CN107353841A - A kind of low cost production thereof of Mylar pieces - Google Patents
A kind of low cost production thereof of Mylar pieces Download PDFInfo
- Publication number
- CN107353841A CN107353841A CN201710691970.4A CN201710691970A CN107353841A CN 107353841 A CN107353841 A CN 107353841A CN 201710691970 A CN201710691970 A CN 201710691970A CN 107353841 A CN107353841 A CN 107353841A
- Authority
- CN
- China
- Prior art keywords
- mould release
- diaphragm
- release membrance
- faced adhesive
- double faced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Landscapes
- Adhesive Tapes (AREA)
Abstract
The present invention relates to Mylar piece fabricating technologies field, more particularly to a kind of low cost production thereof of Mylar pieces, including following process：The glue surface of the not layer upper surface of mould release membrance and diaphragm is compound between two parties；The edge of a knife of first cutting die is punched out to mould release membrance from the bottom up, and partly broken to diaphragm；By venting carry release liners high-temp glue and mould release membrance layer upper surface it is compound between two parties；Then 2 double faced adhesive tapes are bonded to high-temp glue；The edge of a knife of second cutting die is punched to diaphragm from the bottom up, partly breaks to double faced adhesive tape and carries at release liners；The edge of a knife of 3rd cutting die is punched to high-temp glue from top to bottom, partly broken to mould release membrance, hole is broken entirely, and automatic venting housing waste material simultaneously takes away hand and tears a position waste material；Burst is sheared.The Mylar piece preparation technologies of the present invention, its processing step is less, reduces the quantity for taking machine, saves manpower and auxiliary material, it is necessary to the size of main material double faced adhesive tape is less, substantially reduces the production cost of Mylar pieces.
Description
Technical field
The present invention relates to the low cost production work in Mylar piece fabricating technologies field, more particularly to a kind of Mylar pieces
Skill.
Background technology
As illustrated in fig. 1 and 2, the Mylar piece preparation technologies of prior art are as follows：First, it is compound：First mould release membrance is not release
Face is compound between two parties with diaphragm glue surface, and double faced adhesive tape glue surface and the first mould release membrance mould release membrance are compound；2nd, stamp：By the first cutting die knife
Mouth is punched to two-sided glue surface, and high knife partly breaks onto diaphragm, and bed plate partly breaks onto the first mould release membrance, outside the automatic venting of die-cutting machine
Frame waste material；3rd, it is compound：Venting double faced adhesive tape carries release liners, and high temperature glue surface and double faced adhesive tape is compound, and venting high-temp glue carries release
Film is compound with release liners；4th, stamp：The second cutting die edge of a knife is punched to release paper, partly broken onto the first mould release membrance；5th, arrange
It is useless：Waste material on venting ear position side；Six：Stamp：The 3rd cutting die edge of a knife is punched to release paper, partly broken onto diaphragm；
Seven：It is compound：Draw compound with the release liners on joint sealing glue venting high-temp glue surface and the second mould release membrance mould release membrance；8th, stamp：By cutting die
The edge of a knife is punched to release film surface, is partly broken onto high-temp glue；Nine：It is compound：Diaphragm glue surface and the second mould release membrance is compound；Tenth, arrange
It is useless：By the first mould release membrance upward, using waste discharge blade row go surface protection film, the first mould release membrance, high-temp glue waste material；11, cut
Piece：Slice computer machine automatic shearing is.As can be seen here：The Mylar piece preparation technologies of prior art, Mylar pieces are using vertical row
Version, the cutting die quantity that it needs is more, and processing step is more complicated, causes to take more machine, expends more manpower and auxiliary material, needs
Want the main material double faced adhesive tape of large-size, its production cost is higher.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art provide a kind of low cost production thereof of Mylar pieces.
To achieve the above object, the low cost production thereof of a kind of Mylar pieces of the invention, including following process：
It is process one, compound：The glue surface of the not layer upper surface of mould release membrance and diaphragm is compound between two parties；
Process two, stamp：The edge of a knife of first cutting die is punched out to mould release membrance from the bottom up, and partly broken to diaphragm；
It is process three, compound：By venting carry release liners high-temp glue and mould release membrance layer upper surface it is compound between two parties；Then it is double by 2
Face glue laminating is to high-temp glue；
Process four, stamp：The edge of a knife of second cutting die is punched to diaphragm from the bottom up, partly breaks and carries release liners to double faced adhesive tape
Place；
Process five, stamp：The edge of a knife of 3rd cutting die is punched to high-temp glue from top to bottom, partly broken to mould release membrance, hole is broken entirely, from
Move venting housing waste material and take away hand and tear a position waste material；
Process six, section：Burst is sheared.
Preferably, the double faced adhesive tape that the hand of process five tears a position is continuous, the cut-out of surface release liners.
Preferably, a width of 6MM of double faced adhesive tape is bonded in the process three.
Preferably, the high-temp glue and mould release membrance are prepared by banding machine respectively.
Preferably, the double faced adhesive tape and diaphragm are prepared by cutting machine respectively.
