CN107272951A - One kind touches aobvious product and its encapsulating method - Google Patents
One kind touches aobvious product and its encapsulating method Download PDFInfo
- Publication number
- CN107272951A CN107272951A CN201710448441.1A CN201710448441A CN107272951A CN 107272951 A CN107272951 A CN 107272951A CN 201710448441 A CN201710448441 A CN 201710448441A CN 107272951 A CN107272951 A CN 107272951A
- Authority
- CN
- China
- Prior art keywords
- glass
- tft
- fpc
- sealant
- under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Nonlinear Science (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a kind of encapsulating method for touching aobvious product, including：Glass gluing under the upper glass of TFT and TFT；The upper glass binding ITO circuits of TFT；Attach upper polaroid and down polaroid；The upper surface binding display of glass and/or drive integrated circult under TFT；Lower glass FPC is bundled on lower glass binding pin；Lower glass FPC glue curings drying；Upper glass FPC is bundled on glass binding pin；ITO circuits sealing between upper glass FPC and upper polaroid：Loaded using syringe on sealed insulating material, syringe and soft needle is installed；One layer is coated between upper glass FPC and upper polaroid is used for sealed sealed insulating material, forms sealant；Solidification drying sealant.Aobvious product is touched present invention also offers one kind.Beneficial effects of the present invention：Improve exposed ITO circuits in On cell and In cell products and short circuit problem is caused out by steam, foreign matter, dirty contact.
Description
Technical field
The present invention relates to technical field of touch-control display, aobvious product and its encapsulating method are touched in particular to one kind.
Background technology
Touch-control shows that product develops to integrated direction, the overall thick bottom for touching aobvious product can be reduced, with lightening
Advantage.Relative to touch panel to be arranged on to original method for being used on liquid crystal panel, by touch panel function and liquid crystal panel
The research increasing prevalence of integration.At present, the touch panel of main flow and the integrated technique of liquid crystal panel are On-cell and In-
cell.On-cell is a kind of touch-control display module that touch inductive circuit is all made in glass surface on TFT.In-cell's
A kind of structure is that the drive part circuit of touch is made in into glass surface under TFT, and induction line is made in TFT upper glass surface.
The upper glass and lower glass surface of two kinds of structures have circuit, institute's binding at least one each on upper glass and lower glass in need
Piece FPC (flexible circuit board).
At present, the technological process of production of On-cell and In-cell modules includes：TFT cleaning glass is checked；Stick lower inclined
Mating plate；Lower glass terminal cleaning；Integrated circuit is bound；Lower glass FPC bindings；Glass step sealing electrical measurement again；Lower glass FPC points
Line glue；Lower glass FPC glue curings；Upper glass terminal cleaning；Upper glass FPC bindings；Coat encapsulant；Encapsulant solidifies
Processing；Upper glass FPC electrical measurements；Assemble backlight；Weld backlight pin；Display and touch electrical testing+appearance test；Pack out
Goods.
Aobvious product is touched by what above-mentioned technological process was prepared, as shown in figure 1, after the FPC bindings of upper table surface glass
It is exposed into air to have ITO (electro-conductive glass) between its polaroid and FPC, causes ITO herein in contact steam, different
During thing, steam and foreign matter can make circuit micro-short circuit or etching lines cause open circuit, this reliability and quality to product have compared with
Big risk and influence.
The content of the invention
To solve the above problems, touching aobvious product and its encapsulating method it is an object of the invention to provide one kind, On- is improved
Exposed ITO circuits cause out short circuit problem by steam, foreign matter, dirty contact in cell and In-cell products.
The invention provides a kind of encapsulating method for touching aobvious product, including：
Step 1, bilayer TFT glass pieces are prepared：
Step 101, cleaning glass inspection under the upper glass of TFT and TFT, glass under glass on the TFT and the TFT is pasted
Close, and the length of glass is more than glass on the TFT under the TFT；
Step 102, glass binds ITO circuits on the TFT；
Step 103, upper polaroid and down polaroid are attached respectively on glass under glass and the TFT on the TFT；
Step 104, glass does terminal cleaning under the TFT, and under the TFT upper surface binding display of glass and/
Or drive integrated circult, and it is described display and/or drive integrated circult do not contacted with glass on the TFT；
Step 2, FPC is bound：
Step 201, under the TFT on glass end bind under glass binding pin, lower glass FPC be bundled in it is described under
On glass binding pin, a little upper seal line glue at the lower glass binding pin, and the display and/or drive integrated circult
Do not contacted with the lower glass FPC；
Step 202, the lower glass FPC glue curings drying；
Step 203, glass does terminal cleaning on the TFT, and glass binding is drawn in binding on glass end on the TFT
Pin, and upper glass binding pin do not contact with the upper polaroid, upper glass FPC is bundled in the upper glass and binds pin
On, and it is described display and/or drive integrated circult do not contacted with the upper glass FPC；
Step 3, the ITO circuits sealing between the upper glass FPC and the upper polaroid：
Step 301, loaded using syringe on sealed insulating material, syringe and soft needle is installed；
Step 302, first sealed insulating material is extruded from syringe, by soft needle on described glass FPC and described
One layer is coated between upper polaroid is used for sealed sealed insulating material, forms sealant, and the sealant and the upper glass
Glass FPC and the upper polaroid are contacted；
Step 303, the solidification drying sealant.
