CN107304467B - A kind of metal mask version manufacturing process and its manufacturing device - Google Patents

A kind of metal mask version manufacturing process and its manufacturing device Download PDF

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Publication number
CN107304467B
CN107304467B CN201610244251.3A CN201610244251A CN107304467B CN 107304467 B CN107304467 B CN 107304467B CN 201610244251 A CN201610244251 A CN 201610244251A CN 107304467 B CN107304467 B CN 107304467B
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Prior art keywords
substrate
mask version
metal mask
metal
metal base
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CN107304467A (en
Inventor
陈凯凯
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EverDisplay Optronics Shanghai Co Ltd
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EverDisplay Optronics Shanghai Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to technical field of manufacturing semiconductors, more particularly to a kind of metal mask version manufacturing process and its manufacturing device, one first substrate is provided, one is provided with the second substrate of preset pattern and a metal base, then the second substrate is provided with being fitted closely on one side to the lower surface of metal base of preset pattern, the smooth surface of first substrate is fitted closely to the upper surface of metal base, form an overall structure, and continue that the overall structure is heated and pressed, to form opening figure on metal base, first substrate is removed after cooling and the second substrate obtains metal mask version, the technical program provides a kind of completely new manufacturing process of metal mask version, traditional manufacturing technique is etched using acid solution, it is also easy to produce pollution in the production process, the novel manufacturing process does not generate pollution, ideal shape can be produced simultaneously The metal mask version of state.

