As a further improvement of the present invention, the preheating plate is an infrared preheating plate.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
(1) according to the method and/or device for realizing the repair of the BGA chip by using the laser, the repair of the BGA chip is realized by adopting a laser heating mode, the influence on other surrounding components in the repair process of the BGA chip is reduced, and the adverse influence on other normally working components on a PCB (printed Circuit Board) due to the repair of the BGA chip is effectively avoided;
(2) according to the method and/or device for realizing the BGA chip repair by using the laser, the alignment of the laser heating area and the BGA chip to be repaired is realized by arranging the coaxial image system, so that the time consumed by adjusting the horizontal position of the BGA chip to align the BGA chip with the laser beam is shortened, and the repair efficiency of the BGA chip is effectively improved;
(3) according to the method and/or device for realizing the repair of the BGA chip by using the laser, the laser beam axis of the laser scanning heating system and the visible light reflection axis of the coaxial imaging system are coaxially arranged, and the laser beam irradiation area is opposite to the bottom hot air nozzle, so that the coaxial imaging system, the laser scanning heating system and the bottom hot air nozzle are correspondingly arranged, and the BGA chip can be aligned with the bottom hot air nozzle and the laser scanning heating head only by adjusting the view field position of the BGA chip on the coaxial imaging system, so that the alignment efficiency of the BGA chip is greatly improved, and the repair time of the BGA chip is shortened;
(4) the method and/or the device for realizing the BGA chip repair by using the laser have the advantages of simple structure and/or principle, easy realization, effective improvement of the BGA chip repair efficiency, reduction of the overhaul and maintenance cost of the BGA chip, indirect promotion of the development and popularization of the BGA chip and reduction of the application cost of the BGA chip.
Drawings
FIG. 1 is a schematic diagram illustrating a BGA chip rework method using laser according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a device for repairing a BGA chip by using laser according to an embodiment of the present invention;
in all the figures, the same reference numerals denote the same features, in particular: 1. the laser scanning heating system comprises a laser scanning heating system, 101, a laser generator, 102, a laser light path, 103, a laser scanning heating head, 2, a coaxial image system, 201, a zoom lens, 202, a visible light reflector, 203, a display screen, 3, a bottom hot air nozzle, 4, a PCB (printed circuit board) clamp, 5, a preheating plate, 6, an X-Y axis adjusting mechanism, 7, an infrared temperature measuring module, 8, a rack, 801, a bottom plate, 802, a side plate and 9, and a control system.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Specifically, as shown in fig. 2, a schematic structural diagram of an apparatus for implementing BGA chip rework by laser in a preferred embodiment of the present invention is shown, where the apparatus includes a laser scanning heating system 1, a coaxial imaging system 2, a bottom hot air nozzle 3, a PCB clamp 4, a preheating plate 5, an X-Y axis adjusting mechanism 6, an infrared temperature measuring module 7, a rack 8, and a control system 9, and further specifically, the laser scanning heating system 1 includes a laser generator 101, a laser optical path 102, and a laser scanning heating head 103, the coaxial imaging system 2 includes a zoom lens 201, a visible light reflecting mirror 202, and a display screen 203, and the rack 8 includes a bottom plate 801 and a side plate 802.
More specifically, in a preferred embodiment, the main structural components of the BGA chip rework device are arranged on the frame 8 by using laser, the frame 8 may preferably be a structure with an L-shaped lateral cross-section formed by vertically intersecting the bottom plate 801 and the side plate 802, and the side plate 802 may also preferably be designed to be a gantry-type structure, that is, a frame-type structure is formed by two columns and a beam, and then the gantry-type frame is formed by combining the bottom plate 801 and the frame-type structure; further, the laser scanning heating system 1 is disposed on the upper end surface of the side plate 802, wherein the laser scanning heating system 1 preferably includes a laser generator 101, a laser optical path 102 and a laser scanning heating head 103, and the laser generator 101, the laser optical path 102 and the laser scanning heating head 103 are preferably coaxially disposed, wherein the laser generator 101 is disposed at the rear end of the laser optical path 102 for generating laser light and transmitting the laser light to the laser scanning heating head 103 disposed at the front end of the laser optical path 102 via the laser optical path 102, the transmission axis of the laser light in the laser optical path 102 is preferably coincident with the axis of the laser scanning heating system 1 and is transverse to the upper end surface of the side plate 802, and the transmission direction of the laser light is preferably perpendicular to the bottom plate 801 of the rack 8 after being deflected in the laser scanning heating head 103, i.e. the direction of the laser light emitted from the laser scanning heating head 103 is perpendicular to the transmission direction of the laser light in the laser optical path 102, the laser exit of the laser scanning heating head 103 is directed towards the base 801 of the gantry 8.