Further improved as of the invention, in step 3, the coating width of the sealant is glass on the whole TFT
The width of glass, coating height is no more than the surface 0.1mm of the upper polaroid.
As further improvement of the invention, the insulating sealing materials that the sealant is used are that heat-curable glue or UV solidify
Glue or glue or fluorination liquid.
It is used as further improvement of the invention, when sealed insulating material is heat-curable glue, the solidification drying sealant
Method be：
Product is placed into the high-temperature cabinet that temperature is 30-70 degrees Celsius, humid control is below 50%, and baking time is
3-60 minutes.
It is used as further improvement of the invention, when sealed insulating material is UV solidification glues, the solidification drying sealant
Method be：
Wavelength is used to be irradiated for 10-400nm ultraviolet to product, the time is 10-60 minutes.
As further improvement of the invention, when sealed insulating material is glue or fluorination liquid, the solidification drying sealing
Layer method be：
Product is placed 10-60 minutes in natural environment below 60% of 15-30 degrees Celsius, humidity.
As further improvement of the invention, the needle diameter of the soft needle is between 0.2mm-1mm.
By prepared by above-mentioned encapsulating method aobvious product is touched present invention also offers a kind of, including glass under glass and TFT on TFT
The length of glass is more than glass on the TFT under glass, and the TFT；
The upper surface of glass is pasted with upper polaroid on glass binding ITO circuits, the TFT on the TFT；
Under the TFT lower surface of glass be pasted with glass under down polaroid, the TFT upper surface binding display and/
Or drive integrated circult；
Lower glass binding pin is bound under the TFT on glass end, lower glass FPC is bundled in the lower glass binding and drawn
On pin, and seal line glue is set at the lower glass binding pin；
The upper glass binding pin of binding on glass end on the TFT, and the upper glass binds pin and described inclined
Mating plate is not contacted, and upper glass FPC is bundled on the upper glass binding pin；
Sealant, and the sealant and the upper glass FPC are set between the upper glass FPC and the upper polaroid
Contacted with the upper polaroid；
The display and/or drive integrated circult and glass, the lower glass FPC and the upper glass FPC on the TFT
Do not contact.
As further improvement of the invention, the width of the sealant is the width of glass on the TFT, and height does not surpass
Cross the surface 0.1mm of the upper polaroid.
As further improvement of the invention, the insulating sealing materials that the sealant is used are that heat-curable glue or UV solidify
Glue or glue or fluorination liquid.
Beneficial effects of the present invention are：
The region bound by upper glass FPC between position and upper polaroid increases glass in one layer of encapsulant, enhancing
ITO sealing effectiveness, prevents steam, debris from causing product after touching this ITO position between FPC binding position and polaroid
Short circuit or/and open circuit, so that disabler, improve in On-cell and In-cell products exposed ITO circuits by steam, different
Thing, dirty contact cause out short circuit problem, add the environmental reliability of product, under normal air environment, or high temperature is high
In wet, salt fog environment, extend the service life of product, improve product quality and Consumer's Experience.
Brief description of the drawings
Fig. 1 touches aobvious product cross-sectional view for what prior art was provided；
Fig. 2 is that one kind described in the embodiment of the present invention touches aobvious product cross-sectional view；
Fig. 3 is that one kind described in the embodiment of the present invention touches aobvious product positive structure schematic.
In figure,
1st, the upper glass of TFT；2nd, glass under TFT；31st, down polaroid；32nd, upper polaroid；33rd, ITO circuits；34th, sealant；
41st, lower glass FPC；42nd, upper glass FPC；51st, lower glass binding pin；52nd, upper glass binding pin；61st, seal line glue.
