CN107322498A - Grinding tool raw material and preparation method thereof - Google Patents
Grinding tool raw material and preparation method thereof Download PDFInfo
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- CN107322498A CN107322498A CN201710480664.6A CN201710480664A CN107322498A CN 107322498 A CN107322498 A CN 107322498A CN 201710480664 A CN201710480664 A CN 201710480664A CN 107322498 A CN107322498 A CN 107322498A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a kind of grinding tool raw material and preparation method thereof, the preparation method includes:Diamond, zirconium oxide, carbonization silicon, boron carbide, schmigel, bonding agent powder and processing aid are mixed, heated, blank M is obtained;Wherein, the temperature of heating is 140 150 DEG C, and the time of heating is 40 50min;Blank M, sodium oxalate, Boratex, silica, cobalt oxide, nickel oxide and iron oxide are mixed, grinding tool raw material is obtained after sintering;Wherein, the temperature of sintering is 800 1500 DEG C, and the time of sintering is 0.5 1h;The problem of solving existing grinding tool raw material polishing effect poor, and easily reunite after long-time use.
Description
Technical field
The present invention relates to abrasive material preparation, in particular it relates to a kind of grinding tool raw material and preparation method thereof.
Background technology
Abrasive material is sharp keen, hard material, the softer material surface to be ground.Abrasive material has natural abrasive and manufactured abrasive
Two major classes.According to hardness classification has super hard abrasive and commonly wastes the major class of abrasive material two.The scope of abrasive material is very wide, from softer family expenses de-sludging
Agent, jewel abrasive material to most hard material diamond.Abrasive material is the manufacture essential material of each sophisticated product, many days
Right abrasive material, is replaced by manufactured abrasive.Existing abrasive material polishing effect is poor, and easily reunites after long-time use.
Therefore it provides a kind of polishing effect is good, and grinding tool raw material and its preparation of reunion are not susceptible to after long-time use
The problem of method is urgent need to resolve of the present invention.
The content of the invention
It is an object of the invention to provide a kind of grinding tool raw material and preparation method thereof, existing grinding tool raw material polishing effect is solved
It is really poor, and after long-time use easily the problem of reunite.
To achieve these goals, the invention provides a kind of preparation method of grinding tool raw material, the preparation method includes:
(1) diamond, zirconium oxide, carbonization silicon, boron carbide, schmigel, bonding agent powder and processing aid are mixed, added
Heat, obtains blank M;Wherein, the temperature of heating is 140-150 DEG C, and the time of heating is 40-50min;
(2) blank M, sodium oxalate, Boratex, silica, cobalt oxide, nickel oxide and iron oxide are mixed, sintered
After obtain grinding tool raw material;Wherein, the temperature of sintering is 800-1500 DEG C, and the time of sintering is 0.5-1h h.
Present invention also offers a kind of grinding tool raw material, the grinding tool raw material is made by above-mentioned preparation method.
By above-mentioned technical proposal, the invention provides a kind of grinding tool raw material and preparation method thereof, the preparation method bag
Include:Diamond, zirconium oxide, carbonization silicon, boron carbide, schmigel, bonding agent powder and processing aid are mixed, heated, is obtained
Blank M;Wherein, the temperature of heating is 140-150, and the time of heating is 40-50min;By blank M, sodium oxalate, Boratex, two
Silica, cobalt oxide, nickel oxide and iron oxide are mixed, and grinding tool raw material is obtained after sintering;Wherein, the temperature of sintering is 800-
1500 DEG C, the time of sintering is 0.5-1h;Pass through the synergy between each raw material so that obtained grinding tool raw material possesses excellent
Polishing effect, while simple for the method for preparing the grinding tool raw material, raw material is easy to get.
Other features and advantages of the present invention will be described in detail in subsequent embodiment part.
Embodiment
The embodiment to the present invention is described in detail below.It should be appreciated that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to limit the invention.
