CN107293850B - Metamaterial flat plate, preparation method thereof and metamaterial flat plate antenna - Google Patents
Metamaterial flat plate, preparation method thereof and metamaterial flat plate antenna Download PDFInfo
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- CN107293850B CN107293850B CN201610204564.6A CN201610204564A CN107293850B CN 107293850 B CN107293850 B CN 107293850B CN 201610204564 A CN201610204564 A CN 201610204564A CN 107293850 B CN107293850 B CN 107293850B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Aerials With Secondary Devices (AREA)
Abstract
The present disclosure relates to a metamaterial panel, a method of manufacturing the same, and a metamaterial panel antenna. A metamaterial panel antenna of the present disclosure, comprising: a radiator, and a metamaterial flat plate. The metamaterial flat plate comprises: a substrate; a metal microstructure formed on an upper surface of the substrate; and a plurality of metal patches formed on the lower surface of the substrate in an array arrangement, wherein the plurality of metal patches are arranged at intervals from each other. Wherein a surface of the metamaterial flat plate on which the metal microstructure is formed is disposed to face a radiation direction of the radiator.
Description
Technical Field
The present disclosure relates to antennas, and more particularly to planar antennas.
Background
A patch antenna is an antenna that propagates in only one particular direction. Patch antennas are commonly used in point-to-point situations, also known as "patch antennas".
In the prior art, the effect of low side lobe panel antennas is achieved mainly by phased array antennas. Phased array antennas achieve the effect of beam scanning by controlling the feed phase of the radiating elements in the array antenna to change the pattern shape, such as to achieve a low side lobe.
Phased array antennas have their own drawbacks. For example, the circuitry for controlling the feed phase at the rear of a phased array antenna can result in significant losses and the phased array antenna can be very expensive to manufacture. Thus, there is a need for an improved patch antenna.
Disclosure of Invention
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to a first aspect of the present disclosure, there is provided a metamaterial slab comprising: a substrate; a metal microstructure formed on an upper surface of the substrate; and a plurality of metal patches formed on the lower surface of the substrate in an array arrangement, wherein the plurality of metal patches are arranged at intervals from each other.
According to an embodiment of the present disclosure, the substrate is composed of an upper and a lower substrate, and wherein the metamaterial slab further comprises a low dielectric coefficient material bonding the upper and lower substrates together, and wherein the metal microstructures are formed on the upper substrate and the metal patches are formed on the lower substrate. In one example, the low dielectric coefficient material is one or a combination of paper honeycomb, foam, and the like.
According to another embodiment of the present disclosure, the metal microstructures may be two hollow "cross" shaped metal rings, parallel metal wires, metal fold lines, metal rings, metal square rings, etc., nested together, or any combination thereof.
According to yet another embodiment of the present disclosure, the metal microstructures and the metal patches are arranged in units of a lattice of a fixed shape, wherein the metal microstructures and the metal patches are formed on upper and lower crystal planes of the lattice, respectively.
According to yet another embodiment of the present disclosure, the size of the lattice is determined according to the desired wavelength band and the desired electrical properties.
According to yet another embodiment of the present disclosure, in each fixed-shape lattice, the size, shape, and arrangement of the metal microstructures, as well as the size of the metal patches and the spacing between the metal patches, are determined according to the phase and energy characteristics desired at the lattice.
According to a further embodiment of the present disclosure, the lattice is a cuboid lattice.
According to yet another embodiment of the present disclosure, the upper and lower crystal planes of the lattice are square crystal planes, and one metal microstructure is formed on the upper crystal plane, and four square metal patches are formed on the lower crystal plane.
According to a second aspect of the present disclosure, there is provided a low side lobe metamaterial panel antenna comprising: a radiator, and a metamaterial flat plate according to the first aspect of the present disclosure, wherein a surface of the metamaterial flat plate on which the metal microstructure is formed is disposed to face a radiation direction of the radiator.
According to yet another aspect of the present disclosure, there is provided a method of manufacturing a metamaterial slab, comprising: providing a substrate; forming a metal microstructure on an upper surface of the substrate; and forming a plurality of metal patches on a lower surface of the substrate, wherein the plurality of metal patches are disposed at intervals from each other.
According to an embodiment of the present disclosure, the substrate is composed of an upper and a lower substrate, and wherein the method further comprises bonding the upper and lower substrates together using paper honeycomb, and wherein the metal microstructures are formed on an upper surface of the upper substrate and the metal patches are formed on a lower surface of the lower substrate.