Embodiment
The present invention is described in further detail below by specific embodiment and with reference to accompanying drawing.
A kind of embodiment 1, encapsulating method for touching aobvious product of the embodiment of the present invention, with reference to Fig. 1, comprises the following steps：
Step 1, bilayer TFT glass pieces are prepared：
Step 101, the cleaning of glass 2 is checked under the upper glass 1 of TFT and TFT, and glass 2 under glass on TFT 1 and TFT is fitted,
And the length of glass 2 is more than glass 1 on TFT under TFT；
Step 102, the upper binding ITO of glass 1 circuits 33 of TFT；
Step 103, upper polaroid 32 and down polaroid 31 are attached respectively on glass 2 under the upper glass 1 of TFT and TFT；
Step 104, glass 2 does terminal cleaning under TFT, and the upper surface binding of glass 2 shows and/or driven under TFT
Integrated circuit 5, and display and/or drive integrated circult 5 do not contacted with glass on TFT 1；
Step 2, FPC is bound：
Step 201, glass binding pin 51 under being bound under TFT on the end of glass 2, lower glass FPC 41 is bundled in lower glass
On glass binding pin 51, a little upper seal line glue 61 at lower glass binding pin 51, and display and/or drive integrated circult 5 with
Lower glass FPC 41 is not contacted；
Step 202, lower glass FPC41 glue curings drying；
Step 203, the upper glass 1 of TFT does terminal cleaning, and glass binds pin 52 in binding on the end of glass 1 on TFT,
And upper glass binding pin 52 is not contacted with upper polaroid 32, upper glass FPC 42 is bundled on glass binding pin 52, and
Display and/or drive integrated circult 5 are not contacted with upper glass FPC 42；
Step 3, the ITO circuits sealing between upper glass FPC 42 and upper polaroid 32：
Step 301, loaded using syringe on sealed insulating material, syringe and soft needle is installed；
Step 302, first sealed insulating material is extruded from syringe, by soft needle in upper glass FPC 42 and upper polarisation
One layer is coated between piece 32 is used for sealed sealed insulating material, forms sealant 34, and sealant 34 and upper glass FPC 42
Contacted with upper polaroid 32；
Step 303, solidification drying sealant 34.
Wherein, double-deck TFT glass pieces are the conventional structure of this area, bind display and/or drive integrated circult 5, tie up
Fix glass FPC 41, the usual manner that glass FPC 42 is this area in binding.
In coating, the amount of sealed insulating material is controlled, the coating width of sealant 34 is glass 1 on whole TFT
Width, coating height is no more than the surface 0.1mm of upper polaroid 32, in order to avoid interfere cover plate during laminating cover plate, the OCA for cover plate of fitting
Should be between 0.1-0.2mm.
In step 3, the insulating sealing materials that sealant 34 is used is heat-curable glue or UV solidification glues or glues or are fluorinated liquid,
Therefore, the solidification to sealant 34 is dried according to the different and different of insulating sealing materials, specifically includes following three kinds of methods：
First method, when sealed insulating material is heat-curable glue, it is 30-70 degrees Celsius that product is placed into temperature
In high-temperature cabinet, humid control is below 50%, and baking time is 3-60 minutes.
Second method, when sealed insulating material is UV solidification glues, uses the ultraviolet that wavelength is 10-400nm to producing
Product are irradiated, and the time is 10-60 minutes.
The third method, when sealed insulating material is glue or fluorination liquid, product is existed in 15-30 degrees Celsius, humidity
Placed 10-60 minutes in less than 60% natural environment.
When the present embodiment is sealed, the method for using soft needle injection, to ensure that sealed insulating material can be smoothly
Extruded from syringe, and ensure the sealed degree of accuracy, it is ensured that whole sealant can be covered, the needle diameter of soft needle is suitably controlled
System can fill sealing area and reach sealing effectiveness between 0.2mm-1mm.
Lower glass FPC 41, upper glass FPC 42 are respectively to include at least a piece of FPC FPC groups in the present embodiment.
After above-mentioned steps 3, following steps are further carried out：
Step 4, upper glass FPC 42 does energization test；
Step 5, backlight is assembled, backlight pin is welded；
Step 5, electrical testing is shown and touches, and to carrying out appearance test；
Step 6, after upchecking, shipment is packed.
