CN107286627A - A kind of composite and preparation method thereof - Google Patents
A kind of composite and preparation method thereof Download PDFInfo
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- CN107286627A CN107286627A CN201610202938.0A CN201610202938A CN107286627A CN 107286627 A CN107286627 A CN 107286627A CN 201610202938 A CN201610202938 A CN 201610202938A CN 107286627 A CN107286627 A CN 107286627A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The invention discloses a kind of composite and preparation method thereof, the invention also discloses the copper-clad plate prepared using the composite and antenna substrate.The composite includes the graphene oxide wrapped up by epoxy resin, polyphenylene oxide and ceramic powder with core shell structure, wherein being counted on the basis of the weight of the composite, the graphene oxide consumption wrapped up by epoxy resin with core shell structure is 1 3wt%；The consumption of ceramic powder is 7 29wt%；The consumption of polyphenylene oxide is 70 90wt%.The composite prepared using the present invention can not influence the requirement of its dielectric constant while the density of composite is reduced.
Description
Technical field
The present invention relates to composite material with high dielectric constant for antenna substrate and preparation method thereof, further relate to make
The lightweight microwave copper-clad plate prepared with the composite.More particularly it relates to by being aoxidized comprising nucleocapsid
Graphene, the composite dielectric materials of barium-strontium titanate ceramic powder and polyphenylene oxide and use the composite dielectric materials system
The copper-clad plate obtained.
Background technology
Various communication equipments such as portable phone, and alignment system, such as communication positioning, bus location, individual
The fast development of the systems such as positioning, remote control mapping, navigation, the miniaturization of these equipment is promoted.In base
The square root of the wavelength for the signal propagated in plate and the relative dielectric constant of material is inversely proportional, and dielectric constant is high
Material makes signal wavelength shorten, so for the antenna substrate for inside communication equipment, it is normal using high dielectric
Several materials can minimize antenna substrate.To the copper-clad plate for antenna substrate, it is desirable to which it has dielectric
The small and lightweight feature of constant height, small volume, density.
The composite dielectric materials for being commonly used in antenna substrate at present mainly use polytetrafluoroethylene (PTFE), polyvinylidene fluoride
Alkene, polystyrene, epoxy resin etc. are as matrix resin, using ceramic powders, such as titanium dioxide, titanium
Sour strontium, barium titanate, CaCu 3 Ti 4 O etc. improve dielectric constant.
For example, a kind of multiple as made from the mixed-powder of Kynoar and calcium copper titanate ceramics in the prior art
Dielectric material is closed, the material has high-k, be easy to control the loading of filler, with Practical
Property.But in the composite dielectric material, the percent by volume of calcium copper titanate ceramics powder is up to 40%, cause multiple
Condensation material density ratio is larger, and mechanical performance drastically declines.
A kind of high dielectric constant copper clad laminate is also disclosed in the prior art, and it uses bisphenol A epoxide resin conduct
Matrix resin, using dicyandiamide or imidazoles as curing agent, using titanium dioxide, alchlor, barium titanate
Or lead titanates etc. is made as high dielectric filler.The copper-clad plate cost is low to have good dielectric properties.But
Preparation process epoxy resin consumption is 100 parts, and high dielectric filler is 480-500 parts, and the ceramics of high content are filled out
Material not only can increase copper-clad plate density, and be unfavorable for the raising of its mechanical performance.
Have in addition prior art discloses a kind of polymer composite, it includes thermally conductive materials and electromagnetism
Ripple shielding material, the thermally conductive materials include metal, ceramic powder, carbon black, carbon fiber, graphene or stone
Black olefinic oxide etc., high score is used as using thermoplastic resin such as polyphenylene oxide, fluorocarbon resin, polystyrene type etc.
Sub- adhesive, due to the bad dispersibility in the composite such as carbon black, graphene, need to using polyvinyl alcohol,
Polyethylene glycol, ethylene glycol, propane diols, butanediol, triethylene glycol etc. are used as dispersant.The invention is by heat conduction material
Material is scattered in polymer binder with electromagnetic shielding material, fully blending, most end form under dispersant effect
High molecular structure is dispersed in into particle.
But the composite prepared using these prior arts, the close of composite is being reduced it is difficult to meet simultaneously
The requirement of its dielectric constant is not influenceed while spending.
