CN107277329A - A kind of CCD camera assembly and electronic equipment - Google Patents
A kind of CCD camera assembly and electronic equipment Download PDFInfo
- Publication number
- CN107277329A CN107277329A CN201710643094.8A CN201710643094A CN107277329A CN 107277329 A CN107277329 A CN 107277329A CN 201710643094 A CN201710643094 A CN 201710643094A CN 107277329 A CN107277329 A CN 107277329A
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- camera
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- sensitive chip
- ccd camera
- assembly
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- 238000000034 method Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000005321 cobalt glass Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The embodiment of the invention discloses a kind of CCD camera assembly and electronic equipment, the CCD camera assembly includes the first camera, second camera, light guide structure and sensitive chip, light guide structure is arranged in the light path of the first camera and second camera, for the light for injecting the first camera and second camera to be directed into sensitive chip, sensitive chip collects above-mentioned light.The present invention shares a sensitive chip by two cameras, and the image for obtaining two kinds of different resolutions can be realized by a sensitive chip, cost is not only reduced, also reduces the volume of camera module.
Description
Technical field
The present invention relates to camera technology field, and in particular to a kind of CCD camera assembly and electronic equipment.
Background technology
At present, the electronic installation such as mobile phone, notebook computer, tablet personal computer rises is shot simultaneously using double camera modules
The new technology of same object, the image that two camera modules are shot respectively also be able to can be mutually compensated for obtaining with compositing 3 d images
Take the two dimensional image of high definition.
Camera mainly include camera lens, sensitive chip and circuit board, wherein sensitive chip as camera main portion
Its operation principle of part is：Extraneous light is irradiated on sensitive chip face after passing through camera lens, and camera lens is uploaded what is come by sensitive chip
Light is converted to electric signal, then is converted to data signal by analog-to-digital conversion.The amount of light received on sensitive chip is shadow
A key factor of image quality is rung, with diminishing for camera volume, sensitive chip also would have to less and less, and picture
But more and more higher result in elemental area and becomes smaller prime number.Under the elemental area of very little, the light that sensitive chip can be experienced
Line is also reduced, and light signal strength is low, and signal to noise ratio is low, result in the image difference shot and.Therefore the size and image of camera
Quality is just into a pair of implacable contradictions, in order to ensure that picture quality often make it that camera module volume is larger, takes
The excessive space of terminal inner.
The content of the invention
The embodiment of the present invention provides a kind of CCD camera assembly and electronic equipment, and the occupancy that can reduce camera module is empty
Between.
In a first aspect, the embodiment of the present invention provides a kind of CCD camera assembly, including the first camera, second camera, lead
Photo structure and sensitive chip, the light guide structure are arranged in the light path of first camera and the second camera,
For the light for injecting first camera and the second camera to be directed into the sensitive chip, the sensitive chip
Collect the light.
Second aspect, the embodiment of the present invention additionally provides a kind of electronic equipment, including housing and CCD camera assembly, described to take the photograph
As head assembly be arranged on the enclosure interior, the CCD camera assembly include the first camera, second camera, light guide structure with
And sensitive chip, the light guide structure is arranged in the light path of first camera and second camera, for that will inject institute
The light for stating the first camera and second camera is directed to the sensitive chip, and the sensitive chip collects the light.
CCD camera assembly provided in an embodiment of the present invention, can be realized by a sensitive chip and obtain two kinds of different resolutions
The image of rate, not only reduces cost, also reduces the volume of camera module.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the structural representation of a kind of electronic equipment provided in an embodiment of the present invention.
Fig. 2 is the structural representation of another electronic equipment provided in an embodiment of the present invention.
Fig. 3 is the first structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 4 is second of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 5 is the first structural representation of sensitive chip provided in an embodiment of the present invention.
Fig. 6 is second of structural representation of sensitive chip provided in an embodiment of the present invention.
