CN107343358A - The processing method and circuit board of a kind of circuit board - Google Patents
The processing method and circuit board of a kind of circuit board Download PDFInfo
- Publication number
- CN107343358A CN107343358A CN201611109340.3A CN201611109340A CN107343358A CN 107343358 A CN107343358 A CN 107343358A CN 201611109340 A CN201611109340 A CN 201611109340A CN 107343358 A CN107343358 A CN 107343358A
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- Prior art keywords
- film
- aperture
- fitted
- hole
- windowing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the present invention provides a kind of processing method of circuit board, and this method includes：The first film is fitted in the first surface of substrate using laminator；Pre-pressing processing is carried out to the first surface for being fitted with the first film；Using laser machine or control deep drilling machine to carrying out windowing processing on the first film, form first and open a window, be exposed described in first aperture in the first hole in the substrate at windowing；After windowing processing is carried out to the first film, high-temperature laminating processing is carried out to the first surface for being fitted with the first film, to form the circuit board.Using the program, chemicals or liquid resin can be avoided to flow into first hole to a certain extent, reduce the signal transmission performance in first hole.Herein, the circuit board prepared using the processing method is also disclosed.
Description
Technical field
The present invention relates to the processing method and circuit board of circuit board manufacturing area, more particularly to a kind of circuit board.
Background technology
Currently, in the process of circuit board, in order to improve the anti-corrosion capability in the hole being located in circuit board, generally adopt
With toward filling liquid resin in the hole, and the mode for solidifying the liquid resin is heated, prevent corrosive gas or wet dirt
Deng into the hole.But using this processing mode, can cause in the hole can not the pin of crimp connector or the hole again
Signal transmission capabilities decline, so as to cause the service behaviour of the circuit board after machining poor.
The content of the invention
The embodiment of the present invention provides a kind of processing method of circuit board, due in the process of circuit board, positioned at this
The aperture in the hole in circuit board is blocked by film, so as to avoid to a certain extent in circuit board fabrication process, chemical reagent
Or in the ostium such as liquid resin, reduce the service behaviour in hole.In addition, the embodiment of the present invention is additionally provided using above-mentioned processing
Method processes the circuit board to be formed.
In a first aspect, the embodiment of the present invention provides a kind of processing method of circuit board, this method includes：First, patch is utilized
The first film is fitted in the first surface of substrate by film machine；The edge of the first film protrudes from the side of the first surface
Edge, or, coincided with the edge of the first surface.Then, the first surface for being fitted with the first film is entered
The processing of row pre-pressing, the first surface is fixed on by the first film.Then, using laser machine or control deep drilling machine to institute
State and windowing processing is carried out on the first film, to form the first windowing in the first film, and make the first hole in the substrate
The first aperture described in be exposed at windowing；First aperture is located at the first surface side.Finally, to described first
After film carries out windowing processing, high-temperature laminating processing is carried out to the first surface for being fitted with the first film, to be formed
The circuit board.
Using above-mentioned processing method, due to before being opened a window to the first film, first aperture be all by
What the first film was covered, that is, the first film can stop chemical reagent or liquid resin etc. from described
One aperture is flowed into first hole.Thus, it is possible to ensure to a certain extent first hole workability can not because this
One hole is blocked or is corroded and reduces.
With reference in a first aspect, under the first possible embodiment, in the first film with the first surface phase
There is gum layer on one side surface of fitting.That is, the first film single-sided back-adhesive.The gum layer is used for described first
Film bonds on the first surface, and strengthens the bonding force between the first film and the first surface, avoids
During processing, the position of the first film changes.
With reference to the possible embodiment of the first of first aspect or first aspect, in second of possible embodiment
Under, the first film is fine and close solid-state organic film, and the fusion temperature of the first film is Celsius more than or equal to 150
Degree.The first film is fine and close solid-state organic film, for can preferably protect first aperture, namely preventing
Learn reagent or liquid resin etc. and flow into first hole.The fusion temperature of the first film is more than or equal to 150 degrees Celsius,
It is the first film in order to ensure during the first surface to being fitted with the first film carries out high-temperature laminating
It can continue to keep solid-state structure, it is impossible to melt because of high temperature.
With reference to second of possible reality of the first possible embodiment or first aspect of first aspect, first aspect
Mode is applied, under the third possible embodiment, the thickness of the first film is more than or equal to 10 microns and is less than or waits
In 100 microns.The first film positioned at the thickness section can preferably protect first aperture, avoid chemical reagent
Or liquid resin etc. flows into first hole.
