CN107302730B - Earphone framework and manufacturing process thereof - Google Patents
Earphone framework and manufacturing process thereof Download PDFInfo
- Publication number
- CN107302730B CN107302730B CN201710501587.8A CN201710501587A CN107302730B CN 107302730 B CN107302730 B CN 107302730B CN 201710501587 A CN201710501587 A CN 201710501587A CN 107302730 B CN107302730 B CN 107302730B
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- China
- Prior art keywords
- sliding
- arm
- sliding support
- polishing
- support arm
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000003466 welding Methods 0.000 claims abstract description 46
- 238000005498 polishing Methods 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 17
- 239000010959 steel Substances 0.000 claims description 17
- 229910001220 stainless steel Inorganic materials 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000005491 wire drawing Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Laser Beam Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention relates to the technical field of earphones, in particular to an earphone framework and a manufacturing process thereof, wherein the earphone framework comprises a framework body, sliding arms and sliding support arms, the sliding arms are welded at two ends of the lower part of the framework body, and the sliding support arms are welded on the sliding arms; the manufacturing process of the earphone framework comprises the following steps: manufacturing the sliding arm, manufacturing the sliding support arm, manufacturing the framework body, calibrating, welding, polishing and the like, wherein the connection modes among the framework body, the sliding arm and the sliding support arm of the earphone framework manufactured by the process are all welding, so that damage in the using process can be effectively prevented.
Description
Technical Field
The invention relates to the technical field of earphones, in particular to an earphone framework and a manufacturing process thereof.
Background
With the development of society, electronic products have become an indispensable part of people's life. Along with the development of electronic products, the demand of the earphone is also increased, the existing size-adjusting device is generally double-guide-rail adjustment, the existing headset framework is generally assembled through screws, the damage is easy to occur in the using process, and the number of die sleeves is large, the accumulated tolerance is large and the variety of materials is various in the manufacturing process; the connecting wire has a complex wiring mode, low fatigue resistance and easy failure; the assembly process is complicated, long in time consumption, high in difficulty and high in reject ratio; the production cost is high. Because the prior art welds the lead with the left earphone and the right earphone together, the earphone head can not be detached and replaced, and the individual demands of consumers can not be met.
Disclosure of Invention
The invention provides an earphone head, a manufacturing method thereof and an earphone using the same, which are used for solving the problems that the earphone head in the prior art is complex in structure, incapable of being detached and replaced and high in production cost.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides an earphone framework, which comprises a framework body, a sliding arm and a sliding support arm, wherein the sliding arm is welded at two ends of the lower part of the framework body, the sliding support arm is welded on the sliding arm, more than two scale grooves are formed in the sliding arm, a mounting groove and a sliding groove are formed in the sliding support arm, protruding parts are arranged at two ends of the upper end of the sliding support arm, grooves are formed in the side wall of the sliding support arm, and more than two through holes are formed in the framework body.
Preferably, the bottom of the sliding support arm is spherical.
Preferably, a positioning hole is formed in the upper portion of the skeleton body.
Preferably, the earphone skeleton is made of stainless steel.
A method of manufacturing an earphone armature, comprising the steps of:
A. manufacturing a sliding arm: polishing two sides of a cut or injection molded sliding arm into inclined planes with the inclined angle of 40-50 degrees, and polishing the upper end of the sliding arm into the inclined planes with the inclined angle of 40-50 degrees;
B. manufacturing a sliding support arm: polishing the side walls of the two ends of the sliding support arm to form grooves, polishing the side walls of the grooves to incline inwards by 10-20 degrees, and punching more than two scale grooves on the sliding support arm by utilizing gravity;
C. manufacturing a skeleton body: polishing the lower end of the cut or injection molded skeleton body to form an inclined plane with an inclined angle of 40-50 degrees;
D. manufacturing a skeleton body: polishing the lower end of the framework body to be a bevel of 40-50 degrees;
E. welding: installing the sliding arm in a groove of the sliding support arm, calibrating, and melting the steel wire by utilizing laser welding to combine the sliding arm with two ends of the sliding support arm to form a sliding support;
F. the steel wire is melted and dripped into the groove to form a welding seam by utilizing a laser welding technology, so that the framework body and the sliding support are combined into a sliding support arm;
G. matching the inclined plane at the lower end of the framework body with the inclined plane at the upper end of the sliding arm of the sliding support arm, and welding by utilizing a laser welding technology;
H. post-welding treatment: and (3) polishing the welding line, cleaning splashes, and polishing and correcting the welding line by flame or mechanical correction.
Preferably, the steel wire is a stainless steel wire having a diameter of 0.4 to 0.6 mm.
Preferably, the finished product prepared in the step H is integrally polished and ground.
Preferably, the finished product prepared in the step H is electroplated, and finally surface wire drawing is carried out.
The invention has the beneficial effects that:
the frame body, the sliding arm and the sliding support arm of the earphone frame manufactured by the process are welded, so that the earphone frame can be effectively prevented from being damaged in the using process; the manufacturing process can simplify the structure of the earphone framework, when in welding, two sides of the sliding support arm are abutted to the lower end of the groove, molten stainless steel wires are dripped into the groove, the sliding arm and the sliding support arm can be welded rapidly, the molten stainless steel wires can be prevented from entering the back of the groove, the steel wires are wasted, the later polishing time is reduced, and the cost can be effectively reduced.
The invention provides an earphone framework, which comprises a framework body, a sliding arm and a sliding support arm, wherein the sliding arm is welded at two ends of the lower part of the framework body, the sliding support arm is welded on the sliding arm, more than two scale grooves are formed in the sliding arm, a mounting groove and a sliding groove are formed in the sliding support arm, protruding parts are arranged at two ends of the upper end of the sliding support arm, grooves are formed in the side wall of the sliding support arm, more than two through holes are formed in the framework body.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic view of another view overall structure of the present invention.
Fig. 3 is a schematic view of the overall structure of another view of the present invention.
Fig. 4 is a schematic view of the whole structure of the sliding bracket of the present invention.
Fig. 5 is a cross-sectional view of AA of fig. 4.
Fig. 6 is an enlarged view of a portion of fig. 1 prior to welding.
The reference numerals are respectively:
the sliding support comprises a framework body-1, a sliding arm-2, a sliding arm-3, a scale groove-4, a mounting groove-5, a sliding groove-6, a protruding part-7, a groove-8, a through hole-9, a positioning hole-10 and a sliding support-11.
Detailed Description
The invention will be further described with reference to examples and drawings, to which reference is made, but which are not intended to limit the scope of the invention. The present invention will be described in detail below with reference to the accompanying drawings.
Example 1
As shown in fig. 1-5, the earphone frame provided by the invention comprises a frame body 1, a sliding arm 2 and a sliding support arm 3, wherein the sliding arm 2 is welded at two ends of the lower part of the frame body 1, the sliding support arm 3 is welded on the sliding arm 2, more than two scale grooves 4 are arranged on the sliding arm 2, a mounting groove 5 and a sliding groove 6 are arranged on the sliding support arm 3, protruding parts 7 are arranged at two ends of the upper end of the sliding support arm 3, a groove 8 is arranged on the side wall of the sliding support arm 3, more than two through holes 9 are arranged on the frame body 1.
As shown in fig. 1, in this embodiment, the bottom of the sliding arm 3 is configured to be spherical, which can prevent damage to left and right headphones mounted on two ends of the headphone frame during use.
As shown in fig. 1-3, in this embodiment, a positioning hole 10 is provided at the upper part of the skeleton body 1, so as to facilitate positioning during the process of automatically installing other parts such as left and right earphones.
In this embodiment, the earphone skeleton is made of stainless steel.
As shown in fig. 1 to 5, a method for manufacturing the earphone frame includes the following steps:
A. manufacturing a sliding arm 2: polishing two sides of the cut or injection molded sliding arm 2 into inclined planes with the inclined angle of 40 degrees, and polishing the upper end of the sliding arm 2 into the inclined planes with the inclined angle of 40 degrees;
B. manufacturing a sliding support arm 3: the method comprises the steps of polishing the side walls of two ends of a sliding support arm 3 to form grooves 8, polishing the side walls of the grooves 8 to incline inwards by 10 degrees, and punching more than two scale grooves 4 on the sliding support arm 3 by utilizing gravity;
C. manufacturing a skeleton body 1: polishing the lower end of the cut or injection molded skeleton body 1 to an inclined plane with an inclined angle of 40 degrees;
D. manufacturing a skeleton body 1: polishing the lower end of the framework body 1 to be a 40-degree inclined plane;
E. welding: the sliding arm 2 is arranged in a groove 8 of the sliding support arm 3 for calibration, and a steel wire is melted by laser welding to combine the sliding arm 2 with two ends of the sliding support arm 3 to form a sliding support 11;
F. the steel wire is melted and dripped into the groove 8 to form a welding line by utilizing a laser welding technology, so that the framework body 1 and the sliding support 11 are combined into a sliding support arm;
G. the inclined plane at the lower end of the framework body 1 is matched with the inclined plane at the upper end of the sliding arm 2 of the sliding support arm, and the framework body is welded by utilizing a laser welding technology;
H. post-welding treatment: and (3) polishing the welding line, cleaning splashes, and polishing and correcting the welding line by flame or mechanical correction.
As shown in fig. 1 to 5, the frame body 1, the sliding arm 2 and the sliding arm 3 of the earphone frame manufactured by the above process are all welded, so that the earphone frame can be effectively prevented from being damaged in the use process. The manufacturing process can simplify the structure of the earphone framework, when in welding, two sides of the sliding support arm 3 are abutted against the lower end of the groove 8, molten stainless steel wires are dripped into the groove 8, the sliding arm 2 and the sliding support arm 3 can be quickly welded, the molten stainless steel wires can be prevented from entering the back of the groove 8, the steel wires are wasted, the later polishing time is reduced, and the cost can be effectively reduced.
In this embodiment, the steel wire is a stainless steel wire with a diameter of 0.4 mm.
In this embodiment, the finished product obtained in step H is polished and ground integrally, so that the welded seam is flat without grooves 8.
In the embodiment, the finished product prepared in the step H is electroplated, and finally surface wire drawing is carried out, so that the surface of the prepared earphone skeleton is attractive, and the reflectivity is reduced.
Example two
A method of manufacturing an earphone armature, comprising the steps of:
A. manufacturing a sliding arm 2: polishing two sides of the cut or injection molded sliding arm 2 into inclined planes with the inclined angle of 50 degrees, and polishing the upper end of the sliding arm 2 into the inclined planes with the inclined angle of 50 degrees;
B. manufacturing a sliding support arm 3: the method comprises the steps of polishing the side walls of two ends of a sliding support arm 3 to form grooves 8, polishing the side walls of the grooves 8 to incline inwards by 20 degrees, and punching more than two scale grooves 4 on the sliding support arm 3 by utilizing gravity;
C. manufacturing a skeleton body 1: polishing the lower end of the cut or injection molded skeleton body 1 to form an inclined plane with an inclined angle of 50 degrees;
D. manufacturing a skeleton body 1: polishing the lower end of the framework body 1 to form a 50-degree inclined plane;
E. welding: the sliding arm 2 is arranged in a groove 8 of the sliding support arm 3 for calibration, and a steel wire is melted by laser welding to combine the sliding arm 2 with two ends of the sliding support arm 3 to form a sliding support 11;
F. the steel wire is melted and dripped into the groove 8 to form a welding line by utilizing a laser welding technology, so that the framework body 1 and the sliding support 11 are combined into a sliding support arm;
G. the inclined plane at the lower end of the framework body 1 is matched with the inclined plane at the upper end of the sliding arm 2 of the sliding support arm, and the framework body is welded by utilizing a laser welding technology;
H. post-welding treatment: and (3) polishing the welding line, cleaning splashes, and polishing and correcting the welding line by flame or mechanical correction.
The steel wire is a stainless steel wire with the diameter of 0.6 mm.
Example III
A method of manufacturing an earphone armature, comprising the steps of:
A. manufacturing a sliding arm 2: polishing two sides of the cut or injection molded sliding arm 2 into inclined planes with the inclined angle of 45 degrees, and polishing the upper end of the sliding arm 2 into the inclined planes with the inclined angle of 45 degrees;
B. manufacturing a sliding support arm 3: the method comprises the steps of polishing the side walls of two ends of a sliding support arm 3 to form grooves 8, polishing the side walls of the grooves 8 to incline inwards by 15 degrees, and punching more than two scale grooves 4 on the sliding support arm 3 by utilizing gravity;
C. manufacturing a skeleton body 1: polishing the lower end of the cut or injection molded skeleton body 1 to form an inclined plane with an inclined angle of 45 degrees;
D. manufacturing a skeleton body 1: polishing the lower end of the framework body 1 to form a 45-degree inclined plane;
E. welding: the sliding arm 2 is arranged in a groove 8 of the sliding support arm 3 for calibration, and a steel wire is melted by laser welding to combine the sliding arm 2 with two ends of the sliding support arm 3 to form a sliding support 11;
F. the steel wire is melted and dripped into the groove 8 to form a welding line by utilizing a laser welding technology, so that the framework body 1 and the sliding support 11 are combined into a sliding support arm;
G. the inclined plane at the lower end of the framework body 1 is matched with the inclined plane at the upper end of the sliding arm 2 of the sliding support arm, and the framework body is welded by utilizing a laser welding technology;
H. post-welding treatment: and (3) polishing the welding line, cleaning splashes, and polishing and correcting the welding line by flame or mechanical correction.
The steel wire is a stainless steel wire with the diameter of 0.5 mm.
The present invention is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present invention.
Claims (4)
1. A preparation method of an earphone framework is characterized in that: the method comprises the following steps:
A. manufacturing a sliding arm (2): polishing two sides of a cut or injection molded sliding arm (2) into inclined planes with the inclined angles of 40-50 degrees, and polishing the upper end of the sliding arm (2) into the inclined planes with the inclined angles of 40-50 degrees;
B. manufacturing a sliding support arm (3): the method comprises the steps of polishing the side walls at two ends of a sliding support arm (3) to form grooves (8), polishing the side walls of the grooves (8) to incline inwards by 10-20 degrees, and punching more than two scale grooves (4) on the sliding support arm (3) by utilizing gravity;
C. manufacturing a skeleton body (1): polishing the lower end of the cut or injection molded framework body (1) into an inclined plane with the inclined angle of 40-50 ℃;
D. welding: installing the sliding arm (2) in a groove (8) of the sliding support arm (3), calibrating, and melting the steel wire by utilizing laser welding to combine the sliding arm (2) with the two ends of the sliding support arm (3) to form a sliding support (11);
E. the steel wire is melted and dripped into the groove (8) to form a welding line by utilizing a laser welding technology, so that the framework body (1) and the sliding support (11) are combined into a sliding support arm;
F. the inclined plane at the lower end of the framework body (1) is matched with the inclined plane at the upper end of the sliding arm (2) of the sliding support arm, and the framework body is welded by utilizing a laser welding technology;
G. post-welding treatment: and (3) polishing the welding line, cleaning splashes, and polishing and correcting the welding line by flame or mechanical correction.
2. The method for manufacturing an earphone skeleton according to claim 1, wherein: the steel wire is a stainless steel wire with the diameter of 0.4-0.6 mm.
3. The method for manufacturing an earphone skeleton according to claim 1, wherein: and (3) polishing and grinding the whole finished product obtained in the step G.
4. The method for manufacturing an earphone skeleton according to claim 1, wherein: and (3) electroplating the finished product prepared in the step G, and finally, carrying out surface wire drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501587.8A CN107302730B (en) | 2017-06-27 | 2017-06-27 | Earphone framework and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501587.8A CN107302730B (en) | 2017-06-27 | 2017-06-27 | Earphone framework and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107302730A CN107302730A (en) | 2017-10-27 |
| CN107302730B true CN107302730B (en) | 2024-01-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710501587.8A Active CN107302730B (en) | 2017-06-27 | 2017-06-27 | Earphone framework and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107302730B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05277725A (en) * | 1992-03-24 | 1993-10-26 | Tomoe Corp | Welding method of steel member |
| US5369857A (en) * | 1992-12-08 | 1994-12-06 | Hello Direct | Method of making a telephone headset |
| JP2005277617A (en) * | 2004-03-24 | 2005-10-06 | Pioneer Electronic Corp | Headphone |
| CN201674636U (en) * | 2010-05-14 | 2010-12-15 | 中名(东莞)电子有限公司 | Wire-cutting preventing earphone belt |
| CN204408585U (en) * | 2014-12-29 | 2015-06-17 | 何单 | A kind of can K song evaluate earphone |
| CN105208480A (en) * | 2015-09-24 | 2015-12-30 | 厦门宇特信息技术有限公司 | Sliding electric conduction type head phone |
| CN106454601A (en) * | 2016-11-23 | 2017-02-22 | 厦门宇特信息技术有限公司 | Sliding conduction headset |
| CN206100380U (en) * | 2016-08-31 | 2017-04-12 | 东莞市纳百川电子科技有限公司 | Slip bandeau |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013099417A1 (en) * | 2011-12-29 | 2013-07-04 | ソニー株式会社 | Headphones |
-
2017
- 2017-06-27 CN CN201710501587.8A patent/CN107302730B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05277725A (en) * | 1992-03-24 | 1993-10-26 | Tomoe Corp | Welding method of steel member |
| US5369857A (en) * | 1992-12-08 | 1994-12-06 | Hello Direct | Method of making a telephone headset |
| JP2005277617A (en) * | 2004-03-24 | 2005-10-06 | Pioneer Electronic Corp | Headphone |
| CN201674636U (en) * | 2010-05-14 | 2010-12-15 | 中名(东莞)电子有限公司 | Wire-cutting preventing earphone belt |
| CN204408585U (en) * | 2014-12-29 | 2015-06-17 | 何单 | A kind of can K song evaluate earphone |
| CN105208480A (en) * | 2015-09-24 | 2015-12-30 | 厦门宇特信息技术有限公司 | Sliding electric conduction type head phone |
| CN206100380U (en) * | 2016-08-31 | 2017-04-12 | 东莞市纳百川电子科技有限公司 | Slip bandeau |
| CN106454601A (en) * | 2016-11-23 | 2017-02-22 | 厦门宇特信息技术有限公司 | Sliding conduction headset |
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| Publication number | Publication date |
|---|---|
| CN107302730A (en) | 2017-10-27 |
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