CN107343122A - 3D imaging devices - Google Patents
3D imaging devices Download PDFInfo
- Publication number
- CN107343122A CN107343122A CN201710653064.5A CN201710653064A CN107343122A CN 107343122 A CN107343122 A CN 107343122A CN 201710653064 A CN201710653064 A CN 201710653064A CN 107343122 A CN107343122 A CN 107343122A
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- optics module
- module
- support
- substructure
- superstructure
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
- H04N13/204—Image signal generators using stereoscopic image cameras
- H04N13/243—Image signal generators using stereoscopic image cameras using three or more 2D image sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention provides a kind of 3D imaging devices, including：At least one optics module, for receiving or launching light beam；The optics module includes superstructure and substructure, and the superstructure sectional area is less than the sectional area of the substructure；Support, containing through hole corresponding with the optics module, for making the superstructure of the optics module pass through the through hole；The area of the through hole is less than the sectional area of the substructure；Substrate, the bottom of the optics module is connected to, for supporting the optics module.The 3D imaging devices of the present invention use the support and substrate compared with small area to realize the fixation to optics module, so as to reduce the volume of 3D imaging devices, are mainly used in electronic equipment.
Description
Technical field
The present invention relates to optics and electronic technology field, more particularly to a kind of 3D imaging devices.
Background technology
Depth camera can obtain the depth information of target, 3D scannings, scene modeling, gesture interaction be realized whereby, with mesh
Before the RGB camera that is widely used compare, depth camera is just progressively paid attention to by all trades and professions.Such as using depth camera with
The combinations such as TV, computer can realize somatic sensation television game to reach the two-in-one effect of game and body-building, during the KINECT of Microsoft, Austria compare
The ASTRA of light is representative therein.In addition, the tango projects of Google are directed to bringing depth camera into mobile device, it is such as flat
Plate, mobile phone, the usage experience overturned completely is brought with this, for example very real AR game experiencings can be realized, can used
It carries out the functions such as indoor map establishment, navigation.
Intelligent electronic device such as mobile phone, flat board etc. have increasingly urgent demand to the built-in 3D depth cameras being imaged, with
Depth camera at present just quickly towards the direction that volume is less and less, power consumption is increasingly lower developing, built in depth camera conduct
Component is embedded in other electronic equipments and is increasingly becoming possibility.However, because electronic equipment chases after to outward appearance, the continuous of volume
Ask, design, installation to its built-in component etc. also brings huge challenge, and not requiring nothing more than component has small body
Long-pending, relatively low power consumption and high heat dispersion, while also require to be laid out between each component rationally optimal to realize enough.
The content of the invention
The technical problems to be solved by the invention are：The bulky technical problem of 3D imaging devices, to solve above-mentioned technology
Problem, propose a kind of 3D imaging devices.
The technical problem of the present invention is solved by following technical scheme：The solution of the present invention is imaged including 3D
Device and a kind of electronic equipment.
Wherein, the 3D imaging devices include：At least one optics module, for receiving or launching light beam；The optics
Module includes superstructure and substructure, and the superstructure sectional area is less than the sectional area of the substructure；Support,
Containing through hole corresponding with the optics module, for making the superstructure of the optics module pass through the through hole；It is described logical
The area in hole is less than the sectional area of the substructure；Substrate, the optics module bottom is connected to, for supporting the optics
Module.In one embodiment, the optics module includes projection module and imaging modules, and the projection module is used for emitter junction
Structure pattern beam, the imaging modules are used to receive the structured pattern light beam.In another embodiment, the optical mode
Group can also include RGB camera module, for gathering coloured image.In other embodiments, the superstructure includes top
Microscope base；The substructure includes bottom microscope base.In another embodiment, the superstructure can also include microscope base, described
Substructure includes circuit board.In certain embodiments, the optics module also includes location structure, the location structure and institute
Support connection is stated, for fixing the optics module.The location structure preferably includes projection, is provided with accordingly on the support
Groove, the described raised and groove match.