The content of the invention
The oxidation stone wrapped up by epoxy resin with core shell structure is included it is an object of the invention to provide a kind of
The composite material with high dielectric constant of black alkene, polyphenylene oxide and ceramic powder and it is prepared into using the composite
The copper-clad plate arrived and antenna substrate.Oxygen of the present invention that wrapped up by epoxy resin with core shell structure
Graphite alkene has good dispersive property in polyphenylene oxide resin, graphene can be overcome to disperse in media as well
Property difference defect, can reduce ceramic powder consumption using the graphene oxide with core shell structure, can subtract
The density of small composite does not influence dielectric constant simultaneously, so as to prepare compound with high-k
Material.
One aspect of the present invention is used for composite there is provided one kind, and composite, which is included, has nucleocapsid knot
The graphene oxide wrapped up by epoxy resin, polyphenylene oxide and the ceramic powder of structure, wherein with the weight of composite
Counted on the basis of amount, the graphene oxide consumption wrapped up by epoxy resin with core shell structure is 1-3wt%；
The consumption of ceramic powder is 7-29wt%；The consumption of polyphenylene oxide is 70-90wt%.
Further, ceramic powder is barium-strontium titanate ceramic powder.
Further, epoxy resin is bisphenol A type epoxy resin.
Further polyphenylene oxide is the polyphenylene oxide of graft modification.
It is multiple in high-k that another aspect of the present invention provides the graphene oxide with core shell structure
It is used to reduce the purposes of product density in condensation material.
Another aspect of the present invention provides method prepared by composite, comprises the following steps：
1) graphene oxide is dissolved in solvent, adds epoxy resin ingredient progress ultrasonic wave and disperse, with
Surface of graphene oxide is set to wrap up epoxy resin, so as to obtain being wrapped up by epoxy resin with core shell structure
Graphene oxide；
2) by the graphene oxide wrapped up by epoxy resin with core shell structure, polyphenylene oxide and ceramic powder
Body is mixed and is film-made, wherein being counted on the basis of the weight of the composite, with core shell structure by epoxy
The graphene oxide consumption of resin parcel is 1-3wt%；The consumption of ceramic powder is 7-29wt%；Polyphenylene oxide
Consumption is 70-90wt%.
Further, epoxy resin ingredient and the weight proportion scope of graphene oxide are 5：1~1：1.2.
Further, it is the film obtained in step 2 is hot-forming.
Further, it is filmed using the tape casting.
There is provided the copper-clad plate being made of composite for another aspect of the present invention.
There is provided the antenna substrate that composite is made for another aspect of the present invention.
The present invention has following beneficial effect：Obtained composite density is small, lightweight, it is adaptable to day
Line substrate, and preparation method cost is low, and technique is simple, available for lightweight copper-clad plate composite dielectric materials
Large-scale production.In addition, the addition of ceramic powder can improve the dielectric constant of composite, so as to can realize
The miniaturization of antenna.
Brief description of the drawings
Lightweight nucleocapsid graphene/barium strontium titanate/polyphenylene oxide high-k composite wood that Fig. 1 provides for the present invention
The preparation method schematic flow sheet of material.
Embodiment
With reference to specific embodiment, the present invention is further illustrated.It should be understood that these embodiments are only used
In the explanation present invention rather than limitation the scope of the present invention.The reality of unreceipted actual conditions in the following example
Proved recipe method, generally according to normal condition, or according to the condition proposed by manufacturer.Ratio and percentage base
In mole, unless stated otherwise.
The present inventor is currently used for adding in the composite of copper-clad plate by in-depth study extensively, first hair
Plus ceramic powder consumption can be greatly decreased in a small amount of graphene oxide with core shell structure, it can not lose multiple
Its density is reduced in the case of the dielectric constant for closing dielectric material, so as to provide with the light of superior dielectric performance
Matter copper-clad plate.
In the present invention, term " graphene oxide wrapped up by epoxy resin with core shell structure " refers to
The graphene oxide wrapped up by epoxy resin, it is prepared by the following method：Micron order stratiform is aoxidized
Graphene, is added in anhydrous propanone solvent, then adds normal-temperature curing epoxy resin bi-component, ultrasonic wavelength-division
Scattered reaction makes surface of graphene oxide wrap up one layer of cured epoxy resin.
Term " epoxy resin " refers to the resin compound at least containing two reactive epoxy groups in molecule,
Common epoxy resin includes bisphenol A type epoxy resin, bisphenol f type epoxy resin etc..In the present invention, institute
State epoxy resin and be preferably but not limited to bisphenol A type epoxy resin.