In this way, the distribution of energy and phase of electromagnetic waves emitted by the metamaterial microstructure is changed through the metal microstructure and the back metal patch, so that the low-sidelobe metamaterial panel antenna is obtained, a conventional phased array antenna is not needed, and loss and antenna cost are reduced.
Drawings
The above features and advantages of the present application will be better understood after reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily to scale and components having similar related features or characteristics may have the same or similar reference numerals.
FIG. 1 is a schematic diagram of an exemplary metamaterial slab according to an embodiment of the present disclosure;
FIG. 2 is a schematic illustration of an exemplary metamaterial slab according to another embodiment of the present disclosure;
fig. 3 is a top view, front view, left view, and schematic illustration of a back side of a panel of an exemplary metamaterial panel antenna in accordance with an embodiment of the present disclosure;
fig. 4 is an overall schematic diagram of an exemplary metamaterial panel antenna in accordance with an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of one lattice of a metamaterial slab according to an embodiment of the present disclosure;
fig. 6 is an example pattern of a metamaterial patch antenna in accordance with an embodiment of the present disclosure; and
fig. 7 is a flow chart of an exemplary method of manufacturing a metamaterial slab.
Detailed Description
The application is described in detail below with reference to the drawings and the specific embodiments. It is noted that the aspects described below in connection with the drawings and the specific embodiments are merely exemplary and should not be construed as limiting the scope of the application in any way.
The present inventors have recognized that by using the diversity of metamaterial microstructure sizes and shapes, low side lobe metamaterial panel antennas can be obtained by varying the distribution of energy and phase of electromagnetic waves emitted through the metamaterial microstructure without employing a phased array antenna.
Fig. 1 shows a schematic diagram 100 of an exemplary metamaterial slab according to an embodiment of the present disclosure. As shown in fig. 1, the metamaterial panel comprises three layers: a substrate 102, a metal microstructure layer 101 formed on an upper surface of the substrate 102, and a metal patch layer 104 formed on a lower surface of the substrate. According to an embodiment of the present disclosure, the metal patch layer includes a plurality of metal patches separated from each other by voids. For example, a plurality of metal patches are disposed apart from each other on the lower surface of the substrate 102. The substrate 102 may be various substrates known to those skilled in the art, such as a silicon (Si) substrate, a glass substrate, a layered silicon-insulator-silicon substrate, a gallium arsenide substrate, and the like, according to an embodiment of the present disclosure.
Fig. 2 is a schematic diagram 200 of an exemplary metamaterial slab according to another embodiment of the present disclosure. As shown in fig. 2, the metamaterial panel comprises five layers: a substrate 202a, a metal microstructure layer 201 formed on an upper surface of the substrate 202a, a substrate 202b, a metal patch layer 204 formed on a lower surface of the substrate 202b, and a low dielectric coefficient material 203 bonding the substrates 202a and 202 b.
In accordance with an embodiment of the present disclosure, the low dielectric coefficient material 203 has a suitable thickness to eliminate or reduce mutual electromagnetic interference between the metal microstructures and the metal patches. According to an embodiment of the present disclosure, the low dielectric coefficient material 203 may be paper honeycomb, foam, or the like. In one example, the low dielectric coefficient material 203 is paper honeycomb; in this example, the paper honeycomb may improve the flatness of the metamaterial slab, thereby improving the performance of the metamaterial slab.
An exemplary metamaterial panel antenna for one embodiment of the present disclosure will be described below in connection with fig. 1-6. Fig. 3 is a top view, front view, left view, and schematic illustration of a back side of a panel of an exemplary metamaterial panel antenna in accordance with an embodiment of the present disclosure.
As shown in the various views of fig. 3, the metamaterial panel antenna includes a metamaterial panel 300 and a radiator 305 according to an embodiment of the present disclosure.
As shown in the top view of fig. 3, the front face 301 of the metamaterial slab is densely populated with a plurality of metal microstructures. The front side 301 may be, for example, the metal microstructured layer 101 of fig. 1 or the metal microstructured layer 201 of fig. 2 described above, according to an embodiment of the present disclosure.
As shown in the back schematic view of fig. 3, the back surface 304 of the metamaterial plate is densely covered with a plurality of metal patches, wherein the plurality of metal patches are spaced apart from each other and separated by a certain gap. The back side 304 may be the metal patch layer 104 of fig. 1 or the metal patch layer 204 of fig. 2 described above, according to an embodiment of the present disclosure.
Fig. 4 is an overall schematic diagram of a metamaterial panel antenna in accordance with an embodiment of the present disclosure. As shown in fig. 4, the metamaterial panel antenna includes a radiator 401 and a metamaterial panel 402.
In this example, the metal microstructures are formed on the front side of the metamaterial slab 402, as shown more clearly in the partial enlargement 403 of the front side in fig. 4. Those skilled in the art will appreciate that while fig. 4 shows the metal microstructures as two hollow cross-shaped metal rings nested together at 403, the metal microstructures may be in any suitable form, such as two or more parallel metal lines, one or more metal fold lines, a metal ring, a metal square ring, any other form of metal ring, and the like. Further, in this example, a metal patch is formed on the back of the metamaterial slab 401, as shown at 404.
According to an embodiment of the present disclosure, the entire metamaterial flat plate is formed by arranging metal microstructures and metal patches in a lattice of a fixed shape. The lattice may be of any suitable shape, such as cuboid, hexagonal, cylindrical, etc. For example, according to an embodiment of the present disclosure, the lattice is in the form of a cuboid lattice, wherein the upper and lower crystal planes of the lattice are on the front and back sides of the metamaterial slab, respectively, and have a square shape. In addition, as shown in fig. 4 at 404, the cuboid lattice has four square shaped metal patches on the lower crystal plane (i.e., the back side) separated by voids.
According to one embodiment of the present disclosure, the size of the lattice is determined according to the desired wavelength band and the desired electrical properties. For example, according to an embodiment of the present disclosure, a rectangular parallelepiped lattice having 12mm square upper and lower crystal planes may be employed. In each lattice, the size, shape and arrangement of the metal microstructures, as well as the size of the metal patches and the gaps between them, are determined according to the desired phase and energy characteristics at the lattice. In other words, the metamaterial slab is formed by arranging individual lattices with each other, but the metal microstructure and the metal patches of each lattice are determined according to the phase and energy characteristics at the respective positions.
For example, different low side lobe effects require different energy distributions. From the desired target low side lobe, the desired energy distribution can be calculated. Thus, the lattice arrangement of the metamaterial slab is determined by selecting the shape and size of the appropriate metal microstructures and the size of the back metal patches, and the gap width (i.e., the size of the space) based on the desired phase and desired energy distribution converging to the feed.
A schematic of one lattice of a metamaterial slab according to an embodiment of the present application is shown in fig. 5. As shown in fig. 5, the example metamaterial slab lattice is a cuboid. However, those skilled in the art will appreciate that the lattice may be of various suitable shapes. In the embodiment shown in fig. 5, the front side of the metamaterial slab lattice is formed with a metal microstructure 501; the back of the metamaterial plate is formed with a metal patch 502. For example, fig. 5 shows that both the upper and lower crystal planes 503, 504 of the lattice are square. In the example of fig. 5, the metal microstructures 501 formed on the upper crystal plane 503 (i.e., the front side) are two hollow "cross-shaped metal rings nested together, and four square metal patches 502 are formed on the lower crystal plane 504 (i.e., the back side), and these metal patches are separated by a" cross-shaped slit 505. According to an embodiment of the present disclosure, the materials of the metal microstructures 501 and the metal patches 502 are the same. According to another embodiment of the present disclosure, the material of the metal microstructures 501 and the metal patches 502 is copper.
As shown in fig. 5, the exemplary metamaterial slab lattice further includes paper honeycomb 506. Wherein the upper and lower crystal planes 503 and 504 are substrates formed with the metal microstructures 501 and the metal patches 502, respectively, and they are bonded together by the paper honeycomb 506. According to an embodiment of the present disclosure, paper honeycomb 506 (which may be, for example, paper honeycomb 203 of fig. 2) has a suitable thickness to eliminate or reduce mutual electromagnetic interference between metal microstructures 501 and metal patches 502. At the same time, paper honeycomb 506 also increases the flatness of the metamaterial slab, thereby improving the performance of the metamaterial slab.
However, those skilled in the art will appreciate that the metal microstructures and back side metal patches shown in fig. 4-5 are shown for illustrative purposes only. The metal microstructures may be any number and may take various other configurations, such as straight lines, broken lines, curved lines, rectangular, circular, nested loops, and the like. The metal patches may also take various other configurations, such as 4 circular patches, 1 or 9 rectangular patches, and other numbers or shapes of metal patches.
In the metamaterial panel antenna shown in fig. 4, due to the gaps (i.e., intervals) between the metal patches on the back side of the metamaterial panel, part of electromagnetic waves can pass through, so that electromagnetic wave energy reflected by the metamaterial panel is reduced, and further, the energy variation range reflected by the metamaterial panel is enlarged (for example, by controlling the corresponding sizes and arrangements of the metal microstructures and the metal patches, electromagnetic wave reflection can reach 10% -100%, which corresponds to the energy distribution variation range of-20 to 0dB required by the phased array radar matrix). Thus, according to the phase and amplitude required by the simulated low-sidelobe phased array antenna, the distribution of the microstructure and the patches can be calculated, and further the required different phases and amplitudes are obtained, so that the effect of the low-sidelobe panel antenna is realized without the phased array antenna.
For example, an example pattern of a metamaterial patch antenna in accordance with an embodiment of the present disclosure is shown in fig. 6. As shown in fig. 6, at 12GHz, the first side lobe of the metamaterial panel antenna of the present disclosure is substantially below-28 dB, achieving the side lobe effect that can be achieved by a phased array antenna.
Fig. 7 is a flow chart 700 of a method of manufacturing a metamaterial slab according to an embodiment of the present disclosure.
As shown, the method begins at 710, where a substrate is provided. For example, the substrate 102 of fig. 1 may be provided. As another example, the substrate 202a of fig. 2 may be provided.
At step 720, a metal microstructure is formed on the upper surface of the substrate. For example, the metal microstructured layer 101 may be formed on the substrate 102 of fig. 1.
In step 730, a plurality of metal patches are formed on a lower surface of the substrate, wherein the plurality of metal patches are disposed apart from each other. The lower surface of the substrate is the surface opposite the upper surface of the substrate.
Alternatively, in accordance with an embodiment of the present disclosure, the substrate provided at step 710 is comprised of a first substrate and a second substrate, and wherein forming the metal microstructures on the upper surface of the substrate at step 720 comprises forming the metal microstructures on the upper surface of the first substrate and forming the metal patches on the lower surface of the substrate at step 730 comprises forming the metal patches on the lower surface of the second substrate. In this embodiment, the method 700 further includes the step of bonding the first substrate and the second substrate together using paper honeycomb. As shown in fig. 2, a substrate 202a is bonded to a paper honeycomb 203, and a substrate 202b is bonded to the paper honeycomb 203 opposite to the substrate 202a.
It will be appreciated by those skilled in the art that the order of operation of the steps described above is provided for illustrative purposes only and that the steps may be performed in a variety of suitable orders.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A metamaterial slab comprising:
a substrate composed of an upper substrate and a lower substrate, and wherein the metamaterial panel further comprises a low dielectric coefficient material bonding the upper substrate and the lower substrate together;
a metal microstructure formed on an upper substrate of the substrate, the metal microstructure being one or any combination of the following forms: parallel metal wires, metal fold lines, metal square rings, metal circular rings and two hollow cross-shaped metal rings which are nested together; and
a plurality of metal patches arranged in an array and formed on the lower substrate of the substrate, wherein the plurality of metal patches are arranged at intervals,
wherein the metal microstructure and the metal patch are arranged in a unit of a lattice of a fixed shape, wherein the metal microstructure and the metal patch are formed on an upper crystal plane and a lower crystal plane of the lattice, respectively,
and wherein in each fixed-shape lattice, the size, shape and arrangement of the metal microstructures and the size of and spacing between the metal patches are determined according to the phase and energy characteristics desired at the lattice.
2. The metamaterial slab of claim 1, wherein the low dielectric constant material is one or any combination of: paper honeycomb, foam.
3. The metamaterial slab of claim 1, wherein the size of the lattice is determined based on a desired wavelength band and a desired electrical property.
4. The metamaterial slab of claim 1, wherein the lattice is a cuboid lattice.
5. The metamaterial slab as recited in claim 4, wherein the upper and lower crystal planes of the crystal lattice are square crystal planes, and one metal microstructure is formed on the upper crystal plane, and four square metal patches are formed on the lower crystal plane.
6. A low side lobe metamaterial panel antenna comprising: a radiator, and a metamaterial panel as claimed in any one of claims 1 to 5, wherein a surface of the metamaterial panel on which the metal microstructures are formed is arranged to face a radiation direction of the radiator.
7. A method for manufacturing the metamaterial slab as set forth in any one of claims 1 to 5, comprising:
providing a substrate;
forming a metal microstructure on an upper surface of the substrate; and
forming a plurality of metal patches on a lower surface of the substrate, wherein the plurality of metal patches are arranged at intervals from each other,
wherein the metal microstructure and the metal patch are arranged in a unit of a lattice of a fixed shape, wherein the metal microstructure and the metal patch are formed on an upper crystal plane and a lower crystal plane of the lattice, respectively,
and wherein in each fixed-shape lattice, the size, shape and arrangement of the metal microstructures and the size of and spacing between the metal patches are determined according to the phase and energy characteristics desired at the lattice.
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