Description

A kind of metal mask version manufacturing process and its manufacturing device
Technical field
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of metal mask version manufacturing process and its manufacture dresses It sets.
Background technique
In recent years, metal mask version (Mask) as vapor deposition OLED production in indispensable intermediate products, development with There is be closely connected for OLED development and popularization.
The manufacture of metal mask version at present is produced by wet etching mode.Etching process mainly uses acid molten Agent, if dealing with improperly will pollute the environment.Due to the metal mask version that wet etching produces, often there is masking structure Width and masking structure depth it is uncoordinated, and the two parameters are unfavorable factors for the vapor deposition of OLED.
The depth of masking structure is bigger, and effective film width is smaller, and film it is wide not enough in the case where will lead to picture lack color (example Such as: red picture is not red, and part shows orange etc. sometimes).The width of masking structure is smaller, and film width is smaller, and the wide reduction of film can be with Colour mixture risk is reduced, i.e., film is wide reduces in the risk for causing picture to reduce colour mixture while lacking color, therefore, metal mask version nothing Method reaches the depth of masking structure and the width of masking structure coordinates optimal state.
Therefore, how to manufacture that a kind of there is no the width of the depth of masking structure and masking structure can not coordinate to best shape The metal mask version of state becomes a great problem that those skilled in the art face.
Summary of the invention
In view of the above problems, the present invention proposes a kind of metal mask version manufacturing process and a kind of mask plate structure, the technology Scheme specifically:
A kind of metal mask version manufacturing process, which is characterized in that the manufacturing process includes:
The second substrate that one metal base, a first substrate and a surface are provided with preset pattern is provided;
The metal base is clamped between the second substrate between the first substrate and the second substrate, so that the metal base Two surfaces are bonded with the surface for being provided with the preset pattern on the first substrate and the second substrate respectively;
The metal base is heated, and the first substrate and the second substrate are pressed, is made described default Figure runs through the metal base, to form opening corresponding with the preset pattern on the metal base.
Above-mentioned metal mask version manufacturing process further include:
After metal base cooling, the cover board and the substrate are removed, to form the metal mask version.
Above-mentioned metal mask version manufacturing process, wherein in the manufacturing process:
It is formed according to aperture position to be formed in the metal mask version, in Yu Suoshu the second substrate and the opening pair The preset pattern answered.
Above-mentioned metal mask version manufacturing process, wherein in the manufacturing process:
Using electroforming process or etch process in forming the preset pattern in the second substrate.
Above-mentioned metal mask version manufacturing process, wherein in the manufacturing process:
The metal base is heated using vortex electricity.
Above-mentioned metal mask version manufacturing process, wherein in the manufacturing process:
The material of the metal base is abundant steel or stainless steel.
Above-mentioned metal mask version manufacturing process, wherein the area of the opening is more than or equal to 20 μm2
The present invention also provides a kind of manufacturing devices of metal mask version, which is characterized in that the manufacturing device includes:
Pressing device, including a first substrate and a second substrate, the first substrate include opposite first surface and Second surface, the second substrate include opposite third surface and the 4th surface, and on the third surface of the second substrate On be provided with preset pattern, the third surface of the first surface of the first substrate and the second substrate is for clamping a metal Substrate;
Heating device is preset with being formed on the metal base with described for heating to the metal base The corresponding opening of figure.
The manufacturing device of above-mentioned metal mask version, wherein the heating device is vortex electric heater unit.
The manufacturing device of above-mentioned metal mask version, wherein the material of the first substrate and the second substrate is The steel alloy of nickel-base material.
Above-mentioned technical proposal have the following advantages that or the utility model has the advantages that
The technical program provides a kind of completely new preparation method of metal mask version, while disclosing a kind of using this technology side The metal mask version of case manufacture, the manufacturing process is pollution-free, can produce the metal mask version of ideal form.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is metal mask version manufacturing process flow diagram in one embodiment of the invention;
Fig. 2-7 is the structural schematic diagram of metal mask version process for making in an example of the invention.
Specific embodiment
In order to allow the personnel for having this invention fields Conventional wisdom easily to implement this invention, referring to shown below Attached drawing, the embodiment of this invention is described in detail.But this invention can be implemented according to different forms, not only It is confined to embodiment described herein.In order to more clearly illustrate this invention, portion unrelated with explanation in drawing is omitted Point;Moreover, throughout the specification, similar drawing symbol is assigned to similar portions.
In the whole instruction of this invention, " connection " of some part and another part not only includes " directly Connection " further includes " being indirectly connected with " being connected by other components.
In the whole instruction of this invention, some component is located at " top " of another component, not only includes certain The state that one component is in contact with another component further includes the state that another component is additionally provided between two components.
In the whole instruction of this invention, some constituent element of some part " comprising " refers to, is not prohibiting especially Only under the premise of equipment, it is not other constituent elements of exclusion, but can also includes other constituent elements.
The terms of degree " about " that is used in the whole instruction of this invention, " substantial " etc., if prompt has manufacture And substance allowable error, mean that respective value or close to the numerical value;It is intended that preventing bad personnel that will be related to exact value Or the disclosure of absolute figure is used for improper purposes.The terms of degree used in the whole instruction of this invention "~(in ) stage " or "~stage ", be not " in order to~stage ".
' component ' in this specification refers to, the unit (unit) that is made of hardware, by the unit of software sharing, by software The unit constituted with hardware.
In addition, a unit can be made of more than two hardware or more than two units are made of a hardware. In this specification, the operation or function implemented by terminal, device or equipment, it is therein it is a part of it is available with corresponding terminal, The server generation that device or equipment are connected is for implementation.Equally, pass through the operation of server implementation or function, a part therein It can use the terminal being connected with the server, device or equipment to replace implementing.Next, referring to attached drawing, to this invention Example is described in detail.
Flow chart shown in Figure 1, the present invention provides a kind of metal mask version manufacturing process, referring first to shown in Fig. 2 Structure provides metal base 2, the first substrate 3 with first surface and second surface and has third surface and the 4th surface The second substrate 1, preset pattern, and the first surface of first substrate 3 and are provided on the third surface of the second substrate 1 The third surface of two substrates 1 is for clamping metal base 2;In addition to the preset pattern for being provided with protrusion on third surface, remaining table Face is chosen as smooth surface.It is noted that first to fourth surface described herein is to distinguish first substrate and the second substrate Each face used by expression method, be not construed as limiting the invention.
Structure shown in Figure 3 is arranged in the second substrate 1 as seen from the figure for the side schematic view of the second substrate 1 There are several protrusions, optionally, several protrusions are uniformly distributed in the second substrate 1, and raised shape can be set to low wide and up narrow Side be trapezoidal shape structure.
Structure shown in Figure 4 is the side structure schematic diagram of first substrate 3, the thickness on the both sides of the side of first substrate 3 Degree mainly enables first substrate 3 that metal base 2 is completely covered slightly larger than intermediate thickness, reason.
Wherein, according to aperture position to be formed in metal mask version, using etching or electroforming work in the second substrate 1 Skill forms preset pattern (several protrusions i.e. as shown in the figure) corresponding with opening.Optionally, the cross-sectional sizes size of these protrusions ≥20μm2
Continue, metal base 2 is clamped between first substrate 3 and the second substrate 1, so that metal base 2 is opposite Two surfaces are bonded with the third surface for being provided with preset pattern on the first surface of first substrate 3 and the second substrate 2 respectively, are formed Structural schematic diagram shown in Figure 5.
Then, metal base 2 is heated using vortex electric heater unit, and as shown in Figure 6 by first substrate 3 and the The pressing of two substrates 1 makes several protrusions being arranged in the second substrate 1 through metal base 2 until the first table of contact first substrate 3 Face, on metal base 2 formed opening 5, wherein formed on metal base 2 opening be arranged in it is convex in the second substrate 1 It is complementary to play shape, to form metal mask version as shown in Figure 7.
Present invention simultaneously discloses a kind of manufacturing devices of metal mask version, wherein the manufacturing device includes 4 He of pressing device Heating device.
Pressing device 4 includes first substrate 3 and the second substrate 1, and first substrate 3 includes opposite first surface and the second table Face, the second substrate 1 include opposite third surface and the 4th surface, and are provided on the third surface of the second substrate 1 default Figure, the first surface of first substrate 3 and the third surface of the second substrate 1 are for clamping metal base 2;
Heating device, it is corresponding with preset pattern to be formed on metal base 2 for being heated to metal base 2 Opening.
In an alternate embodiment of the present invention, heating device is vortex electric heater unit.
Wherein, heating device heats the metal base 2 being clamped between the second substrate 1 and first substrate 3, pressing Device 4 makes several raised (i.e. preset patterns) through 2 to the first base of metal base by squeezing the second substrate 1 and first substrate 3 The surface of plate 3, to form the metal mask version with opening figure 5.
Wherein, the material of metal base 2 is abundant steel or stainless steel, and the material of the second substrate 1 and first substrate 3 is Ni-based The steel alloy of material.
In conclusion the present invention provides a first substrate, one is provided with the second substrate of preset pattern and a Metal Substrate Then the second substrate is provided with being fitted closely on one side to the lower surface of metal base of preset pattern, by first substrate by material Smooth surface fits closely the upper surface of metal base, forms an overall structure, and continue to heat the overall structure And pressing removes first substrate after cooling and the second substrate obtains metal and covers to form opening figure on metal base Film version, the technical program provide a kind of completely new preparation method of metal mask version, the metal prepared by the manufacturing process Mask plate is pollution-free, while can produce the metal mask version of ideal form.
Mentioned-above this invention related description is only limited to some example;As long as having the affiliated technology of this invention This invention can be changed to by the Conventional wisdom in field without changing the technical thought of this invention or necessary feature Other forms.Therefore, mentioned-above example covers any implementation form of this invention, is not limited only to this theory Form in bright book.Implement for example, each component for being defined as single type is dispersible;Equally, the composition for being defined as dispersion is wanted Element can also be implemented with combining form.
The scope of this invention is not limited to above-mentioned detailed description, can cover patent claim described below;From In the definition of patent claim, range and equivalent conception it is derived have altered or change form be included in this item hair In bright scope.