, can at the 4th kind with reference to the first of first aspect or first aspect to the third any possible embodiment
It is right during the first surface to being fitted with the first film carries out pre-pressing processing under the embodiment of energy
The first surface for being fitted with the first film is heated, to strengthen between the first film and the first surface
Adhesion.
, can at the 5th kind with reference to the first of first aspect or first aspect to the 4th kind of any possible embodiment
Under the embodiment of energy, in the case where the pad in first aperture protrudes from the first surface, the pad pasting is being utilized
The first film is fitted in before the first surface by machine, it is also necessary in the first surface except first aperture and
Region overlay beyond the pad in first aperture has green oil layer, the thickness of the green oil layer and the pad in first aperture
Thickness it is identical.The purpose of this design be in order to ensure that the surface of substrate flushes, and then be advantageous to the substrate surface patch
Film is closed, with the hole in protective substrate.
, can at the 6th kind with reference to the first of first aspect or first aspect to the 5th kind of any possible embodiment
Under the embodiment of energy, in the case of being through hole in first hole, then also include：First, in the second surface of the substrate
The second film is bonded, the second surface is relative with the first surface.Then, to being fitted with described the of second film
Two surfaces carry out pre-pressing processing, and second film is fixed on into the second surface.Then, using the laser machine or
The control deep drilling machine carries out windowing processing on second film, to form the second windowing on second film, and makes
Second aperture in first hole is exposed at second windowing；Second aperture is located at the second surface side,
And second aperture is relative with the first described aperture.Finally, after windowing processing is carried out to second film, to fitting
The second surface for having second film carries out high-temperature laminating processing.
Using this processing method, chemical reagent or liquid resin can not only be prevented to flow into institute from first aperture
State the first hole, additionally it is possible to prevent chemical reagent or liquid resin from flowing into first hole from second aperture, namely ensure
The service behaviour in first hole.
With reference to the 6th kind of possible embodiment of first aspect, under the 7th kind of possible embodiment, described second
Film is fine and close solid-state organic film, and the fusion temperature of second film is more than or equal to 150 degrees Celsius.Described second
Film is fine and close solid-state organic film, for can preferably protect second aperture, namely prevents chemical reagent or stream
Dynamic property resin etc. flows into first hole.The fusion temperature of second film is more than or equal to 150 degrees Celsius, is to ensure
During the second surface to being fitted with second film carries out high-temperature laminating, second film can continue to protect
Hold solid-state structure, it is impossible to melt because of high temperature.
With reference to the 7th kind of possible embodiment of the 6th kind of possible embodiment or first aspect of first aspect,
Under 8th kind of possible embodiment, second film has gum on the interior side surface to be fitted with the second surface
Layer.That is, the second film single-sided back-adhesive.The gum layer is used to second film being bonded in the second surface
On, and strengthen the bonding force between second film and the second surface, avoid during processing, described second is thin
The position of film changes.
With reference to the 6th kind to the 8th kind any possible embodiment of first aspect, in the 9th kind of possible embodiment party
Under formula, the thickness of second film is more than or equal to 10 microns and less than or equal to 100 microns.Institute positioned at the thickness section
Second aperture can preferably be protected by stating the second film, avoid chemical reagent or liquid resin etc. from flowing into described first
Hole.
With reference to the 6th kind to the 9th kind any possible embodiment of first aspect, in the tenth kind of possible embodiment party
It is described to being fitted with during the second surface to being fitted with second film carries out pre-pressing processing under formula
The second surface of second film is heated, to strengthen the adhesion between second film and the second surface.
With reference to the 6th kind to the tenth kind any possible embodiment of first aspect, in a kind of the tenth possible implementation
Under mode, in the case where the pad in second aperture protrudes from the second surface, the laminator is being utilized by described in
Second is film adhered before the second surface, it is also necessary in the second surface in addition to the pad in second aperture
Region overlay have a green oil layer, the thickness of the green oil layer is identical with the thickness of the pad in second aperture.This design
Purpose is to ensure that the surface of substrate flushes, and then is advantageous to the surface attaching film in the substrate, with protective substrate
Hole.
Second aspect, the embodiment of the present invention also provide a kind of circuit board, and the circuit board uses first aspect or first aspect
In any possible embodiment be process.
The circuit board includes the first film, the second film and substrate, and the substrate includes first surface, second surface and the
One through hole, the first surface and the second surface are relative, and the first through hole is used for the pin of crimp connector；
The first through hole includes the first aperture and second aperture relative with first aperture, first aperture position
In the first surface side, second aperture is located at the second surface side；
The first film is fitted in the first surface, and the first film includes the first windowing, first aperture
It is exposed from the described first windowing；Described second is film adhered in the second surface, and second aperture is by described second
Film is blocked.
With reference to second aspect, under the first possible implementation, first aperture has pad, first table
Region overlay in face in addition to the pad in first aperture and first aperture has green oil layer, the thickness of the green oil layer
Degree is identical with the thickness of the pad in first aperture.
Using the circuit board that any possible embodiment is process in first aspect or first aspect, due to adding
During work, covered positioned at two apertures of first through hole by film, the film can stop chemical reagent or mobility tree
In the ostiums such as fat, so for the hole being located in the prior art in circuit board, in electricity provided in an embodiment of the present invention
In the plate of road, the service behaviour in hole is impacted smaller.
Brief description of the drawings
The technical scheme described in order to illustrate the embodiments of the present invention more clearly, required in being described below to embodiment
The accompanying drawing used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, right
For those of ordinary skill in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings
His accompanying drawing.
Figure 1A to 1E is structural representation of the circuit board provided in an embodiment of the present invention in each process segment.
Fig. 2 is the structural representation of the circuit board after provided in an embodiment of the present invention machine.
Fig. 3 and Fig. 4 is a kind of structural representation of circuit board provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
It is worth noting that, " first ", " the 3rd " and " the 3rd " described in present specification, are only used for distinguishing difference
Part, become apparent from the description of application documents, not the limitation of structure cheek.
As shown in Figure 1A to 1E, it is according to circuit board processing method provided in an embodiment of the present invention, is carried out to substrate 10
During processing, structural representation of the substrate 10 after each stage is processed.Figure 1A is the structural representation of substrate 10, should
Substrate 10 includes the first hole 15.The dimension for whether running through the thickness of slab of substrate 10 from first hole 15 is classified to first hole 15
When, first hole 15 can be through hole, or blind hole.The dimension of connector whether is crimped with out of this first hole 15 to this
When first hole 15 is classified, first hole 15 can be crimping hole, or crimpless hole.It should be noted that this
The aperture in one hole 15 is located in the range of 0.2 millimeter to 1 millimeter.
Figure 1B is the structural representation for the first surface 12 that the first film 20 is fitted in substrate 10 using laminator 30.Tool
Body, the first film 20 is cut into, or size slightly larger than first surface 12 big with the grade of first surface 12；Utilize laminator
30 are fitted in the first film 20 after cutting on the surface of first surface 12.It should be noted that after the fitting, the first film 20
Edge protrude from the edge of first surface 12, or, coincided with the edge of first surface 12.It should be appreciated that herein at least
Including three kinds of situations, the first, the edge of the first film 20 protrudes from the edge of first surface 12；Second, the first film
Edge of 20 edge with first surface 12 flushes；The third；The part edge of the first film 20 protrudes from first surface 12
Part edge, and another part edge of the first film 20 flushes with another part edge of first surface 12.
It should be noted that the first film 20 is fine and close solid-state organic film, and the fusion temperature of the first film
More than or equal to 150 degrees Celsius.The first film 20 is fine and close solid-state organic film, such as polyimides (PI), because can
Stop that chemical reagent or liquid resin etc. flow into the first hole 15, so the first hole 15 can preferably be protected.The first film 20
Fusion temperature be more than or equal to 150 degrees Celsius, be to ensure to carry out in the first surface 12 to being fitted with the first film 20
During high-temperature laminating, the first film 20 can continue to keep solid-state structure, it is impossible to be melted because of high temperature.
It is worth noting that, the thickness of the first film is more than or equal to 10 microns and less than or equal to 100 micron.
After the first film 20 is fitted in into first surface 12, method provided in an embodiment of the present invention also includes：To patch
The first surface that closing has the first film carries out pre-pressing processing, and the first film is fixed on into first table
Face.So-called herein " precompressed and processing " can be specifically as shown in Figure 1B, to be rolled over being fitted with the first film using wheel
20 first surface 12, to increase the adhesion between the first film 20 and first surface 12, avoid in subsequent handling, first
Film 20 is shifted over or come off relative to first surface 12.It is appreciated that the various except being rolled over being fitted with using wheel
Outside the first surface 12 of the first film 20, other method can also be used to carry out precompressed and processing, what is included herein utilizes wheel
The method that rumble is rolled is merely illustrative, should not be used as restriction provision.Further, referring to accompanying drawing 1C, Fig. 1 C show through
The structural representation for the substrate 10 for being fitted with the first film 20 crossed after precompressed and processing.
As another implementation of the present invention, laminator 30 also has heating function, then thin to being fitted with first
During the first surface 12 of film 20 carries out precompressed and processing, it can also aid in heating, so that the first film 20 can
It is more snugly fitted on first surface 12.It should be noted that during precompressed and processing is carried out, adding for heating is aided in
Hot temperature is about in 120 degrees centigrades.
As another implementation of the present invention, on the interior side surface to be fitted with first surface 12 of the first film 20
With gum layer 22.The effect of the gum layer is that the first film 20 is more closely fixed on first surface 12, avoids holding
In row subsequent handling, the first film 20 is shifted over or come off from first surface 12.It should be noted that can basis
The top layer copper of substrate 10 is thick, adjusts the thickness of gum layer 22, fully to be bonded between first surface 12 in the first film 20.
Generally, the thickness of the gum layer 22 is located in the range of 10 microns to 100 microns.
It is provided in an embodiment of the present invention after the first surface 12 to being fitted with the first film 20 carries out precompressed and processing
Method also includes：Using laser machine or control deep drilling machine to carrying out windowing processing on the first film.Referring to shown in accompanying drawing 1D, profit
Windowing processing is carried out to the first film 20 with laser machine 40, windowed regions 16 are located at first aperture in the first hole 15.Then join
After the completion of seeing that accompanying drawing 1E, Fig. 1 E show windowing processing, the structural representation of the substrate 10 of the first film 20 is fitted with.Windowing 17
At first aperture 16 in the first hole 15, the first aperture 16 is exposed at windowing 17, wherein, first aperture 16 is located at
The side of the first film 20.It is appreciated that the various in the case of being surrounded with pad in the first aperture 16, as referring to figure 1E, the pad
Need to be exposed at windowing 17.
It is appreciated that the various the mark 40 shown in Fig. 1 D can also be control deep drilling machine.
It should be noted that mark 40 indicate be laser machine in the case of, then opened using the laser machine 40
Before window processing, it is necessary to according to the thickness and material of the first film 20, the beam energy of the laser machine 40 is set, so that the light
Beam energy can cut through the first film 20, but will not injure first surface 12 again.Laser machine 40 is being utilized to the first film
In the case that 20 carry out windowing processing, the depth tolerances of the laser machine 40 cutting can be controlled within 30 microns.In mark 40
Sign be control deep drilling machine in the case of, then using controlling before deep drilling machine 40 carries out windowing processing to the first film 20, it is necessary to
According to the depth bored under the Serve Motor Control of the control deep drilling machine 40, the depth tolerances cut using control deep drilling machine 40 are located at
In the range of 50 microns to 100 microns.
After windowing processing is carried out, method provided in an embodiment of the present invention also includes：To being fitted with the first film 20
First surface 12 carries out high-temperature laminating processing, to form circuit board.It should be noted that carry out the temperature needed for high-temperature laminating processing
Degree is higher than temperature required when carrying out precompressed and processing processing, carries out the temperature needed for high-temperature laminating processing and is located approximately at as 150
Degree Celsius between 180 degrees Celsius.In the case of the single-sided back-adhesive of the first film 20, high-temperature laminating processing is carried out
When, it is necessary to according to the rational pressing-in temp of featured configuration and pressure of gum, for ensureing the first film 20 being bonded securely
On first surface 12, long-term use of in time, the first film 20 and first surface 12 will not also separate.
As yet another embodiment of the present invention, referring to accompanying drawing 1E, the pad in the first aperture 16 protrudes from first surface 12.
Then before the first film 20 is fitted in into the first surface 12 of substrate 10 using laminator 30, it is also necessary in first surface 12
One layer of green oil is brushed in region in addition to the pad in the first aperture 16 and first aperture 16, to form green oil layer.The green oil layer
Thickness and the thickness of pad in first aperture 16 be identical.It is appreciated that the various the pad in first aperture 16
Variable thickness be uniform, namely different zones of the pad in first aperture 16 surely, may have different thickness values,
But in general, the thickness of the pad in first aperture 16 is substantially uniform, so the thickness of so-called green oil layer herein
Degree is identical with the thickness of the pad in the first aperture 16, is not intended to identical in absolute sense, but says roughly the same.