Further, the coaxial imaging system 2 is coaxially disposed right below the laser scanning heating system 1, that is, the axis of the coaxial imaging system 2 and the axis of the laser scanning heating system 1 are parallel to each other in the vertical direction, and the axis of the coaxial imaging system 2 and the laser transmission axis in the laser optical path 102 are also parallel to each other in the vertical direction. Further specifically, the on-axis imaging system 2 in one preferred embodiment includes a zoom lens 201, a visible light reflector 202 and a display screen 203, wherein the visible light reflector 202 can reflect visible light and transmit laser light, is installed right in front of the zoom lens 201 and right below the laser scanning heating head 103, the visible light reflector 202 is installed at a position such that the lens thereof forms an angle of 45 degrees with the axis of the zoom lens 201 and reflects the image right below the laser scanning heating head 103 to the zoom lens 201 for imaging, and the lens thereof just allows the laser beam transmitted from the laser scanning heating head 103 to pass through and form an angle of 45 degrees with the axis of the laser beam, that is, the visible light mirror 202 faces the side of the laser scanning heating head 103 for laser transmission to heat the components below the laser scanning heating head 103, one surface of the visible light reflector 202 facing the zoom lens 201 can emit component images below the surface to the zoom lens 201 for imaging; further, the axis of the zoom lens 201 intersects and is perpendicular to the central axis of the laser beam emitted from the laser scanning heating head 103, and the zoom lens cooperates with a camera arranged at the rear part thereof to realize clear imaging of the components below the visible light reflector 202, and then the clear imaging is displayed on the display screen 203, so that an operator can adjust the position of the corresponding components needing imaging below by means of the image position on the display screen 203. After the coaxial image system 2 and the laser scanning heating system 1 are arranged, the positions of the corresponding components of the two systems are preferably fixed without adjustment, and the optical paths of the components below the visible light reflector 202 and the laser beam emitted by the laser scanning heating head 103 are overlapped after the two systems are arranged.
Further, a preheating plate 5 is further disposed on the bottom plate 801 of the rack 8, and is used for slowly heating the PCB to be repaired, so as to reduce the temperature gradient between the heated area of the BGA chip to be repaired and the peripheral components, and prevent the PCB to be repaired from being deformed due to an excessive temperature gradient, in a preferred embodiment, the preheating time of the preheating plate 5 lasts for 5-10 minutes, the highest temperature is about 100 ℃, further, the preheating plate 5 is disposed on a fixed base on the bottom plate 801 and is parallel to the bottom plate 801 of the rack 8, and the geometric center of the preheating plate preferably faces the laser scanning heating head 103 above, and the preheating plate 5 may further preferably be an infrared preheating plate; furthermore, a bottom hot air nozzle 3 is further arranged at the geometric center of the preheating plate 5 and used for heating the bottom surface of the BGA chip to be repaired, so that a larger temperature gradient does not exist on the upper surface and the lower surface of the BGA chip to be repaired in the surface heating process, the temperature gradient existing between the upper surface and the lower surface due to the fact that the temperature rises too fast in the laser heating process of the upper surface is reduced, deformation, even fracture and damage of the BGA chip to be repaired due to the too large temperature gradient are prevented, the success rate of repair is improved, further, the geometric center of the bottom hot air nozzle 3 is overlapped with the optical axis of laser emitted from the laser scanning heating head 103, the fact that the laser scanning heating area does not exceed the size range of the BGA chip to be repaired is guaranteed, and influences on other components on the PCB are reduced; the size of the bottom hot air nozzle 3 is not specifically limited, and can be specifically replaced according to the size of the BGA chip to be repaired, the bottom hot air nozzle 3 is preferably locked on the fixed base by a movable fastener, and further preferably, the bottom hot air nozzle 3 is heated by an electric heating wire.