In addition, the substrate in the technical program can also include mounting hole, for installing described device, in some realities
Apply in example, mounting hole can also be located on support.The support can include alloy material, wherein the thickness of the support is
0.5mm~5mm.The substrate includes metal and/or ceramics, wherein the thickness of the substrate is 0.1mm~2mm.
Generally speaking, above-mentioned 3D imaging devices, including optics module, for receiving or launching the module of light beam；Clamp mould
Block, for fixing optics module, the width of the self-clamping module is no more than the width of the optics module, described so as to reduce
The volume of 3D imaging devices.
The invention also provides a kind of manufacture method for 3D imaging devices, including：There is provided at least one for receiving
Or the optics module of transmitting light beam；The optics module includes superstructure and substructure, the superstructure sectional area
Less than the sectional area of the substructure；Support is provided, the support contains through hole corresponding with the optics module, the light
The superstructure of module is learned through the through hole on the support, the area of the through hole is less than the sectional area of the substructure；
Substrate is provided, the substrate is connected with the substructure of the optics module, supports the optics module.Wherein, the optics
Module includes projection module and imaging modules, and the projection module is used for emitting structural pattern beam；The imaging modules
For receiving the structured pattern light beam, the optics module also includes RGB camera module, for gathering coloured image.
In addition, the present invention also proposes a kind of electronic equipment, including：Any of the above-described described 3D imaging devices, installed in institute
State in the first plane of electronic equipment, for obtaining depth image and/or coloured image；Display, set installed in the electronics
In the second standby plane, for display image.Wherein, first plane and second plane are same plane or described the
One plane and second plane are opposed plane.
The beneficial effect that the present invention is compared with the prior art includes：The present invention optics module include superstructure and under
Portion's structure, the sectional area of the superstructure are less than the sectional area of the substructure, and the superstructure is led to through support
Hole, the sectional area of substructure are more than the sectional area of the through hole again, and substructure cannot pass through through hole, substrate and the optics
The bottom connection of module, supporting role is served to optics module, optics module is fixed between support and substrate, optical mode
The sectional area of the superstructure of group is less than the sectional area of its underpart structure, when fixing, need to only consider the lower junction of optics module
The sectional area of structure, the fixation to optics module can be realized with the support compared with small area and substrate, so as to reduce 3D imaging devices
Volume.
Brief description of the drawings
Fig. 1 is the 3D imaging device schematic perspective views of one embodiment of the invention.
Fig. 2 is the 3D imaging device front schematic views of one embodiment of the invention.
Fig. 3 is the 3D imaging device side schematic views of one embodiment of the invention.
Fig. 4 is the optics module side schematic view of one embodiment of the invention.
Fig. 5 is the optics module front schematic view of one embodiment of the invention.
Fig. 6 is the mobile terminal structure schematic diagram of one embodiment of the invention.
Embodiment
Below against accompanying drawing and with reference to preferred embodiment, the invention will be further described.
In order that technical problem to be solved of the embodiment of the present invention, technical scheme and beneficial effect are more clearly understood,
Below in conjunction with drawings and Examples, the present invention will be described in further detail.It should be appreciated that specific implementation described herein
Example is not intended to limit the present invention only to explain the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.In addition, connection can be used to fix
Effect can also be used to circuit communication act on.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the embodiment of the present invention and simplify description, rather than the device or element of instruction or hint meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the embodiment of the present invention, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
The present invention is directed to the depth camera for being used for 3D imagings or the electronic equipment that embedded in depth camera module, it is proposed that
A kind of organization plan of Stability Analysis of Structures, small volume and high radiating.Organization plan proposed by the invention has been applicable all types of
Depth camera or electronic equipment, it will be set with the electronics of the depth camera based on structured light technique and its correlation in discussion below
It is standby to be illustrated inventive concept.