Using circuit board processing method provided in an embodiment of the present invention, in the part process of substrate 10, this first
The aperture in hole 15 is covered by the first film 20, and the first film 20, which plays, prevents chemical reagent or liquid resin from flowing into first
The effect in hole 15.So being based on processing method provided in an embodiment of the present invention, first hole 15 can be avoided to a certain extent
It is blocked or is corroded, and then ensure that first hole 15 being capable of normal work.
As the another embodiment of the present invention, referring to accompanying drawing 2, in the case where through hole is in the first hole 15, it is also necessary to
The second film 40 is bonded in the second surface 14 of substrate 10, and windowing 19 is set on the second film 40, the second of the first hole 15
Aperture 18 is exposed at windowing 19.Wherein, second surface 14 and first surface 12 are two relative surfaces of substrate 10.
Second aperture 18 and the first aperture 16 are two relative ports in the first hole 15, and the second aperture 18 is located at second surface.Need
It is noted that by the second film 40 be fitted in second surface 14 method may refer to aforementioned circuit plate processing method (namely
The first film 20 is fitted in the method for first surface 12), here is omitted.
It is worth noting that, the second film 40 is fine and close solid-state organic film, and the fusion temperature of the second film 40 is big
In or equal to 150 degrees Celsius.
It should be noted that the thickness of the second film 40 is more than or equal to 10 microns and less than or equal to 100 micron.
It is appreciated that the various previously with regard to the processing method for the first surface 12 that the first film 20 is fitted to substrate 10,
The processing method for the second surface 14 that the second film 40 is fitted to substrate 10 being also applied for described in the present embodiment.Therefore this reality
Apply example and be not described in detail the second surface 14 how the second film 40 is fitted to substrate 10, be referring specifically to previous embodiment
Can.
Referring to accompanying drawing 3, Fig. 3 shows a kind of circuit board provided in an embodiment of the present invention.Circuit board include the first film 200,
Second film 400 and substrate 100, substrate 100 include first surface 101, second surface 102 and first through hole 105, first surface
101 and second surface 102 be it is relative, first through hole 105 be used for crimp connector pin.First through hole 105 includes first
The aperture 104 of aperture 103 and second, the first aperture 103 are located at the side of first surface 101, and the second aperture 104 is located at second surface 102
Side.The first film 200 is fitted on first surface 101, and the first film 200 is provided with windowing 201, and the first aperture 103 is from windowing
201 are exposed.Second film 400 is fitted on second surface 102, and the second aperture 104 is blocked by the second film 400.
It is worth noting that, also there is gum layer, the gum layer towards the surface of first surface 101 in the first film 200
It is to strengthen the adhesion between the first film 200 and first surface 101.
As an alternative embodiment of the invention, referring to accompanying drawing 4, the first aperture 103 also has pad 106, then the first table
Region overlay in face 101 in addition to the first aperture 103 and pad 106 has green oil layer, and the thickness of the green oil layer and pad 106
Thickness it is identical.
It should be noted that circuit board 100 provided in an embodiment of the present invention also includes the second through hole, the two of second through hole
Individual port is the 3rd aperture and the 4th aperture respectively.Be further opened with three-way window on the first film 200, the 3rd aperture from this
It is exposed at three-way window.The 4th windowing is further opened with second film 400, the 4th aperture exposes at the 4th windowing
Come.
Further, the 3rd aperture can also have pad, then the pad in the 3rd aperture is also at the three-way window
It is exposed.4th aperture can also have pad, and the pad in the 4th aperture is also exposed at the 4th windowing.
It is appreciated that the various circuit board 100 provided in an embodiment of the present invention also includes the 3rd blind hole.On the first film 200
The 5th windowing is further opened with, the aperture of the 3rd blind hole is exposed at the 5th windowing.Naturally, the aperture of the 3rd blind hole
There can also be pad, the pad in the aperture of the 3rd blind hole can also be exposed at the 5th windowing.
Above disclosure is only preferred embodiment of present invention, can not limit the right model of the present invention with this certainly
Enclose, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and will according to right of the present invention
Made equivalent variations are sought, still falls within and invents covered scope.
Claims (10)
- A kind of 1. processing method of circuit board, it is characterised in that including：The first film is fitted in the first surface of substrate using laminator, wherein, the edge of the first film protrudes from institute The edge of first surface is stated, or, coincided with the edge of the first surface；Pre-pressing processing is carried out to the first surface for being fitted with the first film, the first film is fixed on institute State first surface；Using laser machine or control deep drilling machine to carrying out windowing processing on the first film, to form the in the first film One windowing, and make at windowing to be exposed described in first aperture in the first hole in the substrate, first aperture is located at institute State first surface side；After windowing processing is carried out to the first film, high temperature is carried out to the first surface for being fitted with the first film Pressing is handled, to form the circuit board.