Beneficial effects of the present invention：A kind of low cost production thereof of Mylar pieces of the present invention, including following process：Will
The not layer upper surface of mould release membrance and the glue surface of diaphragm are compound between two parties；The edge of a knife of first cutting die is rushed to mould release membrance from the bottom up
Cut, and partly break to diaphragm；By venting carry release liners high-temp glue and mould release membrance layer upper surface it is compound between two parties；Then by 2
Bar double faced adhesive tape is bonded to high-temp glue；The edge of a knife of second cutting die is punched to diaphragm from the bottom up, partly breaks and is taken away certainly to double faced adhesive tape
At type paper；The edge of a knife of 3rd cutting die is punched to high-temp glue from top to bottom, partly broken to mould release membrance, hole is broken entirely, outside automatic venting
Frame waste material simultaneously takes away hand and tears a position waste material；Burst is sheared.The Mylar piece preparation technologies of the present invention, its processing step is less, subtracts
The quantity of machine is taken less, is saved manpower and auxiliary material, it is necessary to the size of main material double faced adhesive tape is less, is substantially reduced the life of Mylar pieces
Produce cost.
Brief description of the drawings
The cutting die that Fig. 1 is Mylar pieces preparation technology in the prior art arranges schematic diagram.
Fig. 2 is the typesetting figure of the Mylar pieces of Mylar pieces preparation technology in the prior art.
Fig. 3 is the arrangement schematic diagram of the first cutting die of the present invention, the second cutting die and the 3rd cutting die.
Fig. 4 is the typesetting figure of Mylar pieces of the present invention.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing.As shown in figure 3, the first cutting die of the present invention, the second knife
Mould and the 3rd cutting die are arranged in order from left to right.
As shown in Figure 3 to Figure 4, a kind of low cost production thereof of a kind of Mylar pieces of the invention, including following process：
It is process one, compound：The glue surface of the not layer upper surface of mould release membrance and diaphragm is compound between two parties.
Process two, stamp：The edge of a knife of first cutting die is punched out to mould release membrance from the bottom up, and partly broken to diaphragm
Place；Above-mentioned partly break be：First cutter die cutting breaks mould release membrance, but not tripping protection film.
It is process three, compound：By venting carry release liners high-temp glue and mould release membrance layer upper surface it is compound between two parties；Then by 2
Bar double faced adhesive tape is bonded to high-temp glue.
Process four, stamp：The edge of a knife of second cutting die is punched to diaphragm from the bottom up, partly breaking to double faced adhesive tape, it is release to carry
At paper；Above-mentioned partly break be：Second cutting die cuts off diaphragm, but does not cut off double faced adhesive tape and carry release liners.
Process five, stamp：The edge of a knife of 3rd cutting die is punched to high-temp glue from top to bottom, partly broken to mould release membrance, Kong Quan
Disconnected, automatic venting housing waste material simultaneously takes away hand and tears a position waste material；Above-mentioned partly break cuts off high-temp glue for the 3rd cutting die, but does not cut
Disconnected mould release membrance.
Process six, section：Burst is sheared.
The Mylar piece preparation technologies of the present invention, Mylar pieces use horizontal composite typesetting, and its processing step is less, reduce
The quantity of machine is taken, reduces cutting die quantity, saves manpower and auxiliary material, and needs the size of main material double faced adhesive tape less, significantly
Reduce the production cost of Mylar pieces.For example, the Mylar piece preparation technologies of prior art need take 8, machine, the people of number 4,
5 sections of auxiliary material, main material double faced adhesive tape size are 60*22.8MM；After improvement present invention only requires take 2, machine, number 1
People, 2 sections of auxiliary material, main material double faced adhesive tape size are 56*6MM, be can be seen that by above-mentioned data, Mylar piece preparation technologies of the invention
Substantially reduce production cost.
The double faced adhesive tape that the hand of process five of the present embodiment tears a position is continuous, the cut-out of surface release liners.
A width of 6MM of double faced adhesive tape is bonded in the process three of the present embodiment.
The high-temp glue and mould release membrance of the present embodiment are prepared by banding machine respectively.The broad-ruler of high-temp glue and mould release membrance
Very little is respectively 53mm, 60mm.
The double faced adhesive tape and diaphragm of the present embodiment are prepared by cutting machine respectively.The broad-ruler of double faced adhesive tape and diaphragm
Very little is respectively 6mm, 50mm.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, there will be changes, this specification content should not be construed as to the present invention in specific embodiments and applications
Limitation.
Claims (5)
- A kind of 1. low cost production thereof of Mylar pieces, it is characterised in that：Including following process：It is process one, compound：The glue surface of the not layer upper surface of mould release membrance and diaphragm is compound between two parties；Process two, stamp：The edge of a knife of first cutting die is punched out to mould release membrance from the bottom up, and partly broken to diaphragm；It is process three, compound：By venting carry release liners high-temp glue and mould release membrance layer upper surface it is compound between two parties；Then it is double by 2 Face glue laminating is to high-temp glue；Process four, stamp：The edge of a knife of second cutting die is punched to diaphragm from the bottom up, partly breaks and carries release liners to double faced adhesive tape Place；Process five, stamp：The edge of a knife of 3rd cutting die is punched to high-temp glue from top to bottom, partly broken to mould release membrance, hole is broken entirely, from Move venting housing waste material and take away hand and tear a position waste material；Process six, section：Burst is sheared.