The end points and any value of disclosed scope are not limited to the accurate scope or value herein, these scopes or
Value should be understood to comprising the value close to these scopes or value.For number range, between the endpoint value of each scope, respectively
It can be combined with each other between the endpoint value of individual scope and single point value, and individually between point value and obtain one or more
New number range, these number ranges should be considered as specific open herein.
The invention provides a kind of preparation method of grinding tool raw material, the preparation method includes:
(1) diamond, zirconium oxide, carbonization silicon, boron carbide, schmigel, bonding agent powder and processing aid are mixed, added
Heat, obtains blank M;Wherein, the temperature of heating is 140-150 DEG C, and the time of heating is 40-50min;
(2) blank M, sodium oxalate, Boratex, silica, cobalt oxide, nickel oxide and iron oxide are mixed, sintered
After obtain grinding tool raw material;Wherein, the temperature of sintering is 800-1500 DEG C, and the time of sintering is 0.5-1h.
The present invention it is a kind of preferred embodiment in, in order that obtained grinding tool raw material possesses more outstanding beat
Effect is ground, relative to the diamond of 100 parts by weight, the consumption of the zirconium oxide is 20-40 parts by weight, the consumption of the carbonization silicon
For 40-50 parts by weight, the consumption of the boron carbide is 10-30 parts by weight, and the consumption of the schmigel is 70-90 parts by weight, institute
The consumption for stating bonding agent powder is 10-30 parts by weight, and the consumption of the processing aid is 15-25 parts by weight;
Relative to the blank M of 100 parts by weight, the consumption of the sodium oxalate is 10-25 parts by weight, the consumption of the Boratex
For 5-15 parts by weight, the consumption of the silica is 5-10 parts by weight, and the consumption of the cobalt oxide is 15-30 parts by weight, institute
The consumption for stating nickel oxide is 5-12 parts by weight, and the consumption of the iron oxide is 12-25 parts by weight.
The present invention it is a kind of preferred embodiment in, in order that obtained grinding tool raw material possesses more outstanding beat
Grind effect, one or more of the bonding agent powder in resin binder powder, metal-to-metal adhesive powder and rubber adhesive powder.
The present invention it is a kind of preferred embodiment in, in order that obtained grinding tool raw material possesses more outstanding beat
Grind effect, one or more of the processing aid in polyethylene glycol 200, machine oil and glycerine.
The present invention it is a kind of preferred embodiment in, in order that obtained grinding tool raw material possesses more outstanding beat
Grind and mixed in effect, step (1) by the way of centrifugation mixing, and the speed of centrifugation mixing is 100-120r/s, centrifugation mixing
Time be 20-30min.
Present invention also offers a kind of grinding tool raw material, the grinding tool raw material is made by above-mentioned preparation method.
The present invention will be described in detail by way of examples below.
Embodiment 1
By 100g diamonds, 20g zirconium oxides, 40g carbonizations silicon, 10g boron carbides, 70g schmigels, 10g resin binder powder
Mixed with 15g polyethylene glycol 200s and (by the way of centrifugation mixing, and centrifuge the speed of mixing for 100r/s, centrifugation mixing
Time be 20min), heating, obtain blank M;Wherein, the temperature of heating is 140 DEG C, and the time of heating is 40min;By 100g
Blank M, 10g sodium oxalate, 5g Boratexes, 5g silica, 15g cobalt oxides, 5g nickel oxide and 12g iron oxide are mixed, and are burnt
Grinding tool raw material A 1 is obtained after knot;Wherein, the temperature of sintering is 800 DEG C, and the time of sintering is 0.5h.
Embodiment 2
By 100g diamonds, 40g zirconium oxides, 50g carbonizations silicon, 30g boron carbides, 90g schmigels, 30g metal-to-metal adhesive powder
Mixed with 25g machine oil and (by the way of centrifugation mixing, and centrifuge the speed of mixing for 120r/s, centrifuge the time of mixing
For 30min), heating, obtain blank M;Wherein, the temperature of heating is 150 DEG C, and the time of heating is 50min;By 100g blanks M,
25g sodium oxalates, 15g Boratexes, 10g silica, 30g cobalt oxides, 12g nickel oxide and 25g iron oxide are mixed, after sintering
Obtain grinding tool raw material A 2;Wherein, the temperature of sintering is 1500 DEG C, and the time of sintering is 1h.
