CN107357136A - Photosensitive liquid resin - Google Patents
Photosensitive liquid resin Download PDFInfo
- Publication number
- CN107357136A CN107357136A CN201710731769.4A CN201710731769A CN107357136A CN 107357136 A CN107357136 A CN 107357136A CN 201710731769 A CN201710731769 A CN 201710731769A CN 107357136 A CN107357136 A CN 107357136A
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- China
- Prior art keywords
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- photosensitive liquid
- liquid resin
- epoxy resin
- compound
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of photosensitive liquid resin, it is related to technical field of chemistry and chemical engineering.This photosensitive liquid resin, include the raw material of following parts by weight：10~85 parts of epoxy resin, 10~85 parts of both-end acrylate based polysiloxane, 0~50 part of polyepoxy polysiloxanes, 0~50 part of oxetane compound, more 5~20 parts of acrylate based polysiloxanes, 10~60 parts of diluent, 1~6 part of radical initiator.The present invention solves the problems, such as the photosensitive liquid resin price costliness of high accuracy, high-fire resistance.
Description
Technical field
The present invention relates to technical field of chemistry and chemical engineering, especially a kind of photosensitive liquid resin.
Background technology
Photosensitive resin is also known as photosensitive resin（UV resins）, it is made up of polymer monomer and performed polymer, mainly includes in material
Oligomer, reactive diluent and light trigger.Cause at once under ultraviolet light (250-300 nanometers) irradiation of certain wavelength poly-
Reaction is closed, completes solidification.Photosensitive resin is generally liquid, is generally used for making the material of high intensity, high temperature resistant, waterproof etc..Together
Polymers is the main body of photosensitive resin, is a kind of base-material containing unsaturated functional group, and there is the active group that can polymerize its end
Group, once there is spike, it is possible to continue polymerization and grow up, one is aggregated, and molecular weight, which rises, to be exceedingly fast, and can turn into solid soon
Body.Light trigger is the specific groups for exciting photosensitive resin crosslinks reaction, when the photon effect by specific wavelength, can be become
Free group with high activity, the high molecular polymer of base-material is acted on, it is produced cross-linking reaction, by original wire
Polymer is changed into network polymers, so as to be rendered as solid-state.The performance of light trigger determine photosensitive resin curing degree and
Curing rate.
At present, photosensitive liquid resin is just being used for 3D printing emerging industry, blue or green by industry because of its outstanding characteristic
Look at and pay attention to.It is adapted to the photosensitive resin of 3D printings to require that the viscosity of glue system is low, good fluidity, solidification rate is fast, solidification
Shrinkage factor is low, and product is bent without sled, and excellent heat resistance etc. requires.At present, it is domestic fast for high accuracy, high-fire resistance stereolithography
The photosensitive resin product of fast moulding material is less and expensive.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of cheap, high accuracy, the photosensitive liquid of high-fire resistance
Resin.
In order to solve the above problems, the technical solution adopted in the present invention is：This photosensitive liquid resin, including it is following heavy
Measure the raw material of part：10~85 parts of epoxy resin, 10~85 parts of both-end acrylate based polysiloxane, polyepoxy polysiloxanes 0
~50 parts, 0~50 part of oxetane compound, more 5~20 parts of acrylate based polysiloxanes, 10~60 parts of diluent, from
By 1~6 part of base initiator；
The diluent is vinyl ethers compound, acrylate polysiloxane, one or more mixtures of acrylate；
The radical initiator is 1- hydroxy-cyclohexyl benzene MEK, dimethoxybenzoin, benzophenone, 4- to toluene sulfydryl
One or more kinds of mixtures of benzophenone, 4- benzoyls -4 '-dimethyl diphenyl sulfide.
In above-mentioned technical proposal, more specifically technical scheme can also be：The epoxy resin be phenol aldehyde type epoxy resin,
One or more kinds of mixtures in bisphenol-A type epoxy resin, cycloaliphatic epoxy resin or alicyclic epoxide compound.
Further：The oxetane compound is to contain two oxetane groups, three oxetanes
The organic matter of group or multiple oxetane groups.
Further：The vinyl ethers compound is triethylene glycol divinyl ether, 4- hydroxy butyl vinyl ethers, glycerine
Carbonic ester propenyl ether, dodecyl vinyl, Isosorbide-5-Nitrae-cyclohexane dimethanol divinyl ether, glycol divinyl base
One or more kinds of mixtures of ether, diethylene glycol divinyl ether.
