CN107342233A - Low loss component flush type antenna packages structure and its manufacture method - Google Patents

Low loss component flush type antenna packages structure and its manufacture method Download PDF

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Publication number
CN107342233A
CN107342233A CN201710514558.5A CN201710514558A CN107342233A CN 107342233 A CN107342233 A CN 107342233A CN 201710514558 A CN201710514558 A CN 201710514558A CN 107342233 A CN107342233 A CN 107342233A
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CN
China
Prior art keywords
low loss
substrate
loss component
plastic packaging
flush type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710514558.5A
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Chinese (zh)
Inventor
林耀剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN201710514558.5A priority Critical patent/CN107342233A/en
Publication of CN107342233A publication Critical patent/CN107342233A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)

Abstract

The present invention relates to a kind of low loss component flush type antenna packages structure and its manufacture method, the structure includes substrate（1）, the substrate（1）Including multilayer line layer（1.1）With low-loss and insulating material（1.2）, the multilayer line layer（1.1）Including antenna area, the substrate（1）Front is provided with low loss component（2）, the low loss component（2）Cover multilayer line layer（1.1）Antenna area, the substrate（1）Top, low loss component（2）Outer peripheral areas is encapsulated with plastic packaging material（3）, the substrate（1）The back side is provided with chip（4）And metal ball（6）.A kind of low loss component flush type antenna packages structure of the present invention and its manufacture method, it adds the structural strength of thin base, ensure that the stability that antenna area is heated at work, prevents the deformation of antenna, ensures the stabilization of aerial signal.

Description

Low loss component flush type antenna packages structure and its manufacture method
Technical field
The present invention relates to a kind of low loss component flush type antenna packages structure and its manufacture method, belong to semiconductor packages Technical field.
Background technology
Antenna is required element in wireless telecommunications system, portable wireless telecommunications system it is integrated, miniaturization, it is micro- Under the requirement of type, the mode used now is by system in package, passive device, small-power can be had with as much as possible In source device, antenna embedment substrate, this requires substrate to have alap dielectric loss, while technological trend requires substrate again It is thinned as far as possible, but low-loss substrate or other materials common mechanical intensity or rigidity are relatively low, it is whole so as to influence whether The intensity of body encapsulation.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of low loss component flush type day for above-mentioned prior art Wire encapsulation construction and its manufacture method, it adds the structural strength of thin base, ensure that antenna area is heated at work Stability, prevent the deformation of antenna, ensure the stabilization of aerial signal.
Technical scheme is used by the present invention solves the above problems：A kind of low loss component flush type antenna packages knot Structure, it includes substrate, and the substrate includes multilayer line layer and low-loss and insulating material, and the multilayer line layer includes antenna field Domain, the substrate front side are provided with low loss component, the antenna area of the low loss component covering multilayer line layer, the base Plate top, low loss component outer peripheral areas are encapsulated with plastic packaging material, and the substrate back is provided with chip and metal ball.
The chip is by underfill upside-down mounting in substrate back.
The dielectric constant Dk of the low loss component in high frequency<3.5, dielectric loss Df<0.01.
A kind of manufacture method of low loss component flush type antenna packages structure, methods described comprise the following steps：
Step 1: take a support plate；
Step 2: making multilayer circuit board on support plate, antenna area is designed between multilayer line, among multilayer line layer Using low-loss and insulating material, substrate is formed；
Step 3: mounting low loss component in substrate front side, low loss component is mounted on above the antenna area of substrate；
Step 4: low loss component is subjected to plastic packaging；
Step 5: remove support plate；
Step 6: the substrate back pasting chip that exposes after support plate is removed and carrying out plant ball；
Step 7: in plastic packaging material surface laser printed product information, single product is finally cut into.
It is ground after step 4 plastic packaging operation thinned.
Step 4 plastic packaging material surface pastes layer protecting film, and this layer of diaphragm is removed before step 7 laser printing.
A kind of manufacture method of low loss component flush type antenna packages structure, methods described comprise the following steps：
Step 1: it will be embedded in low loss component in plastic packaging material；
Step 2: make substrate on plastic packaging material surface；
Step 3: in substrate surface flip-chip and carry out plant ball；
Step 4: in plastic packaging material surface laser printed product information, single product is finally cut into.
Support block is embedded in the plastic packaging material of step 1.
Layer protecting film is pasted on plastic packaging material surface after the completion of step 3, this layer protection is removed before step 4 laser printing Film.
A kind of low loss component flush type antenna packages structure, it includes substrate, the substrate include multilayer line layer and Low-loss and insulating material, the multilayer line layer include antenna area, and the substrate front side is provided with low loss component and chip, The antenna area of the low loss component covering multilayer line layer, the surface, low loss component and chip periphery region Plastic packaging material is encapsulated with, the substrate back is provided with metal ball.
Compared with prior art, the advantage of the invention is that：
When the 1st, being located at substrate both sides respectively invention increases the structural strength of thin base, chip and low loss component, help In the angularity of balance monolith substrate；When chip and low loss component are located at substrate homonymy, the structure of thin base can be increased Intensity, and do not increase integrally-built thickness；
2nd, low loss component of the invention covering antenna area, can ensure the stability that antenna area is heated at work, prevent The only deformation of antenna, ensure the stabilization of aerial signal.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of low loss component flush type antenna packages constructive embodiment 1 of the present invention.
Fig. 2 ~ Fig. 9 is a kind of process of the manufacture method of low loss component flush type antenna packages constructive embodiment 1 of the present invention Schematic flow sheet.
Figure 10 ~ Figure 13 is a kind of 1 another manufacture method of low loss component flush type antenna packages constructive embodiment of the present invention Process flow chart.
Figure 14 is a kind of schematic diagram of low loss component flush type antenna packages constructive embodiment 2 of the present invention.
Figure 15 is a kind of schematic diagram of low loss component flush type antenna packages constructive embodiment 3 of the present invention.
Figure 16 is a kind of schematic diagram of low loss component flush type antenna packages constructive embodiment 4 of the present invention.
Wherein：
Substrate 1
Multilayer line layer 1.1
Low-loss and insulating material 1.2
Antenna area 1.3
Low loss component 2
Plastic packaging material 3
Chip 4
Underfill 5
Metal ball 6.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
Embodiment 1：Chip is located at substrate both sides with low loss component
Referring to Fig. 1, a kind of low loss component flush type antenna packages structure in the present embodiment, it includes substrate 1, the substrate 1 includes multilayer line layer 1.1 and low-loss and insulating material 1.2, and the multilayer line layer 1.1 includes antenna area 1.3, the base The front of plate 1 is provided with low loss component 2, and the low loss component 2 covers the antenna area 1.3 of multilayer line layer 1.1, the base The top of plate 1, the outer peripheral areas of low loss component 2 are encapsulated with plastic packaging material 3, and the back side of substrate 1 is provided with chip 4 and metal ball 6；
The chip 4 is by the upside-down mounting of underfill 5 in the back side of substrate 1；
The low loss component 2 is in high frequency（>20 GHz）There is down low dielectric constant（Dk<3.5）, there is low dielectric loss （Df <0.01）.
Its manufacture method comprises the following steps：
Step 1: referring to Fig. 2, a support plate is taken；
Step 2: referring to Fig. 3, multilayer circuit board is made on support plate, antenna area is designed between multilayer line, in multilayer wire Low-loss and insulating material is used among the floor of road, forms substrate；
Step 3: referring to Fig. 4, low loss component is mounted in substrate front side, low loss component is mounted on the antenna area of substrate Side, the size of low loss component are more than or equal to the area of antenna area；
Step 4: referring to Fig. 5, low loss component is subjected to plastic packaging；
Step 5: referring to Fig. 6, plastic packaging material surface is ground thinned, can be ground to low loss component and expose, can not also reveal Go out, plastic packaging material surface pastes layer protecting film, its purpose is to good adhesive attraction and reduces thermal resistance；
Step 6: referring to Fig. 7, support plate is removed；
Step 7: referring to Fig. 8, the substrate back pasting chip exposed after support plate is removed, mounting method can use upside-down mounting, chip Bottom and surrounding are filled with underfill, are needing to carry out plant ball with exposed electrical junction；
Step 8: referring to Fig. 9, diaphragm is removed, in plastic packaging material surface laser printed product information, finally cuts into single production Product.Its another manufacture method comprises the following steps：
Step 1: referring to Figure 10, it will be embedded in plastic packaging material in low loss component, in order to prevent warpage, can be buried in plastic packaging material Enter other support blocks；
Step 2: referring to Figure 11, carry out multi-layer plating on plastic packaging material surface and fill insulant makes and to form substrate；
Step 3: referring to Figure 12, layer protecting film is pasted on plastic packaging material surface, its purpose is to good adhesive attraction and reduction Thermal resistance, in substrate surface flip-chip and carry out plant ball；
Step 4: referring to Figure 13, diaphragm is removed, in plastic packaging material surface laser printed product information, finally cuts into single production Product.
Embodiment 2：Chip is located at substrate the same side with low loss component
Referring to Figure 14, a kind of low loss component flush type antenna packages structure in the present embodiment, it includes substrate 1, the base Plate 1 includes multilayer line layer 1.1 and low-loss and insulating material 1.2, and the multilayer line layer 1.1 includes antenna area 1.3, described The front of substrate 1 is provided with low loss component 2 and chip 4, and the low loss component 2 covers the antenna area of multilayer line layer 1.1 1.3, the top of substrate 1, low loss component 2 and the outer peripheral areas of chip 4 are encapsulated with plastic packaging material 3, and the back side of substrate 1 is provided with Metal ball 6.
Embodiment 3：
Referring to Figure 15, the difference of embodiment 3 and embodiment 1 is：Do not encapsulated by plastic packaging material 3 at the back side of low loss component 2.
Embodiment 4：
Referring to Figure 16, the difference of embodiment 4 and embodiment 2 is：Do not encapsulated by plastic packaging material 3 at the back side of low loss component 2.
In addition to the implementation, it is all to use equivalent transformation or equivalent replacement present invention additionally comprises there is other embodiment The technical scheme that mode is formed, it all should fall within the scope of the hereto appended claims.

Claims (10)

  1. A kind of 1. low loss component flush type antenna packages structure, it is characterised in that：It includes substrate（1）, the substrate（1）Bag Include multilayer line layer（1.1）With low-loss and insulating material（1.2）, the multilayer line layer（1.1）Including antenna area（1.3）, The substrate（1）Front is provided with low loss component（2）, the low loss component（2）Cover multilayer line layer（1.1）Antenna Region（1.3）, the substrate（1）Top, low loss component（2）Outer peripheral areas is encapsulated with plastic packaging material（3）, the substrate（1）The back of the body Face is provided with chip（4）And metal ball（6）.
  2. A kind of 2. low loss component flush type antenna packages structure according to claim 1, it is characterised in that：The chip （4）Pass through underfill（5）Upside-down mounting is in substrate（1）The back side.
  3. A kind of 3. low loss component flush type antenna packages structure according to claim 1, it is characterised in that：The low damage Consume part（2）Dielectric constant Dk in high frequency<3.5, dielectric loss Df<0.01.
  4. 4. a kind of manufacture method of low loss component flush type antenna packages structure, it is characterised in that methods described includes following step Suddenly：
    Step 1: take a support plate；
    Step 2: making multilayer circuit board on support plate, antenna area is designed between multilayer line, among multilayer line layer Using low-loss and insulating material, substrate is formed；
    Step 3: mounting low loss component in substrate front side, low loss component is mounted on above the antenna area of substrate；
    Step 4: low loss component is subjected to plastic packaging；
    Step 5: remove support plate；
    Step 6: the substrate back pasting chip that exposes after support plate is removed and carrying out plant ball；
    Step 7: in plastic packaging material surface laser printed product information, single product is finally cut into.
  5. 5. a kind of manufacture method of low loss component flush type antenna packages structure according to claim 4, its feature exist In：It is ground after step 4 plastic packaging operation thinned.
  6. 6. a kind of manufacture method of low loss component flush type antenna packages structure according to claim 4, its feature exist In：Step 4 plastic packaging material surface pastes layer protecting film, and this layer of diaphragm is removed before step 7 laser printing.
  7. 7. a kind of manufacture method of low loss component flush type antenna packages structure, it is characterised in that methods described includes following step Suddenly：
    Step 1: it will be embedded in low loss component in plastic packaging material；
    Step 2: make substrate on plastic packaging material surface；
    Step 3: in substrate surface flip-chip and carry out plant ball；
    Step 4: in plastic packaging material surface laser printed product information, single product is finally cut into.
  8. 8. a kind of manufacture method of low loss component flush type antenna packages structure according to claim 7, its feature exist In：Support block is embedded in the plastic packaging material of step 1.
  9. 9. a kind of manufacture method of low loss component flush type antenna packages structure according to claim 7, its feature exist In：Layer protecting film is pasted on plastic packaging material surface after the completion of step 3, this layer of diaphragm is removed before step 4 laser printing.
  10. A kind of 10. low loss component flush type antenna packages structure, it is characterised in that：It includes substrate（1）, the substrate（1） Including multilayer line layer（1.1）With low-loss and insulating material（1.2）, the multilayer line layer（1.1）Including antenna area （1.3）, the substrate（1）Front is provided with low loss component（2）And chip（4）, the low loss component（2）Cover multilayer wire Road floor（1.1）Antenna area（1.3）, the substrate（1）Top, low loss component（2）And chip（4）Outer peripheral areas is encapsulated with Plastic packaging material（3）, the substrate（1）The back side is provided with metal ball（6）.
CN201710514558.5A 2017-06-29 2017-06-29 Low loss component flush type antenna packages structure and its manufacture method Pending CN107342233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710514558.5A CN107342233A (en) 2017-06-29 2017-06-29 Low loss component flush type antenna packages structure and its manufacture method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710514558.5A CN107342233A (en) 2017-06-29 2017-06-29 Low loss component flush type antenna packages structure and its manufacture method

Publications (1)

Publication Number Publication Date
CN107342233A true CN107342233A (en) 2017-11-10

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108461458A (en) * 2018-03-26 2018-08-28 江苏长电科技股份有限公司 Surface mount packages structure and preparation method thereof
CN110635221A (en) * 2019-09-20 2019-12-31 上海先方半导体有限公司 BGA packaging structure and method applied to antenna product
WO2022105161A1 (en) * 2020-11-17 2022-05-27 江苏长电科技股份有限公司 Antenna packaging structure and manufacturing method for antenna packaging structure
WO2022105160A1 (en) * 2020-11-17 2022-05-27 江苏长电科技股份有限公司 Antenna packaging structure, and manufacturing method for antenna packaging structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1959948A (en) * 2005-11-03 2007-05-09 台湾应解股份有限公司 Chip capsulation structure, and fabricating method
US20120161315A1 (en) * 2010-12-22 2012-06-28 ADL Engineering Inc. Three-dimensional system-in-package package-on-package structure
US20140084391A1 (en) * 2012-09-25 2014-03-27 Cambridge Silicon Radio Limited Composite Reconstituted Wafer Structures
CN103779235A (en) * 2012-10-19 2014-05-07 台湾积体电路制造股份有限公司 Fan-out wafer level package structure
CN105140213A (en) * 2015-09-24 2015-12-09 中芯长电半导体（江阴）有限公司 Chip packaging structure and chip packaging method
TW201622509A (en) * 2014-10-31 2016-06-16 Murata Manufacturing Co Antenna module and circuit module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1959948A (en) * 2005-11-03 2007-05-09 台湾应解股份有限公司 Chip capsulation structure, and fabricating method
US20120161315A1 (en) * 2010-12-22 2012-06-28 ADL Engineering Inc. Three-dimensional system-in-package package-on-package structure
US20140084391A1 (en) * 2012-09-25 2014-03-27 Cambridge Silicon Radio Limited Composite Reconstituted Wafer Structures
CN103779235A (en) * 2012-10-19 2014-05-07 台湾积体电路制造股份有限公司 Fan-out wafer level package structure
TW201622509A (en) * 2014-10-31 2016-06-16 Murata Manufacturing Co Antenna module and circuit module
CN105140213A (en) * 2015-09-24 2015-12-09 中芯长电半导体（江阴）有限公司 Chip packaging structure and chip packaging method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108461458A (en) * 2018-03-26 2018-08-28 江苏长电科技股份有限公司 Surface mount packages structure and preparation method thereof
CN108461458B (en) * 2018-03-26 2020-07-28 江苏长电科技股份有限公司 Surface mounting type packaging structure and manufacturing method thereof
CN110635221A (en) * 2019-09-20 2019-12-31 上海先方半导体有限公司 BGA packaging structure and method applied to antenna product
WO2022105161A1 (en) * 2020-11-17 2022-05-27 江苏长电科技股份有限公司 Antenna packaging structure and manufacturing method for antenna packaging structure
WO2022105160A1 (en) * 2020-11-17 2022-05-27 江苏长电科技股份有限公司 Antenna packaging structure, and manufacturing method for antenna packaging structure

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Application publication date: 20171110