Claims (9)

1. a kind of metal mask version manufacturing process characterized by comprising
The second substrate that one metal base, a first substrate and a surface are provided with preset pattern is provided;
The metal base is clamped between the second substrate between the first substrate and the second substrate, so that two tables of the metal base Face is bonded with the surface for being provided with the preset pattern on the first substrate and the second substrate respectively;
The metal base is heated, and the first substrate and the second substrate are pressed, makes the preset pattern Through the metal base, to form opening corresponding with the preset pattern on the metal base.
2. metal mask version manufacturing process as described in claim 1, which is characterized in that further include:
After metal base cooling, the first substrate and the second substrate are removed, to form the metal mask version.
3. metal mask version manufacturing process as described in claim 1, which is characterized in that using electroforming process or etch process in The preset pattern is formed in the second substrate.
4. metal mask version manufacturing process as described in claim 1, which is characterized in that using current vortex to the metal base It is heated.
5. metal mask version manufacturing process as described in claim 1, which is characterized in that the material of the metal base is invar Or stainless steel.
6. the manufacturing process of metal mask version as described in claim 1, which is characterized in that the area of the opening is more than or equal to 20 μm2
7. a kind of manufacturing device of metal mask version, which is characterized in that the manufacturing device includes:
Pressing device, including a first substrate and a second substrate, the first substrate include opposite first surface and second Surface, the second substrate includes opposite third surface and the 4th surface, and is set on the third surface of the second substrate It is equipped with preset pattern, the third surface of the first surface of the first substrate and the second substrate is for clamping a Metal Substrate Material;
Heating device, for being heated to the metal base.
8. the manufacturing device of metal mask version as claimed in claim 7, which is characterized in that the heating device is current vortex heating Device.
9. the manufacturing device of metal mask version as claimed in claim 7, which is characterized in that the first substrate and second base The material of plate is the steel alloy of nickel-base material.
CN201610244251.3A 2016-04-19 2016-04-19 A kind of metal mask version manufacturing process and its manufacturing device Active CN107304467B (en)

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CN108362771A (en) * 2018-02-13 2018-08-03 京东方科技集团股份有限公司 A kind of damage monitoring apparatus and system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55167153A (en) * 1979-06-11 1980-12-26 Nippon Sheet Glass Co Ltd Forming method for patterned film on alkali metal-containing glass plate
JPS56164560A (en) * 1980-05-21 1981-12-17 Fujitsu Ltd Manufacture of reinforcing mask
CN102486996A (en) * 2010-12-03 2012-06-06 中芯国际集成电路制造(北京)有限公司 Dual patterning method
CN103797149A (en) * 2011-09-16 2014-05-14 株式会社V技术 Vapor-deposition mask, vapor-deposition mask manufacturing method, and thin-film pattern forming method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55167153A (en) * 1979-06-11 1980-12-26 Nippon Sheet Glass Co Ltd Forming method for patterned film on alkali metal-containing glass plate
JPS56164560A (en) * 1980-05-21 1981-12-17 Fujitsu Ltd Manufacture of reinforcing mask
CN102486996A (en) * 2010-12-03 2012-06-06 中芯国际集成电路制造(北京)有限公司 Dual patterning method
CN103797149A (en) * 2011-09-16 2014-05-14 株式会社V技术 Vapor-deposition mask, vapor-deposition mask manufacturing method, and thin-film pattern forming method

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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District

Patentee after: Shanghai Hehui optoelectronic Co., Ltd

Address before: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District

Patentee before: EverDisplay Optronics (Shanghai) Ltd.

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