By adopting the above-described technical solution, the present invention has the advantages that compared with prior art：
1st, the light sensitivity of photosensitive liquid resin of the invention is good, and its threshold exposure amount Ec is less than 15mJ/cm2；What is prepared is photosensitive
After liquid resin is by ultraviolet light solidified forming, its cubical contraction≤0.9%, warp factor CF (6) is in ± 0.01 scope
Interior, CF (11) is in the range of ± 0.03.Solidified forming precision is improved, manufacture precision is high.
2nd, the preparation cost price of photosensitive liquid resin of the invention is about 300 yuan of per kilogram, far below DSM Somos
The selling price of the photosensitive resin of company and Huntsman companies（About 1500 yuans of per kilogram）.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described：
Embodiment 1：This photosensitive liquid resin includes the raw material of following parts by weight：85 parts of phenol aldehyde type epoxy resin, both-end propylene
10 parts of acid esters based polysiloxane, more 5 parts of acrylate based polysiloxanes, 10 parts of acrylate polysiloxane, 1- hydroxy-cyclohexyls
1 part of benzene MEK.
After ultraviolet light solidified forming, its cubical contraction=0.9%, warp factor CF (6)=0.01, CF (11)=
0.03。
Embodiment 2：This photosensitive liquid resin includes the raw material of following parts by weight：85 parts of bisphenol-A type epoxy resin, it is double
85 parts of acrylate-based client polysiloxanes, 50 parts of polyepoxy polysiloxanes, more 20 parts of acrylate based polysiloxanes, acrylic acid
60 parts of ester, 6 parts of dimethoxybenzoin；
After ultraviolet light solidified forming, its cubical contraction ＜ 0.8%, warp factor CF (6) ＜ 0.01, CF (11) ＜
0.03。
Embodiment 3：This photosensitive liquid resin includes the raw material of following parts by weight：85 parts of cycloaliphatic epoxy resin, both-end
How acrylate-based 85 parts of acrylate based polysiloxane, 50 parts of polyepoxy polysiloxanes, 50 parts of oxetane compound be
20 parts of polysiloxanes, 30 parts of triethylene glycol divinyl ether, 30 parts of 4- hydroxy butyl vinyl ethers, 3 parts of benzophenone, 4- is to toluene mercapto
3 parts of base benzophenone.
After ultraviolet light solidified forming, its cubical contraction ＜ 0.8%, warp factor CF (6) ＜ 0.01, CF (11)
＜ 0.03.
Embodiment 4：This photosensitive liquid resin includes the raw material of following parts by weight：Epoxy resin is phenol aldehyde type epoxy resin
45 parts, 40 parts of cycloaliphatic epoxy resin, 85 parts of both-end acrylate based polysiloxane, 50 parts of polyepoxy polysiloxanes, oxa-
50 parts of cyclobutane compound, more 20 parts of acrylate based polysiloxanes, 30 parts of dodecyl vinyl, Isosorbide-5-Nitrae-cyclohexyl diformazan
30 parts of alcohol divinyl ether, 3 parts of benzophenone, 3 parts of 4- benzoyls -4 '-dimethyl diphenyl sulfide.
After ultraviolet light solidified forming, its cubical contraction ＜ 0.8%, warp factor CF (6) ＜ 0.01, CF (11)
＜ 0.03.
Embodiment 5：This photosensitive liquid resin includes the raw material of following parts by weight：20 parts of phenol aldehyde type epoxy resin, bis-phenol
25 parts of A types epoxy resin, 40 parts of cycloaliphatic epoxy resin, 85 parts of both-end acrylate based polysiloxane, the poly- silica of polyepoxy
50 parts of alkane, 50 parts of oxetane compound, more 20 parts of acrylate based polysiloxanes, 20 parts of dodecyl vinyl, three
20 parts of ethylene glycol divinyl ether 20, diethylene glycol divinyl ether, 2 parts of 1- hydroxy-cyclohexyl benzene MEK, styrax diformazan
2 parts of ether, 2 parts of benzophenone.
After ultraviolet light solidified forming, its cubical contraction ＜ 0.8%, warp factor CF (6) ＜ 0.01, CF (11)
＜ 0.03.
Claims (4)
1. a kind of photosensitive liquid resin, it is characterised in that include the raw material of following parts by weight：10~85 parts of epoxy resin, both-end third
10~85 parts of olefin(e) acid ester group polysiloxanes, 0~50 part of polyepoxy polysiloxanes, 0~50 part of oxetane compound are more
5~20 parts of acrylate based polysiloxane, 10~60 parts of diluent, 1~6 part of radical initiator；
The diluent is vinyl ethers compound, acrylate polysiloxane, one or more mixtures of acrylate；
The radical initiator is 1- hydroxy-cyclohexyl benzene MEK, dimethoxybenzoin, benzophenone, 4- to toluene sulfydryl
One or more kinds of mixtures of benzophenone, 4- benzoyls -4 '-dimethyl diphenyl sulfide.
