CN107298900A - A kind of conductive ink composition for printed circuit board - Google Patents
A kind of conductive ink composition for printed circuit board Download PDFInfo
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- CN107298900A CN107298900A CN201710543398.7A CN201710543398A CN107298900A CN 107298900 A CN107298900 A CN 107298900A CN 201710543398 A CN201710543398 A CN 201710543398A CN 107298900 A CN107298900 A CN 107298900A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
Abstract
The conductive ink composition for printed circuit board is disclosed, includes the component of following mass fraction：Conductive particle, 35 45 parts by weight；Epoxy resin, 25 35 parts by weight；Polymethyl methacrylate, 9 18 parts by weight；Organic solvent, 10 15 parts by weight；Adhesive aid, 58 parts by weight.Addition organic solvent can reduce the viscosity of conductive ink systems, improve rheological characteristic, be easy to conductive ink composition being uniformly printed on base material；Addition includes the adhesive aid of the silane coupler of acetic acid and end with sulfydryl, it is possible to increase conductive ink composition prevents it from being come off from base material the cohesive force of base material；Addition epoxy resin can improve the wear resistance and chemical resistance of conductive ink composition, reduce resistivity；Add polymethyl methacrylate, reacted by the carbomethoxy and the epoxy radicals of epoxy resin surface on polymethyl methacrylate main chain, the rheological characteristic and the adhesive force to base material of conductive ink composition can be improved, reduction solidification temperature is low, it is short to shorten the set time.
Description
Technical field
Combined the present invention relates to ink class field of material technology, more particularly to a kind of electrically conductive ink for printed circuit board
Thing.
Background technology
The background of related to the present invention is illustrated below, but these explanations might not constitute the existing of the present invention
Technology.
Electrically conductive ink refers to be printed on conductive stock, and electrostatic charge ability is accumulated with conduction electric current and exclusion
Ink, is usually imprinted on the non-conductive stock such as plastics, glass, ceramics or cardboard.Printing process is very wide, such as silk-screen printing,
Letterpress, intaglio printing, flexible version printing etc. can be used.Different printing processes can be selected according to the requirement of thickness,
The different then performances such as thermal conductivity, resistance, Solder resistance and rub resistance of thickness are also different.
Electrically conductive ink generally includes conducting material granule, adhesive, solvent and additive.Conducting material granule is usually used
The silver powder and copper powder conducted electricity very well, sometimes also with bronze, graphite, carbon black, carbon fiber etc..In addition, can also lead as needed
The additives such as dispersant, slipping agent, coupling agent are added in electric ink.The characteristic of conductive ink requirement has：Electric conductivity is (antistatic
Property), adhesive force, printability and solvent resistance etc..
In order that conductive ink composition has preferable printability, it is necessary to assure ink has preferable mobility.
Therefore, generally adding substantial amounts of solvent and diluent in ink formulations.Exist however, these solvents and diluent can reduce ink
Adhesive force on base material, causes the ink composite after solidification easily to be come off from base material.How ink mobility is being taken into account
Improving adhesive force of the ink on base material simultaneously turns into the major issue that those skilled in the art are badly in need of solving.
The content of the invention
It is an object of the invention to propose a kind of conductive ink composition for printed circuit board, conductive oil can be reduced
The viscosity of black system, rheological characteristic and good to the cohesive force of base material, and solidification temperature is low, the set time is short.
It is used for the conductive ink composition of printed circuit board according to the present invention, including：
Conductive particle, 35-45 parts by weight；
Epoxy resin, 25-35 parts by weight；
Polymethyl methacrylate, 9-18 parts by weight；
Organic solvent, 10-15 parts by weight；
Adhesive aid, 5-8 parts by weight；
Conductive particle is any one or combination in following material：Silver powder, copper powder, silver-plated copper powder；
Organic solvent includes the one or more in ethyl acetate, chloroform and acetone；
Adhesive aid includes acetic acid and end carries the silane coupler of sulfydryl.
In the conductive ink composition of the present invention, addition includes one or more in ethyl acetate, chloroform and acetone
Organic solvent, can reduce the viscosity of conductive ink systems, improve the rheological characteristic of conductive ink composition, be easy to electrically conductive ink
Composition is uniformly printed on base material；Addition includes the adhesive aid of the silane coupler of acetic acid and end with sulfydryl, can
Conductive ink composition is improved to the cohesive force of base material, prevents conductive ink composition from being come off from base material；Add epoxy resin
The wear resistance and chemical resistance of conductive ink composition can be improved, the resistivity of conductive ink composition is reduced；Addition is poly-
Methyl methacrylate, occurs anti-by the epoxy radicals of the carbomethoxy on polymethyl methacrylate main chain and epoxy resin surface
Should, it is possible to increase the rheological characteristic of conductive ink composition and the adhesive force to base material, reduction solidification temperature is low, shorten the set time
It is short.
Embodiment
The illustrative embodiments to the present invention are described in detail below.Description to illustrative embodiments is only
For illustration purposes, it is definitely not to the present invention and its application or the limitation of usage.
The present invention is used for the conductive ink composition of printed circuit board, includes the component of following mass fraction：
Conductive particle, 35-45 parts by weight；
Epoxy resin, 25-35 parts by weight；
Polymethyl methacrylate, 9-18 parts by weight；
Organic solvent, 10-15 parts by weight；
Adhesive aid, 5-8 parts by weight.
After electrically conductive ink is dried, because the distance between conducting particles diminishes, free electron moves shape along extra electric field direction
Into electric current, with good electric conductivity.The particle diameter of conductive particle is smaller, and the mobile route of free electron is longer, conductive composition
The resistivity of thing is higher；The particle diameter of conductive particle is excessive, then can not be uniformly adhered on base material, influences the using effect of product
And aesthetic feeling of the design.In some currently preferred embodiments of the present invention, conductive particle can be designed to laminated structure, conductive particle exists
Laminated structure maximum length in the plane be more than perpendicular to laminated structure length in the in-plane direction, so as to obtain foot
Enough wide and flat surface areas.Conductive particle can be used in metal dust, such as bronze, silver powder, copper powder, silver-plated copper powder
Any one or its combination, it is of course also possible to use graphite, carbon black, carbon fibre, nickel powder etc. are used as conductive particle.Argent grain
Stability preferably, there is preferable electrical conductivity and soft as conductive ink composition made from conductive particle using only argent
Property, therefore in certain embodiments, conductive particle is only comprising silver-colored metal dust.
The epoxy radicals of carbomethoxy and epoxy resin surface on polymethyl methacrylate main chain reacts, one side energy
The rheological characteristic and the adhesive force to base material of conductive ink composition are enough improved, reduction solidification temperature is low, it is short to shorten the set time, separately
On the one hand three-dimensional cross-linked network structure can be formed, conductive particle is attached on the network structure, so that electrically conductive ink group
Compound has preferable electrical conductivity.
In the present invention, the mass fraction of conductive particle is 35-45 parts by weight, such as 35 parts by weight, 40 parts by weight, 45 weight
Part.If the loading of conductive particle is too small, the electrical conductivity of gained conductive ink composition is higher.The loading mistake of conductive particle
Greatly, the poor fluidity of gained conductive ink composition, adhesion strength are low, and excessive loading can also increase conductive ink composition
Cost.In addition, if the loading of conductive particle is excessive, conductive particle can not be well-bonded and be retracted to the journey contacted with each other
Degree, produces more particle space so that the electrical conductivity of conductive ink composition is higher.
Prior art when preparing conductive ink composition, the loading of conductive particle have up to 90%, have as little as
20%, but the present inventor has found in chronic study procedure, in the components system of the present invention, if conductive particle
Addition is less than 35 parts by weight, such as when 25 parts by weight, 20 parts by weight or 15 parts by weight, the conductance of gained conductive ink composition
Rate is very low, or even can not form stabling current；If the addition of conductive particle is more than 45 parts by weight, such as 50 parts by weight, 70
When parts by weight or 90 parts by weight, the mobility of gained conductive ink composition is excessively poor, it is difficult to be coated uniformly on substrate surface, and
And the adhesion strength of conductive ink composition and base material is low, easily drops, even if being added into the component of conductive ink composition
Binding agent or other known diluent, can not also avoid the generation of above-mentioned situation.The reason for producing above-mentioned phenomenon be probably
Due to there is mutually synergy, and the effect of the synergy can not be merely from each group between each component in the application
Apparently predicted in the beneficial effect divided.
Epoxy resin after solidification has excellent adhesive strength to the surface of metal and nonmetallic materials, can avoid by
Current stability difference or current interruptions, the dielectricity of gained conductive particle caused by conductive particle comes off from epoxy resin
Can be good, set shrinkage factor is small, and product size stability is good.In addition, the hardness of epoxy resin is high, by improving electrically conductive ink group
The wear resistance of compound.In the present invention, the addition of epoxy resin is 25-35 parts by weight, such as 25 parts by weight, 30 parts by weight or
35 parts by weight.If addition is excessive, the poor fluidity of gained conductive ink composition, if addition is too small, gained electrically conductive ink
Composition is easily deformed, not wear-resisting.
Epoxy resin is thermosetting resin, on the one hand, its solidification temperature is higher, hardening time is longer so that electrically conductive ink
It is low that big, efficiency is lost in the solidification of composition；On the other hand, due to partly plastic base material, easy warpage is even damaged at high temperature, and
Epoxy resin film fragility is larger after solidification, hence in so that the bad adaptability of conductive ink composition, is unfavorable for popularization and application.It is existing
The conductive ink composition of technology, its solidification temperature is higher, the time is long, 15min or 150 DEG C of solidification of such as 200 DEG C solidifications
30min.This condition of cure is unfavorable for use of the conductive ink composition in thermal sensitivity circuit element.Based on above mentioned problem,
The present invention adds 9-18 parts by weight polymethyl methacrylates in conductive ink composition, and consolidating for conductive ink composition is made
Change temperature is lower, hardening time is shorter, such as disposable to solidify at a temperature of 180 DEG C at a temperature of 10min or 150 DEG C of solidification
20min can complete solidification, solidification temperature is lower, hardening time is shorter, and need not move through twice or repeatedly solidification, also without
Photocuring and heat cure need to be carried out respectively.Polymethyl methacrylate belongs to hard and crisp plastics, and has notch sensitivity,
It is easy to crack under stress, but polymethyl methacrylate is added in this mixture system, it will not only increase gained conductive
The hardness and fragility of ink composite, additionally it is possible to reduce the solidification temperature of conductive ink composition, shorten hardening time, this may
Interaction between polymethyl methacrylate and epoxy resin is relevant.The addition of polymethyl methacrylate is excessive,
Gained conductive ink composition is not only hard but also crisp, easily damaged；Addition is too small, it is impossible to plays reduction solidification temperature, shorten solidification
The effect of time.
During using electrically conductive ink printed circuit board, it is desirable to which electrically conductive ink has preferable mobility, otherwise it is difficult to conduction
Ink is uniformly coated on base material.The present invention is one or more organic in ethyl acetate, chloroform and acetone using including
Solvent, can reduce the viscosity of conductive ink systems, improve the mobility of conductive ink composition, consequently facilitating by electrically conductive ink
Composition is uniformly printed on base material.The addition of organic solvent can be 10-15 parts by weight, for example 10 parts by weight, 12 weight
Part or 15 parts by weight；If the addition of organic solvent is too low, the viscosity of conductive ink composition is big, poor fluidity, is unfavorable for
Conductive ink composition is uniformly printed on base material, when organic solvent addition as little as to a certain degree when, or even can not fill
Other solids fractions divided in dissolved constituent system；If the adding too much of organic solvent, the viscosity mistake of conductive ink composition
Low, mobility is excessive, is easily flowed everywhere when being coated on base material, influences the printing of circuit board.In addition, too high organic solvent
Addition can also reduce cohesive force of the conductive ink composition to base material, make the conductive ink composition after solidification easily from base material
In come off.
During long-term use or in the case of shock, bending, the circuit board of electrically conductive ink printing is easily from base material
In come off, influence circuit board and correspondence electric elements service life.Present invention addition in conductive ink composition includes end
Hydrolyzable group, such as chloro, methoxyl group, ethoxy in the adhesive aid of silane coupler of the end with sulfydryl, silane coupler
The groups such as base, methoxy ethoxy, acetoxyl group generate silanol when hydrolyzing, and silanol can be with inorganic material stable bond；Silane
The sulfydryl of coupling agent end reacts and combined with organic substance, so as to be erected between conductive ink composition and board substrate
" molecular bridge ", links together two kinds of materials, improves conductive ink composition to the cohesive force of base material, prevents electrically conductive ink group
Compound comes off from base material, improves the service life of printed circuit board.The addition of adhesive aid can be 5-8 parts by weight, example
Such as 5 parts by weight, 6 parts by weight, 7 parts by weight and 8 parts by weight.The adding too much of adhesive aid, can improve conductive ink composition
Viscosity, reduce its mobility, be unfavorable for being coated uniformly on base material；The addition of adhesive aid is too low, and electrically conductive ink is made
Composition is weaker to the adhesion of base material, is easily come off from base material.In order to improve silane coupler in organic solvent molten
Also include acetic acid in solution property and dispersing uniformity, adhesive aid of the invention.
Viscosity or mobility of the conductive ink composition of same composition on various boards base material and to difference
The adhesion of board substrate is different, and in order to improve the scope of application of conductive ink composition of the present invention, adhesive aid can enter
One step includes：Polyurethane adhesive.By adjusting the addition of polyurethane adhesive, the viscous of conductive ink composition can be adjusted
Spend and to the adhesion of board substrate.In certain embodiments, polyurethane adhesive is any one in following material
Or combination：The agent of polyisocyanates gluing, the adhesive for polyurethane containing NCO, hydroxyl adhesive for polyurethane and polyurethane
Resin gluing.
Influenced each other in conductive ink composition of the present invention between the addition of each component, it is in certain embodiments, conductive
Ink composite includes the component of following mass fraction：The parts by weight of conductive particle 40, the parts by weight of epoxy resin 30, polymethyl
The sour parts by weight of methyl esters 13, the parts by weight of organic solvent 12, the parts by weight of adhesive aid 5.Using the electrically conductive ink group of this constituent mass
Compound, mobility on copper circuit board base material is covered is more preferably, stronger to the adhesion that covers copper circuit board base material, and electrical conductivity
It is good；Solidification temperature is low, hardening time is short.
It may further include in conductive ink composition：The mineral fibres or chemical fibre of 1-5 parts by weight.Mineral fibres
With good dispersiveness, be conducive to making conductive particle uniformly be attached on epoxy resin, improve the electricity of conductive ink composition
Conductance.Chemical fibre has filament, and conductive particle is distributed along the filament rule, can shorten moving for free electron
Path is moved, the electrical conductivity of conductive ink composition is improved.Preferably, conductive particle is laminated structure, and mineral fibres or chemistry are fine
Dimension is coated on the surface of conductive particle laminated structure, so that mineral fibres or chemical fibre and conductive particle piece are sufficiently and uniformly
Contact.
In certain embodiments, mineral fibres is silica.On the one hand, the element silicon in silica can be improved and led
The rheological characteristic of electric ink composite, on the other hand, silica is acidic materials, and this acidic materials can improve electrically conductive ink
The electrical conductivity of composition.The quality of silica is no more than the 1.2% of conductive particle quality, and addition is excessive, can destroy epoxy
Balance between resin and polymethyl methacrylate, influences the property indices of conductive ink composition.
In further embodiments, chemical fibre is polypropylene fibre, and the quality of polypropylene fibre is no more than conductive particle
The 1.2% of quality.Due to the electrical insulating property that has of polypropylene fibre, therefore addition is unsuitable excessive, otherwise can reduce conductive oil
The electrical conductivity of ink composition.
It is illustrative to technical scheme with reference to specific embodiment.
Embodiment 1
Conductive ink composition includes the component of following mass fraction：Flake silver powder, 40 parts by weight；Epoxy resin, 30 weights
Measure part；Polymethyl methacrylate, 13 parts by weight；Organic solvent, 10 parts by weight；
Adhesive aid, 5 parts by weight.
Embodiment 2-10
In addition to the component proportion listed by table 1 below, other conditions are same as Example 1.
Conductive ink composition is to the adhesion strength of base material using maximum load power as index, and its measuring method is：Will test
Copper base material of covering carry out scouring with ethyl acetate and deoil, being then applied to conductive ink composition needs the surface of bonding, by two
Piece covers Copper base material and closed up, and is put in curing oven and solidifies after being fixed using metal racks, and solidification temperature is 150 DEG C, during solidification
Between 20min.After sample is cooled to room temperature, two progress tests are covered into Copper base material respectively round about using tensile testing machine
Pull, the maximum load power that test two is covered between Copper base material.Maximum load power is bigger, shows conductive ink composition to covering copper
The adhesion of base material is bigger, and bonding is more firm.
Each embodiment component proportion of table 1 and test result
Note：Embodiment in upper table, organic solvent is used as using the mixture of ethyl acetate and chloroform；It is viscous in embodiment 10
Knot auxiliary agent includes polyurethane adhesive.
It is can be seen that from embodiment 6-9 with the increase of adhesive aid addition, gained conductive ink composition is covering copper
Adhesive force on base material is continuously increased.Test result indicates that, when the addition of adhesive aid from 8 parts by weight increases to 10 parts by weight
When, conductive ink composition can not uniformly be coated on Copper base material is covered, and cover the conductive ink composition variable thickness in Copper base material
Cause, it is smaller that thicker position is in that the cohesive force covered in Copper base material is larger, relatively thin position is in the cohesive force covered in Copper base material, leads
Adhesive force of the gained conductive ink composition on Copper base material is covered is caused obvious decline occur.Test result indicates that, embodiment 10
After middle addition polyurethane adhesive, mobility of the gained conductive ink composition on Copper base material is covered is with being not added with polyurethane adhesive
Difference before stick less, does not influence conductive ink composition uniformly to be coated on Copper base material is covered；Can be with from embodiment 3 and 10
Find out, after adhesive aid addition polyurethane adhesive, adhesive force of the gained conductive ink composition on Copper base material is covered is obvious
Increase.
Although with reference to illustrative embodiments, invention has been described, but it is to be understood that the present invention does not limit to
The embodiment that Yu Wenzhong is described in detail and shown, in the case of without departing from claims limited range, this
Art personnel can make various changes to the illustrative embodiments.
Claims (10)
1. a kind of conductive ink composition for printed circuit board, it is characterised in that including：
Conductive particle, 35-45 parts by weight；
Epoxy resin, 25-35 parts by weight；
Polymethyl methacrylate, 9-18 parts by weight；
Organic solvent, 10-15 parts by weight；
Adhesive aid, 5-8 parts by weight；
The conductive particle is any one or combination in following material：Silver powder, copper powder, silver-plated copper powder；The organic solvent
Including the one or more in ethyl acetate, chloroform and acetone；The adhesive aid includes acetic acid and end carries the silicon of sulfydryl
Alkane coupling agent.
2. conductive ink composition as claimed in claim 1, it is characterised in that including：
Conductive particle, 40 parts by weight；
Epoxy resin, 30 parts by weight；
Polymethyl methacrylate, 13 parts by weight；
Organic solvent, 12 parts by weight；
Adhesive aid, 5 parts by weight.
3. conductive ink composition as claimed in claim 1, it is characterised in that the adhesive aid further comprises：Poly- ammonia
Ester gum stick.
4. conductive ink composition as claimed in claim 3, it is characterised in that the polyurethane adhesive is in following material
Any one or combination：The agent of polyisocyanates gluing, the adhesive for polyurethane containing NCO, hydroxyl polyurethane gluing
Agent and polyurethane resin gluing.
5. the conductive ink composition as described in claim 1-4 is any, it is characterised in that the conductive particle is only comprising silver
Metal dust.
6. the conductive ink composition as described in claim 1-4 is any, it is characterised in that further comprise：1-5 parts by weight
Mineral fibres or chemical fibre.
7. conductive ink composition as claimed in claim 6, it is characterised in that mineral fibres is silica, silica
Quality be no more than conductive particle quality 1.2%.
8. conductive ink composition as claimed in claim 6, it is characterised in that chemical fibre is polypropylene fibre, polypropylene
The quality of fiber is no more than the 1.2% of conductive particle quality.
9. conductive ink composition as claimed in claim 6, it is characterised in that conductive particle is laminated structure, mineral fibres
Or chemical fibre is coated on the surface of the laminated structure.
10. conductive ink composition as claimed in claim 9, it is characterised in that conductive particle plane where laminated structure
On maximum length be more than perpendicular to laminated structure length in the in-plane direction.
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| CN201710543398.7A CN107298900A (en) | 2017-07-05 | 2017-07-05 | A kind of conductive ink composition for printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109135417A (en) * | 2018-07-23 | 2019-01-04 | 东莞市润盈电子有限公司 | One kind exempting from laser engraving electrically conductive ink and preparation method thereof |
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Application publication date: 20171027 |
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| RJ01 | Rejection of invention patent application after publication |