- 2. according to the method for claim 1, it is characterised in that fitted in the first film with the first surface There is gum layer on one side surface.
- 3. method according to claim 1 or 2, it is characterised in that the first film is fine and close solid-state organic film, And the fusion temperature of the first film is more than or equal to 150 degrees Celsius.
- 4. according to the method described in any one of claims 1 to 3, it is characterised in that the thickness of the first film is more than or waited In 10 microns and less than or equal to 100 microns.
- 5. according to the method described in any one of Claims 1-4, it is characterised in that in the institute to being fitted with the first film During stating first surface progress pre-pressing processing, the first surface for being fitted with the first film is heated, To strengthen the adhesion between the first film and the first surface.
- 6. according to the method described in any one of claim 1 to 5, it is characterised in that the pad in first aperture protrudes from In the case of the first surface, before the first film is fitted in into the first surface using the laminator, institute Stating method also includes：Region overlay in the first surface in addition to the pad in first aperture and first aperture has green oil layer, The thickness of the green oil layer is identical with the thickness of the pad in first aperture.
- 7. according to the method described in any one of claim 1 to 6, it is characterised in that in the case of being through hole in first hole, Methods described also includes：The second film is bonded in the second surface of the substrate, the second surface is relative with the first surface；Pre-pressing processing is carried out to the second surface for being fitted with second film, second film is fixed on institute State second surface；Windowing processing is carried out on second film using the laser machine or the control deep drilling machine, with second film It is upper to form the second windowing, and second aperture in first hole is exposed at second windowing, second aperture Positioned at the second surface side, and second aperture is relative with first aperture；After windowing processing is carried out to second film, high temperature is carried out to the second surface for being fitted with second film Pressing is handled.
- 8. according to the method for claim 7, it is characterised in that second film is fine and close solid-state organic film, and The fusion temperature of second film is more than or equal to 150 degrees Celsius.
- A kind of 9. circuit board, it is characterised in that including the first film, the second film and substrate, the substrate include first surface, Second surface and first through hole, the first surface and the second surface are relative, and the first through hole is used for the company of crimping Connect the pin of device；The first through hole includes the first aperture and second aperture relative with first aperture, and first aperture is located at institute First surface side is stated, second aperture is located at the second surface side；The first film is fitted in the first surface, and the first film includes the first windowing, and first aperture is from institute The first windowing is stated to be exposed；Described second is film adhered in the second surface, and second aperture is by second film Blocked.
- 10. circuit board according to claim 9, it is characterised in that first aperture has pad, the first surface In region overlay in addition to the pad in first aperture and first aperture have green oil layer, the thickness of the green oil layer It is identical with the thickness of the pad in first aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611109340.3A CN107343358B (en) | 2016-12-06 | 2016-12-06 | A kind of processing method and circuit board of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611109340.3A CN107343358B (en) | 2016-12-06 | 2016-12-06 | A kind of processing method and circuit board of circuit board |
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| CN107343358A true CN107343358A (en) | 2017-11-10 |
| CN107343358B CN107343358B (en) | 2019-10-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113740236A (en) * | 2020-05-30 | 2021-12-03 | 华为技术有限公司 | Corrosion detection method and circuit |
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| CN103108502A (en) * | 2011-11-14 | 2013-05-15 | 无锡江南计算技术研究所 | Method for laminating cover film in soft board |
| CN104767096A (en) * | 2015-03-27 | 2015-07-08 | 华为技术有限公司 | Preparation method for back plate |
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| CN105430884A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board, terminal and preparation method of flexible circuit board |
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| CN101313637A (en) * | 2005-12-12 | 2008-11-26 | 松下电器产业株式会社 | Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material |
| CN103108502A (en) * | 2011-11-14 | 2013-05-15 | 无锡江南计算技术研究所 | Method for laminating cover film in soft board |
| CN104767096A (en) * | 2015-03-27 | 2015-07-08 | 华为技术有限公司 | Preparation method for back plate |
| CN105142337A (en) * | 2015-09-10 | 2015-12-09 | 深圳华麟电路技术有限公司 | Inner layer bonding pad later-windowed rigid-flexible printed circuit board and manufacturing method thereof |
| CN105430884A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board, terminal and preparation method of flexible circuit board |
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| CN113740236A (en) * | 2020-05-30 | 2021-12-03 | 华为技术有限公司 | Corrosion detection method and circuit |
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