Shown in Fig. 1 is the schematic perspective view of 3D imaging devices according to an embodiment of the invention.3D imaging devices 1 are
Depth camera includes the projection module 13 for being used for 3D imagings and corresponding imaging modules 11, wherein projection module 13 is used for space
Middle projective structure light pattern, imaging modules 11 are then used to gather by the structured light patterns after target modulation, pass through the knot to modulation
Structure light pattern carries out analysis and calculates the depth image for obtaining target, and analysis here is calculated typically by special in depth camera
Device (not shown) is managed to complete.Usually, project module 13 to be used to project black light pattern, such as infrared light, accordingly
, imaging modules 11 should also be infrared camera, and in certain embodiments, structured light patterns can also be other any wavelength
Light, such as ultraviolet, visible ray etc..
There are certain spacing, referred to herein as baseline between imaging modules 11 and projection module 13.For structure optical depth phase
For machine, the measurement range and precision of the length meeting influence depth camera of baseline, usually, baseline is longer, and measurement range is bigger；
In addition, for same measurement distance, baseline is longer, and measurement accuracy is then higher.But when base length, it is desirable to the chi of depth camera
It is very little also bigger, cause to be difficult to be embedded into some miniature electronic equipments, therefore the selection of baseline should be to depth camera chi
Very little, measurement range, precision etc. are many to be considered.For consumer level depth camera, the distance of baseline is suitable
It is between the 1cm~10cm of section.
In order to allow depth camera 1 to possess more functions, usually, color camera mould is also configured with depth camera 1
Group, such as RGB camera module 12, illustrated by taking RGB camera module as an example in explanation later.It is configured with RGB camera
The depth camera 1 of module 12 then has the synchronous ability for obtaining target depth image and RGB image.Due to imaging modules 11
A certain distance between RGB camera module 12 be present, therefore certainly existed between the depth image and RGB image obtained respectively
Certain parallax.In some applications, it may be desirable to what is utilized is the depth image and RGB image of no parallax, i.e. RGBD images.For
This, generally requires to demarcate imaging modules 11 and RGB camera module 12 to obtain relative position relation therebetween, root
Parallax can be then eliminated according to calibration result, this process is often also referred to as registering.Imaging modules 11 and RGB camera module 12 it
Between distance it is smaller, parallax also just it is smaller, registering difficulty can reduce, therefore, often RGB camera module 12 can it is relatively close into
As module 11 some, as shown in Figure 1.
In other embodiments, other modules in addition to RGB camera module can also be configured, such as in projection module 13
Another side is equally also provided with one and the identical module of imaging modules 11, i.e. three is on same baseline, but two imaging modules
It is located at the different both sides of projection module respectively, thus constitutes the 3D imaging devices of active binocular structure light principle.At one
In embodiment, the parallax range between two imaging modules 11 and projection module 13 is different, it is possible thereby to meet different measurement models
That encloses applies needs, for example when far measuring distance, can be entered using the longer imaging modules 11 of baseline with projection module 13
Row measurement；Or two imaging modules 11 are opened simultaneously, but depth survey is carried out respectively, by finally give two depth images
Merged to obtain the bigger depth image of measurement range, resolution ratio.It is understood that when measurement distance difference, into
As the focal length of the lens in module 11 also differs.
Projection module 13, imaging modules 11 and RGB camera module are referred to as optics module in follow-up explanation, can
With understanding, optics module can also include it is more, such as emitting mould train in the depth camera based on TOF technologies with
Receiving module.
When depth camera is embedded into other electronic equipments, it is necessary to ensure the stability of depth camera all parts,
Also to ensure the high-cooling property of each optics module in addition.In the depth camera shown in Fig. 1, each optics module is fixed on
Through hole is provided with support 14, among support to pass through by optics module upper end to ensure that each optics module is relative in the horizontal direction
Position is fixed, and each optics module is also supported with substrate 15 in the bottom of each optics module in addition, to ensure each optics
Module in vertical direction fixed by relative position, and the structural stability to each optics module is realized by this mode.It is described
The fixation to optics module is completed in the cooperation of support 14 and substrate 15, equivalent to self-clamping module, in other examples, clamping
Module can also be other forms, such as can be two plates that wherein side is flexibly connected, and so only need loading light
After learning module, the opposite side of fixed plate be the fixation that can be achieved to optics module or the box body that can be used cooperatively and
Lid, optics module are fixed in box body.
Accordingly, the manufacture method of 3D imaging devices, can include：There is provided at least one for receiving or launching light beam
Optics module；The optics module includes superstructure and substructure, and the superstructure sectional area is less than the bottom
The sectional area of structure；Support is provided, the support contains through hole corresponding with the optics module, the top of the optics module
For structure through the through hole on the support, the area of the through hole is less than the sectional area of the substructure；Substrate is provided, it is described
Substrate is connected with the substructure of the optics module, supports the optics module；Wherein, the optics module includes projective module
Group and imaging modules, the projection module are used for emitting structural pattern beam；The imaging modules are used to receive the knot
Structure pattern beam, the optics module also includes RGB camera module, for gathering coloured image.
Support 14 is typically made up of rigidity preferably material, such as steel, aluminium alloy, kirsite etc., thickness be about 0.5mm~
5mm, support 14 can also be mainboard in electronic equipment or other are used for the support of immobilising device.Substrate 15 can also be by alloy
Material is made, it is preferable that substrate 15 is made up of copper or ceramic material, and can not only provide rigidity support can also provide preferable dissipate
Hot property, thickness are about 0.1mm~2mm.Connected between support 14 and substrate 15 to ensure resistance to overturning.
Fig. 2 is 3D imaging devices front schematic view according to an embodiment of the invention.From figure 2 it can be seen that
Align member 21 is additionally provided with optics module 11 and 12, the component can be by the structure composition of projection, the phase in support 14
The opening position answered sets fluted, groove and male cooperation, thus can be prevented with preferably being positioned to optics module
There are the alignment errors such as rotation, dislocation in horizontal direction, also prevent the problem of loosening in use.
In one embodiment, the part that optics module enters in the through hole of support 14 is manufactured into square configuration, i.e. optics
The superstructure of module is set as square structure, as shown in the projection module 13 in the present embodiment, the respective through hole of support 14
Square configuration is configured to, the square through hole of support preferably allows the square superstructure to be just passed through.This structure
It is advantageous in that without additionally setting location structure.In other embodiments, optics module can be configured to other it is any can be with
The shape uniquely positioned.The through hole of certain support is different from the shape of superstructure, and it is also possible to play positioning action, example
Such as being used cooperatively for circular upper structure and square through hole, it is to be understood that the optics module of this structure itself is exactly one
Kind location structure.
In the present embodiment, mounting hole 22 is additionally provided with substrate 15, for by whole 3D imaging devices (depth phase
Machine) it is fixed in electronic equipment.Except in the form of mounting hole, the form of other any fixations can be applied to the structure
In, such as mode for dispensing glue.Mounting hole 22 can also be set on the support 14.
Fig. 3 is the side schematic view of 3D imaging devices according to an embodiment of the invention, it can be seen that each
Optics module is fixed on support 14 with that in substrate 15, can be directly connected to that other can also be passed through between support 14 and substrate 15
Structure is indirectly connected with to ensure integrally-built stability.Optics module bottom is supported by substrate 15, and top passes through support 14
Through hole is to ensure the stability in horizontal direction, to ensure that optics module will not be moved in vertical direction, optical mode
The structure of group also needs to further design, and refers to Fig. 4 and Fig. 5 explanation.
Shown in Fig. 4 is the side schematic view of optics module according to an embodiment of the invention.Optics module 4 includes bottom
Portion's circuit board 41, lower microscope base 42, upper microscope base 44 and location structure 43, wherein circuit board 41 include printed circuit board (PCB), soft
Property circuit board (FPC), Rigid Flex one or more combinations.Microscope base is used for fixing optical element, such as lens group, diffraction
Optical element etc..Microscope base is configured to the form of upper and lower microscope base, and 14 opened holes of sectional area and support of upper microscope base are corresponding with true
Microscope base can pass through through hole on guarantor, and the sectional area of lower microscope base is greater than through hole, and lower microscope base can not enter the through hole, such
Being advantageous in that can ensure that optics module is fixed between support 14 and substrate 15, therefore ensure that the vertical stabilization of optics module
Property.
Another advantage of optics module structure is due to that the area of upper microscope base is reduced, and the width of support 14 and substrate 15 can
To be configured to be no more than or be approximately equal to the width of microscope base under optics module, as shown in figure 1, thus ensure that entirety
Structure it is smooth, also reduce integrally-built area, would be more advantageous in being embedded in small electronic equipment, as mobile phone,
Flat board etc..
It is understood that the microscope base of optics module can also be arranged to shape unanimous between the higher and lower levels, but the circuit of bottom
Plate suqare is greater than microscope base sectional area, and microscope base can be by the through hole of support, and circuit board cannot pass through through hole, thus can also be real
Now it is fixed between support 14 and substrate 15 to ensure vertical stability.Therefore, the different knot of any top and the bottom sectional area
Structure can be applied in embodiments of the invention.
The end of circuit board 41 is typically provided with connector 411, as shown in figure 5, connector can be any type of company
Device, such as plate are connect to (BTB) connector, zero insertion force (ZIF) connector etc..
In embodiment above illustrated with the structure of depth camera, in fact, depth camera will turn into more
Come more electronic equipments, such as the component of mobile phone, computer, flat board, TV etc., actually depth camera is also a kind of in itself
Electronic equipment, to cause electronic equipment that there is 3D imaging capabilities.Structure in the various embodiments described above can also be used in electronics and set
In the integrated morphology of standby middle depth camera.Illustrated below by taking mobile phone as an example.
Fig. 6 is mobile terminal structure schematic diagram according to an embodiment of the invention.Mobile terminal 6 includes shell 61, screen
Curtain 62, each module 11,12,13 of depth camera, also include battery 64 and mainboard 63 in terminal inner in addition.Here, depth phase
Machine is arranged on the image for obtaining mobile terminal frontispiece, therefore is preposition depth camera, in some embodiments, it is also possible to
For rearmounted form.In this structure, each module of depth camera is separated with the mainboard in mobile terminal, and depth camera is made
It is integrated in the terminal for independent component, depth camera here can be any shown embodiments of Fig. 1~Fig. 5
In structure.In certain embodiments, Mobile terminal main board 63 can be combined into one with support 14, other yuan on depth camera
Device 23, such as application specific processor can also be placed directly on Mobile terminal main board, it might even be possible to by Mobile terminal main board
Other processors perform the function of application specific processor, it is possible thereby to reduce the quantity of component so that overall electronic equipment
More integrated, power consumption can also reduce.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For those skilled in the art, do not taking off
On the premise of from present inventive concept, some equivalent substitutes or obvious modification can also be made, and performance or purposes are identical, all should
When being considered as belonging to protection scope of the present invention.
Claims (14)
- A kind of 1. 3D imaging devices, it is characterised in that including：At least one optics module, for receiving or launching light beam；The optics module includes superstructure and substructure, The superstructure sectional area is less than the sectional area of the substructure；Support, containing through hole corresponding with the optics module, for making the superstructure of the optics module lead to through described Hole；The area of the through hole is less than the sectional area of the substructure；Substrate, the bottom of the optics module is connected to, for supporting the optics module.
- 2. device as claimed in claim 1, it is characterised in that：The optics module includes projection module and imaging modules, The projection module is used for emitting structural pattern beam, and the imaging modules are used to receive the structured pattern light beam.
- 3. device as claimed in claim 2, it is characterised in that the optics module also includes RGB camera module, for gathering Coloured image.
- 4. device as claimed in claim 1, it is characterised in that the superstructure includes top microscope base；The substructure Including bottom microscope base.
- 5. device as claimed in claim 1, it is characterised in that the superstructure includes microscope base, and the substructure includes Circuit board.
- 6. device as claimed in claim 1, it is characterised in that the optics module also includes location structure, the positioning knot Structure is connected with the support, for fixing the optics module.
- 7. device as claimed in claim 6, it is characterised in that the location structure includes projection, and the support is provided with recessed Groove, the described raised and groove match.
- 8. device as claimed in claim 1, it is characterised in that the substrate or the support are provided with mounting hole, for pacifying Fill described device.
- 9. device as claimed in claim 1, it is characterised in that the support includes alloy material, and the thickness of the support is 0.5mm~5mm.
- 10. device as claimed in claim 1, it is characterised in that the substrate includes metal and/or ceramics, the substrate Thickness is 0.1mm~2mm.
- A kind of 11. method for manufacturing 3D imaging devices, it is characterised in that methods described includes：At least one be used for is provided Receive or launch the optics module of light beam；The optics module includes superstructure and substructure, and the superstructure is cut Area is less than the sectional area of the substructure；Support is provided, the support contains through hole corresponding with the optics module, institute The superstructure of optics module is stated through the through hole on the support, the area of the through hole is less than the section of the substructure Product；Substrate is provided, the substrate is connected with the substructure of the optics module, supports the optics module；Wherein, the light Learning module includes projection module and imaging modules, and the projection module is used for emitting structural pattern beam；The imaging mould Group is used to receive the structured pattern light beam, and the optics module also includes RGB camera module, for gathering coloured image.
- 12. a kind of 3D imaging devices, it is characterised in that including optics module, for receiving or launching the module of light beam；Clamp mould Block, for fixing optics module, the width of the self-clamping module is no more than the width of the optics module, described so as to reduce The volume of 3D imaging devices.
- 13. a kind of electronic equipment, it is characterised in that including：Claim 1~10 or 12 it is any as described in 3D imaging devices, in the first plane of the electronic equipment, use In acquisition depth image and/or coloured image；Display, in the second plane of the electronic equipment, for display image.
- 14. electronic equipment as claimed in claim 13, it is characterised in that first plane is same with second plane Plane or first plane and second plane are opposed plane.
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| CN201710653064.5A CN107343122A (en) | 2017-08-02 | 2017-08-02 | 3D imaging devices |
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| CN201710653064.5A CN107343122A (en) | 2017-08-02 | 2017-08-02 | 3D imaging devices |
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Cited By (13)
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| CN107911584A (en) * | 2017-11-28 | 2018-04-13 | 信利光电股份有限公司 | A kind of image capture device and a kind of terminal |
| CN108156360A (en) * | 2018-01-29 | 2018-06-12 | 信利光电股份有限公司 | A kind of camera module structure with 3D effect |
| CN108390970A (en) * | 2018-04-10 | 2018-08-10 | Oppo广东移动通信有限公司 | Holder, in-out box and terminal |
| CN108881689A (en) * | 2018-07-06 | 2018-11-23 | 信利光电股份有限公司 | A kind of assembly method and 3D camera module of 3D camera module |
| CN109714507A (en) * | 2018-12-27 | 2019-05-03 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
| CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
| CN110032911A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Electronic equipment with structure optical mode group |
| CN110032025A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Structured light projector and its methods and applications |
| CN110278430A (en) * | 2018-03-18 | 2019-09-24 | 宁波舜宇光电信息有限公司 | Depth information camera module and its base assembly, electronic equipment and preparation method |
| CN110418032A (en) * | 2018-04-28 | 2019-11-05 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
| WO2021004248A1 (en) * | 2019-07-09 | 2021-01-14 | Oppo广东移动通信有限公司 | Electronic device |
| US11163225B2 (en) | 2018-04-10 | 2021-11-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection structure and electronic device |
| US11330090B2 (en) | 2018-04-10 | 2022-05-10 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Bracket, input/output assembly and terminal |
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