Furthermore, an X-Y axis adjusting mechanism 6 for adjusting the position of the PCB to be repaired is also arranged above the preheating plate 5, so as to realize the alignment of the BGA chip to be repaired and the laser scanning heating head 103, the X-Y axis adjusting mechanism 6 is of a frame structure, which comprises a fixed frame superposed with the center of a preheating plate 5, the area covered by the fixed frame is preferably larger than that of the preheating plate 5, slide bars which can slide left and right relative to the fixed frame are symmetrically arranged on the fixed frame, the symmetrical sliding rods are symmetrically provided with PCB clamps 4 for fixing the PCB, the PCB clamps 4 can slide back and forth on the sliding rods relative to the frame, the number of the PCB clamps 4 is not particularly limited, the PCB plate clamps 4 in a preferred embodiment are preferably 6, namely 3 same PCB plate clamps 4 are arranged on each sliding rod; after the to-be-repaired PCB is fixed on the PCB clamp 4, the to-be-repaired PCB is located in the heating area of the preheating plate 5, and the horizontal position of the to-be-repaired PCB is adjusted by the X-Y axis adjusting mechanism 6 according to the image frame fed back by the coaxial imaging system 2, so that the to-be-repaired BGA chip is aligned with the bottom hot air nozzle 3, that is, the to-be-repaired BGA chip is aligned with the laser scanning heating area of the laser scanning heating head 103, and the position of the to-be-repaired BGA chip displayed on the display screen 203 is located at the center of the imaging area of the zoom lens 201.
Further, the rack 8 is also provided with a control system 9 for sending a control instruction to the corresponding component of the BGA repairing device to realize the coordination work among the components; furthermore, an infrared temperature measurement module 7 is preferably arranged on the upper end face of the side plate 802 and used for monitoring the surface temperature of the BGA chip to be repaired in real time in the repair process, and when the temperature rises to be close to the alarm temperature, the control system 9 reduces the laser power through negative feedback, so that the temperature rising speed is slowed down until the temperature rising is stopped, and the BGA chip to be repaired is prevented from being damaged; in a preferred embodiment, an auxiliary illumination source is provided to allow a clear image to be presented on the display 203.
In order to further explain the embodiment of the present invention, the steps of the method for implementing the BGA chip rework by using laser in a preferred embodiment are as follows:
s1: the coaxial imaging system 2 for imaging the PCB is arranged corresponding to the laser scanning heating system 1, the axis of the zoom lens 201 is intersected and vertical with the axis of a laser beam emitted from the laser scanning heating head 103, the visible light reflecting mirror 202 and the axis of the laser beam emitted from the laser scanning heating head 103 to the BGA chip are arranged at an angle of 45 degrees for the laser beam to transmit the visible light reflecting mirror 202 to realize the scanning and heating of the laser to the BGA chip, and the visible light reflecting mirror 202 and the axis of the zoom lens 201 are also arranged at an angle of 45 degrees for the visible light reflecting mirror 202 to reflect the BGA chip in a view field below the visible light reflecting mirror 202 to the zoom lens 201 to realize the imaging and displaying of the BGA chip by the zoom lens 201, namely, the range of the view field shot by the coaxial imaging system 2 corresponds to the scanning and heating area of;
s2: selecting a bottom hot air nozzle 3 with a corresponding size according to the size of the BGA chip to be repaired, aligning the bottom hot air nozzle with the field range shot by the coaxial imaging system 2 and/or the scanning and heating area of the laser scanning heating system 1, then tightly locking the bottom hot air nozzle on the bottom plate 801, placing the PCB to be repaired on a PCB clamp 4, completing clamping and fastening by the PCB clamp 4, and arranging an X-Y axis adjusting mechanism 6 for adjusting the horizontal position of the PCB in a matching way with the PCB clamp;
s3: turning on the auxiliary lighting source and the coaxial imaging system 2, adjusting the zoom lens 201 to enable the PCB to be repaired to clearly image on the display screen 203, determining whether the BGA chip to be repaired is aligned with the bottom hot air nozzle 3 or not from the view field of the display screen 203, if not, controlling the X-Y axis adjusting mechanism 6 through the control system 9 to achieve adjustment of the horizontal position of the BGA chip on the PCB to be repaired, enabling the BGA chip to be located at the center position of the view field on the display screen 203, and enabling the BGA chip to be repaired to be aligned with the laser optical axis of the laser scanning heating head 103 and the bottom hot air nozzle 3 at the moment;
s4: opening the preheating plate 5 to slowly preheat the bottom surface of the PCB to be repaired, and closing the preheating plate 5 after preheating for 5-10 min, wherein the preheating temperature is not more than 100 ℃;