- A kind of 2. low cost production thereof of Mylar pieces according to claim 1, it is characterised in that：The hand of process five It is continuous to tear the double faced adhesive tape at a position, the cut-out of surface release liners.
- A kind of 3. low cost production thereof of Mylar pieces according to claim 1, it is characterised in that：In the process three It is bonded a width of 6MM of double faced adhesive tape.
- A kind of 4. low cost production thereof of Mylar pieces according to claim 1, it is characterised in that：The high-temp glue and Mould release membrance is prepared by banding machine respectively.
- A kind of 5. low cost production thereof of Mylar pieces according to claim 1, it is characterised in that：The double faced adhesive tape and Diaphragm is prepared by cutting machine respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710691970.4A CN107353841A (en) | 2017-08-14 | 2017-08-14 | A kind of low cost production thereof of Mylar pieces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710691970.4A CN107353841A (en) | 2017-08-14 | 2017-08-14 | A kind of low cost production thereof of Mylar pieces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107353841A true CN107353841A (en) | 2017-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710691970.4A Pending CN107353841A (en) | 2017-08-14 | 2017-08-14 | A kind of low cost production thereof of Mylar pieces |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110105883A (en) * | 2019-05-17 | 2019-08-09 | 厦门市驰晟胶带有限公司 | A kind of preparation method for protecting film coiled material |
| CN110497471A (en) * | 2018-05-16 | 2019-11-26 | 南昌欧菲显示科技有限公司 | Touch-control motherboard method for die cutting, punching tool and punching cutter |
| CN110862779A (en) * | 2019-11-19 | 2020-03-06 | 深圳小辣椒科技有限责任公司 | Protection film, cutting die assembly, preparation method and terminal cover plate structure |
| CN112743631A (en) * | 2019-10-30 | 2021-05-04 | 昊佰电子科技（上海）有限公司 | Process for producing and processing double-sided adhesive tape product by using circular knife |
| CN112809807A (en) * | 2020-12-17 | 2021-05-18 | 郑州领胜科技有限公司 | One-time waste discharge punching forming method |
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| WO2008126718A1 (en) * | 2007-04-05 | 2008-10-23 | Hitachi Chemical Company, Ltd. | Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film |
| CN101898434B (en) * | 2009-05-27 | 2013-01-02 | 比亚迪股份有限公司 | Preparation method of die-cutting product |
| CN102876251A (en) * | 2012-10-26 | 2013-01-16 | 南京冠佳科技有限公司 | Preparation method of gum |
| WO2016010083A1 (en) * | 2014-07-18 | 2016-01-21 | 三菱瓦斯化学株式会社 | Layered body, substrate for semiconductor element mounting, and method for manufacturing said body and substrate |
| CN105881647A (en) * | 2015-01-26 | 2016-08-24 | 上海景奕电子科技有限公司 | Production method for foam die cutting part with inner handle |
| CN106590455A (en) * | 2015-10-15 | 2017-04-26 | 苏州倍瑞得电子科技有限公司 | Preparation technology of insulating Mylar |
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Patent Citations (6)
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| WO2008126718A1 (en) * | 2007-04-05 | 2008-10-23 | Hitachi Chemical Company, Ltd. | Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film |
| CN101898434B (en) * | 2009-05-27 | 2013-01-02 | 比亚迪股份有限公司 | Preparation method of die-cutting product |
| CN102876251A (en) * | 2012-10-26 | 2013-01-16 | 南京冠佳科技有限公司 | Preparation method of gum |
| WO2016010083A1 (en) * | 2014-07-18 | 2016-01-21 | 三菱瓦斯化学株式会社 | Layered body, substrate for semiconductor element mounting, and method for manufacturing said body and substrate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497471A (en) * | 2018-05-16 | 2019-11-26 | 南昌欧菲显示科技有限公司 | Touch-control motherboard method for die cutting, punching tool and punching cutter |
| CN110105883A (en) * | 2019-05-17 | 2019-08-09 | 厦门市驰晟胶带有限公司 | A kind of preparation method for protecting film coiled material |
| CN110105883B (en) * | 2019-05-17 | 2021-08-10 | 厦门市驰晟胶带有限公司 | Preparation method of protective film coiled material |
| CN112743631A (en) * | 2019-10-30 | 2021-05-04 | 昊佰电子科技（上海）有限公司 | Process for producing and processing double-sided adhesive tape product by using circular knife |
| CN112743631B (en) * | 2019-10-30 | 2022-09-16 | 昊佰电子科技（上海）有限公司 | Process for producing and processing double-sided adhesive tape product by using circular knife |
| CN110862779A (en) * | 2019-11-19 | 2020-03-06 | 深圳小辣椒科技有限责任公司 | Protection film, cutting die assembly, preparation method and terminal cover plate structure |
| CN112809807A (en) * | 2020-12-17 | 2021-05-18 | 郑州领胜科技有限公司 | One-time waste discharge punching forming method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171117 |