Embodiment 2, one kind touches aobvious product, as shown in Figures 2 and 3, including glass 2 under glass 1 and TFT on TFT, and under TFT
The length of glass 2 is more than glass 1 on TFT；The upper binding ITO of glass 1 circuits 33 of TFT, the upper surface of the upper glass 1 of TFT is pasted with
Polaroid 32；The lower surface of glass 2 is pasted with the upper surface binding display of glass 2 under down polaroid 31, TFT and/or driven under TFT
Dynamic integrated circuit 5；Lower glass binding pin 51 is bound under TFT on the end of glass 2, lower glass FPC41 is bundled in lower glass binding
On pin 51, and seal line glue 61 is set at lower glass binding pin 51；Upper glass binding is bound on the upper ends of glass 1 of TFT to draw
Pin 52, and upper glass binding pin 52 do not contacted with upper polaroid 32, upper glass FPC42 be bundled in glass bind pin 52
On；Sealant 34, and sealant 34 and upper glass FPC42 and upper polaroid are set between upper glass FPC42 and upper polaroid 32
32 contact；Display and/or drive integrated circult 5 are not contacted with glass on TFT 1, lower glass FPC41 and upper glass FPC42.
Wherein, the width of sealant 34 is the width of glass 1 on TFT, interferes cover plate during in order to avoid laminating cover plate, height
No more than the surface 0.1mm of upper polaroid 32.
In the present embodiment, the insulating sealing materials that sealant 34 is used is heat-curable glue or UV solidification glues or glue or fluorinations
Liquid.No matter which kind of insulating sealing materials is used, be both needed to carry out solidification drying and processing, upper glass FPC binding portion is caused after solidification
Exposed ITO is isolated from the outside between position and polaroid, plays sealing effectiveness.
The present invention mainly reaches that sealing is protected ITO circuits 33 not by steam and dirty invaded by increasing sealant 34
Erosion influence.After sealed insulating material solidification, make the exposed ITO between the binding area of glass and polaroid close by encapsulant
Envelope, does not contact with outside air, reaches water vapor and the effect of foreign matter, play a part of Moisture-proof corrosion-proof.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of encapsulating method for touching aobvious product, it is characterised in that including：
Step 1, bilayer TFT glass pieces are prepared：
Step 101, glass (2) cleaning is checked under the upper glass of TFT (1) and TFT, by under glass (1) and the TFT on the TFT
Glass (2) is fitted, and the length of glass (2) is more than glass (1) on the TFT under the TFT；
Step 102, glass (1) binding ITO circuits (33) on the TFT；
Step 103, upper polaroid (32) and lower polarisation are attached respectively on glass (2) under glass (1) and the TFT on the TFT
Piece (31)；
Step 104, glass (2) does terminal cleaning under the TFT, and the upper surface binding of glass (2) is shown under the TFT
And/or drive integrated circult (5), and it is described display and/or drive integrated circult (5) do not contacted with glass (1) on the TFT；
Step 2, FPC is bound：
Step 201, glass binding pin (51) under being bound under the TFT on glass (2) end, lower glass FPC (41) binding
On the lower glass binding pin (51), the lower a little upper seal line glue (61) in glass binding pin (51) place, and it is described
Display and/or drive integrated circult (5) are not contacted with the lower glass FPC (41)；
Step 202, lower glass FPC (41) the glue curing drying；
Step 203, glass (1) does terminal cleaning on the TFT, binds upper glass binding on glass (1) end on the TFT
Pin (52), and upper glass binding pin (52) do not contact with the upper polaroid (32), upper glass FPC (42) is bundled in
On the upper glass binding pin (52), and the display and/or drive integrated circult (5) and the upper glass FPC (42) are no
Contact；
Step 3, the ITO circuits sealing between the upper glass FPC (42) and the upper polaroid (32)：
Step 301, loaded using syringe on sealed insulating material, syringe and soft needle is installed；
Step 302, first sealed insulating material is extruded from syringe, by soft needle on described glass FPC (42) and described
One layer is coated between upper polaroid (32) is used for sealed sealed insulating material, forms sealant (34), and the sealant
(34) contacted with the upper glass FPC (42) and the upper polaroid (32)；
Step 303, the solidification drying sealant (34).
2. encapsulating method according to claim 1, it is characterised in that in step 3, the coating width of the sealant (34)
It is the width of glass (1) on the whole TFT, coating height is no more than the surface 0.1mm of the upper polaroid (32).
3. encapsulating method according to claim 1, it is characterised in that the insulating sealing materials that the sealant (34) uses
For heat-curable glue or UV solidification glues or glue or fluorination liquid.