s5: opening the laser scanning heating system 1, the bottom hot air nozzle 3 and the infrared temperature measuring module 7, uniformly scanning and heating the upper surface of the BGA chip to be repaired by laser beams in the laser scanning heating head 103, synchronously and uniformly heating the lower surface of the BGA chip to be repaired by the bottom hot air nozzle 3, and monitoring the surface temperature of the BGA chip in real time by the infrared temperature measuring module 7 in the heating process;
s6: when the BGA chip to be repaired is separated from the PCB, the laser scanning heating system 1, the bottom hot air nozzle 3 and the infrared temperature measuring module 7 are closed, and the BGA chip to be repaired is adsorbed and taken down by the vacuum gun for repairing;
s7: repairing the removed BGA chip, judging whether the BGA chip can be repaired or not, if so, performing repairing work such as ball mounting treatment, and if not, replacing a new BGA chip;
s8: placing the repaired BGA chip or the replaced BGA chip at a corresponding position on the PCB, starting a soldering program to solder the BGA chip at the corresponding position, and completing the repair of the BGA chip on the PCB to be repaired; ,
s9: loosening the PCB clamp 4, and taking down the repaired PCB from the PCB clamp 4 to complete the BGA chip repairing process of the PCB;
s10: and (5) circulating the steps S1-S9 to finish the repair of the BGA chips on the PCB to be repaired in batch.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A method for realizing BGA chip repair by using laser, which utilizes the laser generated by a laser scanning heating system (1) to heat the BGA chip to separate the BGA chip from a PCB board, and comprises the following steps:
s1: a coaxial image system (2) for imaging the PCB is arranged corresponding to the laser scanning heating system (1), so that the light path of a field area shot by the coaxial image system (2) is overlapped with the light path of a laser beam emitted by the laser scanning heating system (1) and emitted to the field area;
s2: a replaceable bottom hot air nozzle (3) and a PCB clamp capable of clamping a PCB are arranged in the field area; the bottom hot air nozzle (3) can be replaced correspondingly according to the size of a BGA chip to be repaired on the PCB, and the geometric center of the bottom hot air nozzle (3) is superposed with the optical axis of the laser beam; the PCB clamp can clamp and fix a PCB to be repaired between the laser scanning heating system (1) and the bottom hot air nozzle (3), and can adjust the position so as to enable the BGA chip to be coaxially aligned with the bottom hot air nozzle;
s3: clamping a PCB to be repaired on a PCB clamp, opening the coaxial imaging system (2) to image the PCB in the field of view, and accurately adjusting the position of a BGA chip to be repaired according to the imaging so that the BGA chip is coaxially aligned with the bottom hot air nozzle (3) and a laser scanning heating head (103) in the laser scanning heating system (1) respectively;
s4: arranging a preheating plate (5) on the periphery of the bottom hot air nozzle (3) to ensure that the other bottom surface parts of the PCB except the BGA chip are aligned to the preheating plate (5), and opening the preheating plate (5) to uniformly preheat the bottom surface of the PCB to be repaired before heating the BGA chip;
s5: close open after preheating plate (5) laser scanning heating system (1) with hot-blast mouth (3) in bottom, laser scanning heating system (1) produces laser and carries out the even scanning heating to the upper surface of BGA chip, simultaneously let in hot-blast lower surface to the BGA chip in hot-blast mouth (3) in bottom and carry out the even heating, can make and wait to reprocess the BGA chip and break away from the PCB board to reprocess.
2. The method for repairing BGA chip by using laser as claimed in claim 1, wherein the coaxial imaging system (2) comprises a visible light reflector (202) for reflecting the position of BGA chip in the field of view, a zoom lens (201) for imaging the field of view picture reflected by the visible light reflector, and a display screen (203) for displaying the zoom lens imaging picture and adjusting the optical alignment of BGA chip;
the axis of the zoom lens (201) is intersected and vertical with the axis of the laser beam emitted from the laser scanning heating head (103), the visible light reflecting mirror (202) and the axis of the laser beam emitted from the laser scanning heating head (103) to the BGA chip are arranged in an angle mode so that the laser beam can transmit the visible light reflecting mirror (202) to scan and heat the BGA chip by laser, and the visible light reflecting mirror (202) and the axis of the zoom lens (201) are also arranged in the same angle mode so that the visible light reflecting mirror (202) can reflect the BGA chip in a view field below the visible light reflecting mirror to the zoom lens (201) to achieve imaging display of the BGA chip by the zoom lens (201).
3. The method for realizing BGA chip repair by using laser according to claim 1 or 2, wherein the position of the BGA chip to be repaired is adjusted so that it is at the center position of the field of view of the coaxial imaging system (2).
4. The method for repairing BGA chip using laser as claimed in claim 2, wherein said angle is set to 45 °.
5. The method for repairing BGA chip using laser according to claim 1, 2 or 4, wherein in step S5, an infrared temperature measuring module (7) is further provided to monitor the surface temperature of BGA chip during heating process in real time.
