CN107325783A - A kind of LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity and preparation method thereof - Google Patents
A kind of LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity and preparation method thereof Download PDFInfo
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- CN107325783A CN107325783A CN201710356261.0A CN201710356261A CN107325783A CN 107325783 A CN107325783 A CN 107325783A CN 201710356261 A CN201710356261 A CN 201710356261A CN 107325783 A CN107325783 A CN 107325783A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000002834 transmittance Methods 0.000 title claims abstract description 17
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 16
- -1 polysiloxane Polymers 0.000 claims abstract description 42
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 32
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- MJULMZZKFYNTHK-UHFFFAOYSA-N ethenyl(phenyl)silicon Chemical compound C=C[Si]C1=CC=CC=C1 MJULMZZKFYNTHK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003112 inhibitor Substances 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 5
- 125000003944 tolyl group Chemical group 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 21
- 238000010792 warming Methods 0.000 claims description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 10
- 230000006837 decompression Effects 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 230000000887 hydrating effect Effects 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical compound CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 2
- 230000001629 suppression Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
LED packaging silicon rubbers of a kind of high index of refraction high-transmittance high rigidity of the present invention and preparation method thereof include two kinds of components of AB, and the weight ratio of both components is A:B=1:2, wherein component A is included：Methyl phenyl vinyl polysiloxane, vinyl benzene based polyalcohol, the catalyst containing platinum, tackifier, inhibitor；B component is included：The hydrogeneous silicones of methyl phenyl vinyl polysiloxane, Vinylphenyl silicon resin, aminomethyl phenyl.A kind of LED packaging silicon rubbers of high index of refraction high rigidity prepared by the present invention have that refractive index is high, hardness is big, viscosity is easily adjusted, excellent heat resistance and the features such as to base material excellent caking property.
Description
Technical field
The present invention relates to a kind of preparation method of the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity, specifically
It is related to a kind of high index of refraction, high rigidity, high-adhesion, the LED packaging silicon rubbers of color inhibition, belongs to adhesive technical field.
Background technology
LED light emitting diodes are as new high-performance solid light-emitting component, with power consumption is small, operating voltage is low, luminous
The advantages of efficiency high, small radiation, green non-pollution, the application field in illumination market is more and more wider, is increasingly becoming future
The main flow lamp source of in the market, with boundless market prospects.
During LED component is produced, chip fabrication techniques, fluorescent material manufacturing technology, heat dissipation technology and package material
The performance of material can all make a significant impact on its luminous efficiency, brightness and service life.Traditional packaging plastic uses epoxy
Resin, the packaging plastic of this material have the shortcomings that it is obvious, such as be heated or ultraviolet irradiation after easily xanthochromia, internal stress it is big
So that the fragility of material is big, shock resistance difference etc., therefore with the development of LED especially high-powered LED lamp, epoxy resin envelope
It is difficult to meet the market demand to fill glue.The organic siliconresin packaging plastic resistance to purple stronger because the particularity of its molecular structure makes it have
Outer aging, light transmittance is high, refractive index is high, be difficult the advantages of xanthochromia, shock resistance are good, in recent years gradually substituted epoxy resin into
For the main product in LED packaging plastics market.
Organic siliconresin packaging plastic is due to resistance to ag(e)ing is good, light transmittance is high, refractive index is high, be difficult xanthochromia, using the longevity
The advantages of ordering long, in recent years by numerous scholars and business research.Refractive index and transparency are higher, and interface light loss is fewer, so that
LED luminous flux and light utilization efficiency can be improved, in addition, hardness is higher, heat endurance is higher, while hydroscopicity, raising can be reduced
Sulfur resistance.Hardness is high, and internal stress easily ftractures greatly, cause in the market most of organic siliconresin packaging plastic hardness exist
Below 55D.
There is provided a kind of packaging plastic preparation method of high refraction high intensity, Wen Zhong for Publication No. 103013431A patent
Do not describe to improve hardness and the method for light transmittance.
The content of the invention
To solve problem above, the invention provides a kind of system of the LED packaging plastics of high index of refraction high grade of transparency high rigidity
Preparation Method.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity, include two kinds of components of A and B, the component A and B component
Weight ratio be 1:2；
Wherein, the component A includes the raw material of following parts by weight：50 ~ 80 parts of methyl phenyl vinyl polysiloxane, ethenylphenyl
20 ~ 50 parts of silicones, 0.02 ~ 0.2 part of platinum catalyst, 1-4 parts of tackifier；0.01 ~ 0.05 part of inhibitor；The B component bag
Include the raw material of following parts by weight：10 ~ 30 parts of methyl phenyl vinyl polysiloxane, 20 ~ 50 parts of Vinylphenyl silicon resin, methylbenzene
35 ~ 55 parts of the hydrogeneous silicones of base.
As a further improvement on the present invention, described methyl phenyl vinyl polysiloxane is the silicon tree containing MDT structures
Fat, its molecular formula is：(ViMe2SiO1/2) x (PhSiO3/2) y (PhSiO) z, wherein, x values be 10 ~ 30, y values be 30 ~
70, z values are that 20 ~ 50, Me is methyl, and Vi is vinyl, and Ph is phenyl.
As a further improvement on the present invention, described Vinylphenyl silicon resin molecular formula is to be divided into (ViMe2SiO1/
2) x (PhSiO3/2) y, wherein x values are that 10 ~ 70, y values are 10-50；According to the difference of X and y values, it is arranged to two kinds of physics shapes
State, one kind is solvent-laden mixture, and one kind is not solvent-laden polymer, wherein the solvent used in solvent-laden mixture is
Toluene or dimethylbenzene, solid content is 30% ~ 70%.
As a further improvement on the present invention, described catalyst is platinum-methyl phenyl silicone complex, and platinum contains
Amount is in 4000ppm ~ 7500ppm.
As a further improvement on the present invention, described tackifier are to contain phenyl, epoxy and acryloyl-oxy functional group
Siloxanes ring body hydrating polymer.
As a further improvement on the present invention, described inhibitor is ethynylcyclohexanol or 1, the propine -1- of 1,3- triphenyl -2
One or both of alcohol.
As a further improvement on the present invention, described hydrogeneous silicones is the hydrogeneous polymer containing methyl and phenyl,
Hydrogen content is 0.2% ~ 0.8%.
A kind of preparation method of the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity, the preparation process of the component A
For：By weight fraction for 50 ~ 80 parts methyl phenyl vinyl polysiloxane, 20 ~ 50 parts of Vinylphenyl silicon resin, 0.02 ~
0.2 part of platinum catalyst, 1 ~ 4 part of tackifier, 0.01 ~ 0.05 part of inhibitor, are sequentially added in stirring container, and stirring is equal
80 ~ 120 DEG C of decompressions are warming up to after even de- low 1 ~ 3 hour, produce the component A；The preparation process of the B component is：By weight
Fraction is 10 ~ 30 parts of methyl phenyl vinyl polysiloxane, 20 ~ 50 parts of Vinylphenyl silicon resin, 35 ~ 55 parts of methylbenzene
The hydrogeneous silicones of base, is sequentially added in stirring container, 80 ~ 120 DEG C of decompressions is warming up to after being stirred after stirring de- low by 1 ~ 3
Hour, produce the B component；Component A and B component are both needed to again enter after 80 DEG C ~ 120 DEG C decompressions remove solvent in de- low 1 ~ 3 hour
Row married operation.
The beneficial effects of the invention are as follows：
Favourable using above-mentioned technical proposal shows as：LED packaging plastics prepared by the present invention are by A, B component according to 1:2 weight ratios
Resin, vinyl, catalyst, inhibitor, the tackifier of example mixing, during the course of the reaction component A offer high intensity, B component are carried
For the resin, vinyl, crosslinking agent of high intensity.The formula designed by the present invention, can improve the crosslink density that colloid reacts,
So as to improve intensity and hardness after solidification.
Embodiment
In order that objects and advantages of the present invention are more clearly understood, traveling one is entered to the present invention below in conjunction with the present embodiment
Step is described in detail, it will be appreciated that the specific embodiments described herein are merely illustrative of the present invention, is not used to limit this hair
It is bright.
Embodiment 1
The preparation of component A：Weigh 70 parts of methyl phenyl vinyl polysiloxane, 26.9 parts of Vinylphenyl silicon resin, platinum catalysis
0.1 part of agent, 3 parts of tackifier, 0.02 part of inhibitor, are sequentially added in stirring container, and 80 ~ 120 DEG C are warming up to after stirring and is subtracted
Pressure-off is low 1 ~ 3 hour, produces the component A；
The preparation of B component：Weigh 10 parts of methyl phenyl vinyl polysiloxane, 45 parts of Vinylphenyl silicon resin, 45 parts of first
The hydrogeneous silicones of base phenyl, is sequentially added in stirring container, 80 ~ 120 DEG C of decompressions is warming up to after being stirred after stirring de-
It is low 1 ~ 3 hour, produce the B component；
In use, by the component A and B component of above-mentioned preparation according to weight ratio 1:2 proportioning is well mixed, vacuum row bubble 30 ~ 60
Minute, it can also be warming up to 30 ~ 50 DEG C and stand nature row's bubble, when in colloid leaving no air bubbles inside post package to required component, first existing
Heat 0.5 ~ 1 hour, then heated 2 ~ 3 hours at 150 DEG C at a temperature of 80 DEG C, be down to after room temperature and produce required product, product glues
4000mpa.s is spent, refractive index is 1.54, and transparency is 99.5%, and hardness is 72D, solidification is not ftractureed.
