CN107286900A - A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays - Google Patents
A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays Download PDFInfo
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- CN107286900A CN107286900A CN201710463690.8A CN201710463690A CN107286900A CN 107286900 A CN107286900 A CN 107286900A CN 201710463690 A CN201710463690 A CN 201710463690A CN 107286900 A CN107286900 A CN 107286900A
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- modified silica
- micro led
- silica
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000003054 catalyst Substances 0.000 claims abstract description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 239000007822 coupling agent Substances 0.000 claims abstract description 12
- 229920006387 Vinylite Polymers 0.000 claims abstract description 11
- 239000002482 conductive additive Substances 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 229960001866 silicon dioxide Drugs 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 8
- 239000001301 oxygen Substances 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 6
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003921 oil Substances 0.000 claims abstract description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 5
- 239000001095 magnesium carbonate Substances 0.000 claims description 5
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 5
- 125000001624 naphthyl group Chemical group 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 150000001336 alkenes Chemical group 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 6
- 239000005977 Ethylene Substances 0.000 abstract description 6
- 229920001897 terpolymer Polymers 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920001558 organosilicon polymer Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003845 household chemical Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/267—Magnesium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays, it is made up of the raw material of following parts by weight：15 34 parts of modified silica-gel, 20 24 parts of vinylite, 35 40 parts of methyl vinyl silicon oil, 59 parts of Thermal conductive additives, 47 parts of coupling agent, 36 parts of aromatic amine antioxidant, 13 parts of platinum group catalyst.Compared with prior art, the beneficial effects of the invention are as follows：The present invention can be effectively reduced or be offset the problem of the transparency declines caused by index of refraction, greatly improve organic silica gel middle crosslink density, oxygen transmission rate and sulfidation-resistance energy by the addition of ethylene/methacrylic acid methyl terpolymer in modified silica-gel；γ glycidyl ether oxygen propyl trimethoxy silicanes coupling agent has good modified effect to the silica-filled system in modified silica-gel simultaneously.
Description
Technical field
The present invention relates to display screen technology field, and in particular to a kind of high refraction encapsulated for Micro LED displays
Rate modified silica-gel.
Background technology
Organosilicon material is that a class excellent performance, function be unique, purposes extremely wide new material, in being macromolecule new material
One of maximum material of industry size, is that one kind is related to technological innovation, the modernization of national defense, the national economic development and people's lives
The new material that level is improved.Organosilicon polymer is the general name of numerous high-molecular compounds containing element silicon, because main chain is with silicon
Oxygen key (- Si-O-) is constituted, and side chain can link various organic groups, with inorganic and organic polymer dual property.Organosilicon
Product is because with electric insulation, fire-retardant, radiation hardness, corrosion-resistant, high-low temperature resistant, and the good characteristic such as good biocompatibility,
The fields such as space flight and aviation, military project apparatus, electric, health care, automobile, building, household chemicals have a wide range of applications.
And organic silica gel be with bonding and sealing function a class silicone composition, by using different organosilicon polymers,
Additive and filler, can obtain the material silica gel composite of various requirement after room temperature, heating or radiation curing.
In recent years, China's power-type and high-power Micro LED displays have reached international industry bleeding edge,
The epitaxial wafer of Micro field of LED display and researching and producing for chip are quickly propelling, relative to ignore to encapsulating material
Research.Current China high brightness, high-power Micro LED displays encapsulation largely need import with organic silica gel, and price is held high
Expensive, this greatly limits the further development of Micro LED display industries.Because of domestic funds and the shortage of technology, product
There are problems that refractive index is relatively low, mouldability is poor, ageing-resistant performance not.Because the refractive index of general silicone binder is relatively low,
Only 1.38-1.43；The mouldability of organosilicon material is poor, develops new coupling agent, changes the shape of filler grain, is adjusted to
Type technique, this would be beneficial for the improvement of packaging plastic mouldability；The silicone binder and crosslinking agent for accelerating synthesis new, reduction solidification temperature
Shorten hardening time while spending, production efficiency is improved, to improve its ageing-resistant performance.
The content of the invention
The present invention is intended to provide a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays.
The present invention provides following technical scheme：
A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays, it is by the original of following parts by weight
Material composition：15-34 parts of modified silica-gel, 20-24 parts of vinylite, 35-40 parts of methyl vinyl silicon oil, 5-9 parts of Thermal conductive additives,
4-7 parts of coupling agent, 3-6 parts of aromatic amine antioxidant, 1-3 parts of platinum group catalyst.
The modified silica-gel includes according to the primary raw material of parts by weight：15-18 parts of organic silica gel, 4-10 parts of silica,
5-15 parts of ethylene/methacrylic acid methyl terpolymer.
The vinylite is the MT resins containing naphthyl, and its structural formula is as follows：
Wherein, m=1-8, n=1-4, m+n=3-10.
The coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane.
The Thermal conductive additives include according to the primary raw material of parts by weight：10-14 parts of magnesium carbonate, 7-16 parts of aluminum oxide, oxidation
5-12 parts of zinc.
The platinum group catalyst be karstedt catalyst, speier catalyst, platinum-vinyl siloxane complex and
Any one in platinum-olefin complex, platinum content is 4000-8000ppm.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention passes through ethylene/methacrylic acid in modified silica-gel
The addition of methyl terpolymer, can be effectively reduced or offset the problem of the transparency declines caused by index of refraction, carry significantly
Organic silica gel middle crosslink density, oxygen transmission rate and sulfidation-resistance energy are risen；While γ-glycidyl ether oxygen propyl trimethoxy silicane
Coupling agent has good modified effect to the silica-filled system in modified silica-gel.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays of embodiment 1, it is by following parts by weight
Several raw material compositions：15 parts of modified silica-gel, 20 parts of vinylite, 35 parts of methyl vinyl silicon oil, 5 parts of Thermal conductive additives, coupling
4 parts of agent, 3 parts of aromatic amine antioxidant, 1 part of platinum group catalyst.
The modified silica-gel includes according to the primary raw material of parts by weight：15-18 parts of organic silica gel, 4-10 parts of silica,
5-15 parts of ethylene/methacrylic acid methyl terpolymer.
The vinylite is the MT resins containing naphthyl, and its structural formula is as follows：
Wherein, m=1-8, n=1-4, m+n=3-10.
The coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane.
The Thermal conductive additives include according to the primary raw material of parts by weight：10-14 parts of magnesium carbonate, 7-16 parts of aluminum oxide, oxidation
5-12 parts of zinc.
The platinum group catalyst be karstedt catalyst, speier catalyst, platinum-vinyl siloxane complex and
Any one in platinum-olefin complex, platinum content is 4000-8000ppm.
A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays of embodiment 2, it is by following parts by weight
Several raw material compositions：34 parts of modified silica-gel, 24 parts of vinylite, 40 parts of methyl vinyl silicon oil, 9 parts of Thermal conductive additives, coupling
7 parts of agent, 6 parts of aromatic amine antioxidant, 3 parts of platinum group catalyst.
The modified silica-gel includes according to the primary raw material of parts by weight：15-18 parts of organic silica gel, 4-10 parts of silica,
5-15 parts of ethylene/methacrylic acid methyl terpolymer.
The vinylite is the MT resins containing naphthyl, and its structural formula is as follows：
Wherein, m=1-8, n=1-4, m+n=3-10.
The coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane.
The Thermal conductive additives include according to the primary raw material of parts by weight：10-14 parts of magnesium carbonate, 7-16 parts of aluminum oxide, oxidation
5-12 parts of zinc.
The platinum group catalyst be karstedt catalyst, speier catalyst, platinum-vinyl siloxane complex and
Any one in platinum-olefin complex, platinum content is 4000-8000ppm.
A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays of embodiment 3, it is by following parts by weight
Several raw material compositions：15-34 parts of modified silica-gel, 20-24 parts of vinylite, 38 parts of methyl vinyl silicon oil, Thermal conductive additives 7
Part, 6 parts of coupling agent, 5 parts of aromatic amine antioxidant, 2 parts of platinum group catalyst.
The modified silica-gel includes according to the primary raw material of parts by weight：15-18 parts of organic silica gel, 4-10 parts of silica,
5-15 parts of ethylene/methacrylic acid methyl terpolymer.
The vinylite is the MT resins containing naphthyl, and its structural formula is as follows：
Wherein, m=1-8, n=1-4, m+n=3-10.
The coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane.
The Thermal conductive additives include according to the primary raw material of parts by weight：10-14 parts of magnesium carbonate, 7-16 parts of aluminum oxide, oxidation
5-12 parts of zinc.
The platinum group catalyst be karstedt catalyst, speier catalyst, platinum-vinyl siloxane complex and
Any one in platinum-olefin complex, platinum content is 4000-8000ppm.
It is obvious to a person skilled in the art that the invention is not restricted to the details of the one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than the explanation is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Although not each moreover, it will be appreciated that the present specification is described in terms of embodiments
Embodiment is only comprising an independent technical scheme, and this narrating mode of specification is only this area for clarity
Technical staff should be using specification as an entirety, and the technical solutions in the various embodiments may also be suitably combined, forms this
Art personnel may be appreciated other embodiment.
Claims (6)
1. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays, it is characterised in that it is by following weight
The raw material composition of number：15-34 parts of modified silica-gel, 20-24 parts of vinylite, 35-40 parts of methyl vinyl silicon oil, heat conduction are helped
5-9 parts of agent, 4-7 parts of coupling agent, 3-6 parts of aromatic amine antioxidant, 1-3 parts of platinum group catalyst.
2. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays according to claim 1, its feature
It is：The modified silica-gel includes according to the primary raw material of parts by weight：15-18 parts of organic silica gel, 4-10 parts of silica, second
Alkene/5-15 parts of methylmethacrylate copolymer.
3. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays according to claim 1, its feature
It is：The vinylite is the MT resins containing naphthyl, and its structural formula is as follows：
Wherein, m=1-8, n=1-4, m+n=3-10.
4. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays according to claim 1, its feature
It is：The coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane.
5. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays according to claim 1, its feature
It is：The Thermal conductive additives include according to the primary raw material of parts by weight：10-14 parts of magnesium carbonate, 7-16 parts of aluminum oxide, zinc oxide 5-
12 parts.
6. a kind of high index of refraction modified silica-gel encapsulated for Micro LED displays according to claim 1, its feature
It is：The platinum group catalyst be karstedt catalyst, speier catalyst, platinum-vinyl siloxane complex and platinum-
Any one in olefin complex, platinum content is 4000-8000ppm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710463690.8A CN107286900A (en) | 2017-06-19 | 2017-06-19 | A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays |
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| CN201710463690.8A CN107286900A (en) | 2017-06-19 | 2017-06-19 | A kind of high index of refraction modified silica-gel encapsulated for Micro LED displays |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102876281A (en) * | 2012-09-13 | 2013-01-16 | 上海大学 | Preparation method for nano TiO2 modified high-refractive index organic silica gel for chip on board-light emitting diode (COB-LED) pressing strip |
| CN103805129A (en) * | 2013-09-27 | 2014-05-21 | 北京化工大学常州先进材料研究院 | Titanium-containing organic silicon adhesive with high refractive index |
| CN105111750A (en) * | 2015-09-09 | 2015-12-02 | 蓝星（成都）新材料有限公司 | Organosilicon sealant for LED (light-emitting diode) packaging |
| CN106751893A (en) * | 2016-12-02 | 2017-05-31 | 镇江高美新材料有限公司 | A kind of refractive power LED encapsulation add-on type liquid silicon rubbers high and preparation method thereof |
-
2017
- 2017-06-19 CN CN201710463690.8A patent/CN107286900A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102876281A (en) * | 2012-09-13 | 2013-01-16 | 上海大学 | Preparation method for nano TiO2 modified high-refractive index organic silica gel for chip on board-light emitting diode (COB-LED) pressing strip |
| CN103805129A (en) * | 2013-09-27 | 2014-05-21 | 北京化工大学常州先进材料研究院 | Titanium-containing organic silicon adhesive with high refractive index |
| CN105111750A (en) * | 2015-09-09 | 2015-12-02 | 蓝星（成都）新材料有限公司 | Organosilicon sealant for LED (light-emitting diode) packaging |
| CN106751893A (en) * | 2016-12-02 | 2017-05-31 | 镇江高美新材料有限公司 | A kind of refractive power LED encapsulation add-on type liquid silicon rubbers high and preparation method thereof |
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Application publication date: 20171024 |