Term " ceramic powder " refers to the inorganic ceramic particle of micron-nanometer rank, such as barium strontium titanate,
The particles such as barium titanate.Increase the dielectric constant of product using ceramic powder generally in composite dielectric materials,
But required ceramic powder addition is higher, usual mass fraction is more than 50%, can cause composite density ratio
Larger, mechanical performance drastically declines.Strontium titanates, barium strontium titanate, rutile-type can be used in the present invention
The ceramic powders such as titanium dioxide, preferably barium-strontium titanate ceramic powder.
The chemical name of term " polyphenylene oxide " is poly- 2,6- dimethyl-Isosorbide-5-Nitrae-phenylate, abbreviation PPO, herein
In, polyphenylene oxide includes unmodified or modified polyphenylene oxide, and modified polyphenylene oxide can be modified functionalized poly
Phenylate, such as amination, esterification, the polyphenylene oxide of etherificate.
In the present invention, the composite material with high dielectric constant is included with core shell structure by epoxy resin bag
Graphene oxide, polyphenylene oxide and the ceramic powder wrapped up in, are counted on the basis of the weight of the composite, had
The graphene oxide consumption wrapped up by epoxy resin of core shell structure is 1-3wt% (percentage by weight), excellent
Select 3wt%；The consumption of ceramic powder is 7-29wt%, preferably 20wt%；The consumption of polyphenylene oxide is 70-90wt%,
It is preferred that 77wt%.
The preparation method the most conventional of composite material with high dielectric constant of the present invention is to be molded/be hot pressed into
Type, the described method comprises the following steps：
1) graphene oxide is dissolved in solvent, adds epoxy resin ingredient progress ultrasonic wave and disperse, with
Surface of graphene oxide is set to wrap up epoxy resin, so as to obtain being wrapped up by epoxy resin with core shell structure
The weight proportion scope of graphene oxide, wherein epoxy resin ingredient and graphene oxide is 5：1~1：1.2；
2) by the graphene oxide wrapped up by epoxy resin with core shell structure, polyphenylene oxide and ceramic powder
Body is mixed and is film-made, and obtained film is hot-forming, wherein counted on the basis of the weight of the composite,
The graphene oxide consumption wrapped up by epoxy resin with core shell structure is 1-3wt%, preferably 3wt%；Pottery
The consumption of porcelain powder is 7-29wt%, preferably 20wt%；The consumption of polyphenylene oxide is 70-90wt%, preferably 77wt
%.
In one preferred embodiment of the invention, graphene oxide is dissolved in anhydrous propanone solvent,
Add epoxy resin bi-component progress ultrasonic wave to disperse, react 30 minutes, so that surface of graphene oxide is wrapped up
One layer of cured epoxy resin, drying for standby, so as to obtain the oxygen wrapped up by epoxy resin with core shell structure
Graphite alkene；Then by the graphene oxide wrapped up by epoxy resin with core shell structure of 1-3 parts by weight,
The polyphenylene oxide of 70-90 parts by weight and the strontium-barium titanate ceramic powder mixing of 7-29 parts by weight, put into toluene solvant
In, ultrasonic disperse 30 minutes, then high-speed stirred 15 minutes, obtained solution curtain coating is made certain thickness
Film, by product thickness, the pellicular cascade is put into mould, in 280-300 DEG C of temperature and
Hot-forming under 10-20MPa pressure, the dwell time is 5-15 minutes.
The thickness for the composite dielectric materials plate that the present invention is prepared usually 1.5-3.0mm, Ke Yitong
Cross the thickness of repeatedly molding regulation composite dielectric materials plate.
Composite material with high dielectric constant of the present invention, according to the difference of concrete application, can mix a small amount of one
Plant or multiple additives, the additive includes antioxidant, age resister, elastomer, anti ultraviolet agent.
Graphene oxide of the present invention that wrapped up by epoxy resin with core shell structure has dielectric
The characteristics of constant height and good dispersion, the graphene oxide skeleton micro-structural wrapped up by epoxy resin can be uniform
Ground is scattered in composite, increases the dielectric constant of composite and reduces density, in terms of volume lightweight
Better than conventional composite dielectric material, and preparation method is simple, cost is low, is covered available for large-scale production lightweight
Copper coin.Because composite dielectric constant is high, it is expected to realize the miniaturization of antenna.
The use nucleocapsid graphene oxide that the present invention is provided/barium-strontium titanate ceramic powder/polyphenylene oxide is situated between as compound
The copper-clad plate of material has good dielectric properties and lightweight feature simultaneously, can meet antenna substrate pair
In high-k and light-weighted dual requirementses.Copper-clad plate using the composite dielectric materials of the present invention is obvious
Better than the copper-clad plate using existing composite dielectric materials, and the material preparation method technique is simple, technical costs
It is low.
It will be appreciated by those skilled in the art that except by nucleocapsid graphene oxide/ceramic powder of the present invention/poly-
Outside phenylate is as composite dielectric materials, derivative of the composite dielectric materials or the like can also be used,
Or the mixing material of the composite dielectric materials and other conventional additives etc. is used to use in antenna substrate
Copper-clad plate.After the above-mentioned instruction content of the present invention has been read, those skilled in the art can be to this hair
Bright to make various changes or modifications, these equivalent form of values equally fall within what the application appended claims were limited
Scope.
Raw material sources and preparation
The preparation of graphene oxide with core shell structure：
Graphene oxide is dissolved in solvent, epoxy resin ingredient progress ultrasonic wave is added and disperses, so that oxygen
Epoxy resin is wrapped up on graphite alkene surface, so as to obtain the oxidation wrapped up by epoxy resin with core shell structure
Graphene.
The method of testing of performance
The test of the dielectric constant of composite
Dielectric constant is carried out using electric impedance analyzer, and basic step is as follows：Composite sample is prepared, is recorded
Area and thickness of sample.Sample top and bottom are connected with probe station, then probe station is connected on electric impedance analyzer,
Frequency sweep, testing capacitor is converted to dielectric constant according to plate condenser formula.
The density measurement of composite
Density is carried out using Density Measuring Instrument.
Embodiment 1：
Prepare the graphene oxide with core shell structure：
10g micron order layered graphite oxide alkene is weighed, is added in 30g anhydrous propanone solvents, then adds 10g
Normal-temperature curing epoxy resin bi-component, the scattered reaction of ultrasonic wave 30 minutes, makes surface of graphene oxide wrap up one
Layer cured epoxy resin, then drying for standby.
Prepare composite material with high dielectric constant
(1) dispensing：Weigh 87 grams of polyphenylene oxide resins, 10 grams of barium-strontium titanate ceramic powder, 3 grams of epoxy resin bags
Wrap up in graphene oxide, input toluene solvant, ultrasonic disperse 30 minutes, then high-speed stirred 15 minutes；
(2) it is film-made：The film that thickness is 0.15mm is made in above-mentioned solution curtain coating；
(3) it is hot-forming：By above-mentioned pellicular cascade to 1.5mm thickness, it is put into mould, is in a temperature
280-300 degree, pressure is 10-20MPa, and the dwell time is hot-forming under conditions of 5-15 minutes, so as to make
It is standby to obtain composite material with high dielectric constant plate of the present invention.
The preparation of copper-clad plate
Above-mentioned composite panel is taken out, copper foil is plated thereon, that is, obtains copper-clad plate.Technique used can be with
For vacuum evaporation or electroless plating.
The copper-clad plate properties of product prepared are tested, its dielectric constant is 8.3, and density is 1.2 grams/cube
Centimetre.
Embodiment 2：
The preparation of graphene oxide with core shell structure is identical with described in embodiment 1, and difference is to make
77 grams of polyphenylene oxide, 20 grams of barium-strontium titanate ceramic powder and 3 grams of asphalt mixtures modified by epoxy resin are used during standby composite material with high dielectric constant
Fat wraps up graphene oxide, and copper-clad plate, test are prepared using the step identical with described in embodiment 1 and condition
Obtained copper-clad plate properties of product, its dielectric constant is 15.2, and density is 1.8 grams/cc.
Embodiment 3:
The preparation of graphene oxide with core shell structure is identical with described in embodiment 1, and difference is to make
79 grams of polyphenylene oxide, 20 grams of barium-strontium titanate ceramic powder and 1 gram of asphalt mixtures modified by epoxy resin are used during standby composite material with high dielectric constant
Fat wraps up graphene oxide, and copper-clad plate, test are prepared using the step identical with described in embodiment 1 and condition
Obtained copper-clad plate properties of product, its dielectric constant is 14.5, and density is 1.79 grams/cc.
Comparative example 1:
Without using the graphene oxide with core shell structure in the formula of composite, using 80 grams of polyphenylene oxide and
20 grams of barium-strontium titanate ceramic powder prepare composite and copper-clad plate, prepare the step of composite and copper-clad plate and
Condition is identical with described in embodiment 1.Obtained copper-clad plate properties of product are tested, its dielectric constant is 8.3, close
Spend for 1.7 grams/cc.
As can be seen that do not use the graphene oxide with core shell structure composite dielectric materials need to use compared with
The barium-strontium titanate ceramic powder of high content realizes high-k, but the ceramic powder of high content can make product density
It is higher, it is unfavorable for product lightweight.
The graphene oxide that the present invention only adds 3 grams of epoxy resin parcels can be reduced the consumption of ceramic powder
10 grams, density reduction is realized in the case where not reducing dielectric constant, is conducive to product to realize lightweight, it is special
Not Shi Yongyu communication equipment antenna substrate.
It is constant (20%) that the result of comparing embodiment 2 and 3 can be seen that holding barium-strontium titanate ceramic powder content
And the consumption of the graphene oxide with core shell structure is reduced, the dielectric constant increase rate of composite is compared
There is a certain degree of reduction in embodiment 2.
With the increase of barium-strontium titanate ceramic powder content, product dielectric constant increase, but density also increase therewith,
Obtained copper-clad plate is heavier.Needing high-k and fitted in the application field not high to lightweight requirements
Close and use such a material, those skilled in the art can be selected according to actual needs.
It is for so that any person skilled in the art all can make or make to provide of this disclosure be previously described
Use the disclosure.Various modifications of this disclosure all will be apparent for a person skilled in the art, and
The generic principles defined herein can be applied to spirit or model of other variants without departing from the disclosure
Enclose.Thus, the disclosure is not intended to be limited to example described herein and design, but should be awarded
Give the widest scope consistent with novel features with principle disclosed herein.
Claims (10)
1. a kind of composite, the composite includes being wrapped up by epoxy resin with core shell structure
Graphene oxide, polyphenylene oxide and ceramic powder, wherein being counted on the basis of the weight of the composite, have
The graphene oxide consumption wrapped up by epoxy resin of core shell structure is 1-3wt%；The consumption of ceramic powder is
7-29wt%；The consumption of polyphenylene oxide is 70-90wt%.
2. composite as claimed in claim 1, it is characterised in that the ceramic powder is barium strontium titanate
Ceramic powder.
3. composite as claimed in claim 1, it is characterised in that the epoxy resin is bisphenol A-type
Epoxy resin.
4. composite as claimed in claim 1, it is characterised in that the polyphenylene oxide is graft modification
Polyphenylene oxide.
5. a kind of method for preparing composite, the described method comprises the following steps：
1) graphene oxide is dissolved in solvent, adds epoxy resin ingredient progress ultrasonic wave and disperse, with
Surface of graphene oxide is set to wrap up epoxy resin, so as to obtain being wrapped up by epoxy resin with core shell structure
Graphene oxide；
2) by the graphene oxide wrapped up by epoxy resin with core shell structure, polyphenylene oxide and ceramic powder
Body is mixed and is film-made, wherein being counted on the basis of the weight of the composite, with core shell structure by epoxy
The graphene oxide consumption of resin parcel is 1-3wt%；The consumption of ceramic powder is 7-29wt%；Polyphenylene oxide
Consumption is 70-90wt%.
6. method as claimed in claim 5, it is characterised in that the epoxy resin ingredient and graphite oxide
The weight proportion scope of alkene is 5：1~1：1.2.
7. method as claimed in claim 5, methods described also includes the film obtained in step 2 being hot pressed into
Type.
8. the method as any one of claim 6-7, it is characterised in that use the tape casting system
Film.
9. the copper-clad plate that a kind of composite as described in claim any one of 1-4 is made.
10. the antenna substrate that a kind of composite as described in claim any one of 1-4 is made.
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| CN108164973A (en) * | 2018-01-18 | 2018-06-15 | 广东中塑新材料有限公司 | A kind of high dielectric polyphenyl ether material and its preparation method and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108164973A (en) * | 2018-01-18 | 2018-06-15 | 广东中塑新材料有限公司 | A kind of high dielectric polyphenyl ether material and its preparation method and application |
| CN108164973B (en) * | 2018-01-18 | 2021-03-30 | 广东中塑新材料有限公司 | High-dielectric polyphenyl ether material and preparation method and application thereof |
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| CN107286627B (en) | 2020-10-30 |
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