Embodiment 2
The preparation of component A：Weigh 80 parts of methyl phenyl vinyl polysiloxane, 18 parts of Vinylphenyl silicon resin, platinum catalyst
0.05 part, 2 parts of tackifier, 0.01 part of inhibitor, sequentially add in stirring container, 80 ~ 120 DEG C of decompressions be warming up to after stirring
It is de- low 1 ~ 3 hour, produce the component A；
The preparation of B component：Weigh 10 parts of methyl phenyl vinyl polysiloxane, 46 parts of Vinylphenyl silicon resin, 44 parts of first
The hydrogeneous silicones of base phenyl, is sequentially added in stirring container, 80 ~ 120 DEG C of decompressions is warming up to after being stirred after stirring de-
It is low 1 ~ 3 hour, produce the B component；
In use, by the component A and B component of above-mentioned preparation according to weight ratio 1:2 proportioning is well mixed, vacuum row bubble 30 ~ 60
Minute, it can also be warming up to 30 ~ 50 DEG C and stand nature row's bubble, when in colloid leaving no air bubbles inside post package to required component, first existing
Heat 0.5 ~ 1 hour, then heated 2 ~ 3 hours at 130 DEG C at a temperature of 70 DEG C, be down to after room temperature and produce required product, product glues
3500mpa.s is spent, refractive index is 1.545, and transparency is 99.5%, and hardness is 70D, solidification is not ftractureed.
Embodiment 3
The preparation of component A：Weigh 65 parts of methyl phenyl vinyl polysiloxane, 31.9 parts of Vinylphenyl silicon resin, platinum catalysis
0.1 part of agent, 3 parts of tackifier, 0.01 part of inhibitor, are sequentially added in stirring container, and 80 ~ 120 DEG C are warming up to after stirring and is subtracted
Pressure-off is low 1 ~ 3 hour, produces the component A；
The preparation of B component：Weigh 20 parts of methyl phenyl vinyl polysiloxane, 40 parts of Vinylphenyl silicon resin, 40 parts of first
The hydrogeneous silicones of base phenyl, is sequentially added in stirring container, 80 ~ 120 DEG C of decompressions is warming up to after being stirred after stirring de-
It is low 1 ~ 3 hour, produce the B component；
In use, by the component A and B component of above-mentioned preparation according to weight ratio 1:2 proportioning is well mixed, vacuum row bubble 30 ~ 60
Minute, it can also be warming up to 30 ~ 50 DEG C and stand nature row's bubble, when in colloid leaving no air bubbles inside post package to required component, first existing
Heat 0.5 ~ 1 hour, then heated 2 ~ 3 hours at 150 DEG C at a temperature of 70 DEG C, be down to after room temperature and produce required product, product glues
It is 1.54 to spend 4600mpa.s refractive indexes, and transparency is 99.5%, and hardness is 68D, and solidification is not ftractureed.
Described above is only some embodiments of the present invention, every formula range described in the claims in the present invention
Inside belong to protection category of the present invention.
Using the above-mentioned desirable embodiment according to the present invention as enlightenment, by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property scope is not limited to the content on specification, it is necessary to its technical scope is determined according to right.
Claims (8)
1. a kind of LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity, it is characterised in that：Include two kinds of components of A and B, institute
The weight ratio for stating component A and B component is 1:2；
Wherein, the component A includes the raw material of following parts by weight：50 ~ 80 parts of methyl phenyl vinyl polysiloxane, ethenylphenyl
20 ~ 50 parts of silicones, 0.02 ~ 0.2 part of platinum catalyst, 1-4 parts of tackifier；0.01 ~ 0.05 part of inhibitor；The B component bag
Include the raw material of following parts by weight：10 ~ 30 parts of methyl phenyl vinyl polysiloxane, 20 ~ 50 parts of Vinylphenyl silicon resin, methylbenzene
35 ~ 55 parts of the hydrogeneous silicones of base.
2. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that described
Methyl phenyl vinyl polysiloxane be the silicones containing MDT structures, its molecular formula is：(ViMe2SiO1/2)x
(PhSiO3/2) y (PhSiO) z, wherein, x values are that 10 ~ 30, y values are that 30 ~ 70, z values are that 20 ~ 50, Me is methyl, and Vi is ethene
Base, Ph is phenyl.
3. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that described
Vinylphenyl silicon resin molecular formula to be divided into (ViMe2SiO1/2) x (PhSiO3/2) y, wherein x values are 10 ~ 70, y values
For 10-50；According to the difference of X and y values, it is arranged to two kinds of physical states, one kind is solvent-laden mixture, and one kind is without molten
The polymer of agent, wherein the solvent used in solvent-laden mixture is toluene or dimethylbenzene, solid content is 30% ~ 70%.
4. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that institute
The catalyst stated is platinum-methyl phenyl silicone complex, and platinum content is in 4000ppm ~ 7500ppm.
5. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that described
Tackifier be the siloxanes ring body hydrating polymer containing phenyl, epoxy and acryloyl-oxy functional group.
6. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that described
Inhibitor be one or both of ethynylcyclohexanol or the propine -1- alcohol of 1,1,3- triphenyls -2.
7. the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity according to claim 1, it is characterised in that described
Hydrogeneous silicones be the hydrogeneous polymer containing methyl and phenyl, hydrogen content is 0.2% ~ 0.8%.
8. a kind of preparation method of the LED packaging silicon rubbers of high index of refraction high-transmittance high rigidity as described in claim 1 ~ 6, its
It is characterised by, the preparation process of the component A is：By weight fraction for 50 ~ 80 parts methyl phenyl vinyl polysiloxane, 20 ~
50 parts of Vinylphenyl silicon resin, 0.02 ~ 0.2 part of platinum catalyst, 1 ~ 4 part of tackifier, 0.01 ~ 0.05 part of suppression
Agent, is sequentially added in stirring container, and 80 ~ 120 DEG C of decompressions are warming up to after stirring and take off low 1 ~ 3 hour, the component A is produced；
The preparation process of the B component is：Methyl phenyl vinyl polysiloxane, 20 ~ 50 parts of ethene by weight fraction for 10 ~ 30 parts
Base phenyl polysiloxane, the hydrogeneous silicones of 35 ~ 55 parts of aminomethyl phenyl, are sequentially added in stirring container, stir equal after stirring
80 ~ 120 DEG C of decompressions are warming up to after even de- low 1 ~ 3 hour, produce the B component；Component A and B component are both needed at 80 DEG C ~ 120 DEG C
Decompression carries out married operation again after removing solvent within de- low 1 ~ 3 hour.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110330946A (en) * | 2019-03-29 | 2019-10-15 | 天永诚高分子材料（常州）有限公司 | A kind of low viscosity high heat conduction organosilicon gel and preparation method thereof |
| CN110964327A (en) * | 2019-12-16 | 2020-04-07 | 杭州之江新材料有限公司 | High-refractive-index transparent silica gel and preparation method and application thereof |
| CN113025054A (en) * | 2019-12-25 | 2021-06-25 | 新特能源股份有限公司 | Silicon rubber composition, preparation method thereof and packaging adhesive |
| CN113105863A (en) * | 2021-03-01 | 2021-07-13 | 华南理工大学 | Ultrahigh-hardness silicone resin film and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110330946A (en) * | 2019-03-29 | 2019-10-15 | 天永诚高分子材料（常州）有限公司 | A kind of low viscosity high heat conduction organosilicon gel and preparation method thereof |
| CN110964327A (en) * | 2019-12-16 | 2020-04-07 | 杭州之江新材料有限公司 | High-refractive-index transparent silica gel and preparation method and application thereof |
| CN110964327B (en) * | 2019-12-16 | 2021-09-17 | 杭州之江新材料有限公司 | High-refractive-index transparent silica gel and preparation method and application thereof |
| CN113025054A (en) * | 2019-12-25 | 2021-06-25 | 新特能源股份有限公司 | Silicon rubber composition, preparation method thereof and packaging adhesive |
| CN113105863A (en) * | 2021-03-01 | 2021-07-13 | 华南理工大学 | Ultrahigh-hardness silicone resin film and preparation method and application thereof |
| CN113105863B (en) * | 2021-03-01 | 2022-06-14 | 华南理工大学 | Ultrahigh-hardness silicone resin film and preparation method and application thereof |
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