Embodiment 3
By 100g diamonds, 30g zirconium oxides, 45g carbonizations silicon, 20g boron carbides, 80g schmigels, 20g rubber adhesive powder
Mixed with 20g glycerine and (by the way of centrifugation mixing, and centrifuge the speed of mixing for 110r/s, centrifuge the time of mixing
For 25min), heating, obtain blank M;Wherein, the temperature of heating is 130 DEG C, and the time of heating is 45min;By 100g blanks M,
20g sodium oxalates, 10g Boratexes, 8g silica, 22g cobalt oxides, 8g nickel oxide and 18g iron oxide are mixed, after sintering
To grinding tool raw material A 3;Wherein, the temperature of sintering is 1200 DEG C, and the time of sintering is 0.8h.
Comparative example 1
It is prepared by the method according to embodiment 3, unlike, the diamond relative to 100g, the use of the zirconium oxide
Measure as 10g, the consumption of the carbonization silicon is 30g, and the consumption of the boron carbide is 5g, and the consumption of the schmigel is 60g, described
The consumption of rubber adhesive powder is 5g, and the consumption of the glycerine is 10g;Blank M relative to 100g, the consumption of the sodium oxalate
For 5g, the consumption of the Boratex is 2g, and the consumption of the silica is 2g, and the consumption of the cobalt oxide is 10g, the oxygen
The consumption for changing nickel is 2g, and the consumption of the iron oxide is 10g, obtains grinding tool raw material D1.
Comparative example 2
It is prepared by the method according to embodiment 3, unlike, the diamond relative to 100g, the use of the zirconium oxide
Measure as 50g, the consumption of the carbonization silicon is 55g, and the consumption of the boron carbide is 35g, and the consumption of the schmigel is 95g, institute
The consumption for stating rubber adhesive powder is 35g, and the consumption of the glycerine is 30g;Blank M relative to 100g, the sodium oxalate
Consumption is 30g, and the consumption of the Boratex is 20g, and the consumption of the silica is 15g, and the consumption of the cobalt oxide is
35g, the consumption of the nickel oxide is 15g, and the consumption of the iron oxide is 30g, obtains grinding tool raw material D2.
Test case
Test piece (initial roughness Ra is 0.7 μm) is carried out respectively using obtained grinding tool raw material A 1-A3, D1 and D2
Polishing, determines the agglomeration of its polish effect and observation grinding tool raw material, the results are shown in Table 1.
Table 1
Embodiment is numbered | Roughness Ra after test piece processing | Agglomeration |
Embodiment 1 | 0.24μm | Without obvious agglomeration |
Embodiment 2 | 0.22μm | Without obvious agglomeration |
Embodiment 3 | 0.22μm | Without obvious agglomeration |
Comparative example 1 | 0.35μm | Without obvious agglomeration |
Comparative example 2 | 0.39μm | There is a small amount of agglomeration |
Can be seen that grinding tool raw material A 1-A3 obtained within the scope of the present invention by upper table data can be effectively to experiment
Workpiece is polished, and grinding efficiency is higher, and the grinding tool raw material after polishing is without obvious agglomeration, and is made outside the scope of the invention
Grinding tool raw material D1 and D2 the polishing effect obtained is poor.
The preferred embodiment of the present invention described in detail above, still, the present invention are not limited in above-mentioned embodiment
Detail, in the range of the technology design of the present invention, a variety of simple variants can be carried out to technical scheme, this
A little simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (6)
1. a kind of preparation method of grinding tool raw material, it is characterised in that the preparation method includes:
(1) diamond, zirconium oxide, carbonization silicon, boron carbide, schmigel, bonding agent powder and processing aid are mixed, heated,
Obtain blank M;Wherein, the temperature of heating is 140-150 DEG C, and the time of heating is 40-50min;
(2) blank M, sodium oxalate, Boratex, silica, cobalt oxide, nickel oxide and iron oxide are mixed, after sintering
To grinding tool raw material;Wherein, the temperature of sintering is 800-1500 DEG C, and the time of sintering is 0.5-1h.
2. preparation method according to claim 1, wherein, relative to the diamond of 100 parts by weight, the use of the zirconium oxide
Measure as 20-40 parts by weight, the consumption of the carbonization silicon is 40-50 parts by weight, and the consumption of the boron carbide is 10-30 parts by weight,
The consumption of the schmigel is 70-90 parts by weight, and the consumption of the bonding agent powder is 10-30 parts by weight, the processing aid
Consumption is 15-25 parts by weight;
Relative to the blank M of 100 parts by weight, the consumption of the sodium oxalate is 10-25 parts by weight, and the consumption of the Boratex is 5-
15 parts by weight, the consumption of the silica is 5-10 parts by weight, and the consumption of the cobalt oxide is 15-30 parts by weight, the oxygen
The consumption for changing nickel is 5-12 parts by weight, and the consumption of the iron oxide is 12-25 parts by weight.
3. preparation method according to claim 1 or 2, wherein, the bonding agent powder is selected from resin binder powder, metal and glued
One or more in mixture powder and rubber adhesive powder.
4. preparation method according to claim 1 or 2, wherein, the processing aid be selected from polyethylene glycol 200, machine oil and
One or more in glycerine.
5. preparation method according to claim 1 or 2, wherein, mixed in step (1) by the way of centrifugation mixing, and
The speed of centrifugation mixing is 100-120r/s, and the time of centrifugation mixing is 20-30min.
6. a kind of grinding tool raw material, it is characterised in that the grinding tool raw material is as the preparation side described in any one in claim 1-5
Method is made.
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CN201710480664.6A CN107322498A (en) | 2017-06-22 | 2017-06-22 | Grinding tool raw material and preparation method thereof |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1134692A (en) * | 1993-11-12 | 1996-10-30 | 美国3M公司 | Abrasive grain and method for making the same |
CN1232419A (en) * | 1996-10-09 | 1999-10-20 | 诺顿公司 | Silicon carbide abrasive wheel |
EP1175965A2 (en) * | 2000-07-25 | 2002-01-30 | Ebara Corporation | Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate |
CN101148035A (en) * | 2007-11-06 | 2008-03-26 | 浙江工业大学 | Soft/hard abrasive grain mixed semi-fixation abrasive grain grinding tool |
CN101862995A (en) * | 2009-10-30 | 2010-10-20 | 西安泽豪实业有限责任公司 | Formula and production technology for diamond ultrathin blade for cutting corundum |
US20120066980A1 (en) * | 2008-04-18 | 2012-03-22 | Saint-Gobain Abrasifs | Hydrophilic and Hydrophobic Silane Surface Modification of Abrasive Grains |
-
2017
- 2017-06-22 CN CN201710480664.6A patent/CN107322498A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1134692A (en) * | 1993-11-12 | 1996-10-30 | 美国3M公司 | Abrasive grain and method for making the same |
CN1232419A (en) * | 1996-10-09 | 1999-10-20 | 诺顿公司 | Silicon carbide abrasive wheel |
EP1175965A2 (en) * | 2000-07-25 | 2002-01-30 | Ebara Corporation | Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate |
CN101148035A (en) * | 2007-11-06 | 2008-03-26 | 浙江工业大学 | Soft/hard abrasive grain mixed semi-fixation abrasive grain grinding tool |
US20120066980A1 (en) * | 2008-04-18 | 2012-03-22 | Saint-Gobain Abrasifs | Hydrophilic and Hydrophobic Silane Surface Modification of Abrasive Grains |
CN101862995A (en) * | 2009-10-30 | 2010-10-20 | 西安泽豪实业有限责任公司 | Formula and production technology for diamond ultrathin blade for cutting corundum |
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