Fig. 7 is the third structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 8 is the 4th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 9 is the 5th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Figure 10 is the another structural representation of electronic equipment provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present invention provides a kind of electronic equipment.The electronic equipment can be the equipment such as smart mobile phone, tablet personal computer.
With reference to Fig. 1, electronic equipment 100 includes cover plate 101, display screen 102, circuit board 103 and housing 104.
Wherein, cover plate 101 is installed on display screen 102, to cover display screen 102.Cover plate 101 can be transparent glass cover
Plate.In certain embodiments, cover plate 101 can be the glass cover-plate being made of materials such as sapphires.
Display screen 102 is arranged on housing 104, to form the display surface of electronic equipment 100.Display screen 102 can include
Viewing area 102A and non-display area 102B.Viewing area 102A is used for the information such as display image, text.Non-display area
102B not display informations.Non-display area 102B bottom can set the functional units such as fingerprint module, touch-control circuit.
Circuit board 103 is arranged on inside housing 104.Circuit board 103 can be the mainboard of electronic equipment 100.Circuit board 103
On can be integrated with the functional units such as camera, proximity transducer and processor.Meanwhile, display screen 102 can be electrically connected to
Circuit board 103.
In certain embodiments, radio frequency (RF, Radio Frequency) circuit is provided with circuit board 103.Radio circuit
Wireless network and the network equipment (for example, server, base station etc.) or other electronic equipments (for example, smart mobile phone etc.) can be passed through
Communication, with the information transmit-receive completed and between the network equipment or other electronic equipments.
In certain embodiments, as shown in Fig. 2 the electronic equipment also includes rear camera 105 and flash lamp 106,
Wherein, the camera 105 can be dual camera, such as respectively 16,000,000 pixel wide-angle cameras and 20,000,000 pixel focal length
Camera.Different FOV (angle of visibility) is used by left and right camera, two cameras is found a view difference.When clapping close shot, make
With wide-angle lens, when clapping distant view, telephoto lens is used.So as to realize optical zoom function.
In one embodiment, with reference to Fig. 3, Fig. 3 is a kind of structural representation of CCD camera assembly provided in an embodiment of the present invention
Figure, the CCD camera assembly includes：First camera 201, second camera 202, light guide structure and sensitive chip 205.
Wherein, light guide structure is arranged in the light path of the first camera 201 and second camera 202, for that will inject
The light of one camera 201 and second camera 202 is directed to sensitive chip 205, and sensitive chip 205 collects light.
Wherein, sensitive chip 205 is arranged on the line of symmetry of the first camera 201 and second camera 202.Above-mentioned leaded light
Structure includes the first light guide structure 203 and the second light guide structure 204, and the first light guide structure 203 is arranged on the first camera 201
In light path, for the light for injecting the first camera 201 to be directed into sensitive chip 205, the second light guide structure 204 is arranged on the
In the light path of two cameras 202, for the light for injecting second camera 202 to be directed into sensitive chip 205.
The above-mentioned light guide structure 204 of first light guide structure 203 and second can be reflective mirror, and the reflective mirror can be anti-for one side
Light microscopic, or double-surface mirror reflector, if one side reflective mirror then the first light guide structure 203 and the second light guide structure 204 is anti-
The face of penetrating is directed to sensitive chip 205.
In one embodiment, refering to Fig. 4, CCD camera assembly provided in an embodiment of the present invention also includes circuit board 206, photosensitive
Chip 205 is fixedly installed on circuit board 206.
As shown in figure 5, the sensitive chip 205 in the embodiment of the present invention includes chip body 2051, chip body 2051 has
There is the smooth surface 2052 of light of the reception by light guide structure direction directive chip body 2051, and it is relative with smooth surface 2052
Shady face 2053, smooth surface 2052 is disposed in parallel relation to one another with shady face 2053.
In one embodiment, should as shown in fig. 6, the sensitive chip 205 in the embodiment of the present invention also includes connector 2054
Connector 2054 is arranged on the side of shady face 2053, for chip body 2051 to be connected with circuit board 206, the connector
2054 is identical with the appearance profile of chip body 2051 and size is corresponding.
In one embodiment, as shown in fig. 7, CCD camera assembly provided in an embodiment of the present invention also includes camera bracket
207, the camera bracket is used to place the first camera 201 and second camera 202.The camera bracket also includes two thoroughly
Light region, is respectively used to make the first camera 201 and second camera 202 carry out printing opacity.
Wherein, above-mentioned camera bracket 207 also includes an extension 208, and the extension 208 is arranged on the first camera
201 and second camera 202 line of symmetry on.The extension 208 can be shadow shield, for stopping the first guiding device 203
With the reflection light between the second guiding device 204, with reduce when the one of camera of 205 pairs of sensitive chip carries out daylighting by
The interference that the light of another camera intake is caused to it.
Among an embodiment, as shown in figure 8, CCD camera assembly provided in an embodiment of the present invention also includes optical filter 209,
The optical filter 209 is arranged at the lower section of the first camera 201 and second camera 202, such as is arranged on two camera difference
Corresponding two transmission regions.Wherein optical filter 209 can be smalt optical filter, and its effect is exactly the mode by " absorption "
Carry out filtering infrared light.Because blue wavelength has higher penetrance, there is more preferable penetrability compared with the glass filters of reddish orange, can
More than 630nm infrared light is filtered, the true colors of object are reduced, so that the problem of solving image color distortion.
Among an embodiment, as shown in figure 9, sensitive chip provided in an embodiment of the present invention 205 is also photosensitive including first
The photosensitive region 211 of region 210 and second, the first photosensitive region 210 is collected the first camera 201 and penetrated through the first photosensitive structure 203
The light entered, the second photosensitive region 211 collects the light that second camera 202 is injected through the second photosensitive structure of knot 204.
In embodiments of the present invention, the horizontal range between the first camera 201 and second camera 202 be 75mm extremely
110mm.Horizontal range between first camera 201 and second camera 202 for the first camera 201 geometric center and the
Horizontal range between the geometric center of two cameras 202.Wherein, the first camera 201 includes a telephoto lens, the second shooting
First 202 include a wide-angle lens.
The embodiment of the present invention also provides a kind of electronic equipment, including housing and CCD camera assembly, and CCD camera assembly is arranged on
Enclosure interior, CCD camera assembly includes the first camera, second camera, light guide structure and sensitive chip, and light guide structure is set
Put in the light path of the first camera and second camera, for the light for injecting the first camera and second camera to be oriented to
To sensitive chip, sensitive chip collects light.
With reference to Figure 10, the another structural representation of Figure 10 electronic equipments 100 provided in an embodiment of the present invention.Electronic equipment
100 include antenna assembly 10, memory 20, display unit 30, power supply 40 and processor 50.Those skilled in the art can manage
The structure of the electronic equipment 100 shown in solution, Figure 10 does not constitute the restriction to electronic equipment 100.Electronic equipment 100 can be wrapped
Include than illustrating more or less parts, either combine some parts or different parts arrangement.
Wherein, antenna assembly 10 can pass through wireless network and the network equipment (for example, server) or other electronic equipments
(for example, smart mobile phone) communicates, and completes and the information transmit-receive between the network equipment or other electronic equipments.
Memory 20 can be used for storage application program and data.Include executable in the application program that memory 20 is stored
Program code.Application program can constitute various functions module.Processor 50 is stored in the application journey of memory 20 by operation
Sequence, so as to perform various function application and data processing.
Display unit 30 can be used for display the information of electronic equipment 100 is input to by user or be supplied to the information of user with
And the various graphical user interface of electronic equipment 100.These graphical user interface can by figure, text, icon, video and its
It is combined to constitute.Display unit 30 may include display panel.
The all parts that power supply 40 is used for electron equipment 100 are powered.In certain embodiments, power supply 40 can pass through electricity
Management system and processor 50 are logically contiguous, so as to realize management charging, electric discharge and power consumption pipe by power-supply management system
The functions such as reason.
Processor 50 is the control centre of electronic equipment 100.Processor 50 is entirely electric using various interfaces and connection
The various pieces of sub- equipment 100, by operation or perform and are stored in application program in memory 20, and call and be stored in
Data in reservoir 20, perform the various functions and processing data of electronic equipment 100, so as to carry out entirety to electronic equipment 100
Monitoring.
In addition, electronic equipment 100 can also include camera module, bluetooth module etc., it will not be repeated here.
It when it is implemented, above modules can be realized as independent entity, can also be combined, be made
Realized for same or several entities, the specific implementation of above modules can be found in embodiment of the method above, herein not
Repeat again.
It should be noted that one of ordinary skill in the art will appreciate that whole in the various methods of above-described embodiment or
Part steps can be by program to instruct the hardware of correlation to complete, and the program can be stored in computer-readable storage medium
In matter, such as it is stored in the memory of terminal, and by least one computing device in the terminal, can wraps in the process of implementation
Include the flow of the embodiment such as information issuing method.Wherein, storage medium can include：Read-only storage (ROM, Read Only
Memory), random access memory (RAM, Random Access Memory), disk or CD etc..
A kind of CCD camera assembly and electronic equipment provided in an embodiment of the present invention are described in detail above, its each work(
Energy module can be integrated in a process chip or modules are individually physically present, can also be two or two
It is integrated in upper module in a module.Above-mentioned integrated module can both be realized in the form of hardware, it would however also be possible to employ soft
The form of part functional module is realized.Specific case used herein is set forth to the principle and embodiment of the present invention,
The explanation of above example is only intended to the method and its core concept for helping to understand the present invention；Simultaneously for the skill of this area
Art personnel, according to the thought of the present invention, will change in specific embodiments and applications, in summary, this
Description should not be construed as limiting the invention.
Claims (11)
1. a kind of CCD camera assembly, it is characterised in that including the first camera, second camera, light guide structure and photosensitive core
Piece, the light guide structure is arranged in the light path of first camera and the second camera, for that will inject described
The light of one camera and the second camera is directed to the sensitive chip, and the sensitive chip collects the light.
2. CCD camera assembly as claimed in claim 1, it is characterised in that the sensitive chip is arranged on first camera
On the line of symmetry of the second camera.
3. CCD camera assembly as claimed in claim 1, it is characterised in that the light guide structure includes the first light guide structure and the
Two light guide structures；
First light guide structure is arranged in the light path of first camera, for the light by first camera is injected
Line is directed to the sensitive chip；
Second light guide structure is arranged in the light path of the second camera, for the light by the second camera is injected
Line is directed to the sensitive chip.
4. CCD camera assembly as claimed in claim 3, it is characterised in that first light guide structure and the second guide-lighting knot
Structure is reflective mirror, and the reflection direction of the speculum is directed to the sensitive chip.
5. CCD camera assembly as claimed in claim 3, it is characterised in that the sensitive chip includes the first photosensitive region and the
Two photosensitive regions；
First photosensitive region collects the light that first camera is injected through first photosensitive structure, second sense
Collect the light that the second camera is injected through second photosensitive structure in light region.
6. CCD camera assembly as claimed in claim 1, it is characterised in that the CCD camera assembly also includes camera bracket,
The camera bracket is used to place first camera and the second camera；
The camera bracket includes body and extension, and the extension is arranged on first camera and described second and taken the photograph
On the line of symmetry of picture head.
7. CCD camera assembly as claimed in claim 1, it is characterised in that first camera and the second camera it
Between horizontal range be 75mm to 110mm.
8. CCD camera assembly as claimed in claim 7, it is characterised in that first camera and the second camera it
Between horizontal range for first camera geometric center and the second camera geometric center between level away from
From.
9. CCD camera assembly as claimed in claim 1, it is characterised in that first camera includes a telephoto lens, institute
Stating second camera includes a wide-angle lens.
10. CCD camera assembly as claimed in claim 1, it is characterised in that the CCD camera assembly also includes circuit board, described
Sensitive chip is fixedly installed on the circuit board.
11. a kind of electronic equipment, it is characterised in that including housing and CCD camera assembly, the CCD camera assembly is arranged on described
Enclosure interior, the CCD camera assembly includes the first camera, second camera, light guide structure and sensitive chip, described to lead
Photo structure is arranged in the light path of first camera and second camera, for that will inject first camera and second
The light of camera is directed to the sensitive chip, and the sensitive chip collects the light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643094.8A CN107277329A (en) | 2017-07-31 | 2017-07-31 | A kind of CCD camera assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643094.8A CN107277329A (en) | 2017-07-31 | 2017-07-31 | A kind of CCD camera assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN107277329A true CN107277329A (en) | 2017-10-20 |
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ID=60075555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710643094.8A Pending CN107277329A (en) | 2017-07-31 | 2017-07-31 | A kind of CCD camera assembly and electronic equipment |
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| Country | Link |
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| CN (1) | CN107277329A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107659760A (en) * | 2017-10-25 | 2018-02-02 | 珠海市魅族科技有限公司 | Camera device and electronic equipment |
| CN107872665A (en) * | 2017-12-07 | 2018-04-03 | 深圳市趣创科技有限公司 | Mobile phone 3D camera functions and system |
| CN108429883A (en) * | 2018-05-30 | 2018-08-21 | Oppo（重庆）智能科技有限公司 | Filming apparatus, electronic equipment and image acquiring method |
| CN109040568A (en) * | 2018-10-22 | 2018-12-18 | 惠州市桑莱士智能科技股份有限公司 | Dual camera mould group for robotic vision system |
| CN111726503A (en) * | 2020-06-28 | 2020-09-29 | 维沃移动通信（杭州）有限公司 | Camera module and electronic equipment |
| CN112187971A (en) * | 2019-07-05 | 2021-01-05 | 北京小米移动软件有限公司 | Periscopic camera module and terminal equipment |
| WO2022011816A1 (en) * | 2020-07-13 | 2022-01-20 | 武汉华星光电半导体显示技术有限公司 | Display screen and display device |
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| CN202617287U (en) * | 2012-01-16 | 2012-12-19 | 信利光电(汕尾)有限公司 | 3D camera |
| CN104010122A (en) * | 2014-06-13 | 2014-08-27 | 广东欧珀移动通信有限公司 | Light sensing chip, camera and electronic product |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202617287U (en) * | 2012-01-16 | 2012-12-19 | 信利光电(汕尾)有限公司 | 3D camera |
| CN104010122A (en) * | 2014-06-13 | 2014-08-27 | 广东欧珀移动通信有限公司 | Light sensing chip, camera and electronic product |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107659760A (en) * | 2017-10-25 | 2018-02-02 | 珠海市魅族科技有限公司 | Camera device and electronic equipment |
| CN107872665A (en) * | 2017-12-07 | 2018-04-03 | 深圳市趣创科技有限公司 | Mobile phone 3D camera functions and system |
| CN108429883A (en) * | 2018-05-30 | 2018-08-21 | Oppo（重庆）智能科技有限公司 | Filming apparatus, electronic equipment and image acquiring method |
| CN109040568A (en) * | 2018-10-22 | 2018-12-18 | 惠州市桑莱士智能科技股份有限公司 | Dual camera mould group for robotic vision system |
| CN112187971A (en) * | 2019-07-05 | 2021-01-05 | 北京小米移动软件有限公司 | Periscopic camera module and terminal equipment |
| CN111726503A (en) * | 2020-06-28 | 2020-09-29 | 维沃移动通信（杭州）有限公司 | Camera module and electronic equipment |
| WO2022011816A1 (en) * | 2020-07-13 | 2022-01-20 | 武汉华星光电半导体显示技术有限公司 | Display screen and display device |
| US11974032B2 (en) | 2020-07-13 | 2024-04-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display screen and display device |
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Application publication date: 20171020 |