2. photosensitive liquid resin according to claim 1, it is characterised in that：The epoxy resin is phenolic epoxy tree
One or more kinds of mixing in fat, bisphenol-A type epoxy resin, cycloaliphatic epoxy resin or alicyclic epoxide compound
Thing.
3. photosensitive liquid resin according to claim 2 is characterized in that：The oxetane compound is to contain two
The organic matter of individual oxetane groups, three oxetane groups or multiple oxetane groups.
4. photosensitive liquid resin according to claim 1 is characterized in that：The vinyl ethers compound is triethylene glycol
Divinyl ether, 4- hydroxy butyl vinyl ethers, glycerol carbonate propenyl ether, dodecyl vinyl, Isosorbide-5-Nitrae-cyclohexyl two
Methanol divinyl ether, triethyleneglycol divinylether, one or more kinds of mixtures of diethylene glycol divinyl ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731769.4A CN107357136A (en) | 2017-08-23 | 2017-08-23 | Photosensitive liquid resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710731769.4A CN107357136A (en) | 2017-08-23 | 2017-08-23 | Photosensitive liquid resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107357136A true CN107357136A (en) | 2017-11-17 |
Family
ID=60288039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710731769.4A Withdrawn CN107357136A (en) | 2017-08-23 | 2017-08-23 | Photosensitive liquid resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107357136A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114621388A (en) * | 2020-12-14 | 2022-06-14 | 常州强力电子新材料股份有限公司 | Resin polymer, photocuring composition and application thereof |
| TWI805762B (en) * | 2018-05-21 | 2023-06-21 | 日商信越化學工業股份有限公司 | Photosensitive resin composition, pattern forming method and method of manufacturing optical semiconductor element |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110237702A1 (en) * | 2008-10-02 | 2011-09-29 | Kaneka Corporation | Photocurable composition and cured product |
| CN102385250A (en) * | 2011-06-29 | 2012-03-21 | 南昌大学 | Ultraviolet laser solidification rapid-prototyping photosensitive resin and manufacture method thereof |
| CN102436145A (en) * | 2011-09-01 | 2012-05-02 | 南昌大学 | Stereo lithography rapid prototyping photosensitive resin and preparation method thereof |
| CN104765251A (en) * | 2014-11-06 | 2015-07-08 | 青岛科技大学 | High-toughness photosensitive resin for 3D printing and preparation method thereof. |
| CN105278239A (en) * | 2014-05-30 | 2016-01-27 | 青岛科技大学 | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof |
| CN105278249A (en) * | 2014-05-30 | 2016-01-27 | 青岛科技大学 | Stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition and preparation method and application thereof |
| CN107001826A (en) * | 2014-09-26 | 2017-08-01 | 株式会社Lg化学 | The ink composite of uV curable, the method using its frame pattern for manufacturing display base plate and the frame pattern thus manufactured |
-
2017
- 2017-08-23 CN CN201710731769.4A patent/CN107357136A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110237702A1 (en) * | 2008-10-02 | 2011-09-29 | Kaneka Corporation | Photocurable composition and cured product |
| CN102385250A (en) * | 2011-06-29 | 2012-03-21 | 南昌大学 | Ultraviolet laser solidification rapid-prototyping photosensitive resin and manufacture method thereof |
| CN102436145A (en) * | 2011-09-01 | 2012-05-02 | 南昌大学 | Stereo lithography rapid prototyping photosensitive resin and preparation method thereof |
| CN105278239A (en) * | 2014-05-30 | 2016-01-27 | 青岛科技大学 | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof |
| CN105278249A (en) * | 2014-05-30 | 2016-01-27 | 青岛科技大学 | Stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition and preparation method and application thereof |
| CN107001826A (en) * | 2014-09-26 | 2017-08-01 | 株式会社Lg化学 | The ink composite of uV curable, the method using its frame pattern for manufacturing display base plate and the frame pattern thus manufactured |
| CN104765251A (en) * | 2014-11-06 | 2015-07-08 | 青岛科技大学 | High-toughness photosensitive resin for 3D printing and preparation method thereof. |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI805762B (en) * | 2018-05-21 | 2023-06-21 | 日商信越化學工業股份有限公司 | Photosensitive resin composition, pattern forming method and method of manufacturing optical semiconductor element |
| CN114621388A (en) * | 2020-12-14 | 2022-06-14 | 常州强力电子新材料股份有限公司 | Resin polymer, photocuring composition and application thereof |
| CN114621388B (en) * | 2020-12-14 | 2023-12-08 | 常州强力电子新材料股份有限公司 | Resin polymer, photo-curing composition and application thereof |
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Application publication date: 20171117 |