6. The method for realizing BGA chip repair by using laser according to claim 1, 2 or 4, further comprising:
s6: the BGA chip which is taken down is maintained and judged, if the BGA chip can not be repaired, a new BGA chip is replaced, and if the BGA chip can be repaired, maintenance work such as ball mounting of the BGA chip is carried out;
s7: after the new BGA chip or the repaired BGA chip is cleaned and aligned with the corresponding position on the PCB, the BGA chip is welded on the PCB, and the repair of the BGA chip is completed;
s8: and taking down the repaired PCB from the PCB clamp (4), closing the corresponding device, and finishing the whole maintenance process.
7. A device for realizing BGA chip repair by laser comprises a frame (8) and is characterized in that,
the rack (8) is provided with a laser scanning heating system (1), a coaxial imaging system (2), a bottom hot air nozzle (3), a preheating plate (5) and a PCB plate clamp (4);
the laser scanning heating system (1) comprises a laser generator (101) for generating laser, a laser optical path (102) for transmitting the laser, and a laser scanning heating head (103) for deflecting the laser beam to be aligned with the BGA chip so as to realize scanning heating of the BGA chip by the laser, wherein the laser scanning heating system (1) is positioned at the top of the rack (8), and the laser beam emitted by the laser scanning heating head (103) is aligned with the bottom hot air nozzle (3);
the coaxial image system (2) comprises a visible light reflecting mirror (202) for reflecting the position of the BGA chip in a field of view, a zoom lens (201) for imaging a field of view image reflected by the visible light reflecting mirror (202), and a display screen (203) for displaying the imaging image of the zoom lens (201) and adjusting the optical alignment of the BGA chip, wherein the axis of the zoom lens (201) is intersected and vertical to the axis of a laser beam emitted from the laser scanning heating head (103), the visible light reflecting mirror (202) and the axis of the laser beam emitted from the laser scanning heating head (103) to the BGA chip are arranged at an angle for the laser beam to transmit through the visible light reflecting mirror (202) to realize the scanning heating of the laser to the BGA chip, and the axes of the visible light reflecting mirror (202) and the zoom lens (201) are also arranged at the same angle for the visible light reflecting mirror (202) to reflect the BGA chip in the field of view below to the zoom BGA chip The lens (201) is used for realizing the imaging display of the zoom lens (201) on the BGA chip;
the bottom hot air nozzle (3) is arranged on the rack (8) and is aligned with the laser beam emitted from the laser scanning heating head (103) so as to heat the bottom surface of the BGA chip to be repaired after adjustment and alignment;
the PCB clamp (4) is used for fixing a PCB to be repaired, is arranged at two sides of the bottom hot air nozzle (3) and can move in the horizontal direction relative to the bottom hot air nozzle (3) so as to align the BGA chip with the laser scanning heating head (103);
the preheating plate (5) is arranged below the PCB clamp (4) and used for preheating the PCB fixed on the PCB clamp.
8. The device for repairing BGA chip by using laser as claimed in claim 7, wherein the angle between the visible light reflector (202) and the laser beam axis of the laser scanning heating head (103) to the BGA chip is 45 °.
9. The apparatus for repairing BGA chip by using laser as claimed in claim 7 or 8, further comprising an infrared temperature measuring module (7) for monitoring the temperature of the surface of BGA chip in real time.
10. The apparatus for repairing BGA chip using laser according to claim 7 or 8, further comprising an X-Y axis adjusting mechanism (6) matched with the PCB clamp (4) for adjusting the horizontal position of BGA chip.
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| CN201710631883.XA CN107359134B (en) | 2017-07-28 | 2017-07-28 | Method and device for realizing BGA chip repair by using laser |
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| CN201710631883.XA CN107359134B (en) | 2017-07-28 | 2017-07-28 | Method and device for realizing BGA chip repair by using laser |
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| CN107359134B true CN107359134B (en) | 2020-09-11 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102047445B1 (en) * | 2018-02-05 | 2019-11-21 | 레이저쎌 주식회사 | Bonding and debonding apparatus for electronic parts |
| CN111526670A (en) * | 2020-04-15 | 2020-08-11 | 武汉博联特科技有限公司 | BGA laser repairing system based on galvanometer |
| CN111962130B (en) * | 2020-07-17 | 2021-11-23 | 苏州浪潮智能科技有限公司 | Electroplating system and method for BGA area in PCB |
| CN113333887A (en) * | 2021-07-11 | 2021-09-03 | 江苏鸿佳电子科技有限公司 | Automatic maintenance system of MINI LED |
| CN113857610A (en) * | 2021-09-27 | 2021-12-31 | 苏州科韵激光科技有限公司 | Laser welding and removing method and device |
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