4. encapsulating method according to claim 3, it is characterised in that when sealed insulating material is heat-curable glue, solidification
The method for drying the sealant (34) is：
Product is placed into the high-temperature cabinet that temperature is 30-70 degrees Celsius, humid control is below 50%, and baking time is 3-60
Minute.
5. encapsulating method according to claim 3, it is characterised in that when sealed insulating material is UV solidification glues, solidification
The method for drying the sealant (34) is：
Wavelength is used to be irradiated for 10-400nm ultraviolet to product, the time is 10-60 minutes.
6. encapsulating method according to claim 3, it is characterised in that when sealed insulating material is glue or fluorination liquid,
The method of the solidification drying sealant (34) is：
Product is placed 10-60 minutes in natural environment below 60% of 15-30 degrees Celsius, humidity.
7. encapsulating method according to claim 1, it is characterised in that the needle diameter of the soft needle is in 0.2mm-1mm
Between.
8. prepared by the encapsulating method in a kind of 1-7 such as claim as described in any one touches aobvious product, it is characterised in that including
Glass (2) under the upper glass of TFT (1) and TFT, and the length of glass (2) is more than glass (1) on the TFT under the TFT；
The upper surface of glass (1) is pasted with upper polaroid on glass (1) binding ITO circuits (33), the TFT on the TFT
(32)；
Under the TFT lower surface of glass (2) be pasted with glass (2) under down polaroid (31), the TFT upper surface binding it is aobvious
Show and/or drive integrated circult (5)；
Lower glass binding pin (51) is bound under the TFT on glass (2) end, lower glass FPC (41) is bundled in the lower glass
On glass binding pin (51), and described lower glass binding pin (51) place sets seal line glue (61)；
Upper glass binding pin (52), and the upper glass binding pin (52) and institute are bound on the TFT on glass (1) end
State upper polaroid (32) not contact, upper glass FPC (42) is bundled on the upper glass binding pin (52)；
Between the upper glass FPC (42) and the upper polaroid (32) set sealant (34), and the sealant (34) with
The upper glass FPC (42) and the upper polaroid (32) are contacted；
Glass (1) on the display and/or drive integrated circult (5) and the TFT, the lower glass FPC (41) and it is described on
Glass FPC (42) is not contacted.
9. according to claim 9 touch aobvious product, it is characterised in that the width of the sealant (34) is on the TFT
The width of glass (1), highly the surface 0.1mm no more than the upper polaroid (32).
10. according to claim 9 touch aobvious product, it is characterised in that the insulated enclosure material that the sealant (34) uses
Expect for heat-curable glue or UV solidification glues or glue or fluorination liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710448441.1A CN107272951A (en) | 2017-06-14 | 2017-06-14 | One kind touches aobvious product and its encapsulating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710448441.1A CN107272951A (en) | 2017-06-14 | 2017-06-14 | One kind touches aobvious product and its encapsulating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107272951A true CN107272951A (en) | 2017-10-20 |
Family
ID=60066335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710448441.1A Pending CN107272951A (en) | 2017-06-14 | 2017-06-14 | One kind touches aobvious product and its encapsulating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107272951A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107992226A (en) * | 2017-11-28 | 2018-05-04 | 长沙市宇顺显示技术有限公司 | A kind of ON-CELL products and its binding area's encapsulating method |
| CN108267872A (en) * | 2018-01-22 | 2018-07-10 | 精电(河源)显示技术有限公司 | Process is bound in a kind of COG anticorrosions |
| CN109324713A (en) * | 2018-09-11 | 2019-02-12 | 深圳市宇顺电子股份有限公司 | A kind of touching display screen with fingerprint and preparation method thereof |
| CN110737308A (en) * | 2019-10-16 | 2020-01-31 | Oppo广东移动通信有限公司 | Screen assembly of electronic equipment and electronic equipment |
| CN110943106A (en) * | 2018-09-21 | 2020-03-31 | 上海和辉光电有限公司 | Display panel and manufacturing method thereof |
| CN113223411A (en) * | 2021-04-27 | 2021-08-06 | 昆山国显光电有限公司 | Display panel and display device |
| TWI825888B (en) * | 2022-08-02 | 2023-12-11 | 元太科技工業股份有限公司 | Touch display device and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203414939U (en) * | 2013-06-09 | 2014-01-29 | 中山微视显示器有限公司 | Embedded touch TN (Twisted Nematic) capacitive screen |
| US20150022730A1 (en) * | 2013-07-18 | 2015-01-22 | Ye Xin Technology Consulting Co., Ltd. | Touch display panel |
| CN105224137A (en) * | 2015-10-21 | 2016-01-06 | 长沙市宇顺显示技术有限公司 | A kind of method touching aobvious product and upper glass FPC binding sealing thereof |
| CN105892732A (en) * | 2014-11-28 | 2016-08-24 | 浙江金徕镀膜有限公司 | Panel apparatus and manufacturing method therefor |
-
2017
- 2017-06-14 CN CN201710448441.1A patent/CN107272951A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203414939U (en) * | 2013-06-09 | 2014-01-29 | 中山微视显示器有限公司 | Embedded touch TN (Twisted Nematic) capacitive screen |
| US20150022730A1 (en) * | 2013-07-18 | 2015-01-22 | Ye Xin Technology Consulting Co., Ltd. | Touch display panel |
| CN105892732A (en) * | 2014-11-28 | 2016-08-24 | 浙江金徕镀膜有限公司 | Panel apparatus and manufacturing method therefor |
| CN105224137A (en) * | 2015-10-21 | 2016-01-06 | 长沙市宇顺显示技术有限公司 | A kind of method touching aobvious product and upper glass FPC binding sealing thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107992226A (en) * | 2017-11-28 | 2018-05-04 | 长沙市宇顺显示技术有限公司 | A kind of ON-CELL products and its binding area's encapsulating method |
| CN107992226B (en) * | 2017-11-28 | 2020-10-30 | 长沙市宇顺显示技术有限公司 | ON-CELL product and binding region sealing method thereof |
| CN108267872A (en) * | 2018-01-22 | 2018-07-10 | 精电(河源)显示技术有限公司 | Process is bound in a kind of COG anticorrosions |
| CN109324713A (en) * | 2018-09-11 | 2019-02-12 | 深圳市宇顺电子股份有限公司 | A kind of touching display screen with fingerprint and preparation method thereof |
| CN110943106A (en) * | 2018-09-21 | 2020-03-31 | 上海和辉光电有限公司 | Display panel and manufacturing method thereof |
| CN110737308A (en) * | 2019-10-16 | 2020-01-31 | Oppo广东移动通信有限公司 | Screen assembly of electronic equipment and electronic equipment |
| CN113223411A (en) * | 2021-04-27 | 2021-08-06 | 昆山国显光电有限公司 | Display panel and display device |
| CN113223411B (en) * | 2021-04-27 | 2022-12-06 | 昆山国显光电有限公司 | Display panel and display device |
| TWI825888B (en) * | 2022-08-02 | 2023-12-11 | 元太科技工業股份有限公司 | Touch display device and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107272951A (en) | One kind touches aobvious product and its encapsulating method | |
| CN105786230B (en) | Touch panel and its manufacturing method | |
| CN102722276B (en) | Touch sensor and preparation method thereof and touch screen LCD | |
| CN105224137B (en) | A method of touching aobvious product and the sealing of glass FPC binding thereon | |
| CN108196386A (en) | A kind of liquid crystal display panel and preparation method thereof | |
| KR101544716B1 (en) | Transparent conductive film | |
| CN105892755A (en) | Touch panel, manufacturing method thereof and touch panel display and device | |
| CN108983477A (en) | Display module and preparation method thereof, electronic device | |
| CN208954073U (en) | A kind of novel touch screen of deflection | |
| CN210864670U (en) | Heating shielding glass structure applied to display window | |
| CN204360348U (en) | Contact panel | |
| KR101272625B1 (en) | Assembly of Pad for Touch Panel and Circuit Board | |
| CN204790931U (en) | Touch control display equipment | |
| CN215895429U (en) | Touch screen | |
| CN105718095A (en) | Touch display device | |
| CN104808875A (en) | Touch panel, touch module and laminating method thereof | |
| CN211264290U (en) | Capacitive touch screen laminated structure and capacitive touch screen | |
| CN204242135U (en) | Touch panel module | |
| CN204288172U (en) | Touch control display apparatus | |
| CN202522821U (en) | Liquid crystal grating, 3D display element and 3D display device | |
| CN206312111U (en) | A kind of structure improved ONCELL touch-controls display module | |
| CN207281732U (en) | A kind of capacitance touch screen | |
| CN206340752U (en) | Electronic installation | |
| CN205121511U (en) | Touch apparent product | |
| CN109358778A (en) | A kind of capacitive touch screen sensor production method, sensor and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |