CN107286305A - A kind of laser fast shaping photosensitive resin material - Google Patents
A kind of laser fast shaping photosensitive resin material Download PDFInfo
- Publication number
- CN107286305A CN107286305A CN201610203054.7A CN201610203054A CN107286305A CN 107286305 A CN107286305 A CN 107286305A CN 201610203054 A CN201610203054 A CN 201610203054A CN 107286305 A CN107286305 A CN 107286305A
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- photosensitive resin
- resin material
- laser fast
- fast shaping
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
- C08F283/008—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00 on to unsaturated polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention proposes a kind of laser fast shaping photosensitive resin material, and its raw material includes following components：UV resins；Epoxy resin；Diluent：Hydroxyethyl methacrylate and hydroxy propyl methacrylate；Light trigger：819 phenyl dual oxide phosphines and 184 1 hydroxy-cyclohexyl phenyl ketones；Anaerobic adhesive initiator；Thixotropic agent：Fumed silica and nano-calcium carbonate；Polymerization inhibitor；Coupling agent.Not only cost is low for a kind of laser fast shaping photosensitive resin material proposed by the present invention, and the light solid time is short, and physics and stable chemical performance are excellent and be environment-friendly materials after shaping, environment and human body are not caused damage.
Description
Technical field
The present invention relates to laser fast shaping field of material technology, more particularly to a kind of laser fast shaping photosensitive resin material.
Background technology
Rapid laser-shaping technique is an advanced manufacturing technology of development and application in recent years, it is a key common technology for manufacturing business's new product development service, has positive impetus to promoting enterprise product innovation, shortening new product development cycle, raising product competitiveness.Since being come out from the technology, it has been widely applied in the manufacturing industry of developed country, and thus produces an emerging technical field.And SLA formers are more common a kind of equipment using rapid laser-shaping technique, SLA is the abbreviation of " Stereo lithography Appearance ", that is stereolithography apparatus method, with specific wavelength and the Laser Focusing of intensity to photo-curing material surface, it is allowed to by point to line, by line to face consecutive solidification, completes the drawing performance of an aspect, then lifting platform moves the height of a synusia in vertical direction, and another aspect of resolidification, which is so layering, constitutes a 3D solid.DLP (Digital Light Processing) projection 3 D-printing technique is also such, laser fast shaping photosensitive resin is a kind of low viscosity liquid photosensitive resin for SLA forming machines and DLP projection 3 D-printing techniques, can make durable, hard, waterproof function part.But in the prior art, the research and development of laser fast shaping photosensitive resin material are not also perfect, its cost is costly, and the light solid time is longer, so as to have impact on the manufacturing inefficiency of related industry, shaping is not precisely quick enough, and performance is unstable, shaping is not superior enough, have impact on the development of rapid laser-shaping technique.
Therefore, a kind of laser fast shaping photosensitive resin material is needed badly, to solve problems of the prior art.
The content of the invention
It is an object of the invention to overcome the defect of prior art there is provided a kind of cost is low, the light solid time is short, physics and stable chemical performance and the laser fast shaping photosensitive resin material of environmental protection after shaping.
What the present invention was realized in：A kind of laser fast shaping photosensitive resin material, its raw material includes following components：
UV resins；
Epoxy resin；
Diluent：Hydroxyethyl methacrylate and hydroxy propyl methacrylate；
Light trigger：819- phenyl dual oxide phosphines and 184-1- hydroxy-cyclohexyl phenyl ketones；
Anaerobic adhesive initiator；
Thixotropic agent：Fumed silica and nano-calcium carbonate；
Polymerization inhibitor；
Coupling agent.
Further, by weight, its raw material is included：
UV resins：25-30 parts；
Epoxy resin：30-35 parts；
Hydroxyethyl methacrylate：15-20 parts；
Hydroxy propyl methacrylate：10-15 parts；
819- phenyl dual oxide phosphines：1-7 parts；
184-1- hydroxy-cyclohexyl phenyl ketones：1-7 parts；
Anaerobic adhesive initiator：2-5 parts；
Fumed silica：2-5 parts；
Nano-calcium carbonate：2-3 parts；
Polymerization inhibitor：0.05-0.1 parts；
Coupling agent：2-3 parts.
Further, the UV resins are CN966J75 type UV resins.
Further, the anaerobic adhesive initiator is tertiary amine.
Further, the coupling agent is KH560.
What the present invention had has the technical effect that：The present invention provides a kind of laser fast shaping photosensitive resin material, and raw material is combined using lower cost materials, and then the cost of material is low, it is easy to extensively using production, be widely popularized suitable for market；The improvement that the present invention passes through material prescription so that this laser fast shaping photosensitive resin material light solid time is fast, is solidified into sturdy material by liquid material rapidly, and then improves the manufacturing efficiency of related industry, saves time cost；And its physical property is superior after material solidification of the present invention, wearability is strong, the processing such as secondary operation shaping or air brushing can be carried out to it, is widely used, and its stable chemical performance, there is stronger corrosion resistance and other chemical resistances after shaping, it is simultaneously environment-friendly materials, it is not easy to decompose, volatilization etc., will not be to human body and environmental concerns, suitable for wide popularization and application in the market and industrial medium quantity batch processing.
Embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made belongs to the scope of protection of the invention.
A kind of laser fast shaping photosensitive resin material of embodiment 1, its raw material is by weight, composed of the following components,
UV resins：25 parts of CN966J75 type UV resins；
Epoxy resin：35 parts；
Diluent：15 parts of hydroxyethyl methacrylate, 10 parts of hydroxy propyl methacrylate；
Light trigger：1 part of 819- phenyl dual oxides phosphine, 1 part of 184-1- hydroxy-cyclohexyls phenyl ketone；
Anaerobic adhesive initiator：2 parts of tertiary amine；
Thixotropic agent：5 parts of fumed silica, 3 parts of nano-calcium carbonate；
Polymerization inhibitor：0.05 part；
Coupling agent：2.95 parts of KH560 types coupling agent.
A kind of preparation method of laser fast shaping photosensitive resin material of the present embodiment comprises the following steps：
S1, raw material detection, sub-material are carried out after water content detection, viscosity measurements, particle detections by its composition by weight progress sub-material respectively to raw material；
S2, UV resins and epoxy resin is put into equipment container after carrying out decentralized processing 60 minutes and premix base-material is made, carrying out fine gtinding by milling apparatus after premix base-material is taken out is made base-material；
S3, diluent and light trigger are put into equipment container and be made after decentralized processing 30 minutes pre-polymerization and mixes thing, and confirm that pre-polymerization mixes thing and is uniformly dispersed no particle, sediment；
S4, base-material and pre-polymerization are mixed after thing is put into vacuum planet dispersing apparatus and are stirred after 60 minutes, are continued to be stirred after 60 minutes after the disposable initiator of input anaerobic adhesive simultaneously, thixotropic agent, polymerization inhibitor, coupling agent, are detected, finished product.
A kind of laser fast shaping photosensitive resin material raw material of the present embodiment is combined using lower cost materials, and then the cost of material is low, it is easy to extensively using production, be widely popularized suitable for market；The improvement that the present embodiment passes through material prescription so that the present embodiment light solid time is short, is solidified into sturdy material by liquid material rapidly, the time can shorten to 3 to 5 seconds, and then improves the manufacturing efficiency of related industry, saves time cost；And its physical property is superior after material solidification of the present invention, wearability is strong, the processing such as secondary operation shaping or air brushing can be carried out to it, it is widely used, and its stable chemical performance, there is stronger corrosion resistance and other chemical resistances after shaping, it is simultaneously environment-friendly materials, it is not easy to decompose, volatilization etc., will not be to human body and environmental concerns, suitable for wide popularization and application in the market and industrial medium quantity batch processing, a kind of specific physicochemical property such as following table of laser fast shaping photosensitive resin material of the present embodiment：
| Project | Test result | Method of testing |
| Tensile strength | 56MPa | D638 |
| Elongation at break | 10.1% | D638 |
| Effective aspect ratio parameter | 5.8% | D638 |
| Modulus of elasticity | 2620MPa | D638M |
| Bending strength | 78MPa | D790 |
| Bending modulus | 2260MPa | D790 |
| Impact strength | 23.0J/m | D256A |
| Hardness (Shore D) | 80 | D2240 |
| Water absorption rate | 0.25% | D570-98 |
| Tg | 46℃ | E1545-00 |
| [email protected] | 62℃ | D648-98C |
A kind of laser fast shaping photosensitive resin material of embodiment 2, its raw material is by weight, composed of the following components,
UV resins：26 parts of CN966J75 type UV resins；
Epoxy resin：31 parts；
Diluent：16 parts of hydroxyethyl methacrylate, 12 parts of hydroxy propyl methacrylate；
Light trigger：2 parts of 819- phenyl dual oxides phosphine, 3 parts of 184-1- hydroxy-cyclohexyls phenyl ketone；
Anaerobic adhesive initiator：2.7 parts of tertiary amine；
Thixotropic agent：2.3 parts of fumed silica, 2.42 parts of nano-calcium carbonate；
Polymerization inhibitor：0.08 part；
Coupling agent：2.5 parts of KH560 types coupling agent.
The present embodiment is identical with the preparation method of above-described embodiment 1, and with same advantageous effects and performance.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection.
Claims (5)
1. a kind of laser fast shaping photosensitive resin material, it is characterised in that its raw material includes following components：
UV resins；
Epoxy resin；
Diluent：Hydroxyethyl methacrylate and hydroxy propyl methacrylate；
Light trigger：819- phenyl dual oxide phosphines and 184-1- hydroxy-cyclohexyl phenyl ketones；
Anaerobic adhesive initiator；
Thixotropic agent：Fumed silica and nano-calcium carbonate；
Polymerization inhibitor；
Coupling agent.
2. laser fast shaping photosensitive resin material according to claim 1, it is characterised in that by weight
Part meter is measured, its raw material is included：
UV resins：25-30 parts；
Epoxy resin：30-35 parts；
Hydroxyethyl methacrylate：15-20 parts；
Hydroxy propyl methacrylate：10-15 parts；
819- phenyl dual oxide phosphines：1-7 parts；
184-1- hydroxy-cyclohexyl phenyl ketones：1-7 parts；
Anaerobic adhesive initiator：2-5 parts；
Fumed silica：2-5 parts；
Nano-calcium carbonate：2-3 parts；
Polymerization inhibitor：0.05-0.1 parts；
Coupling agent：2-3 parts.
3. laser fast shaping photosensitive resin material according to claim 1, it is characterised in that：It is described
UV resins are CN966J75 type UV resins.
4. laser fast shaping photosensitive resin material according to claim 1, it is characterised in that：It is described
Anaerobic adhesive initiator is tertiary amine.
5. laser fast shaping photosensitive resin material according to claim 1, it is characterised in that：It is described
Coupling agent is KH560.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610203054.7A CN107286305A (en) | 2016-04-01 | 2016-04-01 | A kind of laser fast shaping photosensitive resin material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610203054.7A CN107286305A (en) | 2016-04-01 | 2016-04-01 | A kind of laser fast shaping photosensitive resin material |
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| CN107286305A true CN107286305A (en) | 2017-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610203054.7A Pending CN107286305A (en) | 2016-04-01 | 2016-04-01 | A kind of laser fast shaping photosensitive resin material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181219A (en) * | 2018-01-22 | 2019-01-11 | 厦门中凯新材石墨烯科技有限公司 | A kind of high tenacity graphene 3D printing photo-curing material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101392151A (en) * | 2008-10-30 | 2009-03-25 | 广东恒大新材料科技有限公司 | Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof |
| CN101592859A (en) * | 2009-06-24 | 2009-12-02 | 广州机械科学研究院 | A kind of stereolithography rapid prototyping photosensitive resin and its production and application |
| CN101851397A (en) * | 2010-05-21 | 2010-10-06 | 焦作市卓立烫印材料有限公司 | Synthetic resin and ultraviolet light curing adhesive prepared by using same |
-
2016
- 2016-04-01 CN CN201610203054.7A patent/CN107286305A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101392151A (en) * | 2008-10-30 | 2009-03-25 | 广东恒大新材料科技有限公司 | Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof |
| CN101592859A (en) * | 2009-06-24 | 2009-12-02 | 广州机械科学研究院 | A kind of stereolithography rapid prototyping photosensitive resin and its production and application |
| CN101851397A (en) * | 2010-05-21 | 2010-10-06 | 焦作市卓立烫印材料有限公司 | Synthetic resin and ultraviolet light curing adhesive prepared by using same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181219A (en) * | 2018-01-22 | 2019-01-11 | 厦门中凯新材石墨烯科技有限公司 | A kind of high tenacity graphene 3D printing photo-curing material and preparation method thereof |